giikorea.co.kr
 È¨ | ȸ»ç¼Ò°³ | ¸ÂÃãÇü ½ÃÀåÁ¶»ç | ±¹Á¦ÄÁÆÛ·±½º | ±Û·Î¹ú ÆÄÆ®³Ê | īŻ·Î±× | ¿¬¶ôó | Site Map |

Conference banner

ÀüÀÚºÎǰ/¹ÝµµÃ¼ ½ÃÀ庸°í¼­
Electronic Devices/Semiconductors Market Research


  Page:   1  2  3  4  5  6  7  8  9  10  Next >>

Reports

¼¼°èÀÇ MEMS ±â¾÷ µ¥ÀÌÅͺ£À̽º
World MEMS Players 2010
  Pub Time : 2010/03
  Published by : Yole Developpement
¼¼°èÀÇ MEMS ±â¾÷¿¡ ´ëÇÑ Á¶»ç ºÐ¼®À» Excel Çü½ÄÀ¸·Î ÀüÇØµå¸³´Ï´Ù.

½Ç¸®ÄÜ ¸¶ÀÌÅ©·ÎÆù ¹× ½ºÇÇÄ¿ : ±â¼ú/½ÃÀå ºÐ¼®/ÃÖÁ¾ ¿ëµµ
Silicon Microphones and Speakers: Technology, Market Analysis, and End Applications
  Pub Time : 2010/03
  Published by : The Information Network
¸¶ÀÌÅ©·ÎÆù, ½ºÇÇÄ¿, Çìµå¼Â ½ÃÀåÀ» »ó¼¼È÷ ºÐ¼®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

ÇÏµå µð½ºÅ© µå¶óÀÌºê ½ÃÀåÀÇ ºÐ¼®°ú µ¿Çâ
The Hard Disk Drive Industry: Market Analysis And Processing Trends
  Pub Time : 2010/03
  Published by : The Information Network

¼¼°èÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñ µ¥ÀÌÅͺ£À̽º : FabFutures
FabFutures - Details of Frontend Semiconductor Fabs that are Planning to Spend for Construction and Equipping.
  Pub Time : 2010/02
  Published by : SEMI
¼¼°è 200¿© °÷ÀÇ FabÀÇ Á¦Á¶Ç° ŸÀÔ, ÇÁ·ÎÁ§Æ® ŸÀÔ, Á¦Á¶ ¿þÀÌÆÛ »çÀÌÁî ¹× Á¦Á¶ ½Ã³ª¸®¿À µ¥ÀÌÅÍ, °ú°Å 2»çºÐ±â¿Í ÇâÈÄ 6»çºÐ±âÀÇ Fab ¼³ºñ ºñ¿ëÀÇ ÃßÀÌ¿Í ¿¹Ãø, ÆÛ½ºÆ® ½Ç¸®ÄÜÀÇ Á¦Á¶¿Í ¾ç»ê °³½Ã ½ºÄÉÁÙ ½ÇÀûÀ» ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñ µ¥ÀÌÅͺ£À̽º £ºFab Equipment Monitor
Fab Equipment Monitor - Details of Frontend Semiconductor Fabs that are Planning to Spend for Equipping.
  Pub Time : 2010/02
  Published by : SEMI
¼¼°è ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñÀÇ µ¥ÀÌÅͺ£À̽º ¡¸FabFutures¡¹ÀÇ ÀϺÎÀÌ¸ç °¢ FabÀÇ °ú°Å 2»çºÐ±â¿Í ÇâÈÄ 6»çºÐ±âÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñ¿¡ ÁöÃâÇÏ´Â ±Ý¾×°ú ¿¹Ã÷°¡, Á¦Á¶¿ë·®ÀÇ ÃßÀÌ¿Í ¿¹Ãø, Áö¿ª ¹× ¿þÀÌÆÛ »çÀÌÁî ¹× Áö¿À¸ÞÆ®¸®º° Áý°è¸¦ ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñ µ¥ÀÌÅͺ£À̽º £ºFab Construction Monitor
Fab Construction Monitor - Details of Frontend Semiconductor Fabs that are Planning to Spend for Construction
  Pub Time : 2010/02
  Published by : SEMI
¼¼°è ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñÀÇ µ¥ÀÌÅͺ£À̽º ¡¸FabFutures¡¹ÀÇ ÀϺÎÀÌ¸ç °¢ FabÀÇ °ú°Å 2»çºÐ±â¿Í ÇâÈÄ 6»çºÐ±âÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñ¿¡ ÁöÃâÇÏ´Â ±Ý¾×°ú ¿¹Ã÷°¡, Á¦Á¶¿ë·®ÀÇ ÃßÀÌ¿Í ¿¹Ãø, Áö¿ª ¹× ¿þÀÌÆÛ »çÀÌÁî ¹× Áö¿À¸ÞÆ®¸®º° Áý°è¸¦ ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶¼³ºñ µ¥ÀÌÅͺ£À̽º £ºLiteÆÇ FabFutures
FabFutures LE
  Pub Time : 2010/02
  Published by : SEMI
¼¼°è 200¿©°³ ÀÌ»óÀÇ Fab¿¡ °üÇÑ µ¥ÀÌÅͺ£À̽º¡¸FabFutures¡¹¿¡¼­ ³»¿ëÀ» À¯ÃâÇÑ °æ·®ÆÇÀ¸·Î °¢ FabÀÇ Á¦Á¶Á¦Ç° ŸÀÔ, Fab ŸÀÔ, ÇÁ·ÎÁ§Æ® ŸÀÔ, Á¦Á¶ ¿þÀÌÆÛ »çÀÌÁî, Á¦Á¶ Áö¿À¸ÞÆ®¸® µ¥ÀÌÅÍ, °ú°Å 2»çºÐ±â¿Í ÇâÈÄ 6»çºÐ±âÀÇ Fab ¼³ºñ °³½Ã ¹× ÀåÄ¡, ÆÛ½ºÆ® ½Ç¸®ÄÜ Á¦Á¶¤ý¾ç»ê °³½ÃÀÇ ½ºÄÉÁÙ µîÀ» ÀüÇØµå¸³´Ï´Ù.

·¯½Ã¾Æ ¹× ¼¼°èÀÇ Àú¿ÂÃÊÀüµµÃ¼ ½ÃÀå ºÐ¼®
Low-Temperature Superconductor Market Research in Russia and the World
  Pub Time : 2010/02
  Published by : INFOMINE Research Group
·¯½Ã¾Æ ¹× ¼¼°èÀÇ Àú¿ÂÃÊÀüµµÃ¼ ½ÃÀå¿¡ ´ëÇØ ºÐ¼®Çϰí, ÃÊÀüµµ Àç·áÀÇ ¿¬±¸¿Í ½ÃÀå, ·¯½Ã¾ÆÀÇ ¼öÃâÀÔ »óȲ, ÁÖ¿ä »ý»ê ±â¾÷ÀÇ ÇÁ·ÎÆÄÀÏ, ½ÃÀå ¹× ¾ÖÇø®ÄÉÀ̼ÇÀÇ ¹ßÀü ¿¹Ãø µîÀ» ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ MPEG IC ½ÃÀå
Worldwide MPEG IC Market
  Pub Time : 2010/02
  Published by : In-Stat
¼¼°èÀÇ MPEG IC½ÃÀå º¥´õÀÇ Æ÷Áö¼Å´×¿¡ ´ëÇØ Á¶»çÇϰí, °¢ ºÎ¹®ÀÇ 2008³â ÃâÇϰí¤ý¼öÀÍÁ¡À¯À² ¹× ÇâÈÄ 5°³³â ÃâÇϰí¤ýASP¤ý¼öÀÍ ¿¹ÃøÀ» ÀüÇØµå¸³´Ï´Ù.

½º¸¶Æ® ±×¸®µå¿ë 4G ¹× WiMAX : ¾×¼¼½º, ¾ÖÇø®ÄÉÀÌ¼Ç ¹× Àû´çÇÑ °¡°ÝÀÇ ½ÇÇö
4G and WiMAX for the Smart Grid: Enabling Access, Applications and Affordability
  Pub Time : 2010/02
  Published by : Mind Commerce Publishing LLC
¶ó½ºÆ® ¸¶ÀÏ È¤Àº ¾×¼¼½º ¼Ö·ç¼ÇÀ¸·Î¼­ÀÇ WiMAX¿¡ ´ëÇÏ¿© ºÐ¼®Çϰí 4G ½º¸¶Æ® ±×¸®µåÀÇ Àü·Â¼± ºê·Îµå¹êµå(BPL)¿¡ ´ëÇÑ °¡°ÝÀÇ Àû´çÇÔ, 4G ½º¸¶Æ® ±×¸®µå ¾ÖÇø®ÄÉÀ̼ÇÀÌ ÁöÁöÇÏ´Â µµ¸Å Åë½Å ¼­ºñ½º¸¦ °æÀ¯ÇÑ Á¡ÁøÀûÀÎ ¼öÀÍ ½ºÆ®¸², 4G ½º¸¶Æ® ±×¸®µå ¼Ö·ç¼ÇÀÌ À¯Æ¿¸®Æ¼¿¡ Á¦°øÇÏ´Â »ç³» ¾÷¹«(¸ð¹ÙÀÏ ³ëµ¿·Â µî)ÀÇ ºñ¿ë °¨¼Ò µîÀ» Á¶»çÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ Blu-ray¤ýDVD Ç÷¹À̾î¿ë ¹ÝµµÃ¼ ½ÃÀå
Worldwide Blu-ray and DVD Player Semiconductors
  Pub Time : 2010/02
  Published by : In-Stat
¼¼°èÀÇ Blu-ray¤ýDVD Ç÷¹À̾î¿ë ¹ÝµµÃ¼ ½ÃÀå¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, DVD/Blu-ray Ç÷¹À̾îÀÇ BOM(ºÎǰǥ), DVD/Blu-ray Ç÷¹À̾î¿ë ¹ÝµµÃ¼ÀÇ TAM(À¯È¿ ½ÃÀå), 2008³â ½Ç¸®ÄÜ º¥´õÀÇ ½ÃÀåÁ¡À¯À², 2013³â±îÁöÀÇ ½ÃÀå ¿¹Ãø µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ »çÆÄÀÌ¾î ½ÃÀå : 2010³â
Sapphire Market 2010
  Pub Time : 2010/02
  Published by : Yole Developpement
¼¼°è ÀÏ·ºÆ®·Î´Ð½º »ê¾÷ÀÇ »çÆÄÀ̾î Àç·á ½ÃÀåÀ» ÁÖ¿ä ¾ÖÇø®ÄÉÀ̼Ç(LED & SoS)º°·Î Á¶»ç ºÐ¼®Çϰí, Á¦Á¶·®¤ýÁ¦Á¶ ¿ë·®¤ýº¥´õ ¼öÀͤýÃâÇÏ·®¤ýÃâÇÏ¾× µîÀÇ °¢Á¾ ½ÃÀå µ¥ÀÌÅÍ, 2013³â±îÁöÀÇ ½ÃÀå ¼ºÀå ¿¹Ãø, ¾ÖÇø®ÄÉÀ̼Ǻ° ½ÃÀåÀÇ ¹è°æ¤ýÁÖ¿ä µ¿Çâ, ÁÖ¿ä ±â¾÷ÀÇ ÇÁ·ÎÆÄÀϵîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¸Þ¸ð¸® ½ÃÀå : ½ÃÀåÁ¡À¯À² ºÐ¼®(2010³â)
2010 Memory Market Share
  Pub Time : 2010/02
  Published by : Databeans, Inc.
¼¼°èÀÇ ¸Þ¸ð¸® ½ÃÀå¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, ¸Þ¸ð¸® ŸÀÔº° ¼öÀͤýÀ¯´Ö¼ö¤ýASP, °ø±Þ¾÷üÀÇ ½ÃÀåÁ¡À¯À², Áö¿ªº° µ¿Çâ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¸Þ¸ð¸® ½ÃÀå : ½ÃÀåÁ¡À¯À² ºÐ¼®(2010³â)
2010 Memory
  Pub Time : 2010/02
  Published by : Databeans, Inc.
¼¼°èÀÇ ¸Þ¸ð¸® ½ÃÀåÀ» Á¦Ç° ¼¼ºÐ¤ýÁö¿ª¤ýÃÖÁ¾ »ç¿ëÀÚ »ê¾÷º°·Î Á¶»ç ºÐ¼®Çϰí, Á¦Ç° ¼¼ºÐº° ¼öÀͤýÃâÇÏ·®¤ýASP¤ý½ÃÀåÁ¡À¯À²ÀÇ ½ÇÀû ¹× ¿¹Ãø, ±âŸ ÆÑÅͺ° ¼öÀÍ ¿¹Ãø, °ø±Þ¾÷üÀÇ ¼öÀÍÁ¡À¯À² µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

IBM Enterprise StorageÀÇ ÀÜÁ¸°¡Ä¡ ¿¹Ãø (2010³â 1¿ù)
IBM Enterprise Storage Residual Value Forecast, January 2010
  Pub Time : 2010/02
  Published by : IDC
IBM Enterprise Storage System½ÃÀåÀÇ °¡Ä¡¿Í ÀÜÁ¸ °¡Ä¡, Á¦Ç° »ç¾ç¿¡ °üÇÑ Â÷Æ® µîÀÇ ºÐ¼®À» »ó¼¼È÷ Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

ÀÚµ¿Â÷¿ë ¹ÝµµÃ¼ ½ÃÀå : 2010³â
2010 Automotive Semiconductors
  Pub Time : 2010/02
  Published by : Databeans, Inc.
¼¼°è ÀÚµ¿Â÷¿ë ¹ÝµµÃ¼ ½ÃÀåÀÇ ºÎ¹®º° ºÐ¼®, Áö¿ªº° ºÐ¼®, ¼Òºñ¿Í »ý»êÀÇ ¿¹Ãø ¹× ¼­ÇöóÀ̾îÀÇ ½ÃÀåÁ¡À¯À² µîÀ» Á¦°øÇØ µå¸³´Ï´Ù.

SAM»çÀÇ Solar inverter¡¸Sunny Boy 3000TL¡¹-Reverse Costing ºÐ¼®
SMA Sunny Boy 3000TL - Solar inverter Reverse Costing Analysis
  Pub Time : 2010/02
  Published by : Yole Developpement
SAM»çÀÇ Å¾çÀüÁö¿ë ÀιöÅÍ¡¸Sunny Boy 3000TL¡¹¿¡´ëÇÑ Á¶»çºÐ¼®°ú teardown, BOM ºÐ¼®, Á¦Á¶°úÁ¤, °æÁ¦ ºÐ¼®, Á¦Á¶ºñ¿ë ³»¿ª, ÆÇ¸Å°¡°Ý °ßÀû µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

InvenSense»çÀÇ ÀÌÃà ÀÚÀ̷νºÄÚÇÁ(2-Axis Gyroscope)¡¸IDG-600/650¡¹- Reverse Costing ºÐ¼®
InvenSense IDG-600/650 2-Axis Gyroscope Reverse Costing Analysis
  Pub Time : 2010/02
  Published by : Yole Developpement
MEMS(Micro electro mechanical Systems) ÀÚÀ̷νºÄÚÇÁ¿¡´ëÇÑ ¼ÒÀçºÐ¼®°ú ȸ·Î ¾î¼Àºí¸®(assembly), Á¦Á¶°øÁ¤, Á¦Á¶ºñ¿ëÀÇ ³»¿ª, ÆÇ¸Å°¡°Ý ¿¹Ãø µîÀ» Á¶»çÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

SiTime»çÀÇ MEMS ¿À½Ç·¹ÀÌÅÍ(oscillator)¡¸SiT8002¡¹- Reverse Costing ºÐ¼®
SiTime SiT8002 - MEMS Oscillator Reverse Costing Analysis
  Pub Time : 2010/02
  Published by : Yole Developpement
MEMS(Micro electro mechanical Systems) ¿À½Ç·¹ÀÌÅÍ(oscillator)¿¡´ëÇÑ ¼ÒÀçºÐ¼®°ú ȸ·Î ¾î¼Àºí¸®(assembly), Á¦Á¶°øÁ¤, Á¦Á¶ºñ¿ëÀÇ ³»¿ª, ÆÇ¸Å°¡°Ý ¿¹Ãø µîÀ» Á¶»çÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

Freescale»çÀÇ MEMS, TPMS¡¸MPXY8300A¡¹- Reverse Costing ºÐ¼®
Freescale MPXY8300A - MEMS TPMS Reverse Costing Analysis
  Pub Time : 2010/02
  Published by : Yole Developpement
MEMS(Micro electro mechanical Systems), TPMS(Tire pressure monitoring system)¿¡´ëÇÑ ¼ÒÀçºÐ¼®, ȸ·Î ¾î¼Àºí¸®(assembly), Á¦Á¶°øÁ¤, Á¦Á¶ºñ¿ëÀÇ ³»¿ª, ÆÇ¸Å°¡°Ý ¿¹Ãø µîÀ» Á¶»çÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ Àü±â Ȱ¼º °íºÐÀÚ ½ÃÀå(2009¡­2014³â)
Global Electroactive Polymers Market (2009 - 2014)
  Pub Time : 2010/02
  Published by : Markets and Markets
Àü±â Ȱ¼º °íºÐÀÚ¸¦ ÀÌ¿ëÇÑ ´Ù¾çÇÑ Á¦Ç° µ¿ÇâÀ» ºÐ¼®ÇÏ°í ½ÃÀåÀÇ µ¿Çâ, Áö¿ªº° ºÐ¼® ¹× °æÇÕ µ¿Çâ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

GaAs IC½ÃÀåºÐ¼®°ú ¿¹Ãø
The GaAs IC Market
  Pub Time : 2010/02
  Published by : The Information Network
º» º¸°í¼­´Â GaAs IC ±â¼úÀÇ °úÁ¦, ¿ëµµ ½ÃÀå, IC °ø±ÞÀÚ¿Í ÃÖÁ¾ ¼ÒºñÀÚ°¡ Á÷¸éÇÑ °úÁ¦¿Í ½ÃÀå¿¡ °üÇÑ ¿¹Ãø°ú ÁÖ¿ä Á¦Á¶¾÷üÀÇ ÇÁ·ÎÆÄÀÏ µîÀ» ´ë·« ¾Æ·¡¿Í °°Àº ±¸¼ºÀ¸·Î ÀüÇØ µå¸³´Ï´Ù.

¼¼°èÀÇ ÆÕ ¿¹Ãø(ÆÕ Á¦Á¶´É·Â º¸°í¼­)
World Fab Forecast - Detailed Quarterly Forecast for the Frontend Semiconductor Fabs
  Pub Time : 2010/02
  Published by : SEMI
ÇâÈÄ 18°³¿ù°£ ¼¼°èÀÇ ÆÕ¿¡ °üÇÑ °³¿ä ¹× ¼³ºñÅõÀÚ, ±â¼ú, Á¦Ç°¿¡ °üÇÑ µ¿Çâ µîÀ» ÀüÇØµå¸³´Ï´Ù.

3D IC & TSV ÀÎÅÍÄ¿³ØÅÍ : 2009³â
3D-IC & TSV Interconnects 2010
  Pub Time : 2010/02
  Published by : Yole Developpement
3D IC ÆÐŰ¡ÀÇ ºñÁî´Ï½º »ç·Ê ºÐ¼®°ú 3D TSV(°üÅë Àü±Ø) ºñ¾Æ(Via) Á¦ÀÛ ÇÁ·Î¼¼½ºÀÇ °¢Á¾ ½Ã³ª¸®¿À¿¡ °üÇÑ º¸°í¼­¸¦ Á¤¸®Çϰí SD IC ¹× TSV ÀÎÅÍÄ¿³ØÅÍÀÇ ½ÃÀå µ¿Çâ, ½ÃÀå ¿¹Ãø, ÁÖ¿ä ±â¾÷ÀÇ ½ÃÀå Á¡À¯À², °¢Á¾ ±â¼úÀÇ ·Îµå¸Ê, SD ÅëÇÕÀÇ °úÁ¦, SD TSVÀÇ ºñ¾Æ Á¦ÀÛ °¢Á¾ ½Ã³ª¸®¿À, ºñ¿ë ºÐ¼® ¹× Ãßõ Àü·« µîÀ» ÀüÇØµå¸³´Ï´Ù.

Ä¿³ØÅÍÀÇ Á¾·ù ¹× ±â¼ú : ¼ºÀåÀÇ ÀÚ¼¼
Connector Types And Technologies Poised For Growth
  Pub Time : 2010/02
  Published by : Bishop & Associates, Inc.
¼ºÀåÇÒ °ÍÀ̶ó Àü¸ÁµÇ´Â Ä¿³ØÅÍÀÇ Á¾·ù ¹× Ä¿³ØÅÍÀÇ ¼ºÀåÀ» ÃËÁø½ÃŰ´Â »õ·Î¿î ÀüÀÚ Á¦Ç°°ú ±â¼ú¿¡ ´ëÇÏ¿© »ó¼¼È÷ Á¶»ç ºÐ¼®ÇÏ°í °¢ Ä¿³ØÅÍÀÇ Á¦Ç° °³¿ä, ÀüÇüÀûÀÎ ¾ÖÇø®ÄÉÀ̼Ç, 2013³â±îÁöÀÇ ¼¼°è ½ÃÀå ¿¹Ãø ¹× ½ÃÀå µ¿Çâ µîÀ» ÀüÇØµå¸³´Ï´Ù.

ÀÇ·á ¿µ»ó ½ÃÀå - ¼¼°èÀÇ µð½ºÇ÷¹ÀÌ ¹× ÈÄó¸®(Post-Processing) ¼ÒÇÁÆ®¿þ¾î ½ÃÀå (2009~2014³â)
Medical Imaging - Global Displays and Post-Processing Software Market (2009 -2014)
  Pub Time : 2010/02
  Published by : Markets and Markets
¼¼°èÀÇ ÀÇ·á ¿µ»ó µð½ºÇ÷¹ÀÌ ¹× ÈÄó¸®(Post-Processing) ¼ÒÇÁÆ®¿þ¾î ½ÃÀåÀ» °ËÅäÇÏ°í ½ÃÀåÀÇ °³¿ä¿Í °æÀï, Áö¿ªº° µ¿Çâ, Áß¿ä ±â¾÷ÀÇ °³¿ä µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

½º¸¶Æ®Æù ´Ü¸»±â ¹× Ĩ ½ÃÀåÀÇ ±âȸ : 2010³â
SMARTPHONE DEVICE & CHIP MARKET OPPORTUNITIES '10
  Pub Time : 2010/02
  Published by : Forward Concepts Company
¼¼°èÀÇ ½º¸¶Æ®Æù ¹× Ĩ ½ÃÀå¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, ½º¸¶Æ®Æù º¥´õ 24»çÀÇ 2009³â ½ÃÀå Á¡À¯À²°ú 2008³â°úÀÇ ºñ±³, 2014³â±îÁöÀÇ Áö¿ªº°/¹«¼± ÀÎÅÍÆäÀ̽º ±â¼úº° »ó¼¼ ¿¹ÃøÀ» ÀüÇØµå¸³´Ï´Ù.

CMOS À̹ÌÁö ¼¾¼­ÀÇ ±â¼ú ¹× ½ÃÀå : 2010³â ¸®Æ÷Æ®
CMOS Image Sensors Technologies & Markets -2010 Report
  Pub Time : 2010/02
  Published by : Yole Developpement
CMOS À̹ÌÁö ¼¾¼­ ±â¼ú ¹× ½ÃÀåÀÇ ÇöÀç¿Í ÇâÈÄ¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, ½ÃÀå ±Ô¸ð ½ÇÀû°ú ¿¹Ãø(¡­2015³â), ½ÃÀåÁ¡À¯À², Áß¿ä ¾ÖÇø®ÄÉÀ̼Ç, »õ·Î¿î ±â¼úÀÇ °³¹ß µ¿Çâ°ú Àü¸Á, Áß¿ä ±â¾÷°ú ±× µ¿Çâ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

Infineon X-GOLD 213ÀÇ eWLB ÆÐŰÁö : ¸®¹ö½º ÄÚ½ºÆÃ ºÐ¼®
ADVANCED PACKAGING: 3D IC, WLP & TSV : Infineon X-GOLD 213 - eWLB Package Reverse Costing Analysis
  Pub Time : 2010/02
  Published by : Yole Developpement
Infineon X-GOLD 213(TM)ÀÇ eWLB(embedded Wafer Level Ball Grid Array) ÆÐŰÁö¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, Àç·á ºÐ¼®, Á¦Á¶ °øÁ¤ È帧, °æÁ¦¼º ºÐ¼®, Á¦Á¶ ºñ¿ëÀÇ ³»¿ª, ÆÇ¸Å °¡°Ý ÃßÁ¤ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

Branded Tape Automation½ÃÀåÀÇ ¿¹Ãø°ú ºÐ¼®(2009~2013³â)-¾Æ½Ã¾ÆÅÂÆò¾ç Áö¿ª(ÀϺ»Á¦¿Ü)
Asia/Pacific (Excluding Japan) Branded Tape Automation Market 2009-2013 Forecast and Analysis: Semiannual Update
  Pub Time : 2010/01
  Published by : IDC
Tape Automation½ÃÀåÀÇ 09³âµµ Àü¹Ý±â¿Í 08³âµµ Àü¹Ý±â¸¦ ºñ±³Çϰí, ±¹°¡.±â¼ú.º¥´õº° ÃâÇϼö¿Í ¼öÀÍÀÇ ³»¿ª, 2013³â±îÁöÀÇ ½ÃÀå¿¹ÃøÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

2010 LED °ü·Ã ½ÃÀå ÃÑÁ¶»ç(»ó±Ç)-[ÀϺ»¾îÀÚ·á]
(JV) LED Market 2010: Comprehensive Survey Vol.1
  Pub Time : 2010/01
  Published by : Fuji Chimera Research Institute, Inc.
LED ÆÐŰÁö¿¡ °ü·ÃµÈ ¾ÖÇø®ÄÉÀÌ¼Ç µ¿Çâ, °ü·Ã ¸ðµâ, Á¶¸í±â±â, ¹ß±¤ µð¹ÙÀ̽º, ÁÖ¿ä ±â¾÷ µ¿Çâ¿¡ ´ëÇØ Á¶»çÇϰí, ÇØ´ç »ç¾÷ Àü°³¸¦ À§ÇÑ À¯¸Á Á¤º¸¸¦ ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ½º¸¶Æ®Ä«µå¤ý½º¸¶Æ®Ä«µå IC ½ÃÀå : 2010³âÆÇ
The World Market for Smart Cards & Smart Card ICs - 2010 Edition
  Pub Time : 2010/01
  Published by : IMS Research
¼¼°èÀÇ ½º¸¶Æ®Ä«µå ½ÃÀå¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí 2008³â°ú 2009³âÀÇ ÀνºÅç º£À̽º ¹× 2014³â±îÁöÀÇ ¿¹Ãø, ½º¸¶Æ®Ä«µå¤ý½º¸¶Æ®Ä«µå ICÀÇ Á¦Ç° À¯Çü, ½Ç¼ö¿äÀÚ ºÎ¹® ¹× Áö¿ªº° ³»¿ªÀ» ÇÔ²² ÀüÇØµå¸³´Ï´Ù.

½áÁö º¸È£ ºÎǰ : ¼¼°è ½ÃÀå, ÀÀ¿ë, ½Ç¼ö¿äÀÚ(2009¡­2014³âÀÇ ºÐ¼® ¹× ¿¹Ãø)
Surge Protection Components - World Markets, Applications & End-Users: 2009-2014 Analysis & Forecasts
  Pub Time : 2010/01
  Published by : Dedalus Consulting, Inc.
½áÁö º¸È£ ºÎǰ ½ÃÀåÀ» Æ÷°ýÀûÀ¸·Î ºÐ¼®ÇÏ°í ±¹°¡º°, ½Ç¼ö¿äÀÚº°, ¿ëµµº°, ±â¾÷º° Á¦Ç° µ¿Çâ ¹× 2008¡­2014³â±îÁöÀÇ ½ÃÀå µ¿Çâ°ú ¿¹ÃøÀ» ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ Àü·ù º¸È£ ÀåÄ¡ ¹× ÄÄÆ÷³ÍÆ® ½ÃÀå : Áö¿ª¤ý¾ÖÇø®ÄÉÀ̼ǤýÃÖÁ¾ »ç¿ëÀÚº° ºÐ¼®¤ý¿¹Ãø(2009-2014³â)
Current Protection Components and Devices - World Markets, Applications & End-Users: 2009-2014 Analysis & Forecasts
  Pub Time : 2010/01
  Published by : Dedalus Consulting, Inc.
¼¼°èÀÇ Àü·ù º¸È£ ÀåÄ¡ ¹× ÄÄÆ÷³ÍÆ® ½ÃÀåÀ» Æ÷°ýÀûÀ¸·Î Á¶»ç ºÐ¼®Çϰí, ±¹°¡¤ýÃÖÁ¾ »ç¿ëÀÚ¤ý¾ÖÇø®ÄÉÀÌ¼Ç µîÀÇ °¢Á¾ ¿äÀκ° ½ÃÀå ±Ô¸ð ½ÇÀû¤ý¿¹Ãø(¡­2014³â), ±â¼ú °³¿ä, °ø±Þ¾÷üÀÇ ½ÃÀåÁ¡À¯À² µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼­Áö º¸È£ ÀåÄ¡ : ¼¼°è ½ÃÀå, ÀÀ¿ë, ÃÖÁ¾ »ç¿ëÀÚ(2009-2014³âÀÇ ºÐ¼®°ú ¿¹Ãø)
Surge Protection Devices - World Markets, Applications & End-Users: 2009-2014 Analysis & Forecasts
  Pub Time : 2010/01
  Published by : Dedalus Consulting, Inc.
¼­Áö º¸È£ ÀåÄ¡ ½ÃÀåÀ» Æ÷°ýÀûÀ¸·Î ºÐ¼®Çϰí, ±¹°¡º°, ÃÖÁ¾ »ç¿ëÀÚº°, ¿ëµµº°, ±â¾÷º° Á¦Ç° µ¿Çâ, 2008-2014³âÀÇ ½ÃÀå µ¿Çâ°ú ¿¹ÃøÀ» ÇÔ²² ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¸¶ÀÌÅ©·Î ÄÁÆ®·Ñ·¯ ½ÃÀå
Strategic Analysis of the Global Microcontrollers Market
  Pub Time : 2010/01
  Published by : Frost & Sullivan
¼¼°è ¸¶ÀÌÅ©·Î ÄÁÆ®·Ñ·¯ ½ÃÀåÀÇ ½ÃÀå ¿ªÇÐ, ±â¼ú µ¿Çâ, °¡°Ý µ¿Çâ, ½ÃÀå ¿¹Ãø µîÀ» Á¤¸®ÇÏ°í °æÇÕ ±¸Á¶ ¹× ½Ç¼ö¿äÀÚ ±×·ì µîÀ» ºÐ¼®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ÅºÈ­±Ô¼Ò ¹× ÁúÈ­°¥·ý ÆÄ¿ö ¹ÝµµÃ¼ ½ÃÀå : 2010³âÆÇ
The World Market for Silicon Carbide & Gallium Nitride Power Semiconductors - 2010 Edition
  Pub Time : 2010/01
  Published by : IMS Research
¼¼°èÀÇ ÅºÈ­±Ô¼Ò ¹× ÁúÈ­°¥·ý ÆÄ¿ö ¹ÝµµÃ¼ ½ÃÀåÀÇ µ¿Çâ¿¡ ´ëÇØ ºÐ¼®Çϰí, 2019³â±îÁöÀÇ ½ÃÀå È®´ë ¿¹Ãø, ´Ù¾çÇÑ ÀÀ¿ë ºÐ¾ß¿¡¼­ÀÇ ±â¼ú °³¹ß µ¿Çâ°ú º¸±Þ·ü, °æÇÕ µ¿Çâ µîÀ» ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ´ëÇü TFT ¾×Á¤ ÆÐ³Î ½ÃÀå Àü¸Á : 2010³â ¹× 2010³â ÀÌÈÄ
Outlook for the Worldwide Large Area TFT-LCD Panel Industry in 2010 and Beyond
  Pub Time : 2010/01
  Published by : Market Intelligence & Consulting Institute (MIC)
2010³â ¼¼°è ´ëÇü TFT ¾×Á¤ ½ÃÀåÀÇ ÁÖ¿ä ¹ßÀü µ¿Çâ°ú Àå±âÀû ÃâÇÏ°í ¿¹Ãø¿¡ ´ëÇØ ºÐ¼®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¸¶ÀÌÅ©·ÎÇÁ·Î¼¼¼­ ½ÃÀå : 2010³â
2010 Microprocessors
  Pub Time : 2010/01
  Published by : Databeans, Inc.
¼¼°èÀÇ ¸¶ÀÌÅ©·ÎÇÁ·Î¼¼¼­ ½ÃÀå¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, Áö¿ªº° ¿¹Ãø, ÃÖÁ¾ »ç¿ëÀÚ »ê¾÷º° ½ÃÀå »óȲ, Á¦Á¶ ºÐ¼®, °ø±Þ¾÷üº° µ¿Çâ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ °íÈÖµµ ¹ß±¤´ÙÀÌ¿Àµå(HB-LED) ½ÃÀå ¿¹Ãø°ú ºÐ¼® : 2009-2015³â
High Brightness Light Emitting Diodes (HB-LEDs) Global Market Forecast & Analysis 2009-2015
  Pub Time : 2010/01
  Published by : ElectroniCast
¼¼°èÀÇ °íÈÖµµ ¹ß±¤´ÙÀÌ¿Àµå(HB-LED) ½ÃÀåÀÇ ÇöÀç¿Í Àü¸Á¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, Áö¿ª¤ýÄ÷¯ ŸÀÔ¤ý¾ÖÇø®ÄÉÀÌ¼Ç µî °¢Á¾ ¿äÀκ° ½ÃÀå ¿¹Ãø(¡­2015³â), ÁÖ¿ä ±â¼ú µ¿Çâ, ÁÖ¿ä °ü·Ã ±â¾÷ 175»çÀÇ ÇÁ·ÎÆÄÀÏ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ Á¶¸í¿ë LED ½ÃÀå
Light-emitting Diodes for Lighting Applications
  Pub Time : 2010/01
  Published by : BCC Research
¼¼°èÀÇ Á¶¸í¿ë LED ½ÃÀå ÇöȲ°ú Àü¸Á¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, ÇöÀçÀÇ °íü Á¶¸í ¹× LED ±â¼úÀÇ °³¿ä¿Í °³¹ß µ¿Çâ, ÃÖÁ¾ »ç¿ëÀÚ »ê¾÷¤ý¾ÖÇø®ÄÉÀ̼Ǻ° ÃâÇÏ ¿¹Ãø(¡­2015³â), ¼¼°èÀÇ Á¦Á¶¤ý¼Òºñ ºÐÆ÷, ÁÖ¿ä ±â¾÷ÀÇ ½ÃÀåÁ¡À¯À², ÇÁ·ÎÆÄÀÏ µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ ¿øÀÚÃþ ÁõÂø(ALD) ½ÃÀå
Atomic Layer Deposition
  Pub Time : 2010/01
  Published by : BCC Research
¼¼°èÀÇ ¿øÀÚÃþ ÁõÂø(ALD) ½ÃÀå ÇöȲ°ú Àü¸Á¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, ¿øÀÚÃþ ÁõÂø(ALD)ÀÇ ±â¼ú °³¿ä¿Í ±â¼ú°³¹ß µ¿Çâ, ÃÖÁ¾ »ç¿ëÀÚ »ê¾÷¤ý¾ÖÇø®ÄÉÀ̼ǤýÀç·á¤ýÀåºñ ŸÀÔº° ½ÃÀå µ¿Çâ, ½ÃÀå ¼ºÀå ¿¹Ãø(¡­2014³â), ÁÖ¿ä ±â¾÷ÀÇ ½ÃÀåÁ¡À¯À², ÇÁ·ÎÆÄÀÏ µîÀ» ÀüÇØµå¸³´Ï´Ù.

eSATA : USB3.0ÀÇ ¾Ð·ÂÀ» ¹Þ´Â ´ÏÄ¡ ÀÎÅÍÆäÀ̽º
eSATA: A Niche Interface Comes Under Pressure from USB 3.0
  Pub Time : 2010/01
  Published by : In-Stat
eSATA ½ÃÀåÀÇ PC, ¿ÜÀåÇü ÇÏµå µð½ºÅ©, STB µî »óǰ ¼¼ºÐº° »ó¼¼ ºÐ¼® ¹× ¿¹Ãø(¡­2013³â)À» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

ÅÍÄ¡ ½ºÅ©¸°ÀÇ ±â¼ú¤ýÀç·á¤ý½ÃÀå : 2010-2017³â
Touch Screens: Technologies, Materials and Markets - 2010 to 2017
  Pub Time : 2010/01
  Published by : NanoMarkets
ÅÍÄ¡ ½ºÅ©¸°ÀÇ ±â¼ú¤ýÀç·á¤ý½ÃÀå µ¿Çâ°ú Àü¸Á¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, °¢Á¾ ±â¼úÀÇ °³¿ä¤ýƯ¡, °ü·Ã ½ÃÀå ¿ä°Ç, ¾ÖÇø®ÄÉÀ̼Ǻ° 8°³³â ¿¹Ãø, Àç·á & ÄÄÆ÷³ÍÆ®ÀÇ 8°³³â ¿¹Ãø µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

±×·¡ÇÈ DRAM : »õ·Î¿î °æÇÕ È¯°æ
Graphics DRAM - A New Competitive Landscape
  Pub Time : 2010/01
  Published by : Forward Insights
±×·¡ÇÈ DRAM ½ÃÀåÀÇ ÇöȲ°ú Àü¸Á¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, ¾ÖÇø®ÄÉÀ̼ǤýÇ÷§Æûº° µ¿Çâ, ÃâÇϼö ¿¹Ãø, ÇÁ·¹ÀÓ¹öÆÛ ¿¹Ãø, ±â¼úº° ASP ¿¹Ãø(¡­2012³â), ±â¼úº° °ø±Þ¾÷ü ·Îµå¸Ê µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

3D TSV ±â¼ú ¹× ½Ã³ª¸®¿À : Via First¹ýÀΰ¡? Via Last¹ýÀΰ¡?
3D TSV Technologies & Scenarios, Via first or Via last?
  Pub Time : 2010/01
  Published by : Yole Developpement
3D TSV ÀÎÅÍÄ¿³ØÆ® ½ÃÀå µ¿Çâ, ½ÃÀå ¿¡Ãø, ÁÖ¿ä ±â¾÷ÀÇ ½ÃÀå Á¡À¯À², °¢Á¾ ±â¼úÀÇ ·Îµå¸Ê, 3D ÁýÀûÈ­¿¡¼­ÀÇ °úÁ¦, 3D TSVÀÇ Via Á¦ÀÛ ½Ã³ª¸®¿À, ºñ¿ë ºÐ¼® ¹× Ãßõ Àü·« µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

3D IC & TSV ÀÎÅÍÄ¿³ØÆ® : ºñÁî´Ï½º ¾÷µ¥ÀÌÆ® : 2010³â
3D IC & TSV Interconnects - Business Update
  Pub Time : 2010/01
  Published by : Yole Developpement
3D IC ÆÐŰ¡ ºñÁî´Ï½º »ç·Ê ºÐ¼®À» Á¤¸®Çϰí 3D IC ¹× TSV ÀÎÅÍÄ¿³ØÆ® ½ÃÀå µ¿Çâ, ½ÃÀå ¿¹Ãø, ÁÖ¿ä ±â¾÷ÀÇ ½ÃÀå Á¡À¯À², °¢Á¾ ±â¼úÀÇ ·Îµå¸Ê, 3D ÁýÀûÈ­ÀÇ °úÁ¦ µîÀ» ÀüÇØµå¸³´Ï´Ù.

SSD¿Í ¸ÖƼ ºñÆ®/¼¿ NAND Ç÷¡½Ã ¸Þ¸ð¸®ÀÇ ECC¤ý½ÅÈ£ ó¸® ±â¼ú
ECC and Signal Processing Technology for Solid State Drives and Multi-bit per cell NAND Flash Memories
  Pub Time : 2010/01
  Published by : Forward Insights
ÇöÀçÀÇ ¿¡·¯ ¼öÁ¤ ÄÚµå(ECC)¿¡ ´ëÇØ Á¶»ç ºÐ¼®Çϰí, Ç÷¡½Ã ½ÅÈ£ ó¸® ºÐ¾ßÀÇ ±â¼ú, ·Îµå¸Ê, ½ÃÀå µ¿Çâ, ºñ¿ë, °æÇÕ È¯°æ µîÀ» »ó¼¼È÷ Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ Ä¿³ØÅÍ Á¦Á¶»ç ¿¬°¨(3±Ç ¼¼Æ®) : 2010³âÆÇ
The World's Connector Companies (3 Volumes)
  Pub Time : 2010/01
  Published by : Bishop & Associates, Inc.
Àü 2ÀåÀ¸·Î ±¸¼ºµÇ¾î ÀÖÀ¸¸ç Á¦1Àå¿¡¼­´Â ¼¼°èÀÇ Ä¿³ØÅÍ Á¦Á¶»ç ±â¾÷¸í, Á¦Ç°, Æ®·¹ÀÌµå ¸¶Å©, Áö¿ª/½ÃÀ庰 ¸ÅÃâ µîÀ», Á¦2Àå¿¡¼­´Â ¼¼°è 899»çÀÇ ¾ËÆÄºª¼ø ¸®½ºÆ®¸¦ ÀüÇØµå¸³´Ï´Ù.

¼¼°èÀÇ Æ÷Å丶½ºÅ© ½ÃÀå : ¹ÝµµÃ¼ Æ÷Å丶½ºÅ© ½ÃÀåÀÇ µ¿Çâ ¹× ¿¹Ãø
Photomask Characterization Summary - Market Trends/Forecast for the Semiconductor Photomask Market
  Pub Time : 2010/01
  Published by : SEMI
¼¼°è ÁÖ¿ä 7 Áö¿ª(ºÏ¹Ì¤ýÀϺ»¤ýÀ¯·´¤ýŸÀ̿ϤýÇѱ¹¤ýÁß±¹¤ý±âŸ) Æ÷Å丶½ºÅ© ½ÃÀåÀÇ °ø±Þ Ãø¸é Ư¼ºÀ» ºÐ¼®ÇÏ°í ½ÃÀå ±Ô¸ð, ±â¾÷ÀÇ À繫 º¸°í¼­ µîÀ» ÇÔ²² ÀüÇØµå¸³´Ï´Ù.

  Page:   1  2  3  4  5  6  7  8  9  10  Next >>


| Home | Contact | E-mailing | About GII | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§| Site Map |
(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀ̼Ç
Tel:02-2025-2992, Fax:02-2025-2993, E-mail :
(C) Copyright 2009, Global Information, Inc. All rights reserved.