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세계의 SOI(Silicon on Insulator) 시장 예측(-2023년) : 웨이퍼 사이즈별(200mm 및 그 이하, 300mm), 웨이퍼 타입별(RF-SOI, FD-SOI, PD-SOI, 파워 SOI, 신형 SOI), 용도별(소비자 가전, 자동차, 데이터 통신, 산업), 기술별

Silicon on Insulator (SOI) Market by Wafer Size (200 mm & less than 200 mm, 300 mm), Wafer type (RF-SOI, FD-SOI, PD-SOI, Power SOI, Emerging-SOI), Application (Consumer Electronics, Automotive, Datacom, Industrial), Technology - Global Forecast to 2023

리서치사 MarketsandMarkets
발행일 2018년 07월 상품 코드 134075
페이지 정보 영문 125 Pages
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세계의 SOI(Silicon on Insulator) 시장 예측(-2023년) : 웨이퍼 사이즈별(200mm 및 그 이하, 300mm), 웨이퍼 타입별(RF-SOI, FD-SOI, PD-SOI, 파워 SOI, 신형 SOI), 용도별(소비자 가전, 자동차, 데이터 통신, 산업), 기술별 Silicon on Insulator (SOI) Market by Wafer Size (200 mm & less than 200 mm, 300 mm), Wafer type (RF-SOI, FD-SOI, PD-SOI, Power SOI, Emerging-SOI), Application (Consumer Electronics, Automotive, Datacom, Industrial), Technology - Global Forecast to 2023
발행일 : 2018년 07월 페이지 정보 : 영문 125 Pages

이 페이지에 게재되어 있는 내용은 최신판과 약간 차이가 있을 수 있으므로 영문목차를 함께 참조하여 주시기 바랍니다. 기타 자세한 사항은 문의 바랍니다.

한글목차

세계의 SOI(Silicon on Insulator) 시장은 2018년에는 6억 8,600만 달러, 2023년에는 18억 3,250만 달러에 이르고, 2018-2023년간 연평균 복합 성장률(CAGR)은 21.7%를 나타낼 전망입니다. 시장 성장 주요인은 가전제품을 위한 이용 증가, 박막 SOI 웨이퍼 제조시 실리콘의 효과적 이용 등입니다. 웨이퍼 종류별로는 FD-SOI가, 지역별로는 아시아태평양 시장이 향후 크게 성장할 것으로 예측됩니다.

세계의 SOI(Silicon on Insulator) 시장을 조사했으며, SOI 시장의 기본 구조와 최신 상황, 웨이퍼 종류/사이즈·기술·제품·용도·지역별 시장 규모 추이와 예측, 시장 성장 영향요인, 기업간 경쟁 구도, 주요 기업 개요 등의 정보를 정리하여 전해드립니다.

제1장 서론

제2장 조사 방법

제3장 주요 요약

제4장 프리미엄 인사이트

제5장 시장 개요

  • 서론
  • 시장 역학
    • 성장 촉진요인
      • 가전기기에서의 SOI 웨이퍼 사용 증가
      • 박막 SOI 웨이퍼 제조 공정에서의 효과적인 실리콘 활용
      • SOI계 디바이스의 낮은 작동 전압과 높은 성능
    • 성장 억제요인
      • 지식재산권(IP) 에코시스템의 결여
    • 시장 기회
      • 아시아태평양에서의 IC 산업 성장과 SOI 에코시스템 확대
      • 사물인터넷(IoT)에서의 SOI 이용 증가
    • 해결해야 할 과제
      • 휘발성과 손상에 대한 민감성
      • 효과적인 유지관리
  • 밸류체인 분석
    • SOI 시장의 밸류체인

제6장 SOI 시장 : 웨이퍼 사이즈별

  • 서론
  • 200mm 및 그 이하
  • 300mm

제7장 SOI 시장 : 웨이퍼 종류별

  • 서론
  • RF-SOI
  • PD-SOI
  • FD-SOI
  • 파워 SOI
  • 신형 SOI
    • PHOTONICS-SOI
    • IMAGER-SOI

제8장 SOI 시장 : 기술별

  • 서론
  • SMART CUT
  • BONDING
  • LAYER TRANSFER

제9장 SOI 시장 : 용도별

  • 서론
  • 소비자 가전
  • 자동차
  • 데이터 통신
  • 각종 산업
  • 군, 방위 및 항공우주

제10장 SOI 시장 : 제품별

  • 서론
  • RF FEM
  • MEMS
  • 파워
  • 광통신
  • 이미지 센싱(영상 검출)

제11장 지역 분석

  • 서론
  • 북미
  • 유럽
  • 아시아태평양

제12장 경쟁 환경

  • 서론
  • 시장 순위 분석
  • 경쟁 시나리오
    • 제품 발매
    • 합의, 사업 협력
    • 제휴, 사업 확장
    • 기업 인수합병(M&A)

제13장 기업 개요

  • 주요 기업(사업 개요, 주요 제품, 최근 동향, MnM의 견해, SWOT 분석)
    • SOITEC
    • SHIN-ETSU CHEMICAL
    • GLOBALWAFERS
    • SUMCO
    • SIMGUI
    • GLOBALFOUNDRIES
    • STMICROELECTRONICS N.V.
    • TOWERJAZZ
    • NXP SEMICONDUCTORS N.V.
    • MURATA MANUFACTURING
    • SKYWORKS SOLUTIONS
    • QORVO
  • 기타 기업
    • Sony
    • MAGNACHIP SEMICONDUCTOR
    • UNITED MICROELECTRONICS CORPORATION
    • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    • QUALCOMM
  • 스타트업 에코시스템
    • INEDA SYSTEMS
    • EVADERIS
    • WAFERPRO

제14장 부록

LSH 18.08.03

LIST OF TABLES

  • TABLE 1: SOI MARKET, BY WAFER SIZE, 2015-2023 (USD MILLION)
  • TABLE 2: SOI MARKET FOR 200-MM AND <200-MM WAFERS, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 3: SOI MARKET FOR 300 MM WAFERS, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 4: SOI MARKET, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 5: RF-SOI MARKET, BY WAFER SIZE, 2015-2023 (USD MILLION)
  • TABLE 6: RF-SOI MARKET, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 7: RF-SOI MARKET, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 8: FD-SOI MARKET, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 9: FD-SOI MARKET, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 10: POWER-SOI MARKET, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 11: POWER-SOI MARKET, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 12: EMERGING-SOI MARKET, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 13: EMERGING-SOI MARKET, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 14: SOI MARKET, BY TECHNOLOGY, 2015-2023 (USD MILLION)
  • TABLE 15: SOI MARKET, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 16: SOI MARKET FOR CONSUMER ELECTRONICS, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 17: SOI MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 18: SOI MARKET FOR AUTOMOTIVE, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 19: SOI MARKET FOR AUTOMOTIVE, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 20: SOI MARKET FOR DATACOM & TELECOM, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 21: SOI MARKET FOR DATACOM & TELECOM, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 22: SOI MARKET FOR INDUSTRIAL, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 23: SOI MARKET FOR INDUSTRIAL APPLICATION, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 24: SOI MARKET FOR MILITARY, DEFENSE, & AEROSPACE, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 25: SOI MARKET FOR MILITARY, DEFENSE, & AEROSPACE, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 26: SOI MARKET, BY PRODUCT, 2015-2023 (USD MILLION)
  • TABLE 27: SOI MARKET, BY REGION, 2015-2023 (USD MILLION)
  • TABLE 28: SOI MARKET IN NORTH AMERICA, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 29: SOI MARKET IN NORTH AMERICA, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 30: SOI MARKET IN EUROPE, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 31: SOI MARKET IN EUROPE, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 32: SOI MARKET IN APAC, BY WAFER TYPE, 2015-2023 (USD MILLION)
  • TABLE 33: SOI MARKET IN APAC, BY APPLICATION, 2015-2023 (USD MILLION)
  • TABLE 34: RANKING OF TOP 5 PLAYERS IN SOI MARKET 80  
  • TABLE 35: PRODUCT LAUNCHES, 2017-2018
  • TABLE 36: AGREEMENTS AND COLLABORATIONS, 2017-2018
  • TABLE 37: PARTNERSHIPS AND EXPANSIONS, 2014-2018
  • TABLE 38: MERGERS & ACQUISITIONS, 2015-2017

LIST OF FIGURES

  • FIGURE 1: SOI MARKET: RESEARCH DESIGN
  • FIGURE 2: RESEARCH FLOW OF MARKET SIZE ESTIMATION
  • FIGURE 3: MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • FIGURE 4: MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
  • FIGURE 5: DATA TRIANGULATION
  • FIGURE 6: SOI MARKET FOR 300 MM WAFER TO GROW AT HIGHER CAGR DURING FORECAST PERIOD
  • FIGURE 7: FD-SOI WAFER TYPE MARKET EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2018 AND 2023
  • FIGURE 8: SOI MARKET FOR AUTOMOTIVE AND CONSUMER ELECTRONICS TO GROW AT HIGH CAGR BETWEEN 2018 AND 2023
  • FIGURE 9: APAC EXPECTED TO BE THE FASTEST-GROWING REGION IN THE SOI MARKET DURING THE FORECAST PERIOD
  • FIGURE 10: EXPANSION OF SOI ECOSYSTEM IN APAC EXPECTED TO SPUR THE SOI MARKET DURING THE FORECAST PERIOD
  • FIGURE 11: MARKET FOR MEMS TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 12: EUROPE HELD LARGEST SHARE OF THE SOI MARKET IN 2017
  • FIGURE 13: MARKET FOR AUTOMOTIVE TO GROW AT THE HIGHEST CAGR DURING 2018-2023
  • FIGURE 14: SMART CUT TO HOLD THE LARGEST SHARE OF THE SOI MARKET BY 2023
  • FIGURE 15: INCREASING USE OF SOI WAFERS IN CONSUMER ELECTRONIC DEVICES DRIVES THE GROWTH OF MARKET
  • FIGURE 16: SOI MARKET: MAJOR VALUE ADDED DURING WAFER MANUFACTURING AND FOUNDRIES PHASE
  • FIGURE 17: SOI MARKET, BY WAFER SIZE
  • FIGURE 18: MARKET FOR 300-MM WAFER SIZE TO GROW AT A HIGHER CAGR DURING 2018-2023
  • FIGURE 19: SOI MARKET, BY WAFER TYPE
  • FIGURE 20: MARKET FOR FD-SOI WAFER TYPE TO GROW AT THE HIGHEST CAGR BETWEEN 2018 AND 2023
  • FIGURE 21: SOI MARKET, BY TECHNOLOGY
  • FIGURE 22: MARKET FOR SMART CUT TO GROW AT HIGHEST CAGR BETWEEN 2018 AND 2023
  • FIGURE 23: PROCESS OF SOI WAFER MANUFACTURING USING SMART CUT TECHNOLOGY
  • FIGURE 24: PROCESS OF BONDING SOI
  • FIGURE 25: SOI MARKET, BY APPLICATION
  • FIGURE 26: CONSUMER ELECTRONICS APPLICATION TO DOMINATE SOI MARKET DURING THE FORECAST PERIOD
  • FIGURE 27: SOI MARKET, BY PRODUCT
  • FIGURE 28: MARKET FOR MEMS PRODUCT TO GROW AT HIGHEST CAGR BETWEEN 2018 AND 2023
  • FIGURE 29: SOI MARKET FOR APAC TO GROW AT HIGHEST CAGR DURING THE FORECAST PERIOD
  • FIGURE 30: SNAPSHOT: SOI MARKET IN NORTH AMERICA 72  
  • FIGURE 31: SNAPSHOT: SOI MARKET IN EUROPE
  • FIGURE 32: SNAPSHOT: SOI MARKET IN APAC
  • FIGURE 33: COMPANIES ADOPTED PRODUCT LAUNCHES AND DEVELOPMENTS AS KEY GROWTH STRATEGIES BETWEEN 2016 AND 2017
  • FIGURE 34: SOITEC: COMPANY SNAPSHOT
  • FIGURE 35: SHIN-ETSU CHEMICAL: COMPANY SNAPSHOT
  • FIGURE 36: GLOBALWAFERS: COMPANY SNAPSHOT
  • FIGURE 37: SUMCO: COMPANY SNAPSHOT
  • FIGURE 38: STMICROELECTRONICS N.V.: COMPANY SNAPSHOT
  • FIGURE 39: TOWERJAZZ: COMPANY SNAPSHOT
  • FIGURE 40: NXP SEMICONDUCTORS N.V.: COMPANY SNAPSHOT
  • FIGURE 41: MURATA MANUFACTURING: COMPANY SNAPSHOT
  • FIGURE 42: SKYWORKS SOLUTIONS: COMPANY SNAPSHOT
  • FIGURE 43: QORVO: COMPANY SNAPSHOT

영문목차

"The silicon on insulator (SOI) market is estimated to grow at a CAGR of 21.7% between 2018 and 2023"

The overall SOI market is expected to reach USD 1,832.5 million by 2023 from USD 686.0 million by 2018, at a CAGR of 21.7% during 2018-2023. The increasing use of SOI wafers in consumer electronic devices and effective use of silicon during the manufacture of thin SOI wafers are the key factors contributing to the growth of the SOI market. However, lack of intellectual property (IP) ecosystem is a key restraint for the growth of the SOI market. Growing IC industry and expansion of SOI ecosystem in APAC and increasing use of SOI in IOT are the major opportunities for the studied market.

"The market for FD-SOI is expected to grow at the highest CAGR during the forecast period"

Among the wafer types of SOI, the market for FD-SOI is expected to grow at the highest CAGR during the forecast period. This growth is mainly attributed to the developments such as the introduction of FD-SOI based 12FDX by GlobalFoundries (US) and features offered by FD-SOI wafers such as ultralow voltage operation and high-performance mixed-signal integration.

"The SOI market in APAC is expected to grow at the highest CAGR during the forecast period"

APAC is expected to be the fastest-growing market for SOI during the forecast period owing to the expansion of SOI ecosystem in the region. Moreover, the adoption of SOI wafer-based products in consumer electronic, datacom and telecom, and automotive applications is expected to boost the growth of the SOI market in APAC.

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts. The breakup of the profiles of primary participants has been given below:

  • By Company Type: Tier 1-30%, Tier 2-45%, and Tier 3-25%
  • By Designation: Managers-65% and C-Level-35%
  • By Region: Europe-40%, Americas-27%, and APAC-33%

Key market players profiled in this report are as follows:

  • Soitec (France)
  • Shin-Etsu Chemical (Japan)
  • GlobalWafers (Taiwan)
  • SUMCO (Japan)
  • Simgui (China)
  • GlobalFoundries (US)
  • STMicroelectronics N.V. (Switzerland)
  • TowerJazz (Israel)
  • NXP Semiconductor N.V. (Netherlands)
  • Murata Manufacturing (Japan)

Research Coverage:

The report on the SOI market covers the market segmented on the basis of the following segments: wafer size, wafer type, technology, application, product, and geography. The market has been segmented on the basis of wafer size into 200 mm and less than 200 mm, and 300 mm. Based on wafer type, the SOI market has been classified into RF-SOI, PD-SOI, FD-SOI, Power-SOI, and emerging-SOI. Based on technology, the SOI market has been classified into smart cut, bonding, and layer transfer. The market has been segmented on the basis of application, the SOI market has been classified into automotive; consumer electronics; datacom and telecom; military, defense, & aerospace; and industrial. The market has been segmented on the basis of product, RF FEM, MEMS, power, optical communication, and image sensing. The market, on the basis of geography, has been segmented into North America, Europe, and APAC.

Key Benefits of Buying the Report:

  • Illustrative segmentation, analysis, and forecast for the market on the basis of wafer size, wafer type, technology, application, product, and geography have been conducted to give the overall view of the SOI market.
  • The value chain analysis is provided to provide an in-depth insight into the SOI market.
  • Major drivers, restraints, opportunities, and challenges for the SOI market have been detailed in this report.
  • The report includes a detailed competitive landscape and revenue of the key players.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. STUDY OBJECTIVES
  • 1.2. DEFINITION
  • 1.3. SCOPE
    • 1.3.1. MARKETS COVERED
    • 1.3.2. YEARS CONSIDERED
  • 1.4. CURRENCY
  • 1.5. LIMITATIONS
  • 1.6. MARKET STAKEHOLDERS

2. RESEARCH METHODOLOGY

  • 2.1. RESEARCH DATA
    • 2.1.1. SECONDARY DATA
      • 2.1.1.1. Secondary sources
    • 2.1.2. PRIMARY DATA
      • 2.1.2.1. Primary sources
      • 2.1.2.2. Key industry insights
      • 2.1.2.3. Breakdown of primaries
  • 2.2. MARKET SIZE ESTIMATION
    • 2.2.1. BOTTOM-UP APPROACH
    • 2.2.2. TOP-DOWN APPROACH
  • 2.3. MARKET BREAKDOWN AND DATA TRIANGULATION
  • 2.4. RESEARCH ASSUMPTIONS

3. EXECUTIVE SUMMARY

4. PREMIUM INSIGHTS

  • 4.1. ATTRACTIVE GROWTH OPPORTUNITIES IN THE SOI MARKET
  • 4.2. SOI MARKET, BY PRODUCT
  • 4.3. SOI MARKET, BY REGION AND WAFER TYPE
  • 4.4. SOI MARKET, BY APPLICATION
  • 4.5. SOI MARKET, BY TECHNOLOGY

5. MARKET OVERVIEW

  • 5.1. INTRODUCTION
  • 5.2. MARKET DYNAMICS
    • 5.2.1. DRIVERS
      • 5.2.1.1. Increasing use of SOI wafers in consumer electronic devices
      • 5.2.1.2. Effective use of silicon during the manufacture of thin SOI wafers
      • 5.2.1.3. Low operating voltage and high performance offered by SOI-based devices
    • 5.2.2. RESTRAINTS
      • 5.2.2.1. Lack of intellectual property (IP) ecosystems
    • 5.2.3. OPPORTUNITIES
      • 5.2.3.1. Growing IC industry and expansion of SOI ecosystem in APAC
      • 5.2.3.2. Increasing use of SOI in IoT
    • 5.2.4. CHALLENGES
      • 5.2.4.1. Volatility and susceptibility toward damages
      • 5.2.4.2. Effective maintenance
  • 5.3. VALUE CHAIN ANALYSIS
    • 5.3.1. SOI MARKET VALUE CHAIN

6. SOI MARKET, BY WAFER SIZE

  • 6.1. INTRODUCTION
  • 6.2. 200 MM AND LESS THAN 200 MM
  • 6.3. 300 MM

7. SOI MARKET, BY WAFER TYPE

  • 7.1. INTRODUCTION
  • 7.2. RF-SOI
  • 7.3. PD-SOI
  • 7.4. FD-SOI
  • 7.5. POWER-SOI
  • 7.6. EMERGING-SOI
    • 7.6.1. PHOTONICS-SOI
    • 7.6.2. IMAGER-SOI

8. SOI MARKET, BY TECHNOLOGY

  • 8.1. INTRODUCTION
  • 8.2. SMART CUT
  • 8.3. BONDING
  • 8.4. LAYER TRANSFER

9. SOI MARKET, BY APPLICATION

  • 9.1. INTRODUCTION
  • 9.2. CONSUMER ELECTRONICS
  • 9.3. AUTOMOTIVE
  • 9.4. DATACOM & TELECOM
  • 9.5. INDUSTRIAL
  • 9.6. MILITARY, DEFENSE, & AEROSPACE

10. SOI MARKET, BY PRODUCT

  • 10.1. INTRODUCTION
  • 10.2. RF FEM
  • 10.3. MEMS
  • 10.4. POWER
  • 10.5. OPTICAL COMMUNICATION
  • 10.6. IMAGE SENSING

11. GEOGRAPHIC ANALYSIS

  • 11.1. INTRODUCTION
  • 11.2. NORTH AMERICA
  • 11.3. EUROPE
  • 11.4. ASIA PACIFIC

12. COMPETITIVE LANDSCAPE

  • 12.1. INTRODUCTION
  • 12.2. MARKET RANKING ANALYSIS, 2017
  • 12.3. COMPETITIVE SCENARIO
    • 12.3.1. PRODUCT LAUNCHES
    • 12.3.2. AGREEMENTS AND COLLABORATIONS
    • 12.3.3. PARTNERSHIPS AND EXPANSIONS
    • 12.3.4. MERGERS & ACQUISITIONS

13. COMPANY PROFILE (Business overview, Products offered, Recent developments, MNM view, SWOT analysis)*

  • 13.1. KEY PLAYERS
    • 13.1.1. SOITEC
    • 13.1.2. SHIN-ETSU CHEMICAL
    • 13.1.3. GLOBALWAFERS
    • 13.1.4. SUMCO
    • 13.1.5. SIMGUI
    • 13.1.6. GLOBALFOUNDRIES
    • 13.1.7. STMICROELECTRONICS N.V.
    • 13.1.8. TOWERJAZZ
    • 13.1.9. NXP SEMICONDUCTORS N.V.
    • 13.1.10. MURATA MANUFACTURING
    • 13.1.11. SKYWORKS SOLUTIONS
    • 13.1.12. QORVO
  • 13.2. OTHER KEY PLAYERS
    • 13.2.1. SONY CORPORATION
    • 13.2.2. MAGNACHIP SEMICONDUCTOR
    • 13.2.3. UNITED MICROELECTRONICS CORPORATION
    • 13.2.4. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    • 13.2.5. QUALCOMM
  • 13.3. START-UP ECOSYSTEM
    • 13.3.1. INEDA SYSTEMS
    • 13.3.2. EVADERIS
    • 13.3.3. WAFERPRO

*Business overview, Products offered, Recent developments, MNM view, SWOT analysis might not be captured in case of unlisted companies.

14. APPENDIX

  • 14.1. DISCUSSION GUIDE
  • 14.2. KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 14.3. AVAILABLE CUSTOMIZATIONS
  • 14.4. RELATED REPORTS
  • 14.5. AUTHOR DETAILS
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