첨단 패키징 특허 모니터링 서비스

Get up-to-date data on Advanced Semiconductor Packaging patent activity: New patent applications, patents newly granted, expired or abandoned patents, latest patent transfers, patent litigations and oppositions.

Key Features of the service

Every quarter an up-to-date Excel database including:

• New patents applications
• Patent applications newly granted
• Expired or abandoned patents
• Transfer of IP rights (re-assignment, licensing) and IP collaborations (co-fillings)
• Patent litigations and oppositions.
• Patents categorized by packaging technologies: Fan-Out packaging (wafer level, panel level), 2.5D & 3D packaging (interposer, bridge, hybrid bonding, 3D-stacked memory)

Every quarter a PDF report including:

• Key fact & figures of the quarter
• Graphs & comments covering the patent landscape evolutions
• A close look at the key IP players and technologies

Access to an IP analyst for 100 hours per year:

• Q&A sessions and discussions with our IP analysts regarding quarterly report results, trends, analyses, specific patented technologies, or companies' IP portfolios in the field of Advanced Packaging.

2.5D/3D stacking and fan-out WLP are promising solutions to meet the needs of the semiconductor packaging market. It is crucial to monitor patent activity and IP strategies of key semiconductor packaging players

In the semiconductor industry, there is a growing demand for integrating more compute and memory within a single package in order to achieve smaller form factors and improve product performance. However, Moore's Law becomes increasingly difficult to achieve as node advancement reaches its limits. As a result, the process of chip miniaturization has been slowing down. Advanced packaging techniques, such as 2.5D & 3D stacking, and fan-out wafer level packaging, have emerged as crucial solutions to meet the needs of the semiconductor industry. These new approaches allow for the integration of multiple dies into a single package, with the possibility of combining mature and advanced nodes, and they have supplemented the dominant flip-chip (FC) and wire-bond (WB) technologies. The roadmap for these advanced packaging technologies is challenging and the supply chain is becoming increasingly competitive, with the demand for high-density fan-out (HD FO) redistribution layers (RDLs), high-density input/output interconnections (I/O), and advanced interconnect technologies such as silicon interposer, embedded bridge, hybrid bonding, and chiplets approach. The market for 2.5/3D packaging shows the most potential for growth, with 3D SoC technology growing the most driven by the increasing popularity of hybrid bonding for chiplets 3D integration. In the fan-out WLP industry, the segment experiencing the highest growth is the ultra-high density fan-out (UHD FO), which has emerged as a more cost-effective solution compared to silicon interposers. Semiconductor packaging was primarily performed by OSATs such as ASE/SPIL, Amkor, JCET, etc. and they continue to play an important role in this field. However, it is TSMC, Samsung and Intel that have been developing innovative 2.5D/3D packaging solutions such as silicon interposer, embedded bridge, and hybrid bonding. By offering advanced back-end solutions and using their front-end capabilities, these companies poised to influence future technology and intellectual property (IP) developments in this area.

In this context, it is crucial to monitor patent activity and intellectual property (IP) strategies of key players. Such knowledge can assist in understanding your competitors' R&D roadmap and strategies, evaluate the risks, and detect business opportunities. The Advanced Packaging Patent Monitor gives periodic insights on the IP activity of a selection of key companies: TSMC, Intel, Samsung, Amkor, ASE, SPIL, JCET, Deca, Nepes, Powertech (PTI), SJSemi, Tongfu (TFME), Huatian, Infineon, Micron, SK Hynix, YMTC, GlobalFoundries, and Xperi/Adeia.

The Advanced Packaging patent monitoring service allows you to take advantage of a quarterly-updated Excel database and benefit from both quarterly analysis reports and direct interaction with our analysts.

Benefits of the patent monitoring service

Keep a watch on your competitors' IP activities and their future intentions.

With the help of the patent monitoring service, you will be aware of your competitors' current patenting activities, their IP dynamics, patent transfers including acquisitions and licenses, patent litigation, technology development and R&D strategies. You will also be able to early detect new entrants in your business area.

Keep track of the latest technology developments and be ahead of technology trends.

By keeping note of any recent patent filings, you can track the newest innovations in the field. You will get details on claimed inventions and you can follow technology developments. New technical solutions could inspire and improve your R&D activity.

Prevent registration of IP rights that may be harmful to your business.

You will obtain information on patent applications filed even before exclusive rights have been granted and you can react in time to prevent registration of IP rights that may be harmful to your business.

React in time to infringements and mitigate legal risks.

Monitoring newly-issued patents allows you to regularly assess your freedom-to-operate, ensuring your products or processes are not covered by patents, and thus that they can be manufactured, sold or used safely without infringing valid IP rights owned by others.

Take advantage of free technologies and decrease R&D project risks.

By tracking both expired patents and abandoned patents, you will be able to identify inventions entering the public domain that you can use safely for your development.

Understand the current IP trends and IP strategy of competitors.

On a quarterly basis, the report will provide the IP trends over the three last months, with a close look to key IP players and key patented technologies. Main patent applicants and their inventions, blocking patents, promising patents and key patents newly expired or abandoned will be highlighted.

Access to the IP analyst.

Take advantage of direct interaction with our analysts by phone call and/or email and get specific input for specific patented technologies and company IP portfolios through Q&A session and open discussion (100h per year).

TABLE OF CONTENTS (SAMPLE)

INTRODUCTION METHODOLOGY

• Context
• Scope of the patent monitoring service
• Methodology and segments definition
• Companies tracked in this patent monitoring service

MAIN TRENDS

• Time evolution of patent publications over the past decade
• Fan Out packaging
• Silicon interposer
• Embedded interconnect bridge
• Hybrid bonding
• 3D stacked memories

QUARTER OVERVIEW

• Key facts of the quarter
• Patent families newly published and granted in the quarter
• Patents expired or abandoned in the quarter
• Main IP collaborations (patent co filings)
• Main IP transfers (change in patent ownership)
• US IP litigations open or closed
• New EP oppositions

PLAYERS IP ACTIVITY DURING THE QUARTER

Pure play foundries

• TSMC
• GlobalFoundries

OSATs

• Amkor
• ASE
• SPIL
• JCET
• Nepes
• Powertech
• Technology
• Deca
• Huatian
• Technology
• SJSemi
• Tongfu
• Microelectronics

IDMs

• Samsung
• Infineon
• Intel
• Micron
• SK
• Hynix
• YMTC

NPE

• Xperi

ANNEX