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세계의 SiP 기술 시장 : 성장, 동향, COVID-19의 영향, 예측(2021-2026년)

System in Package Technology Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)

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발행일 2022년 01월 상품코드 989459
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세계의 SiP 기술 시장 : 성장, 동향, COVID-19의 영향, 예측(2021-2026년) System in Package Technology Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)
발행일 : 2022년 01월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계의 시스템 인 패키지(SiP) 시장 규모는 2021년부터 2026년의 예측 기간 동안 8%의 CAGR로 성장할 전망입니다. 많은 기업들의 디지털화 증가, 5G 기술 진보, 사물인터넷(IoT) 및 스마트 로봇의 급속한 발달과 스마트 폰, TV, 블루투스, 컴퓨터, 드론, 마이크 등의 전자 기기 투자 증가는 미래 시장 수요를 견인합니다.

  • 시스템 인 패키지 기술은 시스템 성능을 최대화하기 위해 대부분의 고급 가전 제품에서 채용이 증가하고 있습니다.
  • 제조 비용 절감을 통해 군사, 상업, 과학 및 소비자 시장에서의 무인 항공기(UAV) 사용 증가 및 보안 목적의 오픈 소스 소프트웨어 프레임 워크가 시장에서 번창하고 있습니다.
  • 높은 수준의 통합은 장치 효율이 떨어지며 시장 성장을 방해할 수 있는 문제가 발생합니다. 그러나 스마트 기기 전자 부품의 컴팩트한 사이즈와 향상된 내구성에 대한 수요는 시장에 유리한 기회를 제공할 것으로 예상됩니다.

세계의 시스템 인 패키지(SiP : System in Package Technology) 시장을 조사했으며 시장 개요, 시장 성장 요인 및 저해 요인 분석, 유형별·지역별 시장 규모 추이 및 예측, 경쟁 상황, 주요 기업 프로파일 시장 기회 등 포괄적인 정보를 제공합니다.

목차

제1장 서론

제2장 조사 방법

제3장 개요

제4장 시장 역학

  • 시장 개요
  • 시장 추진력
    • 전자 기기 소형화에 대한 수요
    • 급속한 기술 발전에 의한 비용 절감
  • 시장 억제 요인
    • 높은 수준 통합과 기타 열 문제
  • 가치 사슬 분석
  • 포터의 5세력 모형
  • 업계에 COVID-19의 영향 평가

제5장 시장 세분화

  • 패키지별
    • 플랫 패키지
    • 핀 그리드 어레이
    • 표면 부착(SM)
    • 작은 개요
  • 패키지 기술별
    • 2D IC
    • 3D IC
    • 5D IC
  • 포장 방법별
    • 와이어 본드
    • 플립 칩
    • 팬아웃 웨이퍼리브
  • 단말별
    • 전력 관리 집적 회로(PMIC)
    • 마이크로 전자 기계 시스템(MEMS)
    • RF 프론트 엔드
    • RF 전력 증폭기
    • 애플리케이션 프로세서
    • 베이스 밴드 프로세서
    • 기타
  • 용도별
    • 가전
    • 통신
    • 산업 시스템
    • 자동차 및 운송
    • 항공 우주 및 방위
    • 의료
    • 기타
  • 지역별
    • 북미
    • 유럽
    • 아시아태평양
    • 라틴아메리카
    • 중동과 아프리카

제6장 경쟁 상황

  • 기업 프로파일
    • Amkor Technology Inc.
    • ASE Group
    • Samsung Electronics Co Ltd.
    • Powertech Technologies Inc.
    • Fujitsu Ltd.
    • Toshiba Corporation
    • Qualcomm
    • Renesas Electronics Corporation
    • ChipMOS Technologies Inc.
    • Jiangsu Changjiang Electronics Technology Co. Ltd.
    • Powertech Technologies Inc.
    • Siliconware Precision Industries Co.
    • Freescale Semiconductor Inc.

제7장 투자 분석

제8장 시장 기회와 동향

NJH

The system in package technology market is expected to register a CAGR of 8% over the forecast period 2021 - 2026. Increasing adoption of digitalization by many businesses, technological advancement of 5G, Internet of Things (IoT) and rapid development of smart robots across the world, and rising investment on electronic devices such as smartphones, televisions, global positioning systems, bluetooth, computers, drones, microphones, etc will boost the market demand in the future

Key Highlights

  • As system in package technology maximizes system performance due to higher integration and eliminates re-packaging with shorter development cycles at reduced costs has increased its adoption in most advanced consumer electronic devices. According to the 2020 Consumer Technology Association report, the United States consumer technology industry is expected to a record USD 422 billion in retail revenues in 2020 with nearly 4% growth over last year due to increased popularity of streaming services and wireless earbuds along with 5G connectivity and artificial intelligence (AI) enabled devices.
  • Increased utilization of drones, Unmanned Aerial Vehicles (UAVs) in military, commercial, scientific, and consumer markets due to reduction in manufacturing costs, and open source software frameworks for security purposes is thriving the market. As per Federal Aviation and Administration, there are total of 1,563,263 registered drones out of that 441,709 are commercial drones and 1,117,900 are recreational drones as of March 2020.
  • Higher level of integration leads to thermal issues that can compromise the efficiency of devices and would hinder the growth of the market. However, increased demand for compact size and enhanced durability of electronic component in smart gadgets are expected to provide lucrative opportunities to the market.

Key Market Trends

Automotive Industry Will Witness Significant Growth

  • The automotive sector especially electric vehicles will experience growth in the forecast period due to the growing sensitivity of fossil fuel and increasing government measures towards a cleaner environment. For instance, in automotive sectors, giants like General Motors plans to release autonomous (driverless car) cars in 2021 while AUDI collaborated with Nvidia to develop a capability for the non-human supervised car models. The prototype of this highly automated car is based on AUDI's Q7 car model. SIP technology is used in smart and electric vehicles in its electric components such as power modules (ADI µModules), sensors (MEMS), transmission control unit, vehicle central infotainment unit, single-chip module, etc.
  • Growing requirement of compact sensors with integrates packaging technologies such as image sensors, environment sensors and controllers are propelling the manufactures to develop various ICs with a high standard of safety, rapid time-to-market, and cost-effectiveness for various functions that smart automotive requires.
  • For instance, in 2019 ON Semiconductor has developed a portfolio of sensors for automotive including the next-generation RGB-IR image sensor solution for in-cabin applications and the Hayabusa family of CMOS image sensors for advanced driver-assistance systems (ADAS) and viewing automotive camera systems.
  • The COVID-19 pandemic has impacted the automotive industry across the globe. Most of the manufacturing units have been halted due to the risk of COVID-19 poses to vulnerable workers and other citizen in turn has hampered the growth of the SIP technology market temporarily. Automobile companies are stepping in to manufacture necessary medical devices to meet the hospital demand. Tesla has already created a prototype ventilator that uses parts adapted from electric vehicles and has promised to produce ventilator for treatment of patients. But some of the automakers are looking for fast track plans for agile manufacturing processes and supply chains to meet the volatile demand environment after the Covid-19.

North America is Expected to Witness Significant Growth

  • North America is expected to grow the demand for system in package technology due to increase implementation of connected devices, rapid investment for expansion of 5G, and adoption of robots across all the sectors to automate the various workflow for better efficiency.
  • RF power amplifier and baseband processor are used for optical communications, satellite communications, high-speed pulse experiments, data transmission, radar, and antenna measurement. Rapid penetration of 5G in North America is growing the demand for SIP technology. For instance, Ericsson's 2019 report on the mobile industry has predicted that by 2024 there may be 1.9 billion 5G cellular subscriptions that may drive the growth of IoT devices. The North American market is expected to grow most with 63% of mobile subscriptions with 5G service, and 47% of cellular subscribers in East Asia may have 5G access as well due to reductions in chipset prices and the expansion of cellular technologies, such as NB-IoT and Cat-M1.
  • Rapid demand of microelectromechanical systems (MEMS) in medical systems such as blood pressure sensor, muscle stimulators and drug delivery systems, implanted pressure sensors, miniature analytical instruments and pacemakers is growing the market in United States due to increase in various chronic diseases.
  • Rapid demand of microelectromechanical systems (MEMS) in medical systems such as blood pressure sensor, muscle stimulators and drug delivery systems, implanted pressure sensors, miniature analytical instruments and pacemakers is growing the in United States due to various chronic diseases. According to a report chronic disease are among the most prevalent and costly health conditions in the United States and nearly half (approximately 45%, or 133 million) of all Americans suffer from at least one chronic disease and the number is growing. Most common chronic diseases are cancer, diabetes, hypertension, stroke, heart disease, respiratory diseases, arthritis and obesity. And as per the Centers for Disease Control, United States, chronic disease, accounts for nearly 75% of aggregate healthcare spending, or an estimated $5300 per person annually.

Competitive Landscape

The system in package technology market is competitive and is dominated by a few major players like Amkor Technology Inc., ASE Group, Samsung Electronics Co Ltd., Toshiba Corporation, and Qualcomm. These major players with a prominent share in the market are focusing on expanding their customer base across foreign countries. These companies are leveraging strategic collaborative initiatives to increase their market share and increase their profitability. However, with technological advancements and product innovations, mid-size to smaller companies are increasing their market presence by securing new contracts and by tapping new markets.

  • April 2020 - Fujitsu has received a supercomputer order from Japan Aerospace Exploration Agency. Its new computing system will consist of Fujitsu Supercomputer PRIMEHPC FX1000 with 19.4 petaflops (approximately 5.5 times the theoretical computing performance of the current computing system), in addition to 465 nodes of x86 servers Fujitsu Server PRIMERGY series for general-purpose systems handling diverse computing needs. The new system will be used for conventional numerical simulations, AI computational processing platform for joint research/shared use, and large-scale data analysis platform to aggregate/analyze satellite observation data.
  • March 2020 - Toshiba Corporation has launched 80V N-channel power MOSFETs fabricated with the latest generation process. The new MOSFETs are suitable for switching power supplies in industrial equipment used in data centers and communication base stations.The expanded line-up includes "TPH2R408QM," housed in SOP Advance, a surface-mount type packaging, and "TPN19008QM," housed in a TSON Advance package.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing demand for miniaturization of electronic devices
    • 4.2.2 Rapid Technological Advances Led to Cost Reduction
  • 4.3 Market Restraints
    • 4.3.1 Thermal Issues Due to Higher level of Integration
  • 4.4 Value Chain Analysis
  • 4.5 Porter's Five Force Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of COVID-19 Impact on the Industry

5 MARKET SEGMENTATION

  • 5.1 Package
    • 5.1.1 Flat Packages
    • 5.1.2 Pin Grid Arrays
    • 5.1.3 Surface Mount
    • 5.1.4 Small Outline
  • 5.2 Package Technology
    • 5.2.1 2D IC
    • 5.2.2 3D IC
    • 5.2.3 5D IC
  • 5.3 Packaging Method
    • 5.3.1 Wire Bond
    • 5.3.2 Flip Chip
    • 5.3.3 Fan-Out Wafer Leve
  • 5.4 Device
    • 5.4.1 Power Management Integrated Circuit (PMIC)
    • 5.4.2 Microelectromechanical Systems (MEMS)
    • 5.4.3 RF Front-End
    • 5.4.4 RF Power Amplifier
    • 5.4.5 Application Processor
    • 5.4.6 Baseband Processor
    • 5.4.7 Others
  • 5.5 Application
    • 5.5.1 Consumer Electronics
    • 5.5.2 Telecommunications
    • 5.5.3 Industrial Systems
    • 5.5.4 Automotive and Transportation
    • 5.5.5 Aerospace and Defense
    • 5.5.6 Healthcare
    • 5.5.7 Other Applications
  • 5.6 Geography
    • 5.6.1 North America
    • 5.6.2 Europe
    • 5.6.3 Asia-Pacific
    • 5.6.4 Latin America
    • 5.6.5 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Amkor Technology Inc.
    • 6.1.2 ASE Group
    • 6.1.3 Samsung Electronics Co Ltd.
    • 6.1.4 Powertech Technologies Inc.
    • 6.1.5 Fujitsu Ltd.
    • 6.1.6 Toshiba Corporation
    • 6.1.7 Qualcomm
    • 6.1.8 Renesas Electronics Corporation
    • 6.1.9 ChipMOS Technologies Inc.
    • 6.1.10 Jiangsu Changjiang Electronics Technology Co. Ltd.
    • 6.1.11 Powertech Technologies Inc.
    • 6.1.12 Siliconware Precision Industries Co.
    • 6.1.13 Freescale Semiconductor Inc.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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