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Strategic Analysis of the Chinese VLSI Design Services and Semiconductor Packaging Markets

리서치사 Frost & Sullivan
발행일 2007년 04월 상품코드 51021
페이지 정보 149 Pages
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US $ 7,000 ￦ 8,340,500 Web Access (Regional License)
US $ 7,500 ￦ 8,936,200 Hard Copy & Web Access (Regional License)


영문목차

Abstract

The research service provides a in-depth analysis of the Chinese VLSI Design Services and Semiconductor Packaging Markets including market and technology trends analysis, revenue forecasts, market dynamics analysis, and strategic recommendations.

Table of Contents

1. TABLE OF CONTENT

Table of Content

  • 1. Table of Content

2. EXECUTIVE SUMMARY

VLSI Design Services Market Overview

  • 1. VLSI Design Services Market Overview

Challenges - The VLSI Design Service Industry

  • 1. Challenges - The VLSI Design Service Industry

Semiconductor Packaging Market Overview

  • 1. Semiconductor Packaging Market Overview

Challenges - The Semiconductor Packaging Industry

  • 1. Challenges - The Semiconductor Packaging Industry

3. CHINESE VLSI DESIGN SERVICES MARKET

Market Definition

  • 1. VLSI Design Services Market Definitions
  • 2. Technology Definitions

Business Models

  • 1. Time and Material Model
  • 2. Fixed Price Model
  • 3. Dedicated Engagement Model
  • 4. Offshore Outsource Model
  • 5. Conclusions

Design Service Models and Design Chain Evolution

  • 1. Design Service Models
  • 2. Design Chain
  • 3. Design Service Superstore

Market Dynamics

  • 1. Industry Challenges
  • 2. Market Drivers
  • 3. Market Restraints

Trends

  • 1. Overview
  • 2. ASIC Design Starts
  • 3. ASIC Design Starts by Process Technology
  • 4. ASIC Design Trends
  • 5. ASIC Performance Trends
  • 6. FPGA Design Trends
  • 7. FPGA Performance Trends
  • 8. ASSP and Structured ASIC Design Starts
  • 9. Next Generation Product Price
  • 10. Pricing Trends

VLSI Design Services - Opportunities

  • 1. Opportunities
  • 2. Total Available Market Opportunity - Semiconductor Consumption

VLSI Design Services Market

  • 1. Salient Features of the Market
  • 2. Revenue Analysis
  • 3. Total VLSI Design Services Revenue
  • 4. VLSI Design Services Organizations Breakout

Geographic Analysis

  • 1. Regional Distribution
  • 2. Revenue Analysis by Geographic Region
  • 3. Total VLSI Design Services Revenues by Geographic Region
  • 4. Yangtze Delta
  • 5. Beijing Tianjin and Bohai Bay Around
  • 6. Pearl River Delta
  • 7. West China
  • 8. ASIC Design Gate Count by Geographic Region
  • 9. FPGA Design Gate Count by Geographic Region
  • 10. ASIC Process Technology by Geographic Region
  • 11. Employee Strength by Geographic Region
  • 12. China versus India - An Analysis

Strategic Recommendations

  • 1. Strategic Recommendations

4. CHINESE SEMICONDUCTOR PACKAGING MARKET

Market Definition

  • 1. Semiconductor Packaging Market Definitions

Technology Trends

  • 1. Current Major Packaging Technologies
  • 2. Emerging Technologies
  • 3. Major Applications of Semiconductor Packaging
  • 4. Input/Output Count and Package Size Matrix
  • 5. Technology Development of Packaging
  • 6. Trend of Packaging Requirement
  • 7. Packaging Trends

Market Dynamics

  • 1. Industry Challenges
  • 2. Market Drivers
  • 3. Market Restraints

SWOT Analysis of Semiconductor Packaging in China

  • 1. Strength
  • 2. Weakness
  • 3. Opportunities
  • 4. Threats

Semiconductor Packaging - Opportunities

  • 1. Opportunities Overview
  • 2. Opportunities: Trend of Packaging Outsourcing
  • 3. Available Market Opportunity: Semiconductor Consumption
  • 4. Available Market Opportunity: Foundry

Semiconductor Packaging - Revenues

  • 1. Salient Features of the Market
  • 2. Total Semiconductor Packaging Revenue
  • 3. Total Semiconductor Packaging Revenue by Technology

Revenue Forecasts by Technology

  • 1. Semiconductor Packaging Revenue Forecasts - Transistor Outline
  • 2. Semiconductor Packaging Revenue Forecasts - Dual In-line Package
  • 3. Semiconductor Packaging Revenue Forecasts - Small Out-line Package
  • 4. Semiconductor Packaging Revenue Forecasts - Quad Flat Package
  • 5. Semiconductor Packaging Revenue Forecasts - Ball Grid Array
  • 6. Semiconductor Packaging Revenue Forecasts - Pin Grid Array
  • 7. Semiconductor Packaging Revenue Forecasts - Chip Scale Package

Competitive Analysis

  • 1. Regional Distribution of Participants
  • 2. Market Share Analysis
  • 3. Key Competitive Factors

Company Profile of Key Market Participants

  • 1. Company Profile of Key Market Participants

Strategic Recommendations

  • 1. Strategic Recommendations
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