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Ericsson W-CDMA Power Amplifier Model KRB 1011048/60

¸®¼­Ä¡»ç EJL Wireless Research
¹ßÇàÀÏ 2008³â 03¿ù »óǰÄÚµå 63117
ÆäÀÌÁö Á¤º¸ 49 Pages, 10 Tables, 42 Exhibits
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US $ 2,500 £Ü 2,978,700 PDF by E-mail (Single User License)
US $ 7,500 £Ü 8,936,200 PDF by Email, Enterprise use license (up to five users)


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Abstract

REPORT DESCRIPTION

This report covers the design analysis of an Ericsson W-CDMA 2100MHz power amplifier unit. This unit is an integral part of an Ericsson W-CDMA base transmitting station (BTS). The unit was manufactured in early 2003.

A complete bill of materials of all active semiconductors and passive components is presented with the following information:

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Functional Component Description
  • Package Type

THERE IS NO COMPONENT PRICING INFORMATION CONTAINED WITHIN THE REPORT.

TARGETED USERS

  • Mobile Operators
  • Base Station Equipment OEMs
  • RF Subsystems Manufacturers
  • Semiconductor Manufacturers

BENEFITS

  • Proprietary Data
  • Comprehensive Bill of Materials Analysis
  • Mechanical Design Analysis

FEATURES

  • Total Pages: 49
  • Total Tables: 10
  • Total Exhibits: 42
  • Full Color Pictures of PCB and Modules
  • Mechanical Drawings and Dimensions
  • Complete Part Number Identification
  • Complete Component PCB Placement Identification

SUPPPLIERS

The following semiconductor & passive component suppliers are included in this report:

Ace Technology, Analog Devices, Anaren AVX, Freescale Semiconductor, Huber+Suhner, Intel, International Rectifier, Kemet, Maxim Integrated,Merrimac, Murata Electronics, National Semiconductor,ON Semiconductors, RF Microdevices, Samsung,Skyworks Solutions, STMicroelectronics, Texas Instruments,Tyco Electronics M/A-COM.

Table of Contents

  • EXECUTIVE SUMMARY
  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON W-CDMA RBS TECHNOLOGY

  • 1.1 Overview of Ericsson W-CDMA RBS Technology

CHAPTER 2: W-CDMA POWER AMPLIFIER PRODUCT

  • 2.1 Mechanical Analysis
  • 2.2 System Architecture Analysis
  • 2.3 Digital Control Section
  • 2.4 DC/DC Power Supply Module Section
  • 2.5 RF Cavity Filter Section
  • 2.6 Small Signal RF Section
  • 2.7 High Power RF Section

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE

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