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1090130

세계의 수동 전자부품 및 상호 접속 전자부품 시장 규모 : 부품 유형별, 용도별, 지역별 예측(2022-2028년)

Global Passive and Interconnecting Electronic Components Market Size study, By Component Type, By Application, and Regional Forecasts 2022-2028

발행일: | 리서치사: Bizwit Research & Consulting LLP | 페이지 정보: 영문 | 배송안내 : 2-3일 (영업일 기준)

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 수동 전자부품 및 상호 접속 전자부품 시장 규모는 스마트폰과 노트북의 보급, IoT(Internet of Things) 기기 도입 확대, 최근의 인수 활동, 5G 네트워크 인프라에 대한 투자 증가, 다양한 산업에서의 자동화 진전 등에 의해 확대되고 있습니다.

한편, 원재료 비용의 변동이 예측 기간에 시장 성장을 방해할 가능성이 있습니다.

세계의 수동 전자부품(Passive Electronic Components) 및 상호 접속 전자부품(Interconnecting Electronic Components) 시장을 조사했으며, 시장 개요, 시장 분석, 부품 유형·용도·지역별 분석 및 경쟁 구도 등의 정보를 제공합니다.

목차

제1장 개요

제2장 세계의 수동 전자부품 및 상호 접속 전자부품 시장 정의와 범위

제3장 세계의 수동 전자부품 및 상호 접속 전자부품 시장 역학

  • 수동 전자부품 및 상호 접속 전자부품 시장 영향 분석(2020-2028년)

제4장 세계의 수동 전자부품 및 상호 접속 전자부품 시장 : 업계 분석

  • Porter's Five Forces 모델
  • PEST 분석
  • 투자 채용 모델
  • 애널리스트의 추천 사항과 결론
  • 주요 투자 기회
  • 주요 성공 전략

제5장 리스크 평가 : COVID-19의 영향

    • 업계에 대한 COVID-19의 전체적인 영향 평가
    • COVID-19 이전 및 COVID-19 이후의 시장 시나리오

제6장 세계의 수동 전자부품 및 상호 접속 전자부품 시장 : 부품 유형별

  • 시장 현황
  • 부품 유형별 세계의 수동 전자부품 및 상호 접속 전자부품 시장 실적-잠재성 분석
  • 부품 유형별 세계의 수동 전자부품 및 상호 접속 전자부품 시장 추정과 예측(2018-2028년)
  • 수동 전자부품 및 상호 접속 전자부품 시장, 하위 부문 분석
    • 수동
    • 상호 접속

제7장 세계의 수동 전자부품 및 상호 접속 전자부품 시장 : 용도별

  • 시장 현황
  • 용도별 세계의 수동 전자부품 및 상호 접속 전자부품 시장 실적-잠재성 분석
  • 용도별 세계의 수동 전자부품 및 상호 접속 전자부품 시장 추정과 예측(2018-2028년)
  • 수동 전자부품 및 상호 접속 전자부품 시장, 하위 부문 분석
    • 가전
    • IT 및 통신
    • 자동차
    • 산업
    • 항공우주 및 방위
    • 헬스케어
    • 기타

제8장 세계의 수동 전자부품 및 상호 접속 전자부품 시장 : 지역별

  • 지역 시장 현황
  • 북미
    • 미국
    • 캐나다
  • 유럽 현황
    • 영국
    • 독일
    • 프랑스
    • 스페인
    • 이탈리아
    • 기타 유럽
  • 아시아태평양 현황
    • 중국
    • 인도
    • 일본
    • 호주
    • 한국
    • 기타 아시아태평양
  • 라틴아메리카 현황
    • 브라질
    • 멕시코
  • 기타 지역

제9장 경쟁 정보

  • 주요 시장 전략
  • 기업 개요
    • AVX Corporation
    • Vishay Intertechnology, Inc.
    • Mouser Electronics, Inc.
    • Murata Manufacturing Co., Ltd.
    • TDK Corporation
    • Taiyo Yuden Co., Ltd.
    • Samsung Electro-Mechanics
    • Hosiden Corporation
    • Yageo Corporation
    • Nichicon Corporation

제10장 조사 프로세스

LSH 22.07.07

Global Passive and Interconnecting Electronic Components Market is valued approximately USD XX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2028. Passive Electronic Components can be defined as an electrical component that does not generate power, but instead dissipates, stores, and releases it. Passive elements include resistances, capacitors, and coils. Whereas, interconnects are structures that connect two or more circuit elements (such as transistors) together. The growing penetration of smartphones and laptops and increasing adoption of internet of things (IoT) devices as well as recent acquisition activities are factors that are accelerating the global market demand. For instance, according to Statista - In 2021, number of smartphone users globally were estimated at 6259 million, and this number is projected to grow to 7690 million by end of 2027. Furthermore, as per India Brand Equity Forum (IBEF) - In 2019, around 302 million smartphones were manufactured in India, and this number is projected to grow to 829 million by end of 2022. Moreover, in March 2022, US based KYOCERA AVX, announced acquisition of Kyoto, Japan based ROHM Semiconductor's tantalum and polymer capacitor business assets. This acquisition would help the company in strengthening its portfolio of electrolytic capacitor solutions. Also, growing investment towards 5G network infrastructure and rising automation across different industries are anticipated to act as a catalyzing factor for the market demand during the forecast period. However, volatile cost of raw materials impedes the growth of the market over the forecast period of 2022-2028.

The key regions considered for the global Passive and Interconnecting Electronic Components Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. North America is the leading region across the world in terms of market share owing to the growing investment towards 5G network infrastructure and recent acquisition activities in the region. Whereas, Asia Pacific is anticipated to exhibit a significant growth rate over the forecast period 2022-2028. Factors such as growing penetration of electric and electronics devices and rising deployment of 5G network solutions in the region, would create lucrative growth prospects for the global Passive and Interconnecting Electronic Components Market across the Asia Pacific region.

Major market players included in this report are:

AVX Corporation

Vishay Intertechnology, Inc.

Mouser Electronics, Inc.

Murata Manufacturing Co., Ltd.

TDK Corporation

Taiyo Yuden Co., Ltd.

Samsung Electro-Mechanics

Hosiden Corporation

Yageo Corporation

Nichicon Corporation

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Component Type

Passive

Interconnecting

By Application

Consumer Electronics

IT & Telecommunication

Automotive

Industrial

Aerospace & Defense

Healthcare

Others

By Region:

North America

U.S.

Canada

Europe

UK

Germany

France

Spain

Italy

ROE

Asia Pacific

China

India

Japan

Australia

South Korea

RoAPAC

Latin America

Brazil

Mexico

Rest of the World

Furthermore, years considered for the study are as follows:

Historical year - 2018, 2019, 2020

Base year - 2021

Forecast period - 2022 to 2028

Target Audience of the Global Passive and Interconnecting Electronic Components Market in Market Study:

Key Consulting Companies & Advisors

Large, medium-sized, and small enterprises

Venture capitalists

Value-Added Resellers (VARs)

Third-party knowledge providers

Investment bankers

Investors

Table of Contents

Chapter 1. Executive Summary

  • 1.1. Market Snapshot
  • 1.2. Global & Segmental Market Estimates & Forecasts, 2020-2028 (USD Million)
    • 1.2.1. Global Passive and Interconnecting Electronic Components Market, by Region, 2020-2028 (USD Million)
    • 1.2.2. Global Passive and Interconnecting Electronic Components Market, by Component Type, 2020-2028 (USD Million)
    • 1.2.3. Global Passive and Interconnecting Electronic Components Market, by Application, 2020-2028 (USD Million)
  • 1.3. Key Trends
  • 1.4. Estimation Methodology
  • 1.5. Research Assumption

Chapter 2. Global Passive and Interconnecting Electronic Components Market Definition and Scope

  • 2.1. Objective of the Study
  • 2.2. Market Definition & Scope
    • 2.2.1. Scope of the Study
    • 2.2.2. Industry Evolution
  • 2.3. Years Considered for the Study
  • 2.4. Currency Conversion Rates

Chapter 3. Global Passive and Interconnecting Electronic Components Market Dynamics

  • 3.1. Passive and Interconnecting Electronic Components Market Impact Analysis (2020-2028)
    • 3.1.1. Market Drivers
      • 3.1.1.1. Growing penetration of smartphones and laptops.
      • 3.1.1.2. Increasing adoption of internet of things (IoT) devices.
      • 3.1.1.3. Recent acquisition activities.
    • 3.1.2. Market Challenges
      • 3.1.2.1. Volatile cost of raw materials.
    • 3.1.3. Market Opportunities
      • 3.1.3.1. Growing investment towards 5G network infrastructure.
      • 3.1.3.2. Rising automation across different industries.

Chapter 4. Global Passive and Interconnecting Electronic Components Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model (2018-2028)
  • 4.2. PEST Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
  • 4.3. Investment Adoption Model
  • 4.4. Analyst Recommendation & Conclusion
  • 4.5. Top investment opportunity
  • 4.6. Top winning strategies

Chapter 5. Risk Assessment: COVID-19 Impact

    • 5.1.1. Assessment of the overall impact of COVID-19 on the industry
    • 5.1.2. Pre COVID-19 and post COVID-19 Market scenario

Chapter 6. Global Passive and Interconnecting Electronic Components Market, by Component Type

  • 6.1. Market Snapshot
  • 6.2. Global Passive and Interconnecting Electronic Components Market by Component Type, Performance - Potential Analysis
  • 6.3. Global Passive and Interconnecting Electronic Components Market Estimates & Forecasts by Component Type 2018-2028 (USD Million)
  • 6.4. Passive and Interconnecting Electronic Components Market, Sub Segment Analysis
    • 6.4.1. Passive
    • 6.4.2. Interconnecting

Chapter 7. Global Passive and Interconnecting Electronic Components Market, by Application

  • 7.1. Market Snapshot
  • 7.2. Global Passive and Interconnecting Electronic Components Market by Application, Performance - Potential Analysis
  • 7.3. Global Passive and Interconnecting Electronic Components Market Estimates & Forecasts by Application 2018-2028 (USD Million)
  • 7.4. Passive and Interconnecting Electronic Components Market, Sub Segment Analysis
    • 7.4.1. Consumer Electronics
    • 7.4.2. IT & Telecommunication
    • 7.4.3. Automotive
    • 7.4.4. Industrial
    • 7.4.5. Aerospace & Defense
    • 7.4.6. Healthcare
    • 7.4.7. Others

Chapter 8. Global Passive and Interconnecting Electronic Components Market, Regional Analysis

  • 8.1. Passive and Interconnecting Electronic Components Market, Regional Market Snapshot
  • 8.2. North America Passive and Interconnecting Electronic Components Market
    • 8.2.1. U.S. Passive and Interconnecting Electronic Components Market
      • 8.2.1.1. Component Type estimates & forecasts, 2018-2028
      • 8.2.1.2. Application estimates & forecasts, 2018-2028
    • 8.2.2. Canada Passive and Interconnecting Electronic Components Market
  • 8.3. Europe Passive and Interconnecting Electronic Components Market Snapshot
    • 8.3.1. U.K. Passive and Interconnecting Electronic Components Market
    • 8.3.2. Germany Passive and Interconnecting Electronic Components Market
    • 8.3.3. France Passive and Interconnecting Electronic Components Market
    • 8.3.4. Spain Passive and Interconnecting Electronic Components Market
    • 8.3.5. Italy Passive and Interconnecting Electronic Components Market
    • 8.3.6. Rest of Europe Passive and Interconnecting Electronic Components Market
  • 8.4. Asia-Pacific Passive and Interconnecting Electronic Components Market Snapshot
    • 8.4.1. China Passive and Interconnecting Electronic Components Market
    • 8.4.2. India Passive and Interconnecting Electronic Components Market
    • 8.4.3. Japan Passive and Interconnecting Electronic Components Market
    • 8.4.4. Australia Passive and Interconnecting Electronic Components Market
    • 8.4.5. South Korea Passive and Interconnecting Electronic Components Market
    • 8.4.6. Rest of Asia Pacific Passive and Interconnecting Electronic Components Market
  • 8.5. Latin America Passive and Interconnecting Electronic Components Market Snapshot
    • 8.5.1. Brazil Passive and Interconnecting Electronic Components Market
    • 8.5.2. Mexico Passive and Interconnecting Electronic Components Market
  • 8.6. Rest of The World Passive and Interconnecting Electronic Components Market

Chapter 9. Competitive Intelligence

  • 9.1. Top Market Strategies
  • 9.2. Company Profiles
    • 9.2.1. AVX Corporation
      • 9.2.1.1. Key Information
      • 9.2.1.2. Overview
      • 9.2.1.3. Financial (Subject to Data Availability)
      • 9.2.1.4. Product Summary
      • 9.2.1.5. Recent Developments
    • 9.2.2. Vishay Intertechnology, Inc.
    • 9.2.3. Mouser Electronics, Inc.
    • 9.2.4. Murata Manufacturing Co., Ltd.
    • 9.2.5. TDK Corporation
    • 9.2.6. Taiyo Yuden Co., Ltd.
    • 9.2.7. Samsung Electro-Mechanics
    • 9.2.8. Hosiden Corporation
    • 9.2.9. Yageo Corporation
    • 9.2.10. Nichicon Corporation

Chapter 10. Research Process

  • 10.1. Research Process
    • 10.1.1. Data Mining
    • 10.1.2. Analysis
    • 10.1.3. Market Estimation
    • 10.1.4. Validation
    • 10.1.5. Publishing
  • 10.2. Research Attributes
  • 10.3. Research Assumption
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