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다이 어태치 장비 시장 : 성장, 동향, COVID-19의 영향, 예측(2021-2026년)

Die Attach Equipment Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)

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발행일 2022년 01월 상품코드 989463
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다이 어태치 장비 시장 : 성장, 동향, COVID-19의 영향, 예측(2021-2026년) Die Attach Equipment Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)
발행일 : 2022년 01월 페이지 정보 : 영문

본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

세계의 다이 어태치 장비 시장 규모는 2021-2026년 예측기간 중 6.1%의 CAGR로 성장할 것으로 예상됩니다.

  • AuSn 공정 다이 어태치 기술 수요가 시장을 견인하고 있습니다. 기존에 칩을 내장하고, 디바이스 수명 동안 확실히 기능시키려면 금속 충전 전도성 에폭시, 높은 납 함유 솔더, 금-실리콘 솔더 등 다양한 다이 어태치 제품으로 충분했습니다. 그러나 발열량 증가, 컴팩트한 디바이스 수요, RoHS 및 REACH법 제정 및 GaAs 칩으로의 이동 경향에 의해 기존 재료 사용이 제한되고 있습니다. 디바이스의 높은 신뢰성에 대한 요구에 의해 엔지니어는 다이 어태치먼트용 다양한 새로운 재료를 평가하게 되었습니다.
  • 디스크리트 파워 디바이스 수요가 시장을 견인하고 있습니다. 기존 와이어 및 리본 본딩 대신으로 구리 클립의 채용이 증가하고 있습니다. 디스크리트 파워 디바이스 패키징 기술에는 다이 어태치 기능이 포함됩니다. 이 요인에 의해 디스크리트 파워 디바이스용 다이 어태치 장비 수요가 증가합니다.
  • 또한 COVID-19는 장비 수요에 큰 영향을 미치지 않습니다. 예를 들어 2020년 4월 Palomar Technologies는 COVID-19에 대응하기 위한 중요한 반도체 컴포넌트 제조에 대한 수요가 증가했다고 발표했습니다. 또한 의료기기 시장에서는 호흡기나 인공호흡기에 사용되는 중요한 컴포넌트인 압력 센서 생산이 빠르게 증가하고 있으며, 8000i 와이어 본더의 주문이 급증하고 있습니다. 따라서 팬데믹에 의해 장비의 전체적인 수요는 크게 감소하고 있지 않습니다.

다이 어태치 장비(Die Attach Equipment) 시장을 조사했으며, 시장 개요, 시장 성장 촉진요인 및 저해요인 분석, 종류별·지역별 시장 규모 추정과 예측, 경쟁 상황, 주요 기업 개요, 시장 기회 등의 정보를 제공합니다.

목차

제1장 서론

제2장 조사 방법

제3장 주요 요약

제4장 시장 역학

  • 시장 개요
  • 시장 성장 촉진요인
    • AuSn 공정 다이 어태치 기술 수요 증가
    • 디스크리트 파워 디바이스 수요
  • 시장 성장 억제요인
    • 가공중 및 내용연수중 치수 변화와 기계적 불균형
  • 업계의 밸류체인 분석
  • 업계의 매력 - Porter's Five Forces 분석
    • 신규 참여업체의 위협
    • 구매자의 협상력/소비자의 협상력
    • 공급 기업의 협상력
    • 대체 제품의 위협
    • 경쟁 기업간 경쟁 관계

제5장 시장 세분화

  • 종류별
    • 다이 본더
    • 플립칩 본더
  • 접착 기술별
    • 에폭시
    • 공정
    • 소프트 솔더
    • 하이브리드 본딩
    • 기타 접착 기술
  • 용도별
    • 메모리
    • RF & MEMS
    • LED
    • CMOS 이미지 센서
    • 로직
    • 옵토일렉트로닉스/포토닉스
    • 기타
  • 지역별
    • 북미
    • 유럽
    • 아시아태평양
    • 기타 지역

제6장 경쟁 상황

  • 기업 개요
    • Palomar Technologies, Inc.
    • Shinkawa Ltd.
    • MicroAssembly Technologies, Ltd.
    • ASM Pacific Technology Limited
    • Be Semiconductor Industries NV
    • Kulicke and Soffa Industries, Inc.
    • Dr. Tresky AG
    • Fasford Technology Co Ltd.
    • Inseto UK Limited
    • Anza Technology Inc.

제7장 투자 분석

제8장 시장 기회와 동향

KSM 21.02.23

The die attach equipment market is expected to register a CAGR of 6.1 % during the forecast period of 2021 - 2026. In recent trends, the demand of hybrid circuits has remained strong as emerging and existing applications in medical, military, photonics, wireless electronics, etc. The die-to-wafer hybrid bonding platform allows the semiconductor industry to extend beyond Moore's Law, providing unprecedented 2.5D and 3D integration flexibility required for next-generation electronics. C2W hybrid bonding is the promising emerging technology that can enable direct Cu- Cu bonding and has the potential to replace TCB for the 3D stacked memory and high-end logic application. However, C2W hybrid bonding is still in its early stages level and is expected to hit the market in 2021 for stacked memory and in 2022/23 for logic devices with 2.5D structures, which significantly assist the growth of the equipment market.

Key Highlights

  • The demand for the AuSn Eutectic Die-Attach technique drives the market. Traditionally, various die-attach products, which include metal-filled conductive epoxies, high lead-containing solders, and gold-silicon solders were sufficient to mount the chip and have it perform reliably for the life of the device. However, the trend towards increasing heat generation, demand for compact devices, enactment of RoHS and REACH legislation, and the transition to GaAs chips limited the use of conventional materials. The demand for high reliability in devices has led engineers to evaluate various new materials for their die-attachment.
  • The suggested solder preforms are eutectic gold-tin and can be implemented for high volume or lab quantity adoption using a Palomar Technologies' die bonder. This equipment is capable of handling the complete die-attach process, including high-accuracy pick-and-place of substrates, eutectic gold-tin preforms, and components; eutectic die-attach; and pulsed-heat reflow using a computer-controlled Pulse Heat Stage (PHS).
  • The demand for discrete power devices drives the market. The growing adoption of copper clips is growing as a substitute for more conventional wire and ribbon bonding. The packaging technologies for discrete power devices include die attach function. The adoption of wide-bandgap semiconductor die technologies (SiC and GaN) brings new innovative packaging solutions, including silver sintering die-attach (materials include epoxy molding compounds and interconnection materials). The progressive transition from discrete SiC towards SiC modules in EV/HEV applications, the embedded-die packaged systems, and the integration of GaN devices in multichip systems are just a few examples of such trend. This factor enhances the demand of the die attaches equipment for the discrete power devices.
  • Further, the impact of COVID-19 does not highly affect the demand for equipment. For instance, in April 2020, Palomar Technologies announced that they are getting demand for manufacturing critical semiconductor components to address COVID-19. They saw an acceleration of orders of their 3880 Die Bonder equipment to assist in wireless communications and networking bandwidth, remote medicine, IoT in robotics, and the use of video conferencing. Further, within the medical device market, their customers are rapidly ramping up the production of pressure sensors, which are crucial components used in respirators and ventilators, and this has resulted in a surge of orders for their 8000i Wire Bonder. Hence, overall the demand for equipment has not dropped drastically due to the pandemic.
  • However, mostly dimensional changes during processing and service life and mechanical unbalance of moving parts during processing through equipment challenges the equipment's functionality.

Key Market Trends

LED to Witness Significant Growth

  • Die attach material represents a key role in the performance and reliability of mid, high, and super-high power LEDs. With an increasing LED penetration rate, the demand for die-attach equipment is increasing. The selection of suitable die-attach material for a particular chip structure and application depends on various considerations, which include packaging process (throughput and yield), performance (thermal dissipation output and light output), reliability (lumen maintenance), and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and the sintered materials have all been used for LED die attach.
  • For instance, SFE provides an Epoxy Adhesive bonding method where its LED Epoxy Die Bonder machine features an index time of 0.2 Sec /Cycle (90 Percent Rate of Operation) with a chip size of 250 * 250 standard providing lead frame recognition through 2 Camera. Its software function provides auto mount level & pick up level teaching function.
  • Further, conductive adhesives (mostly silver-filled epoxies) constitute the largest class of thermal die-attach materials (by unit number) for LEDs. They are compatible with existing back-end packaging equipment and provide an attractive cost/performance balance (typically up to 50 W/mK thermal with the secondary reflow compatibility). As they stick to bare silicon, they are the most preferred material for dies without back-end metallization like GaN on silicon.
  • Further, in the LED market, there are a lot of rivals or competitors, and ASM is one of the prominent players in this market, and its LED Epoxy High speed die bonder AD830 dominates in the LED market. It is fast, reliable, accurate with die placement accuracy of +/-1 mil and +/-3 degree, cycle time for a small chip like 10mil x 10mil is 180 ms, which is an equivalent UPH of 18,000. It is equipped with a Post bond inspection system that monitors the bonded unit at the pre-set placement range.
  • Furthermore, in June 2019, ASM AMICRA launched a new CoS (Chip-on-Submount) die-bonder, which won the 2019 Productronica Innovation Award. This new machine combines the company's dynamic alignment system with the new handling technologies, and while comparing to the industry average, it has significantly shorter cycle times of 6 seconds. Further, it also provides a massive increase in productivity and an accuracy of ±3 µm @ three sigmas, which represents a new industry standard in accuracy and productivity in LED solutions.

Asia-Pacific Accounts for Significant Market Growth

  • Asia-Pacific accounted for the significant growth of the die attach equipment industry. More than 60% of OSAT (Outsourced Semiconductor Assembly And Test) players present across the world have their headquarters in the APAC region. These OSAT companies use die-attach equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs (Integrated Device Manufacturer) in the region is expected to boost the market growth in the near future.
  • The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components. Further, South Korea, China, and mostly Japan's old age population are anticipated to accelerate the need for healthcare services during the forecast period, thus providing scope for devices, such as ventilators, dialysis, and blood pressure monitoring devices constituting MEMS pressure sensors. The United Nations estimates that the geriatric population in the region, aged 60 years and older, could reach around 606.55 million, by 2020. The instance caters to the growth of the market due to the demand for die-attach equipment for MEMS pressure sensor.
  • Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and are expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc. According to smartcities.gov.in, the central government has allotted USD 977 million into the development of 60 such smart cities. This leads to the demand for a higher number of CMOS image sensors, which further supports the market growth.
  • High Power lasers are finding extensive demand in industrial sectors for a wide range of applications, including cutting, welding, and fabrication. Companies are moving towards Laser technologies to take advantage of high performance and reliability. In December 2019, Mitsubishi Electric Corporation launched the ML562G86 pulse laser diode (LD) for projectors, featuring a vibrant 638-nanometer (nm) red light, the output power of 3.0W under pulse operation and mean time to failure1 (MTTF) of over 20,000 hours. The advancement in laser diode significantly increases the demand for equipment, which processes the technique of Epoxy and Eutectic bonding.
  • Further memory demand is expected to increase with the development of IoT, AI, and ADAS. As a result, productivity improvement in memory chip manufacturing and improvement of post-processing device reliability will be required more than in the past. To address this, in December 2019, DISCO Corporation has developed DDS2320, a fully automatic die separator capable of processing ∅ 300 mm wafers that contributes to improved throughput and reliability in memory production.

Competitive Landscape

The die attach equipment market is fragmented in nature as the presence of local and global players penetrates the intense rivalry in the market. Further, players are focusing on improving their equipment performance in terms of throughput and yield by development, partnership making the market more competitive. Key players are Be Semiconductor Industries N.V., ASM Pacific Technology Limited, etc. Recent developments in the market are -

  • March 2020 - Electroninks announced that it is entering into a strategic alliance with Enjet Inc. to support advanced manufacturing of display, touchpanel, and packaging products. Electroninks and Enjet will collaborate together as a team to supply conductive ink printing at less than 10um in several markets, including micro-LED, mini-LED, EMI Shielding, and die-attach/interconnect applications.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing Demand of AuSn Eutectic Die-Attach Technology
    • 4.2.2 Demand of Discrete Power Devices
  • 4.3 Market Restraints
    • 4.3.1 Dimensional Changes During Processing and Service Life and Mechanical Unbalance
  • 4.4 Industry Value Chain Analysis​
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis​
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Die Bonder
    • 5.1.2 Flip Chip Bonder
  • 5.2 Bonding Technique
    • 5.2.1 Epoxy
    • 5.2.2 Eutectic
    • 5.2.3 Soft Solder
    • 5.2.4 Hybrid Bonding
    • 5.2.5 Other Bonding Techniques
  • 5.3 Application
    • 5.3.1 Memory
    • 5.3.2 RF & MEMS
    • 5.3.3 LED
    • 5.3.4 CMOS Image Sensor
    • 5.3.5 Logic
    • 5.3.6 Optoelectronics / Photonics
    • 5.3.7 Other Applications
  • 5.4 Geography
    • 5.4.1 North America
      • 5.4.1.1 United States
      • 5.4.1.2 Canada
    • 5.4.2 Europe
      • 5.4.2.1 Germany
      • 5.4.2.2 United Kingdom
      • 5.4.2.3 France
      • 5.4.2.4 Rest of Europe
    • 5.4.3 Asia Pacific
      • 5.4.3.1 Taiwan
      • 5.4.3.2 China
      • 5.4.3.3 Japan
      • 5.4.3.4 Rest of Asia Pacific
    • 5.4.4 Rest of the World
      • 5.4.4.1 Latin America
      • 5.4.4.2 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Palomar Technologies, Inc.
    • 6.1.2 Shinkawa Ltd.
    • 6.1.3 MicroAssembly Technologies, Ltd.
    • 6.1.4 ASM Pacific Technology Limited
    • 6.1.5 Be Semiconductor Industries N.V.
    • 6.1.6 Kulicke and Soffa Industries, Inc.
    • 6.1.7 Dr. Tresky AG
    • 6.1.8 Fasford Technology Co Ltd.
    • 6.1.9 Inseto UK Limited
    • 6.1.10 Anza Technology Inc.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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