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미국의 반도체 부문 자본투자(2015-2019년)

Semiconductor Capital Spending Market in the US 2015-2019

리서치사 TechNavio (Infiniti Research Ltd.)
발행일 2016년 01월 상품 코드 350016
페이지 정보 영문 64 Pages
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미국의 반도체 부문 자본투자(2015-2019년) Semiconductor Capital Spending Market in the US 2015-2019
발행일 : 2016년 01월 페이지 정보 : 영문 64 Pages

미국 반도체 벤더의 자본투자액은 예측기간 중 약 9%의 연평균 성장률(CAGR)로 성장할 전망입니다. 이러한 성장세는 다양한 요인에 의해 초래되고 있습니다. 특히 메모리 및 파운드리 관련 투자 확대가 현저한 요인이 되고 있으며, 이러한 자본투자액은 모두 합해서 전체의 2/3에 가까운 점유율을 차지하고 있습니다.

미국 반도체 벤더의 자본투자(Semiconductor Capital Spending) 동향에 대해 조사했으며, 시장 정의, 주요 벤더의 제공 제품, 시장 전체 및 설비/자산별 시장 규모(CAPEX) 추이와 예측, 주요 시장 동향, 각종 시장 영향요인 분석, 경쟁 환경, 주요 벤더 프로파일 등을 정리하여 전해드립니다.

제1장 주요 요약

  • 하이라이트

제2장 조사 범위

  • 시장 개요
  • 주요 벤더의 제품

제3장 시장 조사 방법

  • 조사 방법
  • 경제지표

제4장 서론

  • 주요 시장 하이라이트

제5장 시장 구도

  • 시장 개요
  • 시장 규모와 예측
  • Five Forces 분석

제6장 시장 분석 : 종류별

  • 웨이퍼 제조 장치(WFE)
  • Die-level packaging & assembly equipment
  • 자동검사장비(ATE)
  • Wafer-level packaging & assembly equipment

제7장 시장 성장 촉진요인

제8장 성장 촉진요인의 영향

제9장 시장이 해결해야 할 과제

제10장 성장 촉진요인과 과제의 영향

제11장 시장 동향

제12장 벤더 구도

  • 경쟁 시나리오
  • 주요 벤더
  • 그 외 주목을 끄는 벤더

제13장 주요 벤더 분석

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

제14장 벤더 및 투자가에 대한 제안

제15장 부록

제16장 Technavio 소개

도표

LSH 16.01.29

Market outlook of the semiconductor capital spending market in the US

Semiconductors are the basic component for any electronic component. Semiconductor technology is continuously growing with emergence of advanced technology. Since the last decade, the most prominent segment in global semiconductor industry has been memory, logic, MPU and analog, which made up almost 75% of the total semiconductor demand. Technavio predicts the semiconductor capital spending market in the US to multiply rapidly with a CAGR of close to 9% during the forecast period.

The semiconductor capital spending market in the US is driven by numerous drivers, of which, the most prominent among of all is the accelerated capex in memory and foundry segments. Collectively, memory and foundry represent close to two-third of the total semiconductor capital spending market. With such accelerated capital investments on a global scale, the outcome will have a considerable impact on the semiconductor industry worldwide.

Segmentation of the semiconductor capital spending market in the US by type

  • Wafer fab equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment
  • Wafer-level packaging and assembly equipment
  • Others

Wafer fab equipment segment constitutes the largest share of the overall market, accounting for a market share of more than 48% in 2014. Wafer fab equipment is mainly used during the first half of semiconductor's manufacturing process that makes memory cells and transistors. It covers various patterning, deposition and cleaning process, till wafer passivation.

Competitive landscape and key vendors

The competition in the semiconductor capital spending market in the US is rigid. And the main reason for such intense completion is the evolution of technology. With the pace of technological advancements in the US market, vendors are involved in substantial capital spending, hence, the market comprises of players with strong technological proficiency.

Key vendors in this market are -

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

Other prominent vendors included in this report are AMD, Analog Devices, Broadcom, Freescale, Semiconductor, Marvell Technologies, Qualcomm, and Texas Instruments.

Growth drivers, challenges, and upcoming trends:

Technavio also highlights various trends affecting the semiconductor capital spending market in the US, and one such trend is the rise in China's semiconductor industry. Even though, there are a large number of local semiconductor components manufacturers in China, more than 80% of the semiconductor requirements in China is fulfilled by US semiconductor companies, such as Intel and Global Foundries.

This report provides a number of factors contributing to the adoption, limitations, and opportunities of the semiconductor capital spending market in the US. It also offers an analysis of each factor and an estimation of the extent to which the factors are likely to impact the overall market growth.

Key questions answered in the report include

  • What will the market size and the growth rate be in 2019?
  • What are the key factors driving the semiconductor capital spending market in the US?
  • What are the key market trends impacting the growth of the semiconductor capital spending market in the US?
  • What are the challenges to market growth?
  • Who are the key vendors in the semiconductor capital spending market in the US?
  • What are the market opportunities and threats faced by the vendors in the semiconductor capital spending market in the US?
  • What are the key outcomes of the five forces analysis of the semiconductor capital spending market in the US?

Technavio also offers customization on reports based on specific client requirement.

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Product offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Market overview
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by type

  • Wafer fab equipment
  • Die-level packaging and assembly equipment
  • Automated test equipment
  • Wafer-level packaging and assembly equipment

PART 07: Market Drivers

PART 08: Market drivers and their impacts

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape

  • Competitive scenario
  • Key vendors
  • Other prominent vendors

PART 13: Key vendor analysis

  • Global Foundries
  • Intel
  • Micron
  • Samsung Electronics
  • SK Hynix

PART 14: Key recommendations for vendors/investors

PART 15: Appendix

  • List of abbreviation

PART 16: Explore Technavio

List of Exhibits

  • Exhibit 01: Semiconductor capital spending market in the US
  • Exhibit 02: Semiconductor capital spending market in the US ($ billions)
  • Exhibit 03: Five forces analysis
  • Exhibit 04: Semiconductor capital spending market in the US by type 2014-2019 (% share)
  • Exhibit 05: Capital spending in wafer fab equipment market($ billions)
  • Exhibit 06: Capital spending in die-level packaging and assembly equipment market 2014-2019 ($ billions)
  • Exhibit 07: Capital spending in automated test equipment market 2014-2019 ($ billions)
  • Exhibit 08: Capital spending in wafer-level packaging and assembly equipment market 2014-2019 ($ billions)
  • Exhibit 09: Impact of drivers
  • Exhibit 10: Impact of drivers and challenges
  • Exhibit 11: Global Foundries: Service offerings
  • Exhibit 12: Intel: Business segmentation 2014 by revenue
  • Exhibit 13: Intel: Business segmentation by revenue 2013 and 2014 ($ billions)
  • Exhibit 14: Micron: Business segmentation 2014: By revenue
  • Exhibit 15: Micron: Business segmentation by revenue 2013 and 2014 ($ billion)
  • Exhibit 16: Micron: Geographical segmentation by revenue 2014
  • Exhibit 17: Samsung Electronics: Business segmentation 2013
  • Exhibit 18: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billion)
  • Exhibit 19: Samsung Electronics: Geographical segmentation by revenue 2014
  • Exhibit 20: SK Hynix: Product segmentation 2014
  • Exhibit 21: SK Hynix: Product segmentation revenue by 2014 ($ billions)
  • Exhibit 22: SK Hynix: Geographical segmentation by revenue 2014
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