3D 낸드플래시 메모리 시장 : 유형별, 애플리케이션별, 최종사용자별 - 세계 기회 분석 및 업계 예측(2021-2030년)

The global 3D NAND flash memory market size was valued at $12.38 billion in 2020, and is projected to reach $78.42 billion by 2030, registering a CAGR of 20.3% from 2021 to 2030. 3D NAND, also known as vertical NAND, is a form of non-volatile flash memory in which flash memory cells on a transistor die are stacked vertically to increase storage mass.

The growth of the global 3D NAND flash memory market is majorly driven by rise in space constraints on the semiconductor wafer paired with high performance & low latency of 3D NAND flash memory. Moreover, increase in demand for data centres is anticipated to drive the growth of 3D NAND flash memory. However, precision required at the time of manufacturing and high manufacturing cost are acting as a prime restraint of the global 3D NAND flash memory market. On the contrary, rise in penetrations of Internet of Things application is anticipated to provide lucrative opportunities for the 3D NAND flash memory industry during the forecast period.

The 3D NAND flash memory market is segmented on the basis of type, product type, application, and region. The type segment includes single-level cell, multi-level cell, and triple-level cell. By application, the market is classified into camera, laptops & PCs, smartphones & tablets. By end user, it is categorized into automotive, consumer electronics, enterprise, healthcare, and others. Region-wise, the 3D NAND flash memory market trends are analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, and the rest of the Europe), Asia-Pacific (China, Japan, India, South Korea, and the rest of the Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).

The key players operating in the market include 3D NAND flash memory market players, such as Samsung Electronics Co., Ltd., Toshiba Corporation, SK Hynix Semiconductor, Inc., Micron Technology, Inc., Intel Corporation, Apple Inc., Lenovo Group Ltd., Advanced Micro Devices, STMicroelectronics, and SanDisk Corporation.

Key Market Segments

By Type

• Single-level Cell
• Multi-level Cell
• Triple-level Cell

By Product Type

• Camera
• Laptops and PCs
• Smartphones & Tablets
• Others

By Application

• Automotive
• Consumer Electronics
• Enterprise
• Healthcare
• Others

By Region

• North America
• U.S.
• Canada
• Mexico
• Europe
• UK
• Germany
• France
• Rest of Europe
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Rest of Asia-Pacific
• LAMEA
• Latin America
• Middle East
• Africa
• Key Market Players
• Samsung Electronics Co., Ltd.,
• Toshiba Corporation
• SK Hynix Semiconductor, Inc.
• Micron Technology, Inc.,
• Intel Corporation
• Apple Inc.
• Lenovo Group Ltd.,
• Advanced Micro Devices
• STMicroelectronics
• SanDisk Corporation

TABLE OF CONTENTS

Chapter 1:Introduction

• 1.1.Report description
• 1.2.Key benefits for stakeholders
• 1.3.Key market segments
• 1.4.Research methodology
  • 1.4.1.Primary research
  • 1.4.2.Secondary research
  • 1.4.3.Analyst tools and models

Chapter 2:Executive summary

• 2.1.CXO perspective

Chapter 3:MARKET OVERVIEW

• 3.1.Market definition and scope
• 3.2.Key findings
  • 3.2.1.Top impacting factors
  • 3.2.2.Top investment pockets
• 3.3.Porter's five forces analysis
• 3.4.Patent analysis
  • 3.4.1.By region (2020-2030)
  • 3.4.2.By applicant
• 3.5.Market dynamics
  • 3.5.1.Drivers
    • 3.5.1.1.Surge in space constraints on the semiconductor wafer
    • 3.5.1.2.High performance & low latency of 3D NAND flash memory
    • 3.5.1.3.Increase in demand for data centers
  • 3.5.2.Restraint
    • 3.5.2.1.Precision required at the time of manufacturing
    • 3.5.2.2.High manufacturing cost
  • 3.5.3.Opportunities
    • 3.5.3.1.Rise in penetrations of Internet of Things end user
• 3.1.COVID Impact
  • 3.1.1.Impact on market size
  • 3.1.2.End user trends, preferences, and budget impact
  • 3.1.3.End user trends, preferences, and budget impact
  • 3.1.4.Parent industry impact
  • 3.1.5.Key player strategies to tackle negative impact
    • 3.1.5.1.Limiting cuts to R&D expense:
    • 3.1.5.2.Focusing on next-generation products
    • 3.1.5.3.Shifting toward agile supply chain model
  • 3.1.6.Opportunity window

Chapter 4:3D NAND flash MEMORY MARKET, BY Type

• 4.1.Overview
• 4.2.Single level cell
  • 4.2.1.Key market trends, growth factors, and opportunities
  • 4.2.2.Market size and forecast, by region
  • 4.2.3.Market analysis, by country
• 4.3.Multi-level cell
  • 4.3.1.Key market trends, growth factors and opportunities
  • 4.3.2.Market size and forecast, by region
  • 4.3.3.Market analysis, by country
• 4.4.Triple-level cel
  • 4.4.1.Key market trends, growth factors and opportunities
  • 4.4.2.Market size and forecast, by region
  • 4.4.3.Market analysis, by country

Chapter 5:3D NAND flash MEMORY MARKET, BY Applciation

• 5.1.Overview
• 5.2.Camera
  • 5.2.1.Key market trends, growth factors, and opportunities
  • 5.2.2.Market size and forecast, by region
  • 5.2.3.Market analysis, by country
• 5.3.Laptops & PCs
  • 5.3.1.Key market trends, growth factors and opportunities
  • 5.3.2.Market size and forecast, by region
  • 5.3.3.Market analysis, by country
• 5.4.Smartphones & Tablets
  • 5.4.1.Key market trends, growth factors and opportunities
  • 5.4.2.Market size and forecast, by region
  • 5.4.3.Market analysis, by country
• 5.5.Others
  • 5.5.1.Key market trends, growth factors and opportunities
  • 5.5.2.Market size and forecast, by region
  • 5.5.3.Market analysis, by country

Chapter 6:3D NAND flash memory MARKet, BY End user

• 6.1.Overview
• 6.2.Automotive
  • 6.2.1.Key market trends, growth factors, and opportunities
  • 6.2.2.Market size and forecast, by region
  • 6.2.3.Market analysis, by country
• 6.3.Consumer Electronics
  • 6.3.1.Key market trends, growth factors, and opportunities
  • 6.3.2.Market size and forecast, by region
  • 6.3.3.Market analysis, by country
• 6.4.Enterprise
  • 6.4.1.Key market trends, growth factors and opportunities
  • 6.4.2.Market size and forecast, by region
  • 6.4.3.Market analysis, by country
• 6.5.Healthcare
  • 6.5.1.Key market trends, growth factors, and opportunities
  • 6.5.2.Market size and forecast, by region
  • 6.5.3.Market analysis, by country
• 6.6.Others
  • 6.6.1.Key market trends, growth factors, and opportunities
  • 6.6.2.Market size and forecast, by Country
  • 6.6.3.Market analysis, by country

Chapter 7:3D NAND flash MEMORY MARKET, BY region

• 7.1.Overview
• 7.2.North America
  • 7.2.1.Key market trends, growth factors, and opportunities
  • 7.2.2.Market size and forecast, by Type
  • 7.2.3.Market size and forecast, by Applciation
  • 7.2.4.Market size and forecast, by end user
  • 7.2.5.Market analysis, by country
    • 7.2.5.1.U.S.
    • 7.2.5.1.1.Market size and forecast, by Type
    • 7.2.5.1.2.Market size and forecast, by Applciation
    • 7.2.5.1.3.Market size and forecast, by end user
    • 7.2.5.2.Canada
    • 7.2.5.2.1.Market size and forecast, by Type
    • 7.2.5.2.2.Market size and forecast, by Applciation
    • 7.2.5.2.3.Market size and forecast, by end user
    • 7.2.5.3.Mexico
    • 7.2.5.3.1.Market size and forecast, by Type
    • 7.2.5.3.2.Market size and forecast, by Applciation
    • 7.2.5.3.3.Market size and forecast, by end user
• 7.3.Europe
  • 7.3.1.Key market trends, growth factors, and opportunities
  • 7.3.2.Market size and forecast, by Type
  • 7.3.3.Market size and forecast, by Applciation
  • 7.3.4.Market size and forecast, by end user
  • 7.3.5.Market analysis, by country
    • 7.3.5.1.UK
    • 7.3.5.1.1.Market size and forecast, by Type
    • 7.3.5.1.2.Market size and forecast, by Applciation
    • 7.3.5.1.3.Market size and forecast, by end user
    • 7.3.5.2.Germany
    • 7.3.5.2.1.Market size and forecast, by Type
    • 7.3.5.2.2.Market size and forecast, by Applciation
    • 7.3.5.2.3.Market size and forecast, by end user
    • 7.3.5.3.France
    • 7.3.5.3.1.Market size and forecast, by Type
    • 7.3.5.3.2.Market size and forecast, by Applciation
    • 7.3.5.3.3.Market size and forecast, by end user
    • 7.3.5.4.Rest of Europe
    • 7.3.5.4.1.Market size and forecast, by Type
    • 7.3.5.4.2.Market size and forecast, by Applciation
    • 7.3.5.4.3.Market size and forecast, by end user
• 7.4.Asia-Pacific
  • 7.4.1.Key market trends, growth factors, and opportunities
  • 7.4.2.Market size and forecast, by Type
  • 7.4.3.Market size and forecast, by Applciation
  • 7.4.4.Market size and forecast, by end user
  • 7.4.5.Market analysis, by country
    • 7.4.5.1.China
    • 7.4.5.1.1.Market size and forecast, by Type
    • 7.4.5.1.2.Market size and forecast, by Applciation
    • 7.4.5.1.3.Market size and forecast, by end user
    • 7.4.5.2.Japan
    • 7.4.5.2.1.Market size and forecast, by Type
    • 7.4.5.2.2.Market size and forecast, by Applciation
    • 7.4.5.2.3.Market size and forecast, by end user
    • 7.4.5.3.India
    • 7.4.5.3.1.Market size and forecast, by Type
    • 7.4.5.3.2.Market size and forecast, by Applciation
    • 7.4.5.3.3.Market size and forecast, by end user
    • 7.4.5.4.South Korea
    • 7.4.5.4.1.Market size and forecast, by Type
    • 7.4.5.4.2.Market size and forecast, by Applciation
    • 7.4.5.4.3.Market size and forecast, by end user
    • 7.4.5.5.Rest of Asia-Pacific
    • 7.4.5.5.1.Market size and forecast, by Type
    • 7.4.5.5.2.Market size and forecast, by Applciation
    • 7.4.5.5.3.Market size and forecast, by end user
• 7.5.LAMEA
  • 7.5.1.Key market trends, growth factors, and opportunities
  • 7.5.2.Market size and forecast, by Type
  • 7.5.3.Market size and forecast, by Applciation
  • 7.5.4.Market size and forecast, by end user
  • 7.5.5.Market analysis, by country
    • 7.5.5.1.Latin America
    • 7.5.5.1.1.Market size and forecast, by Type
    • 7.5.5.1.2.Market size and forecast, by Applciation
    • 7.5.5.1.3.Market size and forecast, by end user
    • 7.5.5.2.Middle East
    • 7.5.5.2.1.Market size and forecast, by Type
    • 7.5.5.2.2.Market size and forecast, by Applciation
    • 7.5.5.2.3.Market size and forecast, by end user
    • 7.5.5.3.Africa
    • 7.5.5.3.1.Market size and forecast, by Type
    • 7.5.5.3.2.Market size and forecast, by Applciation
    • 7.5.5.3.3.Market size and forecast, by end user

Chapter 8:COMPETITIVE LANDSCAPE

• 8.1.Introduction
  • 8.1.1.Market player positioning, 2019
  • 8.1.2.Top winning strategies
• 8.2.Competitive dashboard
• 8.3.Competitive heatmap

Chapter 9:Company ProfileS

• 9.1.ADVANCED MICRO DEVICES
  • 9.1.1.Company overview
  • 9.1.2.Key executives
  • 9.1.3.Company snapshot
  • 9.1.4.Operating business segments
  • 9.1.5.Product portfolio
  • 9.1.6.R&D expenditure
  • 9.1.7.Business performance
  • 9.1.8.Key strategic moves and developments
• 9.2.APPLE INC.
  • 9.2.1.Company overview
  • 9.2.2.Key executives
  • 9.2.3.Company snapshot
  • 9.2.4.Operating business segments
  • 9.2.5.Product portfolio
  • 9.2.6.Business performance
  • 9.2.7.Key strategic moves and developments
• 9.3.INTEL CORPORATION
  • 9.3.1.Company overview
  • 9.3.2.Key Executives
  • 9.3.3.Company snapshot
  • 9.3.4.Operating business segments
  • 9.3.5.Product portfolio
  • 9.3.6.R&D Expenditure
  • 9.3.7.Business performance
  • 9.3.8.Key strategic moves and developments
• 9.4.LENOVO GROUP LIMITED
  • 9.4.1.Company overview
  • 9.4.2.Key executives
  • 9.4.3.Company snapshot
  • 9.4.4.Operating business segments
  • 9.4.5.Product portfolio
  • 9.4.6.R&D expenditure
  • 9.4.7.Business performance
  • 9.4.8.Key strategic moves and developments
• 9.5.MICRON TECHNOLOGY, INC.
  • 9.5.1.Company overview
  • 9.5.2.Key executives
  • 9.5.3.Company snapshot
  • 9.5.4.Operating business segments
  • 9.5.5.Product portfolio
  • 9.5.6.R&D expenditure
  • 9.5.7.Business performance
  • 9.5.8.Key strategic moves and developments
• 9.6.SK HYNIX SEMICONDUCTOR, INC.
  • 9.6.1.Company overview
  • 9.6.2.Key Executives
  • 9.6.3.Company snapshot
  • 9.6.4.Product portfolio
  • 9.6.5.Business performance
  • 9.6.6.Key strategic moves and developments
• 9.7.SAMSUNG ELECTRONICS CO. LTD.
  • 9.7.1.Company overview
  • 9.7.2.Key executives
  • 9.7.3.Company snapshot.
  • 9.7.4.Operating business segments
  • 9.7.5.Product portfolio
  • 9.7.6.R&D expenditure
  • 9.7.7.Business performance
  • 9.7.8.Key strategic moves and developments
• 9.8.STMICROELECTRONICS N.V.
  • 9.8.1.Company overview
  • 9.8.2.Key executives
  • 9.8.3.Company snapshot
  • 9.8.4.Operating business segments
  • 9.8.5.Product portfolio
  • 9.8.6.R&D expenditure
  • 9.8.7.Business performance
• 9.9.TOSHIBA CORPORATION
  • 9.9.1.Company overview
  • 9.9.2.Key executives
  • 9.9.3.Company snapshot
  • 9.9.4.Operating business segments
  • 9.9.5.Product portfolio
  • 9.9.6.Business performance
  • 9.9.7.Key strategic moves and developments
• 9.10.WESTERN DIGITAL
  • 9.10.1.Company overview
  • 9.10.2.Key executives
  • 9.10.3.Company snapshot
  • 9.10.4.Product portfolio
  • 9.10.5.Business performance
  • 9.10.6.Key strategic moves and developments