3D 센서 시장 : 종류별, 기술별, 커넥티비티별, 최종 용도별 - 세계 기회 분석과 산업 예측(2021-2031년)

The global 3D sensor market is envisioned to garner $56,992.30 million by 2031, growing from $17,607.90 million in 2021 at a CAGR of 13.0% from 2022 to 2031.

The development of three-dimensional (3D) technology is a significant scientific breakthrough. It is a depth-sensing innovation that improves camera functionality for object and facial recognition. the process of accurately measuring an object's length, width, and height with more sophisticated equipment than is possible with a variety of existing technologies. The use of 3D technology offers distinctive improvements in how daily activities are seen and approached.

The market for 3D sensors is expected to rise over the course of the forecast period due to factors including the rising need for 3D-capable consumer gadgets and the swiftly rising demand for medical imaging solutions. Additionally, the requirement for high precision security & surveillance, the increasing need for 3D-enabled consumer electronics such as smartphones and tablets coupled with the expanding use of 3D sensing technology in virtual reality & gaming, are among the reasons boosting the market expansion.

Many of the fundamental technologies advancing 3D sensing have advantages and disadvantages. To create these new systems, it is necessary to create high-quality sensors and effective algorithms that can make use of both current and emerging technology. For instance, it is difficult to measure any surface that is outside of the scanner's field of view since 3D sensor scanning is optical in nature. Consequently, the scanner cannot detect internal or concealed geometry, making it impossible to measure it. In order to create a full model, scans are collected from a variety of angles. Nevertheless, complicated geometry, such that is seen frequently in holes or threads, may still present a challenge.

A range of 3D-capable consumer electronics products, including cameras, 3D gaming consoles, 3D media players, 3D portable devices, 3D TV displays, 3D desktop PCs, and notebooks, have been introduced in response to the rising demand for better visual effects. As the demand for 3D-capable devices rises, so does the supply of 3D content, fueling market expansion. In order to deliver 3D sensors, Apple Inc. intends to strengthen its collaboration with Sony Corporation. As 3D sensors are frequently used in cameras, this is further propelling the market in terms of security and surveillance needs.

The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. There were import-export restrictions laid down on major 3D sensor-producing countries such as the U.S. and China, which imposed significant challenges on the market. In October 2021, the Indian government took a new initiative to produce 3D sensors from structured lite using sensor technology. Similar other initiatives are projected to relieve the obstacles of the market for any unforeseen situation.

The key players profiled in this report include pmdtechnologies ag, Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, and OmniVision Technologies, Inc.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the 3d sensor market analysis from 2021 to 2031 to identify the prevailing 3d sensor market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the 3d sensor market segmentation assists to determine the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global 3d sensor market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Type

• Image Sensor
• Accelerometer Sensor
• Position Sensor
• Others

By Technology

• Structured Light
• Time of Flight
• Stereoscopic Vision
• Ultrasound
• Others

By Connectivity

• Wireless
• Wired

By End use

• Consumer Electronics
• Healthcare
• Aerospace Defense
• Automotive
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • Rest of Europe
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Rest Of Asia Pacific
• LAMEA
  • Brazil
  • Saudi Arabia
  • UAE
  • South Africa
  • Rest of LAMEA
• Key Market Players
  • Omnivision Technologies
  • Infineon Technologies
  • LMI Technologies
  • PrimeSense
  • Cognex Corporation
  • SoftKinetic
  • Pmdtechnologies GmbH
  • IFM Electronic
  • Occipital Inc.

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

• 1.1.Report description
• 1.2.Key market segments
• 1.3.Key benefits to the stakeholders
• 1.4.Research Methodology
  • 1.4.1.Secondary research
  • 1.4.2.Primary research
  • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

• 2.1.Key findings of the study
• 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

• 3.1.Market definition and scope
• 3.2.Key findings
  • 3.2.1.Top investment pockets
• 3.3.Porter's five forces analysis
• 3.4.Top player positioning
• 3.5.Market dynamics
  • 3.5.1.Drivers
  • 3.5.2.Restraints
  • 3.5.3.Opportunities
• 3.6.COVID-19 Impact Analysis on the market
• 3.7.Value Chain Analysis
• 3.8.Key Regulation Analysis
• 3.9.Patent Landscape
• 3.10.Regulatory Guidelines
• 3.11.Market Share Analysis

CHAPTER 4: 3D SENSOR MARKET, BY TYPE

• 4.1 Overview
  • 4.1.1 Market size and forecast
• 4.2 Image Sensor
  • 4.2.1 Key market trends, growth factors and opportunities
  • 4.2.2 Market size and forecast, by region
  • 4.2.3 Market analysis by country
• 4.3 Accelerometer Sensor
  • 4.3.1 Key market trends, growth factors and opportunities
  • 4.3.2 Market size and forecast, by region
  • 4.3.3 Market analysis by country
• 4.4 Position Sensor
  • 4.4.1 Key market trends, growth factors and opportunities
  • 4.4.2 Market size and forecast, by region
  • 4.4.3 Market analysis by country
• 4.5 Others
  • 4.5.1 Key market trends, growth factors and opportunities
  • 4.5.2 Market size and forecast, by region
  • 4.5.3 Market analysis by country

CHAPTER 5: 3D SENSOR MARKET, BY TECHNOLOGY

• 5.1 Overview
  • 5.1.1 Market size and forecast
• 5.2 Structured Light
  • 5.2.1 Key market trends, growth factors and opportunities
  • 5.2.2 Market size and forecast, by region
  • 5.2.3 Market analysis by country
• 5.3 Time of Flight
  • 5.3.1 Key market trends, growth factors and opportunities
  • 5.3.2 Market size and forecast, by region
  • 5.3.3 Market analysis by country
• 5.4 Stereoscopic Vision
  • 5.4.1 Key market trends, growth factors and opportunities
  • 5.4.2 Market size and forecast, by region
  • 5.4.3 Market analysis by country
• 5.5 Ultrasound
  • 5.5.1 Key market trends, growth factors and opportunities
  • 5.5.2 Market size and forecast, by region
  • 5.5.3 Market analysis by country
• 5.6 Others
  • 5.6.1 Key market trends, growth factors and opportunities
  • 5.6.2 Market size and forecast, by region
  • 5.6.3 Market analysis by country

CHAPTER 6: 3D SENSOR MARKET, BY CONNECTIVITY

• 6.1 Overview
  • 6.1.1 Market size and forecast
• 6.2 Wireless
  • 6.2.1 Key market trends, growth factors and opportunities
  • 6.2.2 Market size and forecast, by region
  • 6.2.3 Market analysis by country
• 6.3 Wired
  • 6.3.1 Key market trends, growth factors and opportunities
  • 6.3.2 Market size and forecast, by region
  • 6.3.3 Market analysis by country

CHAPTER 7: 3D SENSOR MARKET, BY END USE

• 7.1 Overview
  • 7.1.1 Market size and forecast
• 7.2 Consumer Electronics
  • 7.2.1 Key market trends, growth factors and opportunities
  • 7.2.2 Market size and forecast, by region
  • 7.2.3 Market analysis by country
• 7.3 Healthcare
  • 7.3.1 Key market trends, growth factors and opportunities
  • 7.3.2 Market size and forecast, by region
  • 7.3.3 Market analysis by country
• 7.4 Aerospace & Defense
  • 7.4.1 Key market trends, growth factors and opportunities
  • 7.4.2 Market size and forecast, by region
  • 7.4.3 Market analysis by country
• 7.5 Automotive
  • 7.5.1 Key market trends, growth factors and opportunities
  • 7.5.2 Market size and forecast, by region
  • 7.5.3 Market analysis by country
• 7.6 Others
  • 7.6.1 Key market trends, growth factors and opportunities
  • 7.6.2 Market size and forecast, by region
  • 7.6.3 Market analysis by country

CHAPTER 8: 3D SENSOR MARKET, BY REGION

• 8.1 Overview
  • 8.1.1 Market size and forecast
• 8.2 North America
  • 8.2.1 Key trends and opportunities
  • 8.2.2 North America Market size and forecast, by Type
  • 8.2.3 North America Market size and forecast, by Technology
  • 8.2.4 North America Market size and forecast, by Connectivity
  • 8.2.5 North America Market size and forecast, by End use
  • 8.2.6 North America Market size and forecast, by country
    • 8.2.6.1 U.S.
    • 8.2.6.1.1 Market size and forecast, by Type
    • 8.2.6.1.2 Market size and forecast, by Technology
    • 8.2.6.1.3 Market size and forecast, by Connectivity
    • 8.2.6.1.4 Market size and forecast, by End use
    • 8.2.6.2 Canada
    • 8.2.6.2.1 Market size and forecast, by Type
    • 8.2.6.2.2 Market size and forecast, by Technology
    • 8.2.6.2.3 Market size and forecast, by Connectivity
    • 8.2.6.2.4 Market size and forecast, by End use
    • 8.2.6.3 Mexico
    • 8.2.6.3.1 Market size and forecast, by Type
    • 8.2.6.3.2 Market size and forecast, by Technology
    • 8.2.6.3.3 Market size and forecast, by Connectivity
    • 8.2.6.3.4 Market size and forecast, by End use
• 8.3 Europe
  • 8.3.1 Key trends and opportunities
  • 8.3.2 Europe Market size and forecast, by Type
  • 8.3.3 Europe Market size and forecast, by Technology
  • 8.3.4 Europe Market size and forecast, by Connectivity
  • 8.3.5 Europe Market size and forecast, by End use
  • 8.3.6 Europe Market size and forecast, by country
    • 8.3.6.1 Germany
    • 8.3.6.1.1 Market size and forecast, by Type
    • 8.3.6.1.2 Market size and forecast, by Technology
    • 8.3.6.1.3 Market size and forecast, by Connectivity
    • 8.3.6.1.4 Market size and forecast, by End use
    • 8.3.6.2 UK
    • 8.3.6.2.1 Market size and forecast, by Type
    • 8.3.6.2.2 Market size and forecast, by Technology
    • 8.3.6.2.3 Market size and forecast, by Connectivity
    • 8.3.6.2.4 Market size and forecast, by End use
    • 8.3.6.3 France
    • 8.3.6.3.1 Market size and forecast, by Type
    • 8.3.6.3.2 Market size and forecast, by Technology
    • 8.3.6.3.3 Market size and forecast, by Connectivity
    • 8.3.6.3.4 Market size and forecast, by End use
    • 8.3.6.4 Spain
    • 8.3.6.4.1 Market size and forecast, by Type
    • 8.3.6.4.2 Market size and forecast, by Technology
    • 8.3.6.4.3 Market size and forecast, by Connectivity
    • 8.3.6.4.4 Market size and forecast, by End use
    • 8.3.6.5 Italy
    • 8.3.6.5.1 Market size and forecast, by Type
    • 8.3.6.5.2 Market size and forecast, by Technology
    • 8.3.6.5.3 Market size and forecast, by Connectivity
    • 8.3.6.5.4 Market size and forecast, by End use
    • 8.3.6.6 Rest of Europe
    • 8.3.6.6.1 Market size and forecast, by Type
    • 8.3.6.6.2 Market size and forecast, by Technology
    • 8.3.6.6.3 Market size and forecast, by Connectivity
    • 8.3.6.6.4 Market size and forecast, by End use
• 8.4 Asia-Pacific
  • 8.4.1 Key trends and opportunities
  • 8.4.2 Asia-Pacific Market size and forecast, by Type
  • 8.4.3 Asia-Pacific Market size and forecast, by Technology
  • 8.4.4 Asia-Pacific Market size and forecast, by Connectivity
  • 8.4.5 Asia-Pacific Market size and forecast, by End use
  • 8.4.6 Asia-Pacific Market size and forecast, by country
    • 8.4.6.1 China
    • 8.4.6.1.1 Market size and forecast, by Type
    • 8.4.6.1.2 Market size and forecast, by Technology
    • 8.4.6.1.3 Market size and forecast, by Connectivity
    • 8.4.6.1.4 Market size and forecast, by End use
    • 8.4.6.2 Japan
    • 8.4.6.2.1 Market size and forecast, by Type
    • 8.4.6.2.2 Market size and forecast, by Technology
    • 8.4.6.2.3 Market size and forecast, by Connectivity
    • 8.4.6.2.4 Market size and forecast, by End use
    • 8.4.6.3 India
    • 8.4.6.3.1 Market size and forecast, by Type
    • 8.4.6.3.2 Market size and forecast, by Technology
    • 8.4.6.3.3 Market size and forecast, by Connectivity
    • 8.4.6.3.4 Market size and forecast, by End use
    • 8.4.6.4 South Korea
    • 8.4.6.4.1 Market size and forecast, by Type
    • 8.4.6.4.2 Market size and forecast, by Technology
    • 8.4.6.4.3 Market size and forecast, by Connectivity
    • 8.4.6.4.4 Market size and forecast, by End use
    • 8.4.6.5 Australia
    • 8.4.6.5.1 Market size and forecast, by Type
    • 8.4.6.5.2 Market size and forecast, by Technology
    • 8.4.6.5.3 Market size and forecast, by Connectivity
    • 8.4.6.5.4 Market size and forecast, by End use
    • 8.4.6.6 Rest Of Asia Pacific
    • 8.4.6.6.1 Market size and forecast, by Type
    • 8.4.6.6.2 Market size and forecast, by Technology
    • 8.4.6.6.3 Market size and forecast, by Connectivity
    • 8.4.6.6.4 Market size and forecast, by End use
• 8.5 LAMEA
  • 8.5.1 Key trends and opportunities
  • 8.5.2 LAMEA Market size and forecast, by Type
  • 8.5.3 LAMEA Market size and forecast, by Technology
  • 8.5.4 LAMEA Market size and forecast, by Connectivity
  • 8.5.5 LAMEA Market size and forecast, by End use
  • 8.5.6 LAMEA Market size and forecast, by country
    • 8.5.6.1 Brazil
    • 8.5.6.1.1 Market size and forecast, by Type
    • 8.5.6.1.2 Market size and forecast, by Technology
    • 8.5.6.1.3 Market size and forecast, by Connectivity
    • 8.5.6.1.4 Market size and forecast, by End use
    • 8.5.6.2 Saudi Arabia
    • 8.5.6.2.1 Market size and forecast, by Type
    • 8.5.6.2.2 Market size and forecast, by Technology
    • 8.5.6.2.3 Market size and forecast, by Connectivity
    • 8.5.6.2.4 Market size and forecast, by End use
    • 8.5.6.3 UAE
    • 8.5.6.3.1 Market size and forecast, by Type
    • 8.5.6.3.2 Market size and forecast, by Technology
    • 8.5.6.3.3 Market size and forecast, by Connectivity
    • 8.5.6.3.4 Market size and forecast, by End use
    • 8.5.6.4 South Africa
    • 8.5.6.4.1 Market size and forecast, by Type
    • 8.5.6.4.2 Market size and forecast, by Technology
    • 8.5.6.4.3 Market size and forecast, by Connectivity
    • 8.5.6.4.4 Market size and forecast, by End use
    • 8.5.6.5 Rest of LAMEA
    • 8.5.6.5.1 Market size and forecast, by Type
    • 8.5.6.5.2 Market size and forecast, by Technology
    • 8.5.6.5.3 Market size and forecast, by Connectivity
    • 8.5.6.5.4 Market size and forecast, by End use

CHAPTER 9: COMPANY LANDSCAPE

• 9.1. Introduction
• 9.2. Top winning strategies
• 9.3. Product Mapping of Top 10 Player
• 9.4. Competitive Dashboard
• 9.5. Competitive Heatmap
• 9.6. Key developments

CHAPTER 10: COMPANY PROFILES

• 10.1 Omnivision Technologies
  • 10.1.1 Company overview
  • 10.1.2 Company snapshot
  • 10.1.3 Operating business segments
  • 10.1.4 Product portfolio
  • 10.1.5 Business performance
  • 10.1.6 Key strategic moves and developments
• 10.2 Infineon Technologies
  • 10.2.1 Company overview
  • 10.2.2 Company snapshot
  • 10.2.3 Operating business segments
  • 10.2.4 Product portfolio
  • 10.2.5 Business performance
  • 10.2.6 Key strategic moves and developments
• 10.3 LMI Technologies
  • 10.3.1 Company overview
  • 10.3.2 Company snapshot
  • 10.3.3 Operating business segments
  • 10.3.4 Product portfolio
  • 10.3.5 Business performance
  • 10.3.6 Key strategic moves and developments
• 10.4 PrimeSense
  • 10.4.1 Company overview
  • 10.4.2 Company snapshot
  • 10.4.3 Operating business segments
  • 10.4.4 Product portfolio
  • 10.4.5 Business performance
  • 10.4.6 Key strategic moves and developments
• 10.5 Cognex Corporation
  • 10.5.1 Company overview
  • 10.5.2 Company snapshot
  • 10.5.3 Operating business segments
  • 10.5.4 Product portfolio
  • 10.5.5 Business performance
  • 10.5.6 Key strategic moves and developments
• 10.6 SoftKinetic
  • 10.6.1 Company overview
  • 10.6.2 Company snapshot
  • 10.6.3 Operating business segments
  • 10.6.4 Product portfolio
  • 10.6.5 Business performance
  • 10.6.6 Key strategic moves and developments
• 10.7 Pmdtechnologies GmbH
  • 10.7.1 Company overview
  • 10.7.2 Company snapshot
  • 10.7.3 Operating business segments
  • 10.7.4 Product portfolio
  • 10.7.5 Business performance
  • 10.7.6 Key strategic moves and developments
• 10.8 IFM Electronic
  • 10.8.1 Company overview
  • 10.8.2 Company snapshot
  • 10.8.3 Operating business segments
  • 10.8.4 Product portfolio
  • 10.8.5 Business performance
  • 10.8.6 Key strategic moves and developments
• 10.9 Occipital Inc.
  • 10.9.1 Company overview
  • 10.9.2 Company snapshot
  • 10.9.3 Operating business segments
  • 10.9.4 Product portfolio
  • 10.9.5 Business performance
  • 10.9.6 Key strategic moves and developments