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Leading Chinese Mobile Phone Vendors' Component Supply Chains

¸®¼­Ä¡»ç Market Intelligence & Consulting Institute (MIC)
¹ßÇàÀÏ 2008³â 03¿ù »óǰÄÚµå 64430
ÆäÀÌÁö Á¤º¸ 18 pages
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US $ 1,880 £Ü 2,240,900 PDF by E-mail (Single User License)
US $ 3,760 £Ü 4,481,900 PDF By E-mail (2-100 User License)
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Abstract

The growth of the Chinese mobile phone industry has encouraged international component suppliers to establish a presence in China. Chinese mobile phone vendors such as Lenovo, Bird and Amoi, whose operations are heavily oriented towards the Chinese domestic market, have turnkey solutions provided by MTK or Spreadtrum in order to maintain their competitiveness vis-a-vis the smaller mobile phone brands. At the same time, they have also been using IC solutions supplied by companies such as TI, Broadcom and Agere Systems to develop mid-range and high-end EDGE phone products, so as to differentiate their mobile phone models from those of competitors and avoid becoming bogged down in vicious price competition. This report will analyze the component supply chains of six leading Chinese mobile phone vendors: Lenovo, Bird, Amoi, TCL, ZTE, and Huawei.

Table of Contents

List of Topics

Analyzes the component supply chain of six leading Chinese mobile phone vendors, including Lenovo, Bird, Amoi, TCL, ZTE, and Huawei; compares their component supply chains.

  • Lenovo Mobile
  • Bird
  • Amoi
  • TCL
  • ZTE
  • Huawei
  • Comparison of Component Supply Chains
  • MIC Perspective
  • Appendix

Access, ADI, Agere Systems, Amoi, Anadigics, Aplix, BAK, BHflex, Bird, Bitfone, Broadcom, BYD, Calcomp, Career, China Mobile, China Unicom, Chinpoon, Chipnuts, Chongyou Information Technology, Commit, Comtech, CSR, Cypress, Dalian Eastern Displays, Desay, EMP, Enea, Fostex, Foxlink, Freescale, Friwo, Gabeul Plastic, GalaxyCore, Guangdong Goworld, Hebei Jiya Electronics, Huawei, Infineon, LDI, Lenovo, Meerae, Merry, Microsoft, Motorola, MTK, Murata, Nokia, NXP, Omni Vision, Omronlighting, Phenix Optical, Picsel, Qualcomm, RFMD, Rohm, Sagem, Samsung, Sasken, Shennan Circuits, Shenzhen Tianma Microelectronics, Siano, Silicon Laboratories, Skyworks, Sony-Ericsson, Spansion, Spreadtrum, Suizhou Tiancheng, SuperPix, TCL, Tegic, Tenwei, TI, Toshiba, Trolltech, Vimicro, Vodafone, Wintek, Yamaha, ZTE

List of Tables

  • Table 1: Lenovo' s Main Hardware and Software Component Suppliers
  • Table 2: Lenovo' s Baseband IC Suppliers
  • Table 3: Bird' s Mobile Phone Component Suppliers
  • Table 4: Bird' s Baseband IC Suppliers
  • Table 5: Amoi' s Component Suppliers
  • Table 6: Amoi' s Baseband IC Suppliers
  • Table 7: TCL' s Mobile Phone Component Suppliers
  • Table 8: TCL' s Baseband IC Suppliers
  • Table 9: ZTE' s Mobile Phone Component Suppliers
  • Table 10: ZTE' s Baseband IC Suppliers
  • Table 11: Huawei' s Mobile Phone Component Suppliers
  • Table 12: Huawei' s Mobile Phone ODM Providers
  • Table 13: Leading Chinese Mobile Phone Vendors'

Baseband Solution Providers

List of Figures

  • Figure 1: Lenovo' s Mobile Phone Product Line
  • Figure 2: Bird' s Mobile Phone Product Line
  • Figure 3: Amoi' s Mobile Phone Product Line
  • Figure 4: TCL' s Mobile Phone Product Line
  • Figure 5: ZTE' s Mobile Phone and Data Card Product Line
  • Figure 6: Huawei' s Mobile Communications Terminal Product Line
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