Emerging Trends in SMD Placement

리서치사	Technical Insights, Inc.
발행일	2007년 09월	상품코드	56999
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영문목차

This research service focuses on the latest trends in surface mount device (SMD) placement system and its relevant technologies.

Technology Snapshot
- The Emergence of SMD Assembly Process
- Overview of the SMD Assembly Process
SMD Performance and Components
- Factors that Influence SMD Assembly
- SMD Assembly Components

Types of SMD Placement Designs
- Overview
- Turret-Style Systems
- Pick and Place Systems
- Multistation Systems
Summary and Key Companies
- Summary
- Key Players in this Sector

Placement Technology
- Modular Design Using Parallel Placement
- Vision Systems
- Placement Optimization Issues
- Placement Head Technology
Related Technologies and Issues
- Standardization
- Supporting Miniaturization (01005)
- New Packaging and Board Technologies
- Problems of Lead-Free Solder
- Rework Technologies

Global Developments in Placement Machine Technology
- Hybrid Pick and Place Machine--Netherlands
- Handling Capability and Speedpack Upgrade to a Series--Netherlands
- New MG-2 Chipshooter for M Series--Netherlands
- Upgrades in X Series--Netherlands
- Linear Motor Driven AdVantis XS--USA
- Lightning Placement Technology--USA
- Gold Dual-Lane and Black Midrange Electric Tape Feeder--USA
- World' s First Parallel 2D/3D Inspection--Germany
- New D-Series Placement Machines--Germany
- Boosting the Capability of Siplace through Acquisitions--Germany
- Linear Motors in High Speed HLX Series--Germany
Global Developments Affecting Placement Technology
- StencilQuick Rework Solution--USA
- Fully-Hermetic Plastic Packaging--USA
- Assembléon and Yamaha Intelligent Machinery Partnership--Germany and Japan
- New Solder Ball Feeder Equipment--UK