5G와 미래의 RAN 반도체

Actionable Benefits:

• Determine key trends and challenges in 5G and future Radio Access Network (RAN) semiconductor market.
• Assist the mobile industry in making decisions for Open RAN deployments.
• Identify the processing requirements for Massive Multiple Input, Multiple Output (mMIMO) and the need for hardware acceleration.
• Key recommendations to accelerate chipset development for future RANs.

Critical Questions Answered:

• What are the major challenges related to large-scale mMIMO deployments?
• How can Commercial-Off-the-Shelf (COTs) hardware, in combination with accelerator cards, fulfill the RAN processing demands for Open RAN?
• What are the most recent developments related to chipsets for Open RAN?

Research Highlights:

• Detailed description of RAN protocol stack and semiconductors.
• Detailed overview of the types of semiconductors available for RAN processing, including Layers 1, 2, and 3 (traditional RAN, and Open RAN).

Who Should Read This?

• Decision makers for mobile networks who need to understand the role of semiconductors in RANs.
• Open RAN vendors and service providers.
• Chipset vendors.
• Innovation leaders who need to understand the role of semiconductors in future 5G deployments.

Table of Contents

Introduction and Market Overview

Market Developments and Challenges

• mMIMO Technical Background
• Semiconductor Market Overview
• Semiconductors for 5G RAN

Traditional Vendor Approach toward RAN Semiconductors

Open RAN Market Developments

• Hardware Acceleration in Open RAN
• General-Purpose Processors with Layer-1 Acceleration
• Potential New O-RAN Alliance Functional Splits for Uplink Performance
• RISC-V Based Designs for Open RAN

Chipset Vendor Profiles

• Picocom
• NXP Semiconductors
• Intel Corporation
• Marvell Technology
• Qualcomm

Conclusions and Recommendations