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시장보고서
Advances in Thermal Interface Materials
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Abstract
This research service talks about technology developments in the field of
thermal interface materials.
Table of Contents
1 EXECUTIVE SUMMARY
- Scope and Methodology
- Scope
- Methodology
- Thermal Interface Materials Webwatch Directory
- Overview
- Overview
- Global Technology Highlights (North America; Europe)
2 ADVANCED THERMAL INTERFACE MATERIALS INTRODUCTION (NORTH AMERICA; EUROPE)
- Thermal Interface Materials Overview
- The Ideal Interface
- Types of Thermal Interface Materials
- Temperature and Electronic Device Failure
- Thermal Management Performance Simulation
- Thermal Interface Materials Market Trends and Drivers
- Miniaturization Trends Follow Moore' s Law
- Trendsetting LED Illumination Technology
- Leading Indicator Market Drivers
3 ENABLING MATERIAL AND PROCESS TECHNOLOGY ADOPTION IN ADVANCED THERMAL INTERFACE MATERIALS (NORTH AMERICA; EUROPE)
- Thermal Interface Material Options
- Types of Thermal Interface Materials
- TIM Advantages and Disadvantages
- Gap Filler Thermal Interface Materials
- Gap Fillers Defined
- Sheet or Putty Gap Filler
- Ultrasoft Gap Filler Materials
- Thermally Conductive Adhesives
- TIM Adhesives
- Loctite Bead-on-Bead Thermally Conductive Adhesive
- High-Thermal Conductivity Adhesive
- Thermally Conductive Grease
- Thermal Grease Performance
- Dow Corning' s New Thermally Conductive Grease
- Electrically Insulative TIM
- Electrical Properties of TIM
- Electrically Nonconductive Thermal Pastes
- Laird Technologies Thermally Conductive Insulating Material
- Phase Change Materials
- Phase Change Thermal Interface Materials
- Screen Printable Phase Change Material
- High-Performance Thermal Interface Materials
- Carbon and Graphite Advances TIM Development
- Carbon Nanotube Array Thermal Interface
4 ADVANCES IN THERMAL INTERFACE MATERIAL TECHNOLOGY AND APPLICATIONS (NORTH AMERICA; EUROPE; AND ASIA)
- Application Challenges
- Thermal Interface Materials Meet a Range of Application Challenges
- Next Generation TIMs to Meet the Challenges of Next Generation
Applications
- TIM in Microprocessor and Computer Related Applications
- Intel' s Santa Rosa Platform; Merom CPU uses PSH-TIM
- Desktop and Server Processor Thermal Solutions
- Thermal Interface Applications in Aerospace
- Novel PC-TIM on Hubble Repair Mission
- NASA' s Space Shuttle Infrared Camera uses Gap Filler (TIM)
- LED Thermal Interface Applications
- LEDs and Heat Build-up Protection
- LEDs for Automotive Headlights
- Other Thermal Interface Applications
- Metallic TIMs for Power and RF Semiconductors
- Stock-Shaped TIM for Transistors
5 ADVANCE IN THERMAL INTERFACE MATERIAL TECHNOLOGY AND MARKET ASSESSMENT (NORTH AMERICA; EUROPE)
- Advances in Thermal Interface Materials
- Academic Research Advances in Thermal Interface Materials
- Thermal Interface Materials Business Dynamics
- Advances in Development of Next Generation Thermal Interface Materials
- Next Generation TIM Consortium
- CTRC Cooperative Research Center
- Advances in Thermal Interface Material Strategies
- Dow Corning Electronics' Move into Fabricated TIM
- Thermal Management a Top Priority at Henkel Loctite
- Advances in Thermal Interface Application Strategies
- Chomerics' Cross Market TIM Application Development Focus
- Universal Science Sees Strong Growth in LED Thermal Management
6 PATENTS AND GLOSSARY
- Key Patents Listing
- Advances in Thermal Interface Materials Related Patents-United States
- Advances in Thermal Interface Materials Related Patents-European and
World
- Advances in Thermal Interface Materials Glossary and Additional Plastics
Resources
- Advances in Thermal Interface Materials Glossary
- Additional Plastics Resources
7 CRITICAL REFERENCE TABLES
- Database Tables
- Global PCB Sales (2002 to 2012)
- Electronic Components Percentage Distribution (2002 to 2012)
- Total PC Installed Base (2002 to 2012)
- Total Pigment Production (2002 to 2012)
- Total Number of Households (2002 to 2012)
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