시장보고서
상품코드
1299609

세계의 반도체 조립 및 패키징 서비스 시장(2023-2027년)

Global Semiconductor Assembly and Packaging Services Market 2023-2027

발행일: | 리서치사: TechNavio | 페이지 정보: 영문 181 Pages | 배송안내 : 즉시배송


■ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

반도체 조립 및 패키징 서비스 시장은 2022-2027년간 143억 9,723만 달러 확대되고, 예측 기간 동안 6.51%의 CAGR을 나타낼 것으로 예상됩니다. 본 보고서는 반도체 조립 및 패키징 서비스 시장에 대한 전반적인 분석, 시장 규모와 예측, 동향, 시장 성장 촉진요인 및 저해요인, 과제, 약 25개 벤더를 대상으로 한 벤더 분석 등의 정보를 전해드립니다.

현재의 시장 시나리오, 최신 동향 및 성장요인, 전체 시장 환경에 대한 최신 분석을 제공합니다. 반도체 웨이퍼 수요 증가, IoT의 등장으로 인한 무선 컴퓨팅 장치의 폭발적인 성장, 3D 칩 패키징, FIWLP, FOWLP 기술 시장 개척 등이 시장을 주도하고 있습니다.

이 보고서는 모바일 기기의 짧은 제품 수명주기가 향후 몇 년 동안 반도체 조립 및 패키징 서비스 시장 성장을 주도하는 주요 요인 중 하나라고 지적했습니다. 또한, 반도체 메모리 디바이스에 대한 수요 증가와 웨어러블 디바이스의 수용 확대도 시장의 큰 수요로 이어질 것으로 보입니다.

목차

제1장 주요 요약

  • 시장 개요

제2장 시장 구도

  • 시장 생태계

제3장 시장 규모

  • 시장의 정의
  • 시장 부문 분석
  • 시장 규모(2022년)
  • 시장 전망(2022-2027년)

제4장 시장 규모 실적

  • 세계의 반도체 조립 및 패키징 서비스 시장(2017-2021년)
  • 유형별 부문 분석(2017-2021년)
  • 용도별 부문 분석(2017-2021년)
  • 지역별 부문 분석(2017-2021년)
  • 국가별 부문 분석(2017-2021년)

제5장 Five Forces 분석

  • Five Forces 요약
  • 바이어의 교섭력
  • 공급 기업의 교섭력
  • 신규 진출업체의 위협
  • 대체품의 위협
  • 경쟁 위협
  • 시장 현황

제6장 시장 세분화 : 유형별

  • 시장 부문
  • 비교 : 유형별
  • WLP : 시장 규모와 예측(2022-2027년)
  • Die level packaging : 시장 규모와 예측(2022-2027년)
  • 시장 기회 : 유형별

제7장 시장 세분화 : 용도별

  • 시장 부문
  • 비교 : 용도별
  • 통신 분야 : 시장 규모와 예측(2022-2027년)
  • 산업 및 자동차 분야 : 시장 규모와 예측(2022-2027년)
  • 컴퓨팅 및 네트워킹 분야 : 시장 규모와 예측(2022-2027년)
  • 가전제품 분야 : 시장 규모와 예측(2022-2027년)
  • 시장 기회 : 용도별

제8장 고객 상황

  • 고객 상황 개요

제9장 지역별 상황

  • 지역별 세분화
  • 지역별 비교
  • 아시아태평양 : 시장 규모와 예측(2022-2027년)
  • 북미 : 시장 규모와 예측(2022-2027년)
  • 유럽 : 시장 규모와 예측(2022-2027년)
  • 남미 : 시장 규모와 예측(2022-2027년)
  • 중동 및 아프리카 : 시장 규모와 예측(2022-2027년)
  • 한국 : 시장 규모와 예측(2022-2027년)
  • 대만 : 시장 규모와 예측(2022-2027년)
  • 중국 : 시장 규모와 예측(2022-2027년)
  • 미국 : 시장 규모와 예측(2022-2027년)
  • 일본 : 시장 규모와 예측(2022-2027년)
  • 지역 상황별 시장 기회

제10장 성장 촉진요인, 과제 및 동향

  • 시장 성장 촉진요인
  • 시장이 해결해야 할 과제
  • 성장 촉진요인과 과제의 영향
  • 시장 동향

제11장 벤더 구도

  • 개요
  • 벤더 구도
  • 혼란 상황
  • 업계 리스크

제12장 벤더 분석

  • 대상 벤더
  • 벤더의 시장 포지셔닝
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • ASMPT GmbH and Co. KG
  • ChipMOS TECHNOLOGIES Inc.
  • HANA Micron Co. Ltd.
  • Intel Corp.
  • King Yuan Electronics Co. Ltd.
  • KLA Corp.
  • Microchip Technology Inc.
  • Powertech Technology Inc.
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • ULVAC Inc.
  • Yole Developpement SA

제13장 부록

LSH 23.07.07

Global Semiconductor Assembly and Packaging Services Market by Type, Application, and Geography - Forecast and Analysis 2023-2027

The semiconductor assembly and packaging services market is forecasted to grow by USD 14,397.23 million during 2022-2027, accelerating at a CAGR of 6.51% during the forecast period. The report on the semiconductor assembly and packaging services market provides a holistic analysis, market size, and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for semiconductor wafers, the explosive growth of wireless computing devices due to the advent of IoT, and the development of 3D chip packaging, FIWLP, and FOWLP technology.

Technavio's semiconductor assembly and packaging services market is segmented as below:

By Type

  • WLP and Die level packaging

By Application

  • Communication sector
  • Industrial and automotive sector
  • Computing and networking sector
  • Consumer electronics sector

By Geographical Landscape

  • APAC
  • North America
  • Europe
  • South America
  • Middle East and Africa

This study identifies the short product lifecycle of mobile devices as one of the prime reasons driving the semiconductor assembly and packaging services market growth during the next few years. Also, growing need for semiconductor memory devices and rising acceptance of wearable devices will lead to sizable demand in the market.

The report on the semiconductor assembly and packaging services market covers the following areas:

  • Semiconductor assembly and packaging services market sizing
  • Semiconductor assembly and packaging services market forecast
  • Semiconductor assembly and packaging services market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor assembly and packaging services market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., ChipMOS TECHNOLOGIES Inc., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., KLA Corp., Microchip Technology Inc., Powertech Technology Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Toshiba Corp., ULVAC Inc., ASMPT GmbH and Co. KG, HANA Micron Co. Ltd., Promex Industries Inc., SIGNETICS Corp., and Yole Developpement SA. Also, the semiconductor assembly and packaging services market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

Table of Contents

1 Executive Summary

  • 1.1 Market overview
  • Exhibit 01: Executive Summary - Chart on Market Overview
  • Exhibit 02: Executive Summary - Data Table on Market Overview
  • Exhibit 03: Executive Summary - Chart on Global Market Characteristics
  • Exhibit 04: Executive Summary - Chart on Market By Geographical Landscape
  • Exhibit 05: Executive Summary - Chart on Market Segmentation by Type
  • Exhibit 06: Executive Summary - Chart on Market Segmentation by Application
  • Exhibit 07: Executive Summary - Chart on Incremental Growth
  • Exhibit 08: Executive Summary - Data Table on Incremental Growth
  • Exhibit 09: Executive Summary - Chart on Vendor Market Positioning

2 Market Landscape

  • 2.1 Market ecosystem
  • Exhibit 10: Parent market
  • Exhibit 11: Market Characteristics

3 Market Sizing

  • 3.1 Market definition
  • Exhibit 12: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
  • Exhibit 13: Market segments
  • 3.3 Market size 2022
  • 3.4 Market outlook: Forecast for 2022-2027
  • Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
  • Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
  • Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
  • Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

4 Historic Market Size

  • 4.1 Global semiconductor assembly and packaging services market 2017 - 2021
  • Exhibit 18: Historic Market Size - Data Table on global semiconductor assembly and packaging services market 2017 - 2021 ($ million)
  • 4.2 Type Segment Analysis 2017 - 2021
  • Exhibit 19: Historic Market Size - Type Segment 2017 - 2021 ($ million)
  • 4.3 Application Segment Analysis 2017 - 2021
  • Exhibit 20: Historic Market Size - Application Segment 2017 - 2021 ($ million)
  • 4.4 Geography Segment Analysis 2017 - 2021
  • Exhibit 21: Historic Market Size - Geography Segment 2017 - 2021 ($ million)
  • 4.5 Country Segment Analysis 2017 - 2021
  • Exhibit 22: Historic Market Size - Country Segment 2017 - 2021 ($ million)

5 Five Forces Analysis

  • 5.1 Five forces summary
  • Exhibit 23: Five forces analysis - Comparison between 2022 and 2027
  • 5.2 Bargaining power of buyers
  • Exhibit 24: Chart on Bargaining power of buyers - Impact of key factors 2022 and 2027
  • 5.3 Bargaining power of suppliers
  • Exhibit 25: Bargaining power of suppliers - Impact of key factors in 2022 and 2027
  • 5.4 Threat of new entrants
  • Exhibit 26: Threat of new entrants - Impact of key factors in 2022 and 2027
  • 5.5 Threat of substitutes
  • Exhibit 27: Threat of substitutes - Impact of key factors in 2022 and 2027
  • 5.6 Threat of rivalry
  • Exhibit 28: Threat of rivalry - Impact of key factors in 2022 and 2027
  • 5.7 Market condition
  • Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

6 Market Segmentation by Type

  • 6.1 Market segments
  • Exhibit 30: Chart on Type - Market share 2022-2027 (%)
  • Exhibit 31: Data Table on Type - Market share 2022-2027 (%)
  • 6.2 Comparison by Type
  • Exhibit 32: Chart on Comparison by Type
  • Exhibit 33: Data Table on Comparison by Type
  • 6.3 WLP - Market size and forecast 2022-2027
  • Exhibit 34: Chart on WLP - Market size and forecast 2022-2027 ($ million)
  • Exhibit 35: Data Table on WLP - Market size and forecast 2022-2027 ($ million)
  • Exhibit 36: Chart on WLP - Year-over-year growth 2022-2027 (%)
  • Exhibit 37: Data Table on WLP - Year-over-year growth 2022-2027 (%)
  • 6.4 Die level packaging - Market size and forecast 2022-2027
  • Exhibit 38: Chart on Die level packaging - Market size and forecast 2022-2027 ($ million)
  • Exhibit 39: Data Table on Die level packaging - Market size and forecast 2022-2027 ($ million)
  • Exhibit 40: Chart on Die level packaging - Year-over-year growth 2022-2027 (%)
  • Exhibit 41: Data Table on Die level packaging - Year-over-year growth 2022-2027 (%)
  • 6.5 Market opportunity by Type
  • Exhibit 42: Market opportunity by Type ($ million)
  • Exhibit 43: Data Table on Market opportunity by Type ($ million)

7 Market Segmentation by Application

  • 7.1 Market segments
  • Exhibit 44: Chart on Application - Market share 2022-2027 (%)
  • Exhibit 45: Data Table on Application - Market share 2022-2027 (%)
  • 7.2 Comparison by Application
  • Exhibit 46: Chart on Comparison by Application
  • Exhibit 47: Data Table on Comparison by Application
  • 7.3 Communication sector - Market size and forecast 2022-2027
  • Exhibit 48: Chart on Communication sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 49: Data Table on Communication sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 50: Chart on Communication sector - Year-over-year growth 2022-2027 (%)
  • Exhibit 51: Data Table on Communication sector - Year-over-year growth 2022-2027 (%)
  • 7.4 Industrial and automotive sector - Market size and forecast 2022-2027
  • Exhibit 52: Chart on Industrial and automotive sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 53: Data Table on Industrial and automotive sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 54: Chart on Industrial and automotive sector - Year-over-year growth 2022-2027 (%)
  • Exhibit 55: Data Table on Industrial and automotive sector - Year-over-year growth 2022-2027 (%)
  • 7.5 Computing and networking sector - Market size and forecast 2022-2027
  • Exhibit 56: Chart on Computing and networking sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 57: Data Table on Computing and networking sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 58: Chart on Computing and networking sector - Year-over-year growth 2022-2027 (%)
  • Exhibit 59: Data Table on Computing and networking sector - Year-over-year growth 2022-2027 (%)
  • 7.6 Consumer electronics sector - Market size and forecast 2022-2027
  • Exhibit 60: Chart on Consumer electronics sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 61: Data Table on Consumer electronics sector - Market size and forecast 2022-2027 ($ million)
  • Exhibit 62: Chart on Consumer electronics sector - Year-over-year growth 2022-2027 (%)
  • Exhibit 63: Data Table on Consumer electronics sector - Year-over-year growth 2022-2027 (%)
  • 7.7 Market opportunity by Application
  • Exhibit 64: Market opportunity by Application ($ million)
  • Exhibit 65: Data Table on Market opportunity by Application ($ million)

8 Customer Landscape

  • 8.1 Customer landscape overview
  • Exhibit 66: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

9 Geographic Landscape

  • 9.1 Geographic segmentation
  • Exhibit 67: Chart on Market share By Geographical Landscape 2022-2027 (%)
  • Exhibit 68: Data Table on Market share By Geographical Landscape 2022-2027 (%)
  • 9.2 Geographic comparison
  • Exhibit 69: Chart on Geographic comparison
  • Exhibit 70: Data Table on Geographic comparison
  • 9.3 APAC - Market size and forecast 2022-2027
  • Exhibit 71: Chart on APAC - Market size and forecast 2022-2027 ($ million)
  • Exhibit 72: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
  • Exhibit 73: Chart on APAC - Year-over-year growth 2022-2027 (%)
  • Exhibit 74: Data Table on APAC - Year-over-year growth 2022-2027 (%)
  • 9.4 North America - Market size and forecast 2022-2027
  • Exhibit 75: Chart on North America - Market size and forecast 2022-2027 ($ million)
  • Exhibit 76: Data Table on North America - Market size and forecast 2022-2027 ($ million)
  • Exhibit 77: Chart on North America - Year-over-year growth 2022-2027 (%)
  • Exhibit 78: Data Table on North America - Year-over-year growth 2022-2027 (%)
  • 9.5 Europe - Market size and forecast 2022-2027
  • Exhibit 79: Chart on Europe - Market size and forecast 2022-2027 ($ million)
  • Exhibit 80: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
  • Exhibit 81: Chart on Europe - Year-over-year growth 2022-2027 (%)
  • Exhibit 82: Data Table on Europe - Year-over-year growth 2022-2027 (%)
  • 9.6 South America - Market size and forecast 2022-2027
  • Exhibit 83: Chart on South America - Market size and forecast 2022-2027 ($ million)
  • Exhibit 84: Data Table on South America - Market size and forecast 2022-2027 ($ million)
  • Exhibit 85: Chart on South America - Year-over-year growth 2022-2027 (%)
  • Exhibit 86: Data Table on South America - Year-over-year growth 2022-2027 (%)
  • 9.7 Middle East and Africa - Market size and forecast 2022-2027
  • Exhibit 87: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
  • Exhibit 88: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
  • Exhibit 89: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
  • Exhibit 90: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)
  • 9.8 South Korea - Market size and forecast 2022-2027
  • Exhibit 91: Chart on South Korea - Market size and forecast 2022-2027 ($ million)
  • Exhibit 92: Data Table on South Korea - Market size and forecast 2022-2027 ($ million)
  • Exhibit 93: Chart on South Korea - Year-over-year growth 2022-2027 (%)
  • Exhibit 94: Data Table on South Korea - Year-over-year growth 2022-2027 (%)
  • 9.9 Taiwan - Market size and forecast 2022-2027
  • Exhibit 95: Chart on Taiwan - Market size and forecast 2022-2027 ($ million)
  • Exhibit 96: Data Table on Taiwan - Market size and forecast 2022-2027 ($ million)
  • Exhibit 97: Chart on Taiwan - Year-over-year growth 2022-2027 (%)
  • Exhibit 98: Data Table on Taiwan - Year-over-year growth 2022-2027 (%)
  • 9.10 China - Market size and forecast 2022-2027
  • Exhibit 99: Chart on China - Market size and forecast 2022-2027 ($ million)
  • Exhibit 100: Data Table on China - Market size and forecast 2022-2027 ($ million)
  • Exhibit 101: Chart on China - Year-over-year growth 2022-2027 (%)
  • Exhibit 102: Data Table on China - Year-over-year growth 2022-2027 (%)
  • 9.11 US - Market size and forecast 2022-2027
  • Exhibit 103: Chart on US - Market size and forecast 2022-2027 ($ million)
  • Exhibit 104: Data Table on US - Market size and forecast 2022-2027 ($ million)
  • Exhibit 105: Chart on US - Year-over-year growth 2022-2027 (%)
  • Exhibit 106: Data Table on US - Year-over-year growth 2022-2027 (%)
  • 9.12 Japan - Market size and forecast 2022-2027
  • Exhibit 107: Chart on Japan - Market size and forecast 2022-2027 ($ million)
  • Exhibit 108: Data Table on Japan - Market size and forecast 2022-2027 ($ million)
  • Exhibit 109: Chart on Japan - Year-over-year growth 2022-2027 (%)
  • Exhibit 110: Data Table on Japan - Year-over-year growth 2022-2027 (%)
  • 9.13 Market opportunity By Geographical Landscape
  • Exhibit 111: Market opportunity By Geographical Landscape ($ million)
  • Exhibit 112: Data Tables on Market opportunity By Geographical Landscape ($ million)

10 Drivers, Challenges, and Trends

  • 10.1 Market drivers
  • 10.2 Market challenges
  • 10.3 Impact of drivers and challenges
  • Exhibit 113: Impact of drivers and challenges in 2022 and 2027
  • 10.4 Market trends

11 Vendor Landscape

  • 11.1 Overview
  • 11.2 Vendor landscape
  • Exhibit 114: Overview on Criticality of inputs and Factors of differentiation
  • 11.3 Landscape disruption
  • Exhibit 115: Overview on factors of disruption
  • 11.4 Industry risks
  • Exhibit 116: Impact of key risks on business

12 Vendor Analysis

  • 12.1 Vendors covered
  • Exhibit 117: Vendors covered
  • 12.2 Market positioning of vendors
  • Exhibit 118: Matrix on vendor position and classification
  • 12.3 Amkor Technology Inc.
  • Exhibit 119: Amkor Technology Inc. - Overview
  • Exhibit 120: Amkor Technology Inc. - Business segments
  • Exhibit 121: Amkor Technology Inc. - Key offerings
  • Exhibit 122: Amkor Technology Inc. - Segment focus
  • 12.4 ASE Technology Holding Co. Ltd.
  • Exhibit 123: ASE Technology Holding Co. Ltd. - Overview
  • Exhibit 124: ASE Technology Holding Co. Ltd. - Business segments
  • Exhibit 125: ASE Technology Holding Co. Ltd. - Key offerings
  • Exhibit 126: ASE Technology Holding Co. Ltd. - Segment focus
  • 12.5 ASMPT GmbH and Co. KG
  • Exhibit 127: ASMPT GmbH and Co. KG - Overview
  • Exhibit 128: ASMPT GmbH and Co. KG - Business segments
  • Exhibit 129: ASMPT GmbH and Co. KG - Key offerings
  • Exhibit 130: ASMPT GmbH and Co. KG - Segment focus
  • 12.6 ChipMOS TECHNOLOGIES Inc.
  • Exhibit 131: ChipMOS TECHNOLOGIES Inc. - Overview
  • Exhibit 132: ChipMOS TECHNOLOGIES Inc. - Business segments
  • Exhibit 133: ChipMOS TECHNOLOGIES Inc. - Key offerings
  • Exhibit 134: ChipMOS TECHNOLOGIES Inc. - Segment focus
  • 12.7 HANA Micron Co. Ltd.
  • Exhibit 135: HANA Micron Co. Ltd. - Overview
  • Exhibit 136: HANA Micron Co. Ltd. - Business segments
  • Exhibit 137: HANA Micron Co. Ltd. - Key offerings
  • Exhibit 138: HANA Micron Co. Ltd. - Segment focus
  • 12.8 Intel Corp.
  • Exhibit 139: Intel Corp. - Overview
  • Exhibit 140: Intel Corp. - Business segments
  • Exhibit 141: Intel Corp. - Key news
  • Exhibit 142: Intel Corp. - Key offerings
  • Exhibit 143: Intel Corp. - Segment focus
  • 12.9 King Yuan Electronics Co. Ltd.
  • Exhibit 144: King Yuan Electronics Co. Ltd. - Overview
  • Exhibit 145: King Yuan Electronics Co. Ltd. - Business segments
  • Exhibit 146: King Yuan Electronics Co. Ltd. - Key offerings
  • Exhibit 147: King Yuan Electronics Co. Ltd. - Segment focus
  • 12.10 KLA Corp.
  • Exhibit 148: KLA Corp. - Overview
  • Exhibit 149: KLA Corp. - Business segments
  • Exhibit 150: KLA Corp. - Key news
  • Exhibit 151: KLA Corp. - Key offerings
  • Exhibit 152: KLA Corp. - Segment focus
  • 12.11 Microchip Technology Inc.
  • Exhibit 153: Microchip Technology Inc. - Overview
  • Exhibit 154: Microchip Technology Inc. - Business segments
  • Exhibit 155: Microchip Technology Inc. - Key offerings
  • Exhibit 156: Microchip Technology Inc. - Segment focus
  • 12.12 Powertech Technology Inc.
  • Exhibit 157: Powertech Technology Inc. - Overview
  • Exhibit 158: Powertech Technology Inc. - Business segments
  • Exhibit 159: Powertech Technology Inc. - Key offerings
  • Exhibit 160: Powertech Technology Inc. - Segment focus
  • 12.13 Renesas Electronics Corp.
  • Exhibit 161: Renesas Electronics Corp. - Overview
  • Exhibit 162: Renesas Electronics Corp. - Business segments
  • Exhibit 163: Renesas Electronics Corp. - Key offerings
  • Exhibit 164: Renesas Electronics Corp. - Segment focus
  • 12.14 Samsung Electronics Co. Ltd.
  • Exhibit 165: Samsung Electronics Co. Ltd. - Overview
  • Exhibit 166: Samsung Electronics Co. Ltd. - Business segments
  • Exhibit 167: Samsung Electronics Co. Ltd. - Key news
  • Exhibit 168: Samsung Electronics Co. Ltd. - Key offerings
  • Exhibit 169: Samsung Electronics Co. Ltd. - Segment focus
  • 12.15 Taiwan Semiconductor Manufacturing Co. Ltd.
  • Exhibit 170: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
  • Exhibit 171: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
  • Exhibit 172: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
  • 12.16 ULVAC Inc.
  • Exhibit 173: ULVAC Inc. - Overview
  • Exhibit 174: ULVAC Inc. - Business segments
  • Exhibit 175: ULVAC Inc. - Key news
  • Exhibit 176: ULVAC Inc. - Key offerings
  • Exhibit 177: ULVAC Inc. - Segment focus
  • 12.17 Yole Developpement SA
  • Exhibit 178: Yole Developpement SA - Overview
  • Exhibit 179: Yole Developpement SA - Product / Service
  • Exhibit 180: Yole Developpement SA - Key offerings

13 Appendix

  • 13.1 Scope of the report
  • 13.2 Inclusions and exclusions checklist
  • Exhibit 181: Inclusions checklist
  • Exhibit 182: Exclusions checklist
  • 13.3 Currency conversion rates for US$
  • Exhibit 183: Currency conversion rates for US$
  • 13.4 Research methodology
  • Exhibit 184: Research methodology
  • Exhibit 185: Validation techniques employed for market sizing
  • Exhibit 186: Information sources
  • 13.5 List of abbreviations
  • Exhibit 187: List of abbreviations
비교리스트
0 건의 상품을 선택 중
상품 비교하기
전체삭제