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LEDinside : 마이크로 LED 차세대 디스플레이(2019년) : 주요 기술 리포트

LEDinside: 2019 Micro LED Next Generation Display Key Technology Report

리서치사 TrendForce
발행일 2019년 01월 상품 코드 752366
페이지 정보 영문
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LEDinside : 마이크로 LED 차세대 디스플레이(2019년) : 주요 기술 리포트 LEDinside: 2019 Micro LED Next Generation Display Key Technology Report
발행일 : 2019년 01월 페이지 정보 : 영문

세계의 마이크로 LED(Micro LED) 시장을 조사했으며, 시장 및 제품의 개요, 시장 발전의 추이, 시장 규모의 추이와 예측, 응용 제품과 개발 동향, 특허 동향, 주요 기술 부문별 보틀넥·과제 분석, 주요 기업에 의한 기술개발 동향 등을 정리하여 전해드립니다.

제1장 마이크로 LED : 정의·시장 규모

  • 제품 정의
  • 시장 규모 분석·예측
  • 출하량 분석
  • 보급률 분석

제2장 마이크로 LED 응용 제품·개발 동향

  • 마이크로 LED 제품의 개요
  • 헤드 마운트 디바이스
  • 웨어러블 디바이스
  • 핸드헬드 디바이스
  • IT 디바이스
  • IT 디스플레이
  • 자동차 디스플레이
  • TV
  • LED 디스플레이

제3장 마이크로 LED 특허 분석

제4장 마이크로 LED 기술 보틀넥과 솔루션

  • 기술 개요
  • 제조 프로세스
  • LED 에피택시·칩 제조 프로세스
  • 트랜스퍼 기술/본딩 기술/구동·백플레인 기술

제5장 에피택시 기술 : 보틀넥과 과제

  • 솔루션
  • 에피텍셜 웨이퍼 구조·발광 원리
  • 에피택시 발광 레이어 재료·시감 효율
  • 누설 문제
  • 장비 기술의 분류
  • 장비 기술의 비교
  • 에피텍셜 웨이퍼 : 주요 기술 분류
  • 적용 분석 등

제6장 칩 제조 프로세스 기술 : 보틀넥·과제 분석

  • LED 칩의 소형화
  • LED 칩 제조 프로세스
  • 래터럴 칩·플립칩·버티컬 칩의 구조상 차이
  • 소형 LED 칩(사파이어 기판 포함) 스크라이빙 기술
  • 소형 LED 칩(사파이어 기판 생략) 스크라이빙 기술
  • 레이저 절제
  • 구조적인 취약성과 절연층
  • 트랜스퍼 헤드의 설계
  • 기존형 LED와 마이크로 LED 칩 제조 프로세스의 차이 등

제7장 매스 트랜스퍼 기술 : 보틀넥·과제 분석

  • 매스 트랜스퍼 기술의분류
  • 박막 매스 트랜스퍼 기술의 분류
  • 픽 & 플레이스 기술
  • UPH에 대한 영향요인
  • Apple(LuxVue)
  • Samsung
  • X : Celeprint
  • ITRI
  • MikroMesa
  • AUO
  • VueReal
  • Rohinni
  • eLux
  • PlayNitride
  • Sony
  • QMAT
  • Uniqarta
  • OPTOVATE
  • KIMM
  • 마이크로 LED 매스 트랜스퍼 기술의 7가지 주요 과제
  • 적용 분석 등

제8장 검사 기술 : 보틀넥·과제 분석

  • 마이크로 LED 기술의 보틀넥 & 솔루션 : 개요 - 검사 기술
  • PL 검사 기술
  • 디지털카메라 광전 검사
  • 접촉형 광전 검사
  • 비접촉형 광전 검사 기술
  • 비접촉 EL 검사 기술
  • 자외선 조사형 광전 검사
  • 각종 기술의 비교 등

제9장 수복 기술 : 보틀넥·과제 분석

  • 마이크로 LED 기술의 보틀넥 & 솔루션 : 개요 - 수복 기술
  • 자외선 조사
  • 레이저 용접
  • 선택적 픽
  • 선택적 레이저
  • 백업 회로설계 솔루션 등

제10장 풀 컬러 테크니컬 솔루션 : 보틀넥·과제 분석

  • 풀 컬러 테크니컬 솔루션의 각종 종류
  • RGB 칩의 채색 기술
  • 색변환
  • 양자점 색변환 기술·용도
  • QW 색변환 기술
  • 적용 분석 등

제11장 본딩 기술 : 보틀넥·과제 분석

  • 기술적 분류
  • SMT 솔루션
  • 공정 웨이브 납땜
  • 이방성 전도성 접착제(ACF) 솔루션
  • 이방성 솔더 페이스트(SAP) 솔루션
  • 웨이퍼 본딩 기술 솔루션
  • 웨이퍼 본딩의 어려움 분석
  • 마이크로 TUBE 솔루션
  • 실행가능성 분석 등

제12장 구동 스킴 : 보틀넥·과제 분석

  • 구동 스킴의 종류
  • 드라이버 IC의 중요성
  • 스위치 모드 드라이버의 각종 종류
  • 액티브 vs 패시브 매트릭스 구동의 비교
  • 디스플레이 구동 스킴
  • 박막 트랜지스터
  • OLED 구동 스킴
  • 마이크로 LED 구동 스킴
  • OLED vs 마이크로 LED : 파워 모듈의 비교 등

제13장 백플레인 기술 : 보틀넥·과제 분석

  • 디스플레이 백플레인의 구조
  • 백플레인 재료의 각종 종류
  • 집적 백플레인 : 유리 기판·화소 스위치 컴포넌트의 동작 원리
  • 집적 백플레인 : 유리 기판·화소 스위치 컴포넌트의 특징
  • 집적 백플레인 : 유리 기판 화소 스위치 컴포넌트의 제조 프로세스
  • 집적 백플레인 : 유리 기판 화소 스위치 컴포넌트의 해상도 비교
  • 집적 백플레인 : 유리 기판 화소 스위치 컴포넌트의 소비전력 비교
  • 집적 백플레인 : 유리 기판 화소 스위치 컴포넌트의 누설 비교
  • 집적 백플레인 : 플렉서블 기판·화소 스위치 컴포넌트의 특징
  • 집적 백플레인 : 플렉서블 기판의 제조 프로세스
  • 집적 백플레인 : 플렉서블 기판 재료의 특징
  • 집적 백플레인 : 실리콘 기판의 구조
  • 집적 백플레인 : 실리콘 기판의 제조 프로세스
  • 집적 백플레인 : 실리콘 기판 재료의 특징
  • 비집적 백플레인 : PCB 기판의 비교
  • 비집적 백플레인 : PCB 제조의 과제
  • 비집적 백플레인 : PCB 사이즈상 제약
  • 백플레인 기술의 비교
  • 적용 분석 등

제14장 마이크로 LED 공급망·기업별 기술개발 분석

KSA 19.02.12

Analysis and Prediction of Micro LED Market Value

The market value of Micro LED doesn't include mass transfer and other cost but includes LED epitaxyand chip.

Due to the high unit price of wafer used in Micro LED Display, it will contribute to the market value in the short term although there are only a few quantities. As the technology matures, the wafer price has gradually declined. It is estimated that the price will drop to 29% of CAGR in 2018-2023.

Remark:

This report makes further classification for different application fields.

  • Head mounted display (HMD) includes AR/VR product application.
  • IT display contains NB and MNT.
  • Mobile display embeds in smart phone and tablet.
  • TV display and Micro LED will be self-emitting display modes. As for Mini LED, it is mainly used for backlight. Both of them wil lcompete with OLED TV in the high-end market.
  • Video Wall with size larger than 100" are mainly used in commercial display areas. Currently, Micro LED display application is represented by the CLEDS solution of SONY.

Overview Analysis

At present, there are six bottlenecks, including epitaxyand chip, transfer, full color, power drive, backplane, and inspection and repairing technologies.

Table of Contents

Chapter 1: Definition and Market Scale of Micro LED

  • Product Definition of Micro LED
  • Analysis and Prediction of Micro LED Market Value
  • Analysis and Prediction of Micro LED Output Volume
  • Estimation of Micro LED Display Penetration Rate

Chapter 2: Micro LED Applications and Technology Development

  • Micro LED Product Overview
  • Micro LED Product Specifications Overview
  • Micro LED Applications-Specifications of Head Mounted Device
  • Micro LED Applications-Cost of Head Mounted Device
  • Micro LED Applications-Shipment Volume of Head Mounted Device
  • Micro LED Applications-Specifications of Wearable Device
  • Micro LED Applications-Cost of Wearable Device
  • Micro LED Applications-Shipment Volume of Wearable Device
  • Micro LED Applications-Specifications of Handheld Device
  • Micro LED Application-Cost of Handheld Device
  • Micro LED Application-Shipment Volume of Handheld Device
  • Micro LED Application-Specifications of IT Device
  • Micro LED Application-Cost of IT Display
  • Micro LED Application-Shipment Volume of IT Device
  • Micro LED Application-Specification of Automotive Display
  • Micro LED Application-Cost of Automotive Display
  • Micro LED Application-Shipment Volume of Automotive Display
  • Micro LED Application-Specifications of TV
  • Micro LED Application-Cost of TV
  • Micro LED Application-Shipment Volume of TV
  • Micro LED Application-Specifications of LED Display
  • Micro LED Application-Cost of LED Display
  • Micro LED Application-Shipment Volume of LED Display

Chapter 3: Micro LED Patent Analysis

  • 2000-2018 Micro LED Patent Layout-Patent Family Analysis
  • 2000-2018 Micro LED Patent Layout-Region Analysis
  • 2000-2018 Micro LED Patent Layout-Technology Analysis
  • 2000-2018 Micro LED Patent Layout-Manufacturer Analysis
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Patent Technology Overview
  • Mass Transfer Technology-Patent Technology Classification
  • 2001-2018 Micro LED Patent Layout-Mass Transfer Technology Patent Family Analysis
  • Mass Transfer Technology-Brand Manufacturer Technology Layout Analysis
  • Mass Transfer Technology-Start-up and Research Institution Technology Layout Analysis

Chapter 4: Micro LED Technology Bottleneck and Solution

  • Micro LED Industry Technology Overview Analysis
  • Micro LED Technology Bottleneck and Solution Overview-Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-LED Epitaxy and Chip Manufacturing Process
  • Micro LED Technology Bottleneck and Solution Overview-Transfer Technology/Bonding Technology/Drive and Backplane Technology

Chapter 5: EpitaxyTechnology Bottleneck and Challenge Analysis

  • Epitaxy Technology-Solution
  • Epitaxy Technology-Epitaxial Wafer Structure and Light Emitting Principle
  • Epitaxy Technology-Epitaxy Emissive Layer Material and Luminous Efficacy
  • EpitaxyTechnology-The Leakage Problem of Chip Miniaturization Causes the Drop of Luminous Efficacy
  • EpitaxyTechnology-Equipment Technology Classification
  • EpitaxyTechnology-Equipment Technology Comparison
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Wavelength Uniformity
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Defect Control
  • EpitaxyTechnology-Epitaxial Wafer Key Technology Classification-Increase of Utilization of Epitaxial Wafer
  • Epitaxy Technology-Applicability Analysis

Chapter 6: Chip Manufacturing Process Technology Bottleneck and Challenge Analysis

  • Chip Manufacturing Process Technology-Development of LED Chip Miniaturization
  • Chip Manufacturing Process Technology-LED Chip Production Process
  • Chip Manufacturing Process Technology-Structural Differences between Lateral Chip, Flip Chip and Vertical Chip
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Including Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Miniaturized LED Chip (Excluding Sapphire Substrate) Scribing Technology
  • Chip Manufacturing Process Technology-Laser Ablation
  • Chip Manufacturing Process Technology-Structural Weakening and Insulating Layer
  • Chip Manufacturing Process Technology-Design of Structural Weakening
  • Chip Manufacturing Process Technology-Design of Transfer Head
  • Chip Manufacturing Process Technology-Differences between Traditional LED and Micro LED Chip Manufacturing Processes

Chapter 7: Mass Transfer Technology Bottleneck and Challenge Analysis

  • Mass Transfer Technology-Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology Classification
  • Mass Transfer Technology-Thin Film Transfer Technology-Pick & Place Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Non-selective Pick Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology will Increase Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Selective Pick Technology in Repair Application
  • Mass Transfer Technology-Thin Film Transfer Technology-Factors that Affect UPH
  • Mass Transfer Technology-Thin Film Transfer Technology-Solution of Increasing UPH for Large Transfer Head
  • Mass Transfer Technology-Thin Film Transfer Technology-Higher Transfer Head Accuracy Requirement
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Transfer Times and Wafer Utilization
  • Mass Transfer Technology-Thin Film Transfer Technology-Comparison between Cycle Time and UPH
  • Mass Transfer Technology-Thin Film Transfer Technology: Apple (LuxVue)
    • Electrostatic Adsorption + Phase Change Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Samsung
    • Chip Transfer and Flip
  • Mass Transfer Technology-Thin Film Transfer Technology-Van der Waals Force Introduction
  • Mass Transfer Technology-Thin Film Transfer Technology: X-Celeprint
    • Van der Waals Force
  • Mass Transfer Technology-Thin Film Transfer Technology: ITRI
    • Electromagnetic Adsorption
  • Mass Transfer Technology-Thin Film Transfer Technology: MikroMesa
    • Adhesion and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: AUO
    • Electrostatic Adsorption and Reaction Force
  • Mass Transfer Technology-Thin Film Transfer Technology: VueReal
    • Solid Printing
  • Mass Transfer Technology-Thin Film Transfer Technology: Rohinni
    • Alignment Pin
  • Mass Transfer Technology-Thin Film Transfer Technology-Fluidic Assembly Technology
  • Mass Transfer Technology-Thin Film Transfer Technology: eLux
    • Fluidic Assembly
  • Mass Transfer Technology-Thin Film Transfer Technology: PlayNitride
    • Fluidic Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology-Laser Transfer Classification
  • Mass Transfer Technology-Thin Film Transfer Technology: Sony
    • Laser Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: QMAT
    • BAR(Beam-Addressed Release) Mass Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: Uniqarta
    • Multi-Beam Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: OPTOVATE
    • Laser Lift-off (δ-LLO)Technology
  • Mass Transfer Technology-Thin Film Transfer Technology-Roll to Roll Transfer
  • Mass Transfer Technology-Thin Film Transfer Technology: KIMM
    • Roll to Roll Transfer
  • Mass Transfer Technology-Seven Major Challenges of Micro LED Mass Transfer Technology
  • Mass Transfer Technology-Transfer Yield Depends on the Control of Manufacturing Capability
  • Mass Transfer Technology-Applicability Analysis

Chapter 8: Testing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Testing Technology
  • Testing Technology-Testing Method
  • Testing Technology-Electrical Properties
  • Testing Technology-EL
  • Testing Technology-Light Properties
  • Testing Technology-PL
  • Testing Technology-Overview of Mass Testing Technology
  • Mass Testing Method-PL Testing Technology
  • Mass Testing Method-Digital Camera Photoelectric Testing Technology
  • Mass Testing Method-Contact Photoelectric Testing Technology
  • Mass Testing Method-Contactless Photoelectric Testing Technology
  • Mass Testing Method-Contactless EL Testing Technology
  • Mass Testing Method-Ultraviolet Irradiation Photoelectric Testing Technology
  • Mass Testing Technology Difference Comparison

Chapter 9: Repairing Technology Bottleneck and Challenge Analysis

  • Micro LED Technology Bottleneck and Solution Overview-Repairing Technology
    • Micro LED Repairing Technology Solution
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Repairing Process of Micro LED Dead Pixel
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Dead Pixel Repairing Technology Analysis
  • Repairing Technology Solution-Ultraviolet Irradiation Repairing Technology
    • Transfer Head Pickup Process
  • Repairing Technology Solution-Laser Welding Repairing Technology
  • Repairing Technology Solution-Selective Pick Repairing Technology
  • Repairing Technology Solution-Selective Laser Repairing Technology
  • Repairing Technology Solution-Backup Circuit Design Solution
    • Micro LED Active Defect Detection Design

Chapter 10: Full Color Technical Bottleneck and Challenge Analysis

  • Full Color Technical Solution Types
  • Full Color Technical Solution -RGB Chip Colorization Technique
  • Full Color Technical Solution -RGB's QantumPhotonic Imager on the Same Wafer
  • Full Color Technical Solution -Color Conversion Technology
  • Full Color Technical Solution -QunatumDot Color Conversion Technology and Application
  • Full Color Technical Solution -Quantum Well (QW) Color Conversion Technology
  • Full Color Technical Solution -Overview
  • Full Color Technical Solution -Applicability Analysis

Chapter 11: Bonding Technical Bottleneck and Challenge Analysis

  • Bonding Technology -Technical Classification
  • Bonding Technology -SMT Solution
  • Bonding Technology -Eutectic Wave Soldering Assembly Technical Solution
  • Bonding Technology -Anisotropic Conductive Adhesive (ACF) Solution
  • Bonding Technology -Anisotropic Solder Paste (SAP) Solution
  • Bonding Technology -Wafer Bonding Technical Solution
  • Bonding Technology -Wafer Bonding Difficulty Analysis
  • Bonding Technology -Micro TUBE Solution
  • Bonding Technology -Technical Difficulty Analysis
  • Bonding Technology -Feasibility Analysis

Chapter 12: Analysis of driving scheme bottlenecks and challenges

  • Driving Technology-driving scheme types
  • Driving Technology-the importance of driver IC
  • Driving Technology-Relationship Between V-I Characteristics and Luminance of LED
  • Driving Technology-Types of Switch Mode Driver
  • Driving Technology-Relationship between PWM and Duty Cycle
  • Driving Technology-Comparison between Active and Passive Matrix Driving
  • Driving Technology-Display Driving Scheme-Scanning Behavior and Refresh Rate
  • Driving Technology-Display Driving Scheme-Fine-pitch Display Analysis
  • Driving Technology-Thin Film Transistor-Driving Matrix of LCD displays
  • Driving Technology-Thin Film Transistor-Active Matrix (AM) V.S. Passive Matrix (PM)
  • Driving Technology-Thin Film Transistor-Analysis of Quality-affecting Factors
  • Driving Technology-OLED Driving Scheme-Photoelectric Properties of OLED
  • Driving Technology-OLED Driving Scheme-PMOLED
  • Driving Technology-OLED Driving Scheme-AMOLED
  • Driving Technology-Micro LED Driving Scheme-PM Micro LED
  • Driving Technology-Micro LED Driving Scheme-AM Micro LED
  • OLED V.S. Micro LED: Power Module Comparison

Chapter 13: Analysis of Backplane Technology Bottlenecks and Challenges

  • Backplane Technology-Structure of Display Backplane
  • Backplane Technology-Types of Backplane Material
  • Backplane Technology-Integrated Backplane: Operating Principles of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Features of Glass Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Size Development of Glass Substrate
  • Backplane Technology-Integrated Backplane: Thermal Expansion Challenges of Glass Substrate
  • Backplane Technology-Integrated Backplane: Application of Glass Substrate with Switch Components
  • Backplane Technology-Integrated Backplane: Structure of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of a-Si Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of IGZO Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of LTPS Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Resolution Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Power Consumption Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Leakage Comparison of Pixel Switch Components for Glass Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate and Pixel Switch Components
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Flexible Substrate
  • Backplane Technology-Integrated Backplane: Features of Flexible Substrate Materials
  • Backplane Technology-Integrated Backplane: Structure of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Manufacturing Process of Silicon Substrate
  • Backplane Technology-Integrated Backplane: Features of Silicon Substrate Materials
  • Backplane Technology-Non-integrated Backplane: Outward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Inward Structure of PCB
  • Backplane Technology-Non-integrated Backplane: Thermal Effect of PCB
  • Backplane Technology-Non-integrated Backplane: Comparison of PCB Substrates
  • Backplane Technology-Non-integrated Backplane: Challenges of Manufacturing PCB
  • Backplane Technology-Non-integrated Backplane: Size Limit of PCB
  • Comparison of Backplane Technologies
  • Backplane Technology-Applicability Analysis

Chapter 14: Analysis of Micro LED Supply Chain and Technology Developments by Company

  • Analysis of Major Micro LED Developers (in the Supply Chain)
  • Analysis of Product Strategies and Technology Developments by Region-Taiwan
  • Analysis of Product Strategies and Technology Developments by Region-China
  • Analysis of Product Strategies and Technology Developments by Region-Korea
  • Analysis of Product Strategies and Technology Developments by Region-Japan
  • Analysis of Product Strategies and Technology Developments by Region-EU & the US
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