시장보고서
상품코드
1193107

웨이퍼 가공 장비 시장 : 프로세스별, 용도별, 최종사용자별 - 세계의 기회 분석, 산업 예측(2021-2031년)

Wafer Processing Equipment Market By Process, By Application, By End User : Global Opportunity Analysis and Industry Forecast, 2021-2031

발행일: | 리서치사: Allied Market Research | 페이지 정보: 영문 218 Pages | 배송안내 : 2-3일 (영업일 기준)

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 웨이퍼 가공 장비 시장은 2021년에 85억 2100만 달러, 2031년에는 144억 1610만 달러에 달하며, 2022-2031년 CAGR 5.3%를 기록할 것으로 예측됩니다.

목차

제1장 서론

제2장 주요 요약

제3장 시장의 개요

  • 시장의 정의와 범위
  • 주요 조사 결과
    • 주요 투자 포켓
  • Porter's Five Forces 분석
  • 주요 기업의 포지셔닝
  • 시장 역학
    • 촉진요인
    • 억제요인
    • 기회
  • COVID-19 영향 분석

제4장 웨이퍼 가공 장비 시장 : 프로세스별

  • 개요
    • 시장 규모·예측
  • 디포지트
    • 주요 시장 동향, 성장요인과 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 에칭
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 질량분석
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 스트립·클린
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별

제5장 웨이퍼 가공 장비 시장 : 용도별

  • 개요
    • 시장 규모·예측
  • 다이싱
    • 주요 시장 동향, 성장요인과 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 그라인딩, 프로빙
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 폴리싱
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 엣지 셰이핑
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 클리닝
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별

제6장 웨이퍼 가공 장비 시장 : 최종사용자별

  • 개요
    • 시장 규모·예측
  • 컴퓨터
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 통신
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 소비자
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 산업용
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별
  • 기타
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 점유율 분석 : 국가별

제7장 웨이퍼 가공 장비 시장 : 지역별

  • 개요
    • 시장 규모·예측
  • 북미
    • 주요 동향과 기회
    • 북미 시장 규모·예측 : 프로세스별
    • 북미 시장 규모·예측 : 용도별
    • 북미 시장의 시장 규모·예측 : 최종사용자별
    • 북미 시장 규모·예측 : 국가별
      • 미국
      • 캐나다
      • 멕시코
  • 유럽
    • 주요 동향과 기회
    • 유럽의 시장 규모·예측 : 프로세스별
    • 유럽의 시장 규모·예측 : 용도별
    • 유럽 시장 규모·예측 : 최종사용자별
    • 유럽 시장 규모·예측 : 국가별
      • 독일
      • 프랑스
      • 영국
      • 이탈리아
      • 기타 유럽 지역
  • 아시아태평양
    • 주요 동향과 기회
    • 아시아태평양의 시장 규모·예측 : 프로세스별
    • 아시아태평양의 시장 규모·예측 : 용도별
    • 아시아태평양의 시장 규모·예측 : 최종사용자별
    • 아시아태평양의 시장 규모·예측 : 국가별
      • 중국
      • 일본
      • 한국
      • 인도
      • 기타 아시아태평양
  • LAMEA
    • 주요 동향과 기회
    • LAMEA의 시장 규모·예측 : 프로세스별
    • LAMEA의 시장 규모·예측 : 용도별
    • LAMEA의 시장 규모·예측 : 최종사용자별
    • LAMEA의 시장 규모·예측 : 국가별
      • 라틴아메리카
      • 중동
      • 아프리카

제8장 기업 상황

  • 서론
  • 주요 성공 전략
  • 주요 10사의 제품 매핑
  • 경쟁 대시보드
  • 경쟁 히트맵
  • 주요 발전

제9장 기업 개요

  • Tokyo Electron Limited
  • Lam Research Corporation
  • Applied Materials, Inc.
  • spts technologies ltd
  • plasma-therm
  • Nikon Corporation
  • KLA Corporation
  • DISCO
  • Motorola Solutions, Inc.
  • hitachi kokusai linear
KSA 23.03.15

The global wafer processing equipment market was valued at $8,521.0 million in 2021, and is projected to reach $14,416.1 million by 2031, registering a CAGR of 5.3% from 2022 to 2031. The wafer processing includes activities such as formation, texturing, cleaning, dicing and etching. The texturing of wafers is done as per the application of the wafer. The equipment used for performing such a task is known as wafer processing equipment.

The demand for wafer processing equipment is due to multiple utilization of wafers for various electronic units, which is growing with greater pace. In addition, the lower cost of raw materials for manufacturing wafer is leading to lower price of such components which boosts the adoption of wafer processing equipment.

However, because of the warfare between the U.S and China, caused serious impact over the manufacturing of electronic products in North America. On the other side, the evolution of light weighted electronic components for designing lean electronic gadgets is expected to provide a new beginning in the market.

The wafer processing equipment market is segmented on the basis of process, application, end user, and region. By process, the wafer processing equipment market is fragmented into deposition, etch, mass metrology and strip & clean. By application, the market is categorized into dicing, grinding & probing, polishing, edge shaping and cleaning. By end user, the market is divided into computer, communication, consumer, industrial and others. By region, the wafer processing equipment market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The major players profiled in the wafer processing equipment market report include Applied Materials, Inc, DISCO , Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc. , Nikon Corporation, Plasma-Therm, SPTS technologies Ltd and Tokyo Electron Limited.

Key benefits for stakeholders

The study provides an in-depth analysis of the global wafer processing equipment market along with the current trends and future estimations to elucidate the imminent investment pockets.

A comprehensive analysis of the factors that drive and restrict the market growth is provided in the report.

Comprehensive quantitative analysis of the industry from 2021 to 2031 is provided to enable the stakeholders to capitalize on the prevailing market opportunities.

Key market players and their strategies have been analyzed to understand the competitive outlook of the market.

Key Market Segments

By Process

  • Depositon
  • Etch
  • Mass Metrology
  • Strip and Clean

By  Application

  • Grinding and Probing
  • Polishing
  • Edge Shaping
  • Cleaning
  • Dicing

By End User

  • Computer
  • Communication
  • Consumer
  • Industrial
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
  • Key Market Players
    • Tokyo Electron Limited
    • Lam Research Corporation
    • Applied Materials, Inc.
    • Spts technologies ltd.
    • Plasma- Therm
    • Nikon Corporation
    • KLA Corporation
    • DISCO
    • Motorola Solutions, Inc.
    • Hitachi kokusai linear

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.Report description
  • 1.2.Key market segments
  • 1.3.Key benefits to the stakeholders
  • 1.4.Research Methodology
    • 1.4.1.Secondary research
    • 1.4.2.Primary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.Key findings of the study
  • 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

  • 3.1.Market definition and scope
  • 3.2.Key findings
    • 3.2.1.Top investment pockets
  • 3.3.Porter's five forces analysis
  • 3.4.Top player positioning
  • 3.5.Market dynamics
    • 3.5.1.Drivers
    • 3.5.2.Restraints
    • 3.5.3.Opportunities
  • 3.6.COVID-19 Impact Analysis on the market

CHAPTER 4: WAFER PROCESSING EQUIPMENT MARKET, BY PROCESS

  • 4.1 Overview
    • 4.1.1 Market size and forecast
  • 4.2 Depositon
    • 4.2.1 Key market trends, growth factors and opportunities
    • 4.2.2 Market size and forecast, by region
    • 4.2.3 Market share analysis by country
  • 4.3 Etch
    • 4.3.1 Key market trends, growth factors and opportunities
    • 4.3.2 Market size and forecast, by region
    • 4.3.3 Market share analysis by country
  • 4.4 Mass Metrology
    • 4.4.1 Key market trends, growth factors and opportunities
    • 4.4.2 Market size and forecast, by region
    • 4.4.3 Market share analysis by country
  • 4.5 Strip and Clean
    • 4.5.1 Key market trends, growth factors and opportunities
    • 4.5.2 Market size and forecast, by region
    • 4.5.3 Market share analysis by country

CHAPTER 5: WAFER PROCESSING EQUIPMENT MARKET, BY  APPLICATION

  • 5.1 Overview
    • 5.1.1 Market size and forecast
  • 5.2 Dicing
    • 5.2.1 Key market trends, growth factors and opportunities
    • 5.2.2 Market size and forecast, by region
    • 5.2.3 Market share analysis by country
  • 5.3 Grinding and Probing
    • 5.3.1 Key market trends, growth factors and opportunities
    • 5.3.2 Market size and forecast, by region
    • 5.3.3 Market share analysis by country
  • 5.4 Polishing
    • 5.4.1 Key market trends, growth factors and opportunities
    • 5.4.2 Market size and forecast, by region
    • 5.4.3 Market share analysis by country
  • 5.5 Edge Shaping
    • 5.5.1 Key market trends, growth factors and opportunities
    • 5.5.2 Market size and forecast, by region
    • 5.5.3 Market share analysis by country
  • 5.6 Cleaning
    • 5.6.1 Key market trends, growth factors and opportunities
    • 5.6.2 Market size and forecast, by region
    • 5.6.3 Market share analysis by country

CHAPTER 6: WAFER PROCESSING EQUIPMENT MARKET, BY END USER

  • 6.1 Overview
    • 6.1.1 Market size and forecast
  • 6.2 Computer
    • 6.2.1 Key market trends, growth factors and opportunities
    • 6.2.2 Market size and forecast, by region
    • 6.2.3 Market share analysis by country
  • 6.3 Communication
    • 6.3.1 Key market trends, growth factors and opportunities
    • 6.3.2 Market size and forecast, by region
    • 6.3.3 Market share analysis by country
  • 6.4 Consumer
    • 6.4.1 Key market trends, growth factors and opportunities
    • 6.4.2 Market size and forecast, by region
    • 6.4.3 Market share analysis by country
  • 6.5 Industrial
    • 6.5.1 Key market trends, growth factors and opportunities
    • 6.5.2 Market size and forecast, by region
    • 6.5.3 Market share analysis by country
  • 6.6 Others
    • 6.6.1 Key market trends, growth factors and opportunities
    • 6.6.2 Market size and forecast, by region
    • 6.6.3 Market share analysis by country

CHAPTER 7: WAFER PROCESSING EQUIPMENT MARKET, BY REGION

  • 7.1 Overview
    • 7.1.1 Market size and forecast
  • 7.2 North America
    • 7.2.1 Key trends and opportunities
    • 7.2.2 North America Market size and forecast, by Process
    • 7.2.3 North America Market size and forecast, by  Application
    • 7.2.4 North America Market size and forecast, by End User
    • 7.2.5 North America Market size and forecast, by country
      • 7.2.5.1 U.S.
      • 7.2.5.1.1 Key market trends, growth factors and opportunities
      • 7.2.5.1.2 Market size and forecast, by Process
      • 7.2.5.1.3 Market size and forecast, by  Application
      • 7.2.5.1.4 Market size and forecast, by End User
      • 7.2.5.2 Canada
      • 7.2.5.2.1 Key market trends, growth factors and opportunities
      • 7.2.5.2.2 Market size and forecast, by Process
      • 7.2.5.2.3 Market size and forecast, by  Application
      • 7.2.5.2.4 Market size and forecast, by End User
      • 7.2.5.3 Mexico
      • 7.2.5.3.1 Key market trends, growth factors and opportunities
      • 7.2.5.3.2 Market size and forecast, by Process
      • 7.2.5.3.3 Market size and forecast, by  Application
      • 7.2.5.3.4 Market size and forecast, by End User
  • 7.3 Europe
    • 7.3.1 Key trends and opportunities
    • 7.3.2 Europe Market size and forecast, by Process
    • 7.3.3 Europe Market size and forecast, by  Application
    • 7.3.4 Europe Market size and forecast, by End User
    • 7.3.5 Europe Market size and forecast, by country
      • 7.3.5.1 Germany
      • 7.3.5.1.1 Key market trends, growth factors and opportunities
      • 7.3.5.1.2 Market size and forecast, by Process
      • 7.3.5.1.3 Market size and forecast, by  Application
      • 7.3.5.1.4 Market size and forecast, by End User
      • 7.3.5.2 France
      • 7.3.5.2.1 Key market trends, growth factors and opportunities
      • 7.3.5.2.2 Market size and forecast, by Process
      • 7.3.5.2.3 Market size and forecast, by  Application
      • 7.3.5.2.4 Market size and forecast, by End User
      • 7.3.5.3 UK
      • 7.3.5.3.1 Key market trends, growth factors and opportunities
      • 7.3.5.3.2 Market size and forecast, by Process
      • 7.3.5.3.3 Market size and forecast, by  Application
      • 7.3.5.3.4 Market size and forecast, by End User
      • 7.3.5.4 Italy
      • 7.3.5.4.1 Key market trends, growth factors and opportunities
      • 7.3.5.4.2 Market size and forecast, by Process
      • 7.3.5.4.3 Market size and forecast, by  Application
      • 7.3.5.4.4 Market size and forecast, by End User
      • 7.3.5.5 Rest of Europe
      • 7.3.5.5.1 Key market trends, growth factors and opportunities
      • 7.3.5.5.2 Market size and forecast, by Process
      • 7.3.5.5.3 Market size and forecast, by  Application
      • 7.3.5.5.4 Market size and forecast, by End User
  • 7.4 Asia-Pacific
    • 7.4.1 Key trends and opportunities
    • 7.4.2 Asia-Pacific Market size and forecast, by Process
    • 7.4.3 Asia-Pacific Market size and forecast, by  Application
    • 7.4.4 Asia-Pacific Market size and forecast, by End User
    • 7.4.5 Asia-Pacific Market size and forecast, by country
      • 7.4.5.1 China
      • 7.4.5.1.1 Key market trends, growth factors and opportunities
      • 7.4.5.1.2 Market size and forecast, by Process
      • 7.4.5.1.3 Market size and forecast, by  Application
      • 7.4.5.1.4 Market size and forecast, by End User
      • 7.4.5.2 Japan
      • 7.4.5.2.1 Key market trends, growth factors and opportunities
      • 7.4.5.2.2 Market size and forecast, by Process
      • 7.4.5.2.3 Market size and forecast, by  Application
      • 7.4.5.2.4 Market size and forecast, by End User
      • 7.4.5.3 South Korea
      • 7.4.5.3.1 Key market trends, growth factors and opportunities
      • 7.4.5.3.2 Market size and forecast, by Process
      • 7.4.5.3.3 Market size and forecast, by  Application
      • 7.4.5.3.4 Market size and forecast, by End User
      • 7.4.5.4 India
      • 7.4.5.4.1 Key market trends, growth factors and opportunities
      • 7.4.5.4.2 Market size and forecast, by Process
      • 7.4.5.4.3 Market size and forecast, by  Application
      • 7.4.5.4.4 Market size and forecast, by End User
      • 7.4.5.5 Rest of Asia-Pacific
      • 7.4.5.5.1 Key market trends, growth factors and opportunities
      • 7.4.5.5.2 Market size and forecast, by Process
      • 7.4.5.5.3 Market size and forecast, by  Application
      • 7.4.5.5.4 Market size and forecast, by End User
  • 7.5 LAMEA
    • 7.5.1 Key trends and opportunities
    • 7.5.2 LAMEA Market size and forecast, by Process
    • 7.5.3 LAMEA Market size and forecast, by  Application
    • 7.5.4 LAMEA Market size and forecast, by End User
    • 7.5.5 LAMEA Market size and forecast, by country
      • 7.5.5.1 Latin America
      • 7.5.5.1.1 Key market trends, growth factors and opportunities
      • 7.5.5.1.2 Market size and forecast, by Process
      • 7.5.5.1.3 Market size and forecast, by  Application
      • 7.5.5.1.4 Market size and forecast, by End User
      • 7.5.5.2 Middle East
      • 7.5.5.2.1 Key market trends, growth factors and opportunities
      • 7.5.5.2.2 Market size and forecast, by Process
      • 7.5.5.2.3 Market size and forecast, by  Application
      • 7.5.5.2.4 Market size and forecast, by End User
      • 7.5.5.3 Africa
      • 7.5.5.3.1 Key market trends, growth factors and opportunities
      • 7.5.5.3.2 Market size and forecast, by Process
      • 7.5.5.3.3 Market size and forecast, by  Application
      • 7.5.5.3.4 Market size and forecast, by End User

CHAPTER 8: COMPANY LANDSCAPE

  • 8.1. Introduction
  • 8.2. Top winning strategies
  • 8.3. Product Mapping of Top 10 Player
  • 8.4. Competitive Dashboard
  • 8.5. Competitive Heatmap
  • 8.6. Key developments

CHAPTER 9: COMPANY PROFILES

  • 9.1 Tokyo Electron Limited
    • 9.1.1 Company overview
    • 9.1.2 Company snapshot
    • 9.1.3 Operating business segments
    • 9.1.4 Product portfolio
    • 9.1.5 Business performance
    • 9.1.6 Key strategic moves and developments
  • 9.2 Lam Research Corporation
    • 9.2.1 Company overview
    • 9.2.2 Company snapshot
    • 9.2.3 Operating business segments
    • 9.2.4 Product portfolio
    • 9.2.5 Business performance
    • 9.2.6 Key strategic moves and developments
  • 9.3 Applied Materials, Inc.
    • 9.3.1 Company overview
    • 9.3.2 Company snapshot
    • 9.3.3 Operating business segments
    • 9.3.4 Product portfolio
    • 9.3.5 Business performance
    • 9.3.6 Key strategic moves and developments
  • 9.4 spts technologies ltd
    • 9.4.1 Company overview
    • 9.4.2 Company snapshot
    • 9.4.3 Operating business segments
    • 9.4.4 Product portfolio
    • 9.4.5 Business performance
    • 9.4.6 Key strategic moves and developments
  • 9.5 plasma-therm
    • 9.5.1 Company overview
    • 9.5.2 Company snapshot
    • 9.5.3 Operating business segments
    • 9.5.4 Product portfolio
    • 9.5.5 Business performance
    • 9.5.6 Key strategic moves and developments
  • 9.6 Nikon Corporation
    • 9.6.1 Company overview
    • 9.6.2 Company snapshot
    • 9.6.3 Operating business segments
    • 9.6.4 Product portfolio
    • 9.6.5 Business performance
    • 9.6.6 Key strategic moves and developments
  • 9.7 KLA Corporation
    • 9.7.1 Company overview
    • 9.7.2 Company snapshot
    • 9.7.3 Operating business segments
    • 9.7.4 Product portfolio
    • 9.7.5 Business performance
    • 9.7.6 Key strategic moves and developments
  • 9.8 DISCO
    • 9.8.1 Company overview
    • 9.8.2 Company snapshot
    • 9.8.3 Operating business segments
    • 9.8.4 Product portfolio
    • 9.8.5 Business performance
    • 9.8.6 Key strategic moves and developments
  • 9.9 Motorola Solutions, Inc.
    • 9.9.1 Company overview
    • 9.9.2 Company snapshot
    • 9.9.3 Operating business segments
    • 9.9.4 Product portfolio
    • 9.9.5 Business performance
    • 9.9.6 Key strategic moves and developments
  • 9.10 hitachi kokusai linear
    • 9.10.1 Company overview
    • 9.10.2 Company snapshot
    • 9.10.3 Operating business segments
    • 9.10.4 Product portfolio
    • 9.10.5 Business performance
    • 9.10.6 Key strategic moves and developments
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