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세계의 스마트 포장 및 지능형 포장 시장(2020-2030년)

Smart and Intelligent Packaging 2020-2030

리서치사 IDTechEx Ltd.
발행일 2019년 10월 상품 코드 813705
페이지 정보 영문 258 Slides
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세계의 스마트 포장 및 지능형 포장 시장(2020-2030년) Smart and Intelligent Packaging 2020-2030
발행일 : 2019년 10월 페이지 정보 : 영문 258 Slides

세계의 스마트 포장(Smart and Intelligent Packaging) 시장을 조사했으며, 시장의 정의와 개요, 스마트 포장 기술의 도입 촉진요인 분석, 각종 실현 기술의 동향·평가, 사례 연구, 기술별 시장 규모의 추이와 예측, 주요 기업 개요 등을 정리하여 전해드립니다.

제1장 개요·결론

제2장 스마트 포장 : 성장 촉진요인

  • 스마트 포장에 대한 요구
  • 소매 산업의 문제
  • 헬스케어의 문제
  • 보다 많은 인간의 감각을 더 나은 방법으로 사용

제3장 최종사용자 피드백

  • 최종사용자의 요구 : 스마트 포장의 촉진요인
  • 최종사용자의 스마트 포장 피드백 : 애플리케이션의 요구
  • 최종사용자의 스마트 포장에 대한 견해 : 기술의 요구
  • P&G와 프린티드 일렉트로닉스
  • Diage와 프린티드 일렉트로닉스
  • Amcor
  • Colgate-Palmolive Group
  • Unilever

제4장 RFID : 스마트 포장용 NFC·RAIN

  • RFID
  • RFID 기술 : 전체상
  • 패시브 RFID
  • 선호 RFID 주파수
  • 패시브 RFID 시스템
  • 배터리 어시스트 패시브/세미 액티브 태그
  • 배터리 어시스트 패시브(BAP) RFID 센서의 예
  • 액티브 RFID
  • RTLS
  • 칩리스/프린티드 RFID
  • 패시브 RFID 기술 : 동작 주파수별
  • 패시브 HF·UHF 태그의 구조
  • HF/NFC 코일 접촉의 과제
  • 패시브 RFID에 대한 위협 : 머신 비전 등

제5장 프린티드·플렉서블·유기 일렉트로닉스

  • 프린티드·플렉서블·유기 일렉트로닉스의 주요 기술 컴포넌트 설명·분석
  • 시장의 잠재성·수익성
  • 현재 시장 규모
  • 시장 진출 전략 : 이점·단점
  • 밸류체인 등

제6장 디스플레이

  • 일렉트로크로믹 디스플레이
  • AC 일렉트로루미네센트 디스플레이
  • 서모크로믹 디스플레이

제7장 프린티드 LED 조명

제8장 프린티드 플렉서블 배터리

제9장 프린티드 센서

제10장 로직

  • 플렉서블/프린티드 트랜지스터 회로의 각종 종류
  • 왜 프린티드 트랜지스터인가?
  • 반도체 선택의 비교
  • 그러나 과제는 존재
  • 반도체 선택
  • 기존 실리콘 기반 TFT 기술 : 실리콘 기반
  • 금속 산화물 반도체
  • 금속 산화물 제조 프로세스
  • 그러나 금속 산화물 반도체는 프린트 가능한가?
  • Evonik의 솔루션 : 가공 가능한 금속 산화물
  • iXensic의 최신 진보
  • 유기 반도체
  • OTFT 모빌리티의 과장 : 리얼리티 체크
  • 올 프린티드 TFT
  • JAPERA의 올 프린티드 TFT
  • S2S 오토매틱 프린티드 OTFT
  • 롤-투-롤 프린티드 유기 TFT
  • Merck의 유기 TFT
  • 탄소나노튜브·그래핀 트랜지스터
  • 플렉서블/프린티드 트랜지스터 RFID의 최신 진보 등

제11장 QR코드

제12장 용량성/ 잉크 스트라이프 ID

  • 트랜지스터 없는 RFID : HidE(Hidden Electronic Product Code)
  • Printechnologics의 프린티드 ID
  • 레이더 ID 60GHz
  • Inksure : SARcode의 예
  • Touchcode : T-ink /Printechnologics
  • Touchcode의 애플리케이션 컨셉
  • Touchcode의 진보
  • TicTag
  • Prismade Labs

제13장 RFID 센서

  • RFID 센서 : 주요 선택
  • IC 태그에 의한 RFID 태그 센서
  • 패시브 UHF RFID 센서 : Powercast·Vanguard ID Systems에 의한 공동 개발
  • 패시브 UHF RFID 센서 : RFMicron·Smartrac
  • GE/Kemsense : 기존형 RFID 라벨에 기반한 바이오센서
  • 케미컬 파워리스 RFID 센서 태그
  • 실패로부터 얻는 교훈

제14장 화학제품 스마트 포장 기술

  • 식품 열화
  • 미생물 부패
  • 화학·효소 활성
  • 산화 열화·악취
  • 수분/증기 이동
  • 유효기한 판정
  • 식품 열화
  • TTI(Time Temperature Indicators)
  • 화학적 TTI(Time Temperature Indicators)의 예
  • 신선도 지표
  • 숙성도 지표
  • 시간 지표 등

제15장 스마트 포장의 용도 : 기존형 RFID

  • 팰릿/케이스 태깅
  • 소매 의류·아이템 레벨
  • 위조 방지용 RFID
  • 일본의 경제산업성에 의한 태그 목표
  • Coca-Cola Freestyle Machine 등

제16장 스마트 블리스터 팩

  • 복약 준수의 과제
  • 현재 솔루션
  • 프린티드 일렉트로닉스/RFID 솔루션
  • 스마트 블리스터 팩 등

제17장 스마트 포장 : 사례 연구

제18장 전자 스마트 포장 : 시장 예측

  • RAIN(UHF RFID) 스마트 포장
    • 태그 수 예측
    • 평균 가격 예측
    • 시장 규모 예측
  • NFC(HF RFID) 스마트 포장
    • 태그 수 예측
    • 평균 가격 예측
    • 시장 규모 예측
  • 전자 스마트 포장
    • 총수 예측
    • 시장 규모 예측
  • 과제·시장 기회

제19장 부록 : 기업 개요

제20장 부록 : 용어

KSA 19.10.10

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Smart (or intelligent) packaging for goods is packaging which goes beyond the basic function of passively containing and protecting the product by adding useful functionality with real benefits for the consumer.

This comprehensive IDTechEx Research report covers the upcoming requirements and drivers for smart packaging; feedback from Fast Moving Consumer Goods (FMCG) brands with their views of smart packaging; assessment of enabling technologies; smart packaging case studies; key players; and forecasts of electronic smart packaging.

This analysis is done on a global basis, from assessing the rise of QR codes in China to the latest electronic smart labels based on novel semiconductors and other components that are enabling a radical change in the $400 billion+ packaging industry.

IDTechEx concludes how the global demand for electronic smart packaging features will be a $895 million market in 2030 versus $55 million in 2020 (and more if the infrastructure, software and services are also included). Based on an impartial analysis, IDTechEx expects that almost 21 billion packages sold in 2030 will feature an electronic feature to enhance the package.

Why Smart and Intelligent Packaging?

Smart and intelligent packaging can offer many different benefits to the brand, retailer and consumer. For example, it addresses the need for brands to reconnect with the customer or face potential oblivion from competing products. Other drivers include counterfeiting to the ageing population's need for better drug delivery devices.

There are many current and developing emerging technologies which are driving change in the smart packaging segment, often with very different purposes, which include:

  • RFID for wireless item identification (usually invisible to the consumer)
  • Electronic Articles Surveillance (EAS) for anti theft (usually invisible to the consumer)
  • QR codes for identification (increasingly used for payments)
  • Data loggers for temperature, shock, vibration, etc monitoring
  • Interactive smart packaging including illumination, sound, measuring (such as smart blister packs) and much more
  • Chemical indicators: temperature, frozen chemical visual indicators
  • Internal active packaging: whereby the package interacts with the contents to keep it fresher for longer, for example
  • External active packaging: whereby the package releases aromas, for example, to entice consumers

Drivers for Smart Packaging

There are prominent drivers for smart packaging, including the ageing population, more wealthy consumers, requirement for more data on products purchased, entertainment value, need to distinguish products amidst greater competition and tougher legislation.

Smart packaging can also solve big challenges such as monitoring patients not taking medication at the correct times when needed or informing that the medicines or foods are still safe to consume.

Across that backdrop there are other significant impending changes, from increasing home delivery of products and groceries which may change the value of the product packaging in the decision and sales process to many new enabling technologies from machine vision systems to identify items to the increasing adoption of RFID to printed electronics labels. Of course, sustainability is also a high priority for brands.

Global, Detailed Assessment of Smart Packaging

This report from IDTechEx covers the full picture and opportunities - in addition to the challenges. To gain very high volume, and therefore lowest costs, by selling across all industries, basic hardware platforms must be developed. These are discussed. The detailed market forecasts, statistics for associated industries, pros and cons, technology choices and lessons of success and failure provide a lucid, compact analysis.

The report is structured as follows:

  • Executive summary, including key conclusions and forecasts

The need for Smart Packaging and brand perspectives This section covers the drivers for smart packaging, end user requirements and voice of the customer based on feedback from global FMCG firms on their perspectives on smart packaging

  • RFID: NFC and RAIN for Smart Packaging
  • NFC and RAIN technologies, prices and their application to packaging
  • Printed, Flexible and Organic Electronics
  • Assessment of enabling technologies including displays, flexible/printed batteries, printed sensors and flexible logic circuits
  • QR codes
  • Failures and successes, analysis of use of QR codes in China
  • Capacitive ink strip / identification systems
  • Analysis of novel identification systems relevant to smart packaging
  • RFID Sensors
  • NFC and RAIN sensor systems, passive or with battery
  • Chemical smart packaging technologies
  • Review of chemical smart packaging technologies including time temperature and freshness indicators
  • Smart Packaging Applications: RFID
  • Applications and case studies of RFID smart packaging
  • Smart Blister Packs
  • Assessment of smart blister packs for monitoring medication compliance'
  • Smart Packaging Case Studies
  • Case studies and applications of printed electronics in smart packaging
  • Electronic Smart Packaging Forecasts
  • Forecasts and conclusions of electronic smart packaging. Forecasts are given in terms of number of units, average sales price and total market value for each of the following: NFC, RAIN RFID, Light-up/display based electronic smart packaging, audio smart packaging

Opportunities in Smart Packaging

The report identifies and assesses the many challenges still to be addressed, including the value of tagging products in the highest volume versus cost, sustainable profitable applications beyond one-off projects, environmental impact and unmet needs including the lack of integrators and complete product designers. Applicable technologies are assessed with details of the key players.

All of these opportunities and trends, including detailed ten year forecasts, are covered in this IDTechEx report "Smart and Intelligent Packaging 2020-2030". The report reveals many ways in which brands can create a sharp increase in market share, customer satisfaction and profitability. It covers case studies of successes and failures and why.

Analyst access from IDTechEx

All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.

Table of Contents

1. EXECUTIVE SUMMARY AND CONCLUSIONS

  • 1.1.What is Smart Packaging?
  • 1.2.Why Smart Packaging - Logistical and Safety Reasons
  • 1.3.Why Smart Packaging - Increasing Sales and Better Merchandising
  • 1.4.Smart Packaging - Status
  • 1.5.Smart Packaging: Things Are Changing
  • 1.6.EAS tags
  • 1.7.QR Codes
  • 1.8.Unique ID with no silicon chip
  • 1.9.Chipless RFID or Flexible/Printed IC Passive tags
  • 1.10.RAIN (UHF RFID) Smart Packaging
  • 1.11.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 1.12.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 1.13.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 1.14.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 1.15.NFC (HF RFID) Smart Packaging
  • 1.16.NFC (HF RFID) tags 2020-2030 - numbers million
  • 1.17.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 1.18.NFC (HF RFID) tags 2020-2030 - market value $M
  • 1.19.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 1.20.Electronic Smart Packaging beyond RFID
  • 1.21.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 1.22.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 1.23.Challenges and Opportunities

2. SMART PACKAGING DRIVERS

  • 2.1.The need for smart packaging
  • 2.2.Problems in the retail industry
  • 2.3.Problems in healthcare
  • 2.4.Using more of the human senses and in a better way

3. END-USER FEEDBACK

  • 3.1.End User Needs: Drivers for Smart Packaging
  • 3.2.End User Feedback on Smart Packaging - Application Needs
  • 3.3.End User Views on Smart Packaging - Technical Needs
  • 3.4.P&G and printed electronics
  • 3.5.Diageo and printed electronics
  • 3.6.Amcor
  • 3.7.Colgate-Palmolive Group
  • 3.8.Unilever

4. RFID: NFC AND RAIN FOR SMART PACKAGING

  • 4.1.RFID
  • 4.2.RFID Technologies: The Big Picture
  • 4.3.Passive RFID
  • 4.4.Favourite RFID frequencies
  • 4.5.Passive RFID Systems
  • 4.6.Battery Assisted Passive /Semi Active tags
  • 4.7.Examples of Battery Assisted Passive (BAP) RFID sensors
  • 4.8.Active RFID
  • 4.9.Real Time Locating Systems (RTLS)
  • 4.10.Chipless/printed RFID
  • 4.11.Passive RFID: Technologies by Operating Frequency
  • 4.12.Anatomy of passive HF and UHF tags
  • 4.13.Challenges in contacting HF/NFC coils
  • 4.14.Threats to passive RFID: machine vision?
  • 4.15.Might Packaging Become Irrelevant with Online Retailing?

5. PRINTED, FLEXIBLE AND ORGANIC ELECTRONICS

  • 5.1.Description and analysis of the main technology components of printed, flexible and organic electronics
  • 5.2.Market potential and profitability
  • 5.3.Current market size
  • 5.4.Go to Market Strategies: Pros and Cons
  • 5.5.The value chain is unbalanced
  • 5.6.But many have shifted to provide complete solutions
  • 5.7.Many enabling printed electronic technologies are an enabler but not an obvious product
  • 5.8.Creating successful new products is hard
  • 5.9.Cost reduction has been more commercially successful...
  • 5.10....but if it is the only differentiator suppliers can struggle
  • 5.11.Competing on more than cost has been the most successful
  • 5.12.Keep It Simple, Stupid

6. DISPLAYS

  • 6.1.Electrochromic displays
    • 6.1.1.Electrochromic displays
    • 6.1.2.Ynvisible Electrochromic Displays
  • 6.2.AC Electroluminescent displays
    • 6.2.1.AC Electroluminescent displays
    • 6.2.2.AC electroluminescent displays
    • 6.2.3.EL technology
    • 6.2.4.AC Electroluminescent (EL) Displays
  • 6.3.Thermochromic displays
    • 6.3.1.Thermochromic Displays

7. PRINTED LED LIGHTING

  • 7.1.Printed LED lighting
  • 7.2.Nth Degree - Printed LEDs

8. PRINTED, FLEXIBLE BATTERIES

  • 8.1.Introduction to batteries
  • 8.2.Comparison of Power Options
  • 8.3.Applications

9. PRINTED SENSORS

  • 9.1.Applications of printed batteries
  • 9.2.Types of sensors that can be printed
  • 9.3.Sensors: Technology Readiness
  • 9.4.Capacitive pressure/force sensor
  • 9.5.Fluid level sensor

10. LOGIC

  • 10.1.Types of Flexible or Printed Transistor Circuits
  • 10.2.Why Print Transistors
  • 10.3.Semiconductor Choices Compared
  • 10.4.But challenges persist...
  • 10.5.Semiconductor choices
  • 10.6.Incumbent TFT technologies- silicon based
  • 10.7.Metal Oxide Semiconductors
  • 10.8.Metal Oxide production process
  • 10.9.But can Metal Oxide Semiconductors be printed?
  • 10.10.Evonik's solution processible metal oxide
  • 10.11.Latest progress with iXensic
  • 10.12.And even at room temperature with deep UV annealing
  • 10.13.Organic semiconductors
  • 10.14.OTFT Mobility hype: reality check
  • 10.15.All printed TFTs
  • 10.16.JAPERA all printed TFT
  • 10.17.S2S automatic printed OTFT
  • 10.18.Roll-to-roll printed organic TFTs
  • 10.19.Merck's Organic TFT
  • 10.20.Carbon nanotubes and graphene transistors
  • 10.21.Latest progress with flexible/printed transistor RFID
  • 10.22.Flexible or printed transistors for logic, creating smart systems
  • 10.23.Mediocre TFTs can do many functions
  • 10.24.Current work in developing flexible transistor RFID and Smart Packaging
  • 10.25.IMEC / Holst Centre Roadmap
  • 10.26.Benefits of flexible logic
  • 10.27.Save on IC attach cost?
  • 10.28.Logic Based Systems
  • 10.29.Lessons from the Silicon Chip: need for modularity
  • 10.30.Thin, flexible 'NFC' ICs come to market for simple wireless barcodes
  • 10.31.Printed electronics components
  • 10.32.PragmatIC's wine temperature sensing label
  • 10.33.Logic and Smart System Forecast 2018-2030 $ millions
  • 10.34.Company profiles related to this chapter

11. QR CODES

  • 11.1.QR Codes: Failure in Europe and America, Huge Success in China
  • 11.2.QR Codes: where next?
  • 11.3.Will NFC or RAIN Impact QR Codes?

12. CAPACITIVE / INK STRIPE IDENTIFICATION

  • 12.1.RFID without transistors Hidden Electronic Product Code (HidE)
  • 12.2.Printechnologics printed ID
  • 12.3.Radar ID 60GHz
  • 12.4.Inksure - SARcode Example
  • 12.5.Touchcode: T-ink / Printechnologics
  • 12.6.Touchcode Application Concepts
  • 12.7.Touchcode Progress
  • 12.8.TicTag
  • 12.9.Prismade Labs

13. RFID SENSORS

  • 13.1.RFID Sensors: main choices
  • 13.2.RFID tag sensor from IC-TAG
  • 13.3.Passive UHF RFID sensor co-developed by Powercast and Vanguard ID Systems
  • 13.4.Passive UHF RFID Sensor: RFMicron and Smartrac
  • 13.5.GE/ Kemsense: BioSensors on conventional RFID labels
  • 13.6.Chemical powerless RFID sensor tag
  • 13.7.Lessons from Failures

14. CHEMICAL SMART PACKAGING TECHNOLOGIES

  • 14.1.Food degradation
  • 14.2.Microbial Spoilage
  • 14.3.Chemical and Enzymatic Activity
  • 14.4.Oxidative Deterioration/Rancidity
  • 14.5.Moisture/Vapour Migration
  • 14.6.Determining Shelf Life
  • 14.7.Food Degradation
  • 14.8.Time Temperature Indicators (TTIs)
  • 14.9.Chemical TTIs
  • 14.10.Chemical Time Temperature Indicators
  • 14.11.Examples of Chemical Time Temperature Indicators (TTIs
  • 14.12.Freshness Indicators
  • 14.13.Ripeness Indicators
  • 14.14.Time Indicators

15. SMART PACKAGING APPLICATIONS - CONVENTIONAL RFID

  • 15.1.Pallet/ case tagging
  • 15.2.Retail apparel, item level
  • 15.3.Retail Apparel Payback
  • 15.4.RFID for anti-counterfeiting - it's the law!
  • 15.5.METI, Japan, target 100 billion tags/year by 2025
  • 15.6.IDTechEx view on the METI announcement
  • 15.7.RFID provides more consumer engagement and use data
  • 15.8.Coca-Cola Freestyle Machine
  • 15.9.RFID provides more consumer engagement and use data

16. SMART BLISTER PACKS

  • 16.1.The Problem: Medication Non-Compliance
  • 16.2.The Problem: Medication Non-Compliance - Statistics
  • 16.3.The Current Solution
  • 16.4.The Printed Electronics / RFID Solutions
  • 16.5.Smart Blister Packs
  • 16.6.Smart Blister Packs - Not a Big Success Yet
  • 16.7.Things are Changing & More Players Enter
  • 16.8.Smart Blister Packs: Outlook

17. SMART PACKAGING CASE STUDIES

  • 17.1.Batteries with integral battery tester
  • 17.2.Light up Packaging: Bombay Sapphire, KENT Gold, Copoya Rum
  • 17.3.Place mats - McDonalds
  • 17.4.Interactive tablecloth - Hallmark
  • 17.5.Beer package game - VTT Technology
  • 17.6.Cookie heater pack - T-Ink
  • 17.7.Theft detection - Swedish Postal Service and Deutsche Post

18. FORECASTS: ELECTRONIC SMART PACKAGING

  • 18.1.RAIN (UHF RFID) Smart Packaging
  • 18.2.RAIN (UHF RFID) Smart Packaging 2020-2030
  • 18.3.RAIN (UHF RFID) tags 2020-2030 - numbers million
  • 18.4.RAIN (UHF RFID) tags 2020-2030 - avg sale price $cents
  • 18.5.RAIN (UHF RFID) tags 2020-2030 - market value $M
  • 18.6.NFC (HF RFID) Smart Packaging
  • 18.7.NFC (HF RFID) tags 2020-2030 - numbers million
  • 18.8.NFC (HF RFID) tags 2020-2030 - avg sale price $cents
  • 18.9.NFC (HF RFID) tags 2020-2030 - market value $M
  • 18.10.NFC (HF RFID) Smart Packaging Forecast Reasoning
  • 18.11.Electronic Smart Packaging beyond RFID
  • 18.12.Electronic Smart Packaging Total Forecast 2020-2030 Numbers million
  • 18.13.Electronic Smart Packaging Total Forecast 2020-2030 Market value $M
  • 18.14.Challenges and Opportunities

19. APPENDIX: COMPANY PROFILES

20. APPENDIX: GLOSSARY

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