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Â÷¼¼´ë FPD Á¦Á¶°øÁ¤À» À§ÇÑ ÃÖ÷´Ü ·¹ÀÌÀú ÀÀ¿ë ±â¼ú

Advanced Laser Applications for Next-Generation FPD Manufacturing Process

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ÃâÆÇÀÏ 2008/08
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Â÷¼¼´ë FPD Á¦Á¶°øÁ¤À» À§ÇÑ ÃÖ÷´Ü ·¹ÀÌÀú ÀÀ¿ë ±â¼úÀ» Á¶»çÇϰí, Ç÷§ µð½ºÇ÷¹ÀÌ ÆÐ³Î¤ýÀåºñ¤ýºÎǰ ½ÃÀåÀÇ ¸¶½ºÅ©¸®½º ³ë±¤ Àåºñ ¹× Á÷Á¢ ÆÐÅÍ´× ±â¼úÀÇ °³¹ß, ÃÖ÷´Ü ·¹ÀÌÀú ±â¼úÀ» ÀÌ¿ëÇÑ À¯¸® ±âÆÇ Àý´Ü¤ýÇÁ¸´ ¾Á¸µ¤ýACF º»µùÀÇ °³¹ß µ¿Çâ, TFT ¾×Á¤ÀÇ Ä÷¯ ÇÊÅÍ Á¦Á¶¿Í ÆÐ³Î ¸®Æä¾î ±â¼ú µ¿Ç⠺м® µîÀ» ÀüÇØµå¸³´Ï´Ù.

    1. ·¹ÀÌÀú ±â¼ú °³¿ä
    • ·¹ÀÌÀúÀÇ Æ¯¼º
      • ·¹ÀÌÀúÀÇ Á¤ÀÇ ¹× Ư¼º
      • ·¹ÀÌÀúÀÇ ¹ßÁø ¿ø¸®
    • FPD Á¦Á¶¸¦ À§ÇÑ Ã·´Ü ·¹ÀÌÀú
      • ¹ÝµµÃ¼ ·¹ÀÌÀú
      • °íü ·¹ÀÌÀú
      • ±âü ·¹ÀÌÀú
      • ÆèÅäÃÊ ·¹ÀÌÀú
    • FPD Á¦Á¶¿ë ·¹ÀÌÀúÀÇ Àåºñ ±âº» ±¸¼º
      • ·¹ÀÌÀú ¹× ±¤Çаè
      • ·¹ÀÌÀú ÅëÇÕ ½Ã½ºÅÛ Àåºñ
    • ÷´Ü ·¹ÀÌÀú ÀÀ¿ë ºÐ¾ß
      • FPD °ü·Ã ·¹ÀÌÀú ÀÀ¿ë
      • Àü±â/ ÀüÀÚ/ žçÀüÁö °ü·Ã ·¹ÀÌÀú ÀÀ¿ë
    • ÃÖ±Ù ·¹ÀÌÀú ±â¼ú °³¹ß µ¿Çâ
    2. FPD ½ÃÀå µ¿Çâ
    • FPD ½ÃÀå µ¿Çâ
      • TFT-LCD ½ÃÀå µ¿Çâ
      • PDP ½ÃÀå µ¿Çâ
    • FPD Á¦Á¶ ¿ø°¡ ¹× ÆÇ¸Å °¡°Ý ºñ±³
      • 42ÀÎÄ¡ PDP vs. TFT-LCD Á¦Á¶ ¿ø°¡ ¹× ÆÇ¸Å °¡°Ý ºñ±³ (FHD ±Þ)
      • 50ÀÎÄ¡ PDP vs. 52ÀÎÄ¡ TFT-LCD Á¦Á¶ ¿ø°¡ ¹× ÆÇ¸Å °¡°Ý ºñ±³ (FHD ±Þ)
    3. ·¹ÀÌÀú ÆÐÅÍ´×(LASER PATTERNING) ±â¼úÀ» ÀÌ¿ëÇÑ Â÷¼¼´ë FPD °øÁ¤
    • ¸¶½ºÅ©¸®½º ³ë±¤ ±â¼ú(MASKLESS EXPOSURE)
      • Polygon Mirror(Æú¸®°ï ¹Ý»ç°Å¿ï) ±â¹Ý ±â¼ú
      • SLM(Spatial Light Modulator) ±â¹Ý ±â¼ú
        • DMD ±â¹Ý ¸¶½ºÅ©¸®½º ³ë±¤±â
        • GLV ±â¹Ý ¸¶½ºÅ©¸®½º ³ë±¤±â
      • LDW(Laser Direct Writing) ±â¹Ý ±â¼ú
      • Àåºñ ¸ÞÀÌÄ¿ µ¿Çâ
        • ASML
        • DNS (Dainippon Screen)
        • Hitachi Via
        • Index Techonology
        • LG ÀüÀÚ
        • Micronic Laser Systems
        • Orbotech
        • ORC Manufacturing
        • SDI/ »ï¼º ÀüÀÚ
        • Ball Semiconductor
      • SLM(Spatial Light Modulator) ¸ÞÀÌÄ¿ µ¿Çâ
        • Texas Instrument
        • Silicon Light Machines
        • Micronic Laser Systems
        • Fraunhofer IPMS
      • ÆÐ³Î ¸ÞÀÌÄ¿ µ¿Çâ
        • »ï¼ºÀüÀÚ
        • LG µð½ºÇ÷¹ÀÌ
        • »ï¼ºSDI
      • ƯÇã µ¿Çâ
    • ·¹ÀÌÀú Á÷Á¢ ÆÐÅÍ´×(LASER DIRECT PATTERNING) ±â¼ú
      • ITO (Indium Tin Oxide) Direct Patterning
      • LCD ¿Í Flexible Display Á¦Á¶¸¦ À§ÇÑ Laser Selective Etching
    • OLED À¯±â¸· Á÷Á¢ ÆÐÅÍ´×À» À§ÇÑ ·¹ÀÌÀú Àü»ç¹ý
      • KodakÀÇ IST(Radiation Induced Sublimination Transfer) ±â¼ú
      • »ï¼ºSDIÀÇ LITI(Laser Induced Thermal Imaging) ±â¼ú
      • SonyÀÇ LIPS(Laser Induced Pattern-wise Sublimation) ±â¼ú
    • ŸÀÌÆ²·¯(TITLER) ¹× ID ¸¶Ä¿(MARKER)
      • UV ·¹ÀÌÀú¸¦ ÀÌ¿ëÇÑ PDP ÆÐ³Î ID ¸¶Å·
      • ·¹ÀÌÀú ³ë±¤±â¼úÀ» ÀÌ¿ëÇÑ LCD ÆÐ³Î ŸÀÌÆ²¸µ
      • °íǰÁú Â÷¼¼´ë ŸÀÌÆ²·¯ ±â¼ú
    4. FPD Á¦Á¶¸¦ À§ÇÑ Ã·´Ü ·¹ÀÌÀú ÀÀ¿ë ±â¼ú
    • LASER CRYSTALLIZATION FOR LTPS (LOW TEMPERARTURE POLY SILICON)
      • ¿¢½Ã¸Ó ·¹ÀÌÀú ±â¹Ý ±â¼ú(ELA, SLS, TDX)
      • °íü ·¹ÀÌÀú ±â¹Ý ±â¼ú(SELAX, Green Laser, CLC)
      • ¹ÝµµÃ¼ ·¹ÀÌÀú ±â¹Ý ±â¼ú(dLTA: Diode Laser Thermal Annealing)
    • ·¹ÀÌÀú ¸®Æä¾î (LASER REPAIR) ±â¼ú
      • ·¹ÀÌÀú ¾î·¹ÀÌ ¸®Æä¾î (Laser Array Repair)
      • ·¹ÀÌÀú CVD ¸®Æä¾î (Laser CVD Repair)
    • ·¹ÀÌÀú À¯¸® ±âÆÇ Àý´Ü(LASER GLASS CUTTING) ±â¼ú
      • CO2 ·¹ÀÌÀú¸¦ ÀÌ¿ëÇÑ ·¹ÀÌÀú ±Û·¡½º Ä¿ÆÃ ±â¼ú
      • ÇÏÀ̺긮µå ¹æ¹ýÀ» ÀÌ¿ëÇÑ Â÷¼¼´ë ·¹ÀÌÀú ±Û·¡½º Ä¿ÆÃ ±â¼ú
    • ·¹ÀÌÀú ÇÁ¸´ ¾Á¸µ(FRIT SEALING) ¹× ÆÐŰ¡(PACKAGING) ±â¼ú
      • ¹ÝµµÃ¼ ·¹ÀÌÀú¸¦ ÀÌ¿ëÇÑ AMOLED ÇÁ¸´ ¾Á¸µ ±â¼ú
      • ·¹ÀÌÀú¸¦ ÀÌ¿ëÇÑ Â÷¼¼´ë FPD ¹× RFID ÆÐŰ¡ ±â¼ú
    5. INDEX
    • TABLE
    • FIGURE
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