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Chemical Vapor Deposition(ÈÇÐÁõÂø)ÀÇ °³¿ä¿Í ÇÔ²² ¼¼°è ¹ÝµµÃ¼ Á¦Á¶¾÷üÀÇ µ¿Çâ, ¼¼°è ¹× Áö¿ªº° Gas Chemical ½ÃÀåÀÇ µ¿ÇâÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.
Á¦1Àå Chemical Vapor Deposition
- Gas ChemicalÀÇ Á¾·ù ¹× ¿ªÇÒ
- CVD °øÁ¤, Dry Etching, Chamber Cleaning °øÁ¤ ¼Ò°³
Á¦2Àå ÁÖ¿ä ¹ÝµµÃ¼ Á¦Á¶»ç
- Áö¿ªº° ÁÖ¿ä ¹ÝµµÃ¼ Á¦Á¶»ç ¸®½ºÆ®(Fablees ¾÷ü Á¦¿Ü)
- 25°³ ¸ÞÀÌÀú ¹ÝµµÃ¼ Á¦Á¶»ç Á¤º¸(ÀÎÅÚ, »ï¼ºÀüÀÚ, TI, µµ½Ã¹Ù µîÀÇ ¿þÀÌÆÛ ÀÎÄ¡º° ¶óÀÎ Capa Á¤º¸ ¹× »ý»ê Á¦Ç° ºÐ·ù)
Á¦3Àå Àü¼¼°è Gas Chemical ½ÃÀå µ¿Çâ
- ¹ÝµµÃ¼ °øÁ¤¿ë Gas ChemicalÀÇ 2008~2011³â±îÁö ¹Ý±â±âÁØ ½ÃÀå µ¿Çâ ¹× Àü¸Á ºÐ¼®(¹°·® ¹× ±Ý¾× ±âÁØ)
- NF3, SiH4, DCS, NH3, WF6, CF(CF4, C2F6, C3F8 µî)ÀÇ 2008~2011³â±îÁö ¹Ý±â±âÁØ ½ÃÀå µ¿Çâ ¹× Àü¸Á ºÐ¼®(¹°·® ¹× ±Ý¾× ±âÁØ)
- À§ 6°¡Áö ¾ÆÀÌÅÛÀÇ ¹Ì±¹(ºÏ¹Ì), À¯·´, Çѱ¹, ÀϺ», ´ë¸¸, Áß±¹ ¹× ±âŸ Áö¿ªÀÇ °¢ ¼ÒÀ纰 2008~2011³â±îÁö ¹Ý±â±âÁØ ½ÃÀå µ¿Çâ ¹× Àü¸Á ºÐ¼®(¹°·® ¹× ±Ý¾× ±âÁØ)
Á¦4Àå Çѱ¹ ½ÃÀå ºÐ¼®
- »ï¼ºÀüÀÚ, ÇÏÀ̴нº ¹× ±âŸ ¾÷ü ¹ÝµµÃ¼ ¶óÀκ° Á¤º¸(ÀÎÄ¡, Capa, ¹Ý±â±âÁØ wafer ÅõÀÔ·®, »ý»ê Á¦Ç°, ¶óÀÎ º¯µ¿ »çÇ× µî)
- NF3, SiH4, DCS, NH3, WF6, CF(CF4, C2F6, C3F8 µî)ÀÇ °¢ ¾÷ü »ç¾÷À庰 »ç¿ë·® ºÐ¼® (2008³â ¹Ý±â±âÁØ ½ÇÁ¦ »ç¿ë·® ¹× 2009³â ¹Ý±â±âÁØ ¿¹Ãø »ç¿ë·®)
- ¾÷ü »ç¾÷Àå ±âÁØ °ø±Þ»ç ºÐ¼®
- »ï¼ºÀüÀÚ, ÇÏÀ̴нºÀÇ °³º° Á¦Ç°º°(¿¬±¸¼Ò °ø±Þ Á¦Ç° Æ÷ÇÔ) °ø±Þ»ç ¹× ÇöÀç(2009³â 2, 3ºÐ±â ±âÁØ)¿ù Æò±Õ »ç¿ë·® ºÐ¼®
Á¦5Àå ½ÃÀå ºÐ¼®
- °¢°¢ÀÇ ¾ÆÀÌÅÛ¿¡ ´ëÇÑ °æÀï ±¸µµ ºÐ¼®
- °¢ ¾ÆÀÌÅÛÀÇ °¡°Ý ºÐ¼®
- °¢ ¾ÆÀÌÅÛÀÇ »ç¾÷ À̽´ ¹× È帧 ºÐ¼®
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