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세계의 반도체 조립 및 패키징 서비스 시장

Semiconductor Assembly and Packaging Services

리서치사 Global Industry Analysts, Inc.
발행일 2021년 04월 상품코드 958625
페이지 정보 영문 142 Pages 배송안내 1-2일 (영업일 기준)
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세계의 반도체 조립 및 패키징 서비스 시장 Semiconductor Assembly and Packaging Services
발행일 : 2021년 04월 페이지 정보 : 영문 142 Pages

본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계 반도체 조립 및 패키징 서비스 시장 규모는 분석기간(2020년-2027년)에 4.7%의 연평균 복합 성장률(CAGR)로 성장할 전망이며, 2020년 61억 달러에서 2027년에는 85억 달러에 달할 것으로 예측됩니다. 본 보고서에서 분석한 부문 중 하나인 통신은 분석기간 중 5.1%의 CAGR을 나타내고, 41억 달러에 달할 전망입니다.

세계의 반도체 조립 및 패키징 서비스(Semiconductor Assembly and Packaging Services) 시장에 대해 조사했으며, 시장 점유율, 동향 및 전망, 성장요인, 지역별 시장 분석, 경쟁 구도, 주요 기업 개요 등의 정보를 정리하여 전해드립니다.

조사 대상 기업 사례

  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd.
  • TSMC Ltd.

목차

I. 서론, 조사 방법, 조사 범위

II. 주요 요약

  • 시장 개요
    • 경쟁사의 시장 점유율
    • 경쟁사의 시장 점유율 시나리오
    • Covid-19의 영향과 다가오는 세계의 경기후퇴
  • 주요 기업
  • 동향과 성장 촉진요인
  • 세계 시장 전망

III. 시장 분석

  • 지역별 시장 분석
  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 기타 유럽
  • 아시아태평양
  • 기타 지역

IV. 경쟁

  • 기업 개요 : 52개사
KSM 20.10.06

Abstract:

Global Semiconductor Assembly and Packaging Services Market to Reach $8.5 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor Assembly and Packaging Services estimated at US$6.1 Billion in the year 2020, is projected to reach a revised size of US$8.5 Billion by 2027, growing at a CAGR of 4.7% over the analysis period 2020-2027. Communication, one of the segments analyzed in the report, is projected to record a 5.1% CAGR and reach US$4.1 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Computing & Networking segment is readjusted to a revised 4.5% CAGR for the next 7-year period.

The U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 4.5% CAGR

The Semiconductor Assembly and Packaging Services market in the U.S. is estimated at US$1.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.5 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 3.9% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.

Industrial & Automotive Segment to Record 4.1% CAGR

In the global Industrial & Automotive segment, USA, Canada, Japan, China and Europe will drive the 4.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$557.1 Million in the year 2020 will reach a projected size of US$742.1 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$942.9 Million by the year 2027.

Select Competitors (Total 52 Featured) -

  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd.
  • TSMC Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Impact of Covid-19 and a Looming Global Recession
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Semiconductor Assembly and Packaging Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 2: World Historic Review for Semiconductor Assembly and Packaging Services by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 3: World 15-Year Perspective for Semiconductor Assembly and Packaging Services by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027
    • TABLE 4: World Current & Future Analysis for Communication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 5: World Historic Review for Communication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 6: World 15-Year Perspective for Communication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 7: World Current & Future Analysis for Computing & Networking by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 8: World Historic Review for Computing & Networking by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 9: World 15-Year Perspective for Computing & Networking by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 10: World Current & Future Analysis for Industrial & Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 11: World Historic Review for Industrial & Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 12: World 15-Year Perspective for Industrial & Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 13: World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 14: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 15: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • TABLE 16: USA Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 17: USA Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 18: USA 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • CANADA
    • TABLE 19: Canada Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 20: Canada Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 21: Canada 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • JAPAN
    • TABLE 22: Japan Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 23: Japan Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 24: Japan 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • CHINA
    • TABLE 25: China Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 26: China Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 27: China 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • EUROPE
    • TABLE 28: Europe Current & Future Analysis for Semiconductor Assembly and Packaging Services by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 29: Europe Historic Review for Semiconductor Assembly and Packaging Services by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 30: Europe 15-Year Perspective for Semiconductor Assembly and Packaging Services by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027
    • TABLE 31: Europe Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 32: Europe Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 33: Europe 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • FRANCE
    • TABLE 34: France Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 35: France Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 36: France 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • GERMANY
    • TABLE 37: Germany Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 38: Germany Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 39: Germany 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • ITALY
    • TABLE 40: Italy Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 41: Italy Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 42: Italy 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • UNITED KINGDOM
    • TABLE 43: UK Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 44: UK Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 45: UK 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • REST OF EUROPE
    • TABLE 46: Rest of Europe Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 47: Rest of Europe Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 48: Rest of Europe 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • ASIA-PACIFIC
    • TABLE 49: Asia-Pacific Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 50: Asia-Pacific Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 51: Asia-Pacific 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027
  • REST OF WORLD
    • TABLE 52: Rest of World Current & Future Analysis for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 53: Rest of World Historic Review for Semiconductor Assembly and Packaging Services by Application - Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 54: Rest of World 15-Year Perspective for Semiconductor Assembly and Packaging Services by Application - Percentage Breakdown of Value Sales for Communication, Computing & Networking, Industrial & Automotive and Consumer Electronics for the Years 2012, 2020 & 2027

IV. COMPETITION

  • Total Companies Profiled: 52
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