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미세유체 디바이스용 접착제 : 기술 분석

Adhesives for Microfluidics - Technology Assessment

리서치사 Frost & Sullivan
발행일 2016년 12월 상품 코드 410394
페이지 정보 영문 81 Pages
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미세유체 디바이스용 접착제 : 기술 분석 Adhesives for Microfluidics - Technology Assessment
발행일 : 2016년 12월 페이지 정보 : 영문 81 Pages

미세유체 디바이스용 접착제(Adhesives for Microfluidics)의 각종 기술에 대해 조사했으며, 각종 기술·재료 동향, MEMS 웨이퍼 제조 능력, 혁신·R&D·새로운 용도의 동향, 성장 분야와 성장 기회, 특허 데이터 등의 정보를 전해드립니다.

제1장 주요 요약

제2장 기술 개요

제3장 영향 분석 : 미세유체 디바이스용 접착제

  • 헬스케어 시장의 성장 : 주요 성장 촉진요인
  • 파운드리 및 OEM : 밸류체인에서의 주요 의사결정자
  • 북미와 유럽의 최종사용자 기업 : 아시아태평양 지역 파운드리와의 제휴에 열의

제4장 혁신 에코시스템

  • 광범위한 연구 활동
  • 의약품 산업에서 접착제의 혁신
  • 진단 용도에서 접착제의 혁신
  • 기타 산업에서 접착제의 혁신
  • 의약품 산업에서 주요 미세유체 디바이스의 혁신
  • 임상 진단 용도에서 주요 미세유체 디바이스의 혁신
  • POC 진단 용도에서 주요 미세유체 디바이스의 혁신

제5장 기술 개발 및 도입 동향

  • 용이한 접합 및 자기 회복 특성 : R&D의 주요 초점
  • USPTO : 최대의 특허 출원수
  • 실리콘 접착제 : 현저한 특허 신청 대상
  • 에폭시 접착제 : 웨이퍼 본딩에서 과거 수년간 최대 특허 신청수
  • 미세유체 디바이스용 접착제 : 세계적으로 관심을 얻고 있는 연구 대상
  • 의약품, 약물 전달, 진단, 어세이, 옵틱스 : 미세유체의 새로운 분야 등

제6장 시장 기회 분석

  • 헬스케어 : 미세유체용 접착제에서 가장 중요한 산업
  • 화학 및 식품 산업의 미세유체 기술 : 여전히 R&D 단계
  • 미세유체 : 일렉트로닉스 산업에서의 대폭 성장 전망
  • 미세유체 : 바이오테크놀러지 및 에너지 산업에서 중기적으로 큰 가능성이 잠재
  • 접착제 : 일렉트로닉스 산업용 웨이퍼 본딩의 시장 기회
  • 접착제 : 헬스케어 부문용 웨이퍼 본딩의 시장 기회

제7장 성장 기회

  • 헬스케어 부문의 미세유체 : 새로운 능력
  • 헬스케어 부문의 미세유체 : 지역적 확장
  • 생명과학 부문의 미세유체 : 각종 시장
  • 생명과학 부문의 미세유체 : 새로운 능력
  • 일렉트로닉스 부문의 미세유체 : 파괴적 용도
  • 일렉트로닉스 부문의 미세유체 : 부가가치 서비스
  • 성공과 성장을 위한 전략적 필수요건

제8장 주요 특허

제9장 주요 연락처 정보

제10장 부록

제11장 Frost & Sullivan 소개

KSM 17.01.24

Adhesives for wafer-scale bonding is expected to impact the future of next-generation microfluidic devices

With the boom of the micro-electromechanical systems (MEMS) industry in the last 3 to 5 years, wafer bonding and packaging have become a significant area of interest for the fabrication of the different types of MEMS devices. Among various fabrication techniques, wafer bonding with intermediate adhesives is an important technique as in comparison to other fabrication techniques, adhesive bonding is cost effective, robust, and simple. In adhesive wafer bonding, the adhesive is capable to hold both wafer surfaces together. Adhesive wafer bonding is preferred over other methods because of technical attributes such as insensitivity to surface topography, low bonding temperatures, compatibility with standard integrated circuit wafer processing, and ability to join different types of wafers. This research service provides:a snapshot of various adhesives and capabilities for MEMS wafer fabrication, impact analysis and assessment of recent innovations, a detailed analysis of technology and business accelerators and challenges in adhesives for microfluidic devices, an assessment of technology adoption focusing on the global hotspots and an evaluation of emerging opportunities and adoption roadmap that helps identify the year of impact of various adhesives

Table of Contents

1.0 EXECUTIVE SUMMARY

  • 1. 1.1 Research Scope
  • 2. 1.2 Research Process and Methodology
  • 3. 1.3 Key Findings

2.0 TECHNOLOGY SNAPSHOT

  • 1. 2.1 Adhesives for wafer-level bonding in microfluidics
  • 2. 2.2 Conformal adherence and tailored surface chemistry are key requirements of adhesives
  • 3. 2.3 Continuous, droplet, and digital microfluidics continue to remain the key microfluidics
  • 4. 2.4 Spin coating is most commonly used for application of adhesives
  • 5. 2.5 Adhesive bonding is still one of the most significant wafer-bonding techniques
  • 6. 2.6 MEMS continue to be the most attractive area for adhesive bonding processes
  • 7. 2.7 Patterned form of adhesive bonding offers selectivity and localized adhesive application
  • 8. 2.8 Steady rise in innovations related to adhesive bonding
  • 9. 2.9 Adhesive bonding follows a step-by-step process from surface cleaning to final bonding
  • 10. 2.10 Epoxy and silicones are key materials preferred for wafer-scale bonding
  • 11. 2.11 PDMS and silicones offer very high opportunities to demonstrate durability and high adhesion
  • 12. 2.12 Use of silicones as adhesives can reduce the non-bonded area
  • 13. 2.13 Healthcare and pharmaceuticals will have highest potential for microfluidics in short term
  • 14. 2.14 Chemicals and personal care are considered emerging areas for microfluidics
  • 15. 2.15 MEMS and optoelectronics are considered most attractive segments for wafer bonding process

3.0 IMPACT ASSESSMENT OF ADHESIVES FOR MICROFLUIDICS

  • 1. 3.1 Growing healthcare market is the main driver for adhesives in microfluidics
  • 2. 3.2 Foundries and original equipment manufacturers (OEM) are the key decision makers in the microfluidics value chain
  • 3. 3.3 North American and European end-user companies are keen to partner with Asia-Pacific foundries

4.0 INNOVATION ECOSYSTEM

  • 1. 4.1 Widespread research activity across the innovation ecosystem
  • 2. 4.2 Adhesive innovations in the pharmaceutical industry
  • 3. 4.3 Adhesive innovations for diagnostic applications
  • 4. 4.4 Adhesive innovations for other application industries
  • 5. 4.5 Key microfluidic device innovations in the pharmaceutical industry
  • 6. 4.6 Key microfluidic device innovations for clinical diagnostics
  • 7. 4.7 Key microfluidic device innovations for point of care diagnostics

5.0 TECHNOLOGY DEVELOPMENT AND ADOPTION TRENDS

  • 1. 5.1 Ease of bonding and good self-healing properties are two primary focus areas in terms of R&D
  • 2. 5.2 USPTO finds the highest number of patent applications in the microfluidics space
  • 3. 5.3 Silicone adhesives are prominent in patent filings in 2015
  • 4. 5.4 Epoxy adhesives find the highest number of patent filings in the last few years in wafer-scale bonding
  • 5. 5.5 Adhesives for microfluidics gaining research interest across the globe
  • 6. 5.6 Pharmaceutical, drug delivery, diagnostics, assays, and optics are some of the highly emerging areas for microfluidics
  • 7. 5.7 LOC devices and diagnostics represent key opportunities for adhesive development
  • 8. 5.8 Increasing R&D focusing on adhesives for microfluidics facilitates new product development
  • 9. 5.9 R&D initiatives are focused toward development of newer adhesive and bonding technologies to develop better designed MEMS and ICs

6.0 OPPORTUNITY EVALUATION

  • 1. 6.1 Healthcare is the most significant industry for adhesives in the microfluidics space
  • 2. 6.2 Microfluidic technologies in the chemicals and food industry are still in the R&D phase
  • 3. 6.3 Microfluidics will grow exponentially in the electronics industry
  • 4. 6.4 Microfluidics will have high potential in the biotechnology and energy industries in the mid term
  • 5. 6.5 Opportunities for adhesives in wafer bonding for the electronics sector
  • 6. 6.6 Opportunities for adhesives for wafer bonding in the healthcare sector

7.0 GROWTH OPPORTUNITIES

  • 1. 7.1 Growth opportunity : microfluidics in the healthcare space - new capabilities
  • 2. 7.2 Growth opportunity : microfluidics in the healthcare space - geographic expansion
  • 3. 7.3 Growth opportunity : microfluidics in the life sciences applications - vertical markets
  • 4. 7.4 Growth opportunity : microfluidics in the life sciences applications -new capabilities
  • 5. 7.5 Growth opportunity : microfluidics in electronics - disruptive applications
  • 6. 7.6 Growth opportunity: microfluidics in electronics - value-add services
  • 7. 7.7 Strategic imperatives for success and growth

8.0 KEY PATENTS

  • 1. 8.1 Key Patents
  • 2. 8.1 Key Patents (continued)
  • 3. 8.1 Key Patents (continued)

9.0 KEY CONTACTS

  • 1. 9.1 Key Contacts
  • 2. 9.1 Key Contacts (continued)
  • 3. Legal Disclaimer

10.0 APPENDIX

  • 1. 10.1 Ratings of OSE Matrix
  • 2. 10.2 Final Ratings of OSE

11.0 THE FROST & SULLIVAN STORY

  • 1. 11.1 The Frost & Sullivan Story
  • 2. 11.2 Value Proposition: Future of Your Company & Career
  • 3. 11.3 Global Perspective
  • 4. 11.4 Industry Convergence
  • 5. 11.5 360° Research Perspective
  • 6. 11.6 Implementation Excellence
  • 7. 11.7 Our Blue Ocean Strategy
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