웨이퍼 가공 장비 시장 : 프로세스별, 용도별, 최종사용자별 - 세계의 기회 분석, 산업 예측(2021-2031년)

The global wafer processing equipment market was valued at $8,521.0 million in 2021, and is projected to reach $14,416.1 million by 2031, registering a CAGR of 5.3% from 2022 to 2031. The wafer processing includes activities such as formation, texturing, cleaning, dicing and etching. The texturing of wafers is done as per the application of the wafer. The equipment used for performing such a task is known as wafer processing equipment.

The demand for wafer processing equipment is due to multiple utilization of wafers for various electronic units, which is growing with greater pace. In addition, the lower cost of raw materials for manufacturing wafer is leading to lower price of such components which boosts the adoption of wafer processing equipment.

However, because of the warfare between the U.S and China, caused serious impact over the manufacturing of electronic products in North America. On the other side, the evolution of light weighted electronic components for designing lean electronic gadgets is expected to provide a new beginning in the market.

The wafer processing equipment market is segmented on the basis of process, application, end user, and region. By process, the wafer processing equipment market is fragmented into deposition, etch, mass metrology and strip & clean. By application, the market is categorized into dicing, grinding & probing, polishing, edge shaping and cleaning. By end user, the market is divided into computer, communication, consumer, industrial and others. By region, the wafer processing equipment market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The major players profiled in the wafer processing equipment market report include Applied Materials, Inc, DISCO , Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc. , Nikon Corporation, Plasma-Therm, SPTS technologies Ltd and Tokyo Electron Limited.

Key benefits for stakeholders

The study provides an in-depth analysis of the global wafer processing equipment market along with the current trends and future estimations to elucidate the imminent investment pockets.

A comprehensive analysis of the factors that drive and restrict the market growth is provided in the report.

Comprehensive quantitative analysis of the industry from 2021 to 2031 is provided to enable the stakeholders to capitalize on the prevailing market opportunities.

Key market players and their strategies have been analyzed to understand the competitive outlook of the market.

Key Market Segments

By Process

• Depositon
• Etch
• Mass Metrology
• Strip and Clean

By  Application

• Grinding and Probing
• Polishing
• Edge Shaping
• Cleaning
• Dicing

By End User

• Computer
• Communication
• Consumer
• Industrial
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • India
  • Rest of Asia-Pacific
• LAMEA
  • Latin America
  • Middle East
  • Africa
• Key Market Players
  • Tokyo Electron Limited
  • Lam Research Corporation
  • Applied Materials, Inc.
  • Spts technologies ltd.
  • Plasma- Therm
  • Nikon Corporation
  • KLA Corporation
  • DISCO
  • Motorola Solutions, Inc.
  • Hitachi kokusai linear

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

• 1.1.Report description
• 1.2.Key market segments
• 1.3.Key benefits to the stakeholders
• 1.4.Research Methodology
  • 1.4.1.Secondary research
  • 1.4.2.Primary research
  • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

• 2.1.Key findings of the study
• 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

• 3.1.Market definition and scope
• 3.2.Key findings
  • 3.2.1.Top investment pockets
• 3.3.Porter's five forces analysis
• 3.4.Top player positioning
• 3.5.Market dynamics
  • 3.5.1.Drivers
  • 3.5.2.Restraints
  • 3.5.3.Opportunities
• 3.6.COVID-19 Impact Analysis on the market

CHAPTER 4: WAFER PROCESSING EQUIPMENT MARKET, BY PROCESS

• 4.1 Overview
  • 4.1.1 Market size and forecast
• 4.2 Depositon
  • 4.2.1 Key market trends, growth factors and opportunities
  • 4.2.2 Market size and forecast, by region
  • 4.2.3 Market share analysis by country
• 4.3 Etch
  • 4.3.1 Key market trends, growth factors and opportunities
  • 4.3.2 Market size and forecast, by region
  • 4.3.3 Market share analysis by country
• 4.4 Mass Metrology
  • 4.4.1 Key market trends, growth factors and opportunities
  • 4.4.2 Market size and forecast, by region
  • 4.4.3 Market share analysis by country
• 4.5 Strip and Clean
  • 4.5.1 Key market trends, growth factors and opportunities
  • 4.5.2 Market size and forecast, by region
  • 4.5.3 Market share analysis by country

CHAPTER 5: WAFER PROCESSING EQUIPMENT MARKET, BY  APPLICATION

• 5.1 Overview
  • 5.1.1 Market size and forecast
• 5.2 Dicing
  • 5.2.1 Key market trends, growth factors and opportunities
  • 5.2.2 Market size and forecast, by region
  • 5.2.3 Market share analysis by country
• 5.3 Grinding and Probing
  • 5.3.1 Key market trends, growth factors and opportunities
  • 5.3.2 Market size and forecast, by region
  • 5.3.3 Market share analysis by country
• 5.4 Polishing
  • 5.4.1 Key market trends, growth factors and opportunities
  • 5.4.2 Market size and forecast, by region
  • 5.4.3 Market share analysis by country
• 5.5 Edge Shaping
  • 5.5.1 Key market trends, growth factors and opportunities
  • 5.5.2 Market size and forecast, by region
  • 5.5.3 Market share analysis by country
• 5.6 Cleaning
  • 5.6.1 Key market trends, growth factors and opportunities
  • 5.6.2 Market size and forecast, by region
  • 5.6.3 Market share analysis by country

CHAPTER 6: WAFER PROCESSING EQUIPMENT MARKET, BY END USER

• 6.1 Overview
  • 6.1.1 Market size and forecast
• 6.2 Computer
  • 6.2.1 Key market trends, growth factors and opportunities
  • 6.2.2 Market size and forecast, by region
  • 6.2.3 Market share analysis by country
• 6.3 Communication
  • 6.3.1 Key market trends, growth factors and opportunities
  • 6.3.2 Market size and forecast, by region
  • 6.3.3 Market share analysis by country
• 6.4 Consumer
  • 6.4.1 Key market trends, growth factors and opportunities
  • 6.4.2 Market size and forecast, by region
  • 6.4.3 Market share analysis by country
• 6.5 Industrial
  • 6.5.1 Key market trends, growth factors and opportunities
  • 6.5.2 Market size and forecast, by region
  • 6.5.3 Market share analysis by country
• 6.6 Others
  • 6.6.1 Key market trends, growth factors and opportunities
  • 6.6.2 Market size and forecast, by region
  • 6.6.3 Market share analysis by country

CHAPTER 7: WAFER PROCESSING EQUIPMENT MARKET, BY REGION

• 7.1 Overview
  • 7.1.1 Market size and forecast
• 7.2 North America
  • 7.2.1 Key trends and opportunities
  • 7.2.2 North America Market size and forecast, by Process
  • 7.2.3 North America Market size and forecast, by  Application
  • 7.2.4 North America Market size and forecast, by End User
  • 7.2.5 North America Market size and forecast, by country
    • 7.2.5.1 U.S.
    • 7.2.5.1.1 Key market trends, growth factors and opportunities
    • 7.2.5.1.2 Market size and forecast, by Process
    • 7.2.5.1.3 Market size and forecast, by  Application
    • 7.2.5.1.4 Market size and forecast, by End User
    • 7.2.5.2 Canada
    • 7.2.5.2.1 Key market trends, growth factors and opportunities
    • 7.2.5.2.2 Market size and forecast, by Process
    • 7.2.5.2.3 Market size and forecast, by  Application
    • 7.2.5.2.4 Market size and forecast, by End User
    • 7.2.5.3 Mexico
    • 7.2.5.3.1 Key market trends, growth factors and opportunities
    • 7.2.5.3.2 Market size and forecast, by Process
    • 7.2.5.3.3 Market size and forecast, by  Application
    • 7.2.5.3.4 Market size and forecast, by End User
• 7.3 Europe
  • 7.3.1 Key trends and opportunities
  • 7.3.2 Europe Market size and forecast, by Process
  • 7.3.3 Europe Market size and forecast, by  Application
  • 7.3.4 Europe Market size and forecast, by End User
  • 7.3.5 Europe Market size and forecast, by country
    • 7.3.5.1 Germany
    • 7.3.5.1.1 Key market trends, growth factors and opportunities
    • 7.3.5.1.2 Market size and forecast, by Process
    • 7.3.5.1.3 Market size and forecast, by  Application
    • 7.3.5.1.4 Market size and forecast, by End User
    • 7.3.5.2 France
    • 7.3.5.2.1 Key market trends, growth factors and opportunities
    • 7.3.5.2.2 Market size and forecast, by Process
    • 7.3.5.2.3 Market size and forecast, by  Application
    • 7.3.5.2.4 Market size and forecast, by End User
    • 7.3.5.3 UK
    • 7.3.5.3.1 Key market trends, growth factors and opportunities
    • 7.3.5.3.2 Market size and forecast, by Process
    • 7.3.5.3.3 Market size and forecast, by  Application
    • 7.3.5.3.4 Market size and forecast, by End User
    • 7.3.5.4 Italy
    • 7.3.5.4.1 Key market trends, growth factors and opportunities
    • 7.3.5.4.2 Market size and forecast, by Process
    • 7.3.5.4.3 Market size and forecast, by  Application
    • 7.3.5.4.4 Market size and forecast, by End User
    • 7.3.5.5 Rest of Europe
    • 7.3.5.5.1 Key market trends, growth factors and opportunities
    • 7.3.5.5.2 Market size and forecast, by Process
    • 7.3.5.5.3 Market size and forecast, by  Application
    • 7.3.5.5.4 Market size and forecast, by End User
• 7.4 Asia-Pacific
  • 7.4.1 Key trends and opportunities
  • 7.4.2 Asia-Pacific Market size and forecast, by Process
  • 7.4.3 Asia-Pacific Market size and forecast, by  Application
  • 7.4.4 Asia-Pacific Market size and forecast, by End User
  • 7.4.5 Asia-Pacific Market size and forecast, by country
    • 7.4.5.1 China
    • 7.4.5.1.1 Key market trends, growth factors and opportunities
    • 7.4.5.1.2 Market size and forecast, by Process
    • 7.4.5.1.3 Market size and forecast, by  Application
    • 7.4.5.1.4 Market size and forecast, by End User
    • 7.4.5.2 Japan
    • 7.4.5.2.1 Key market trends, growth factors and opportunities
    • 7.4.5.2.2 Market size and forecast, by Process
    • 7.4.5.2.3 Market size and forecast, by  Application
    • 7.4.5.2.4 Market size and forecast, by End User
    • 7.4.5.3 South Korea
    • 7.4.5.3.1 Key market trends, growth factors and opportunities
    • 7.4.5.3.2 Market size and forecast, by Process
    • 7.4.5.3.3 Market size and forecast, by  Application
    • 7.4.5.3.4 Market size and forecast, by End User
    • 7.4.5.4 India
    • 7.4.5.4.1 Key market trends, growth factors and opportunities
    • 7.4.5.4.2 Market size and forecast, by Process
    • 7.4.5.4.3 Market size and forecast, by  Application
    • 7.4.5.4.4 Market size and forecast, by End User
    • 7.4.5.5 Rest of Asia-Pacific
    • 7.4.5.5.1 Key market trends, growth factors and opportunities
    • 7.4.5.5.2 Market size and forecast, by Process
    • 7.4.5.5.3 Market size and forecast, by  Application
    • 7.4.5.5.4 Market size and forecast, by End User
• 7.5 LAMEA
  • 7.5.1 Key trends and opportunities
  • 7.5.2 LAMEA Market size and forecast, by Process
  • 7.5.3 LAMEA Market size and forecast, by  Application
  • 7.5.4 LAMEA Market size and forecast, by End User
  • 7.5.5 LAMEA Market size and forecast, by country
    • 7.5.5.1 Latin America
    • 7.5.5.1.1 Key market trends, growth factors and opportunities
    • 7.5.5.1.2 Market size and forecast, by Process
    • 7.5.5.1.3 Market size and forecast, by  Application
    • 7.5.5.1.4 Market size and forecast, by End User
    • 7.5.5.2 Middle East
    • 7.5.5.2.1 Key market trends, growth factors and opportunities
    • 7.5.5.2.2 Market size and forecast, by Process
    • 7.5.5.2.3 Market size and forecast, by  Application
    • 7.5.5.2.4 Market size and forecast, by End User
    • 7.5.5.3 Africa
    • 7.5.5.3.1 Key market trends, growth factors and opportunities
    • 7.5.5.3.2 Market size and forecast, by Process
    • 7.5.5.3.3 Market size and forecast, by  Application
    • 7.5.5.3.4 Market size and forecast, by End User

CHAPTER 8: COMPANY LANDSCAPE

• 8.1. Introduction
• 8.2. Top winning strategies
• 8.3. Product Mapping of Top 10 Player
• 8.4. Competitive Dashboard
• 8.5. Competitive Heatmap
• 8.6. Key developments

CHAPTER 9: COMPANY PROFILES

• 9.1 Tokyo Electron Limited
  • 9.1.1 Company overview
  • 9.1.2 Company snapshot
  • 9.1.3 Operating business segments
  • 9.1.4 Product portfolio
  • 9.1.5 Business performance
  • 9.1.6 Key strategic moves and developments
• 9.2 Lam Research Corporation
  • 9.2.1 Company overview
  • 9.2.2 Company snapshot
  • 9.2.3 Operating business segments
  • 9.2.4 Product portfolio
  • 9.2.5 Business performance
  • 9.2.6 Key strategic moves and developments
• 9.3 Applied Materials, Inc.
  • 9.3.1 Company overview
  • 9.3.2 Company snapshot
  • 9.3.3 Operating business segments
  • 9.3.4 Product portfolio
  • 9.3.5 Business performance
  • 9.3.6 Key strategic moves and developments
• 9.4 spts technologies ltd
  • 9.4.1 Company overview
  • 9.4.2 Company snapshot
  • 9.4.3 Operating business segments
  • 9.4.4 Product portfolio
  • 9.4.5 Business performance
  • 9.4.6 Key strategic moves and developments
• 9.5 plasma-therm
  • 9.5.1 Company overview
  • 9.5.2 Company snapshot
  • 9.5.3 Operating business segments
  • 9.5.4 Product portfolio
  • 9.5.5 Business performance
  • 9.5.6 Key strategic moves and developments
• 9.6 Nikon Corporation
  • 9.6.1 Company overview
  • 9.6.2 Company snapshot
  • 9.6.3 Operating business segments
  • 9.6.4 Product portfolio
  • 9.6.5 Business performance
  • 9.6.6 Key strategic moves and developments
• 9.7 KLA Corporation
  • 9.7.1 Company overview
  • 9.7.2 Company snapshot
  • 9.7.3 Operating business segments
  • 9.7.4 Product portfolio
  • 9.7.5 Business performance
  • 9.7.6 Key strategic moves and developments
• 9.8 DISCO
  • 9.8.1 Company overview
  • 9.8.2 Company snapshot
  • 9.8.3 Operating business segments
  • 9.8.4 Product portfolio
  • 9.8.5 Business performance
  • 9.8.6 Key strategic moves and developments
• 9.9 Motorola Solutions, Inc.
  • 9.9.1 Company overview
  • 9.9.2 Company snapshot
  • 9.9.3 Operating business segments
  • 9.9.4 Product portfolio
  • 9.9.5 Business performance
  • 9.9.6 Key strategic moves and developments
• 9.10 hitachi kokusai linear
  • 9.10.1 Company overview
  • 9.10.2 Company snapshot
  • 9.10.3 Operating business segments
  • 9.10.4 Product portfolio
  • 9.10.5 Business performance
  • 9.10.6 Key strategic moves and developments