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Ericsson의 5G NR 39GHz 모델 AIR 5331 B260 KRD 901 079/1

ERICSSON 5G NR 39GHz Model AIR 5331 B260 KRD 901 079/1

리서치사 EJL Wireless Research
발행일 2021년 12월 상품코드 1040635
페이지 정보 영문 70 Pages, 78 Exhibits, 17 Tables 배송안내 1-2일 (영업일 기준)
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Ericsson의 5G NR 39GHz 모델 AIR 5331 B260 KRD 901 079/1 ERICSSON 5G NR 39GHz Model AIR 5331 B260 KRD 901 079/1
발행일 : 2021년 12월 페이지 정보 : 영문 70 Pages, 78 Exhibits, 17 Tables

본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

Ericsson의 5G NR 39GHz 모델인 AIR 5331 B260B260 KRD 901 079/1 39GHz 밀리미터파 시스템에 대해 종합적으로 분석했으며, 시스템 기능의 개요와 기계적 특성, 컴포넌트의 배치와 구성 내용 등의 정보를 정리하여 전해드립니다.

목차

주요 요약

  • 액티브/패시브 컴포넌트 개요
  • 주요 주의점

제1장 Ericson의 PAAU

  • 밀리미터파 위상 배열 안테나 유닛의 개요
  • 제품 사양

제2장 기계적 분석

  • 프런트 커버/안테나 레이돔
  • 탑 커버
  • 바텀 커버
  • 인터페이스 패널 커넥터
  • 사이드 커버
  • 메인 섀시
  • 전열 핀
  • 무선 트랜시버 RF 실드
  • 베이스밴드 서멀 실드
  • 위상 배열 안테나 모듈(PAAM) 프레임
  • SFP 광개스킷

제3장 무선 트랜시버 서브시스템

제4장 밀리미터파 위상 배열 안테나 모듈(PAAM) 서브시스템

제5장 전원 서브시스템

부록 A 컴포넌트 분석

부록 B 컴포넌트 종류 : 유닛 시스템별

부록 C 액티브 컴포넌트 : 공급업체별

부록 D 패시브 컴포넌트 : 공급업체별

KSM 22.01.04

List of Tables

  • Table 1: AIR 5331 Electrical Specifications
  • Table 2: Radio Transceiver PCB Top, Active Bill of Materials
  • Table 3: Radio Transceiver PCB Top, Area A0, Bill of Materials
  • Table 4: Radio Transceiver PCB Top, Area A1, Bill of Materials
  • Table 5: Radio Transceiver PCB Top, Area A2, Bill of Materials
  • Table 6: Radio Transceiver PCB Top, Area A3, Bill of Materials
  • Table 7: Radio Transceiver PCB Top, Passive Bill of Materials
  • Table 8: Radio Transceiver PCB Bottom, Active Bill of Materials
  • Table 9: Radio Transceiver PCB Bottom, Passive Bill of Materials
  • Table 10: PAAM PCB, Bottom, Bill of Materials
  • Table 11: Power Supply PCB, Top, Active Bill of Materials
  • Table 12: Power Supply PCB, Top, Passive Bill of Materials
  • Table 13: Power Supply PCB, Bottom, Active Bill of Materials
  • Table 14: AIR 5331 Unit PCBs by Component Type
  • Table 15: AIR 5331 Unit PCBs by Component Type (con't)
  • Table 16: AIR 5331 Unit PCBs by Active Component Vendor
  • Table 17: AIR 5331 Unit PCBs by Passive/Connector/Other Component Vendor

List of Exhibits:

  • Exhibit 1: AIR 5331
  • Exhibit 2: Ericsson mmWave Product Generations
  • Exhibit 3: AIR 5331 Front (Left) and Rear (Right) Views
  • Exhibit 4: AIR 5331 Left Side (Left) and Right Side (Right) Views
  • Exhibit 5: AIR 5331 Top (Left) and Bottom (Right) Views
  • Exhibit 6: AIR 5331 Product and FCC ID Labels
  • Exhibit 7: Antenna Radome, External View
  • Exhibit 8: Antenna Radome, Internal View
  • Exhibit 9: AIR 5331 Antenna Radome Detail
  • Exhibit 10: AIR 5331 Antenna Radome
  • Exhibit 11: AIR 5331 Top Cover, External View (Left) and Internal View (Right)
  • Exhibit 12: AIR 5331 Top Cover, Top View (Left) and Bottom View (Right)
  • Exhibit 13: AIR 5331 Bottom Cover, External View (Left) and Internal View (Right)
  • Exhibit 14: AIR 5331 Bottom Cover, Top View (Left) and Bottom View (Right)
  • Exhibit 15: AIR 5331 Bottom Cover Interface Ports
  • Exhibit 16: SFP Panel Mount Connector, Front View (Left) and Rear View (Right)
  • Exhibit 17: SFP Panel Mount Connector, Side View
  • Exhibit 18: DC Power Panel Mount Connector, Front View (Left) and Side View (Right)
  • Exhibit 19: DC Power Cable Terminal Pin Connector, Top View (Left) and Bottom View (Right)
  • Exhibit 20: Alarm Panel Mount Connector Assembly, Front View (Left) and Side View (Right)
  • Exhibit 21: LED Indicator Panel Front View w/Cover (Left) and without Cover (Right)
  • Exhibit 22: LED Indicator Panel Rear View 1 (Left) and View 2 (Right)
  • Exhibit 23: AIR 5331 Side Covers, External View (Left) and Internal View (Right)
  • Exhibit 24: AIR 5331 Main Chassis, External View
  • Exhibit 25: AIR 5331 Main Chassis, Internal View with Baseband Thermal Shield
  • Exhibit 26: AIR 5331 Main Chassis, Internal View with Baseband Thermal Shield Removed
  • Exhibit 27: AIR 5331 Main Chassis, Internal View, Thermal Pedestal Map
  • Exhibit 28: AIR 5331 Main Chassis, Internal View, Power Supply Cavity Dimensions
  • Exhibit 29: Heat Transfer Fin Dimensions
  • Exhibit 30: Heat Transfer Fin Types
  • Exhibit 31: Heat Transfer Fin Stabilizer Posts, Top View
  • Exhibit 32: Heat Transfer Fin Stabilizer Posts, Side View
  • Exhibit 33: Radio Transceiver RF Shield Location
  • Exhibit 34: Radio Transceiver RF Shield, External View
  • Exhibit 35: Radio Transceiver RF Shield, Internal View
  • Exhibit 36: Baseband Thermal Shield, External View
  • Exhibit 37: Baseband Thermal Shield, Internal View
  • Exhibit 38: PAAM Window Frame Locations
  • Exhibit 39: PAAM Window Frame Inside Edge Detail
  • Exhibit 40: PAAM Frame, External View
  • Exhibit 41: PAAM Frame, Internal View
  • Exhibit 42: SFP Optical Port Gasket Locations
  • Exhibit 43: SFP Optical Port Gaskets Removed
  • Exhibit 44: Radio Transceiver PCB, Top View
  • Exhibit 45: Radio Transceiver PCB, Bottom View
  • Exhibit 46: Radio Transceiver Subsystem Block Diagram
  • Exhibit 47: 63-Pos Male-Male Header Connector
  • Exhibit 48: Radio Transceiver PCB Top, Active Component Diagram
  • Exhibit 49: Radio Transceiver PCB Top, Passive Component Diagram
  • Exhibit 50: PAAM Ground Connector
  • Exhibit 51: PAAM RF/Digital/DC Power Connector
  • Exhibit 52: Radio Transceiver PCB Bottom, Active Component Diagram
  • Exhibit 53: Radio Transceiver PCB Bottom, Passive Component Diagram
  • Exhibit 54: Phased Array Antenna Module Subsystem Location
  • Exhibit 55: Phased Array Antenna Module PCB, Top View
  • Exhibit 56: Phased Array Antenna Module PCB, Bottom View
  • Exhibit 57: Phased Array Antenna Element Matrix
  • Exhibit 58: PAAM Beam Configuration Mode
  • Exhibit 59: PAAM 39GHz Antenna Element Dimensions
  • Exhibit 60: PAAM Block Diagram
  • Exhibit 61: PAAM PCB, Bottom, Component Diagram
  • Exhibit 62: Ericsson 39GHz RFIC ASIC

This report provides a comprehensive analysis for the Ericsson AIR 5331 B260 39GHz mmWave system. This product is a 5G NR phased array antenna/radio unit and supports single mode 5G NR.

Features:

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
    • Heat Fins
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type
  • Excludes analysis of passive chip resistors, capacitors, and inductors
  • Total Pages: 70
  • Total Exhibits: 78
  • Total Tables: 17

TABLE OF CONTENTS

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON MPAAU

  • Overview of mmWave Phased Array Antenna Unit
  • Product Specifications

CHAPTER 2: MECHANICAL ANALYSIS

  • Front Cover/Antenna Radome
  • Top Cover
  • Bottom Cover
  • Interface Panel Connectors/
  • Side Covers
  • Main Chassis
  • Heat Transfer Fins
  • Radio Transceiver RF Shield
  • Baseband Thermal Shield
  • Phased Array Antenna Module (PAAM) Frame
  • SFP Optical Gasket

CHAPTER 3: RADIO TRANSCEIVER SUBSYSTEM

CHAPTER 4: MMWAVE PHASED ARRAY ANTENNA MODULE (PAAM) SUBSYSTEM

CHAPTER 5: POWER SUPPLY SUBSYSTEM

APPENDIX A: COMPONENT ANALYSIS

APPENDIX B: COMPONENT TYPE BY SYSTEM UNIT

APPENDIX C: ACTIVE COMPONENTS BY SUPPLIER

APPENDIX D: PASSIVE COMPONENTS BY SUPPLIER

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