홈 카테고리 맞춤형시장조사 국제컨퍼런스 글로벌 파트너 메일링 서비스 회사소개회사소개 Contact Us
English Japaness Chinese
Home > 시장보고서 > 전자부품/반도체 > 반도체 제조장비 > WLP 2009 - Technologies, applications and market
카테고리
전자부품/반도체 (1998)
디스플레이 (217)
멤스(MEMS) (100)
반도체 재료 (76)
반도체 제조장비 (463)
센서 (195)
인쇄전자 (122)
조명/LED (189)
커넥터 (58)
파워디바이스 (108)
시장보고서

WLP 2009 - Technologies, applications and market

리서치사 Yole Developpement
발행일 2009년 09월 상품코드 100735
페이지 정보 286 pages
가격
US $ 4,990 ￦ 5,905,100 PDF by E-mail (Single User License)
US $ 7,590 ￦ 8,982,000 PDF by E-mail (Multi-User License)


영문목차

Abstract

A complete update on Wafer Level Packaging technologies with market status and forecast

MARKET TRENDS

Wafer Level Packaging is a confirmed high growth trend in the semiconductor packaging industry. Wafer Level Chip Scale Packaging (WLCSP), or the direct bonding of bumped integrated circuits (IC' s) on printed circuit boards (PCB' s) as one of the most visible expressions of WLP, is undoubtedly the fastest growing package type in the whole industry. Yole forecasts that it will exceed 10 billion units per year by 2012, at a compound annual growth rate of more than 20% over the next 5 years.

Primarily driven by footprint and thickness reduction of packaged integrated circuits in mobile phones, WLCSP is now used in a wide range of circuits for handsets: EMI/ESD interface protection; power supply (PMIC/PMU, DC/DC converters, LED drivers, MOSFET' s,...); connectivity (Bluetooth, WLAN); and other features (FM, GPS, TV on mobile, camera).

Wafer-Level Packaging of MEMS devices is also expected to grow fast, driven here too by the handset market and its fast increasing rate of integrated sensors (MEMS microphones, accelerometers, gyroscopes, pressure and magnetic sensors).

Key features of the report

  • Detailed account of all the application fields of WLCSP (examples are Integrated circuits, DC/DC converters, GPS, Bluetooth, audio amplifiers, ...)
  • Market trends and figures in Munits and wafer size equivalent with breakdown by application. Market value evaluation in $M assembly service.
  • Wafer price ranges of WLCSP contract assembly by wafer size
  • Complete technologies and material tool-box analysis, covering WLCSP, fan-out WLCSP and chip embedding platforms, as well as WLP of MEMS devices.
    • Key drivers, Benefits and challenges of each of these technologies
    • Supply chain analysis: main contract assemblers (OSAT) for WLCSP.

Companies cited in the report:

Amkor, Analog Devices, Apple, Asahi Glass Chemicals , ASE, Analog Devices, Air Products, Austriamicrosystems, Arch Chemical, AT&S, Avago Technologies, AVX, Brewer Sciences, Bosch, Broadcom, California Micro Devices, Casio Computer, China WLCSP, Clover Electronics, CSR, Dalsa Semiconductor, DNP, DOW Chemical, Dupont, Enthone, Epcos, EPWorks, EVGroup, Fairchild Semiconductors, FlipChip International, Fraunhofer-IZM,Freescale, Fujikura, Fujifilm, i2a, IC Interconnect / JCAP, Imbera Electronics, Ibiden, IBM, IME,IMEC, IMT, Infineon, International Rectifier, JSR Micro, Maxim, MaxLinear, Mentor Graphics, MicroChem, Micron, National Semiconductor, Nanya, NEC Toppan Circuit, Nokia, NXP, OKI Electric, Omnivision, OptoPAC, Pac Tech, Replisaurus Technologies, RFMD, Rohm & Hass, Samsung, Sanyo, Schott, Sensonor, Silex, SiTime, Sharp, Shin-Etsu, Shinko, Skyworks, StatsChipPac, STMicroelectronics, STEricsson, SPIL, Sumitomo, SUSS MicroTec, Telephus, Tessera, Texas Instruments, TOK, Toshiba, Triquint, Tronic' s Microsystems, Touch Microsystems Technology, TSMC, Ultratech, VTI, Wolfson Microelectronics, Xintec.

Table of Contents

Scope of the report & definition

  • Wafer scale packaging, wafer level packaging and wafer-level chip scale packaging
  • Scope of the report
  • Application main sectors of WLP

Executive Summary

Technologies

  • Market drivers and comparisons with other package platforms
  • Limitations and challenges: reliability and pad limitation issues
  • Mother PCB IO pitch reduction rate: 0.5mm versus 0.4mm
  • Key WLP technologies
  • Equipments and materials
  • Embedded die technologies
  • Technology roadmaps

Applications

  • Present and future applications of WLP
  • WLCSP for ICs in handsets
  • WLCSP for ICs in medical, automotive and space applications
  • WLP of CMOS image sensors
  • WLP of MEMS devices

Market forecasts

  • WLCSP and WLP market value and 2008-2013 forecasts
  • WLCSP and WLP unit 2008 volumes and 2008-2013 forecasts by application main sector and by application segment
  • WLCSP and WLP 2008 wafer volumes and 2008-2013 forecasts For 6-inch, 8-inch and 12-inch wafers
  • Materials for WLP market forecasts

Cost of WLCSP

  • Cost benefits and drawbacks of WLP and WLCSP
  • Estimated outsourced WLCSP assembly wafer prices for 6-inch, 8-inch and 12-inch wafers
  • Cost comparisons with competing package platforms
  • WLCSP Cost roadmap

Supply Chain

  • Players and geographical locations
  • Respective market shares of contract WLCSP assemblers
  • Ratio contract versus in-house WLCSP assembly by wafer size
  • Supply chain perspectives

Conclusion

Back to Top