시장보고서
상품코드
1193049

군용 임베디드 시스템 시장 : 제품 유형별(머더보드 및 컴퓨터 온 모듈, OPEN VPX, VME BUS, Compact-PCI, 기타), 컴포넌트별, 플랫폼별, 용도별 : 세계 기회 분석 및 산업 예측(2021-2031년)

Military Embedded System Market By Product Type (Motherboard & Computer-On-Module, OPEN VPX, VME BUS, Compact-PCI, Others), By Component, By Platform, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031

발행일: | 리서치사: Allied Market Research | 페이지 정보: 영문 378 Pages | 배송안내 : 2-3일 (영업일 기준)

※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 군용 임베디드 시스템 시장은 2022-2031년 CAGR7.9%로 2021년 15억 4000만 달러에서 성장하며, 2031년에는 32억 5930만 달러를 획득할 것으로 추정됩니다.

목차

제1장 서론

제2장 주요 요약

제3장 시장의 개요

  • 시장의 정의와 범위
  • 주요 조사 결과
    • 주요 투자 포켓
  • Porter's Five Forces 분석
  • 주요 기업의 포지셔닝
  • 시장 역학
    • 촉진요인
    • 억제요인
    • 기회
  • COVID-19 영향 분석
  • 밸류체인 분석
  • 시장 점유율 분석
  • 주요 규제 분석
  • 특허 상황
  • 규제 가이드라인

제4장 군용 임베디드 시스템 시장 : 제품 유형별

  • 개요
    • 시장 규모·예측
  • 머더보드·컴퓨터 온 모듈(COM)
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별 분석
  • OPEN VPX
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • VME BUS
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 컴팩트 PCI(보드 & 시리얼)
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 기타
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별

제5장 군용 임베디드 시스템 시장 : 컴포넌트별

  • 개요
    • 시장 규모·예측
  • 하드웨어
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 소프트웨어
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별

제6장 군용 임베디드 시스템 시장 : 플랫폼별

  • 개요
    • 시장 규모·예측
  • 에어본
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별 분석
  • 육상
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 해군
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 우주
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별

제7장 군용 임베디드 시스템 시장 : 용도별

  • 개요
    • 시장 규모·예측
  • 레이더
    • 주요 시장 동향, 성장요인과 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 커맨드 & 컨트롤
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 아비오닉스
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 전자전
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 통신·내비게이션
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 무기 사격 통제 시스템
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별
  • 기타
    • 주요 시장 동향, 성장요인, 기회
    • 시장 규모·예측 : 지역별
    • 시장 분석 : 국가별

제8장 군용 임베디드 시스템 시장 : 지역별

  • 개요
    • 시장 규모·예측
  • 북미
    • 주요 동향과 기회
    • 북미 시장 규모·예측 : 제품 유형별
    • 북미 시장 규모·예측 : 컴포넌트별
    • 북미 시장 규모·예측 : 플랫폼별
    • 북미 시장 규모·예측 : 용도별
    • 북미 시장 규모·예측 : 국가별
      • 미국
      • 캐나다
      • 멕시코
  • 유럽
    • 주요 동향과 기회
    • 유럽 시장 규모·예측 : 제품 유형별
    • 유럽 시장 규모·예측 : 컴포넌트별
    • 유럽 시장 규모·예측 : 플랫폼별
    • 유럽 시장 규모·예측 : 용도별
    • 유럽 시장 규모·예측 : 국가별
      • 영국
      • 독일
      • 프랑스
      • 스페인
      • 이탈리아
      • 기타 유럽
  • 아시아태평양
    • 주요 동향과 기회
    • 아시아태평양의 시장 규모·예측 : 제품 유형별
    • 아시아태평양의 시장 규모·예측 : 컴포넌트별
    • 아시아태평양의 시장 규모·예측 : 플랫폼별
    • 아시아태평양의 시장 규모·예측 : 용도별
    • 아시아태평양의 시장 규모·예측 : 국가별
      • 중국
      • 인도
      • 일본
      • 한국
      • 호주
      • 기타 아시아태평양
  • LAMEA
    • 주요 동향과 기회
    • LAMEA의 시장 규모·예측 : 제품 유형별
    • LAMEA의 시장 규모·예측 : 컴포넌트별
    • LAMEA의 시장 규모·예측 : 플랫폼별
    • LAMEA의 시장 규모·예측 : 용도별
    • LAMEA 시장의 시장 규모·예측 : 국가별
      • 브라질
      • UAE
      • 사우디아라비아
      • 남아프리카공화국
      • LAMEA의 기타 지역

제9장 기업 상황

  • 서론
  • 주요 성공 전략
  • 주요 10사의 제품 매핑
  • 경쟁 대시보드
  • 경쟁 히트맵
  • 주요 발전

제10장 기업 개요

  • Xilinx Inc.
  • General Micro Systems
  • BAE Systems
  • Intel Corporation
  • Kontron AG
  • Curtiss-Wright Corporation
  • Radisys Corporation
  • Telephonics Corporation
  • Microsemi Corporation
  • Abaco Systems
KSA 23.03.15

The global military embedded system market is envisioned to garner $3,259.3 million by 2031, growing from $1,540 million in 2021 at a CAGR of 7.9% from 2022 to 2031.

Military embedded systems play an important role in gathering and analyzing vital information to help military officials make the best decisions possible. Military intelligence agencies can employ embedded systems to spy on their potential enemies' radio, television, and other broadcasting systems in the majority of countries. Radar systems, military traffic systems, and surveillance satellites all employ embedded military technology. In addition, military embedded enhance system reliability, enable remote control operation, and safeguard systems from unauthorized access.

The use of cloud computing and artificial intelligence has broadened and redefined the capabilities of military-embedded systems. Nations are deploying AI-powered weapons, and embedded systems are enabling new forms of combat. However, the price of military embedded systems, complexity in the design and development of embedded systems, and data security are some factors that are anticipated to hamper the military embedded market share during the forecast period.

Embedded vision systems are the latest technology used for military embedded systems. For soldiers, embedded vision systems produce unprecedented visibility and autonomy. The most important embedded vision application is multispectral imaging in surveillance systems used by drones and aircraft. Embedded vision cameras and sensors provide a synthetic vision that provides pilots with relevant information when natural visibility is limited Military vehicles that are autonomous and equipped for combat use embedded vision systems to navigate challenging terrain. Soldiers can use head-up displays with embedded vision systems to access navigation information and the enemy's location in real-time.

The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. The pandemic had a negative influence on commercial aerospace and general industrial end-market developments. Various government restrictions on personnel movement, lockdowns, and shutdown of non-essential businesses affected chip manufacturing companies during the pandemic, affecting military embedded system production. In addition, import-export restrictions, transportation issues, and labor shortage affected the market. R&D in the embedded system processor manufacturing business has been negatively impacted, due to the travel restrictions implemented by various governments around the world to combat the COVID-19 pandemic. Governments and consumers focused on supplying necessities like food and safety equipment, which impacted the demand for custom or standard hardware systems for embedded systems makers during the COVID-19 pandemic.

The key players profiled in this report include Intel Corporation, Mercury Systems, Inc. Curtiss-Wright Corporation, Advantech Co., Ltd., BAE Systems, SMART Embedded Computing, SDK Embedded Systems Ltd., General Dynamics Corporation, Kontron (S&T), and Xilinx Inc.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the military embedded system market analysis from 2021 to 2031 to identify the prevailing military embedded system market opportunities.
  • Market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
  • An in-depth analysis of the military embedded system market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global military embedded system market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Product Type

  • VME BUS
  • Compact-PCI (Board Serial)
  • Others
  • Motherboard Computer-On-Module (COM)
  • OPEN VPX

By Component

  • Hardware
  • Software

By Platform

  • Airborne
  • Land
  • Naval
  • Space

By Application

  • Radar
  • Command Control
  • Avionics
  • Electronic Warfare
  • Communication Navigation
  • Weapon Fire Control System
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Spain
    • Italy
    • Rest Of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Australia
    • Rest Of Asia-Pacific
  • LAMEA
    • Brazil
    • UAE
    • Saudi Arabia
    • South Africa
    • Rest Of LAMEA
  • Key Market Players
    • Xilinx Inc.
    • General Micro Systems
    • BAE Systems
    • Intel Corporation
    • Kontron AG
    • Curtiss-Wright Corporation
    • Radisys Corporation
    • Telephonics Corporation
    • Microsemi Corporation
    • Abaco Systems

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.Report description
  • 1.2.Key market segments
  • 1.3.Key benefits to the stakeholders
  • 1.4.Research Methodology
    • 1.4.1.Secondary research
    • 1.4.2.Primary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.Key findings of the study
  • 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

  • 3.1.Market definition and scope
  • 3.2.Key findings
    • 3.2.1.Top investment pockets
  • 3.3.Porter's five forces analysis
  • 3.4.Top player positioning
  • 3.5.Market dynamics
    • 3.5.1.Drivers
    • 3.5.2.Restraints
    • 3.5.3.Opportunities
  • 3.6.COVID-19 Impact Analysis on the market
  • 3.7.Value Chain Analysis
  • 3.8.Market Share Analysis
  • 3.9.Key Regulation Analysis
  • 3.10.Patent Landscape
  • 3.11.Regulatory Guidelines

CHAPTER 4: MILITARY EMBEDDED SYSTEM MARKET, BY PRODUCT TYPE

  • 4.1 Overview
    • 4.1.1 Market size and forecast
  • 4.2 Motherboard & Computer-On-Module (COM)
    • 4.2.1 Key market trends, growth factors and opportunities
    • 4.2.2 Market size and forecast, by region
    • 4.2.3 Market analysis by country
  • 4.3 OPEN VPX
    • 4.3.1 Key market trends, growth factors and opportunities
    • 4.3.2 Market size and forecast, by region
    • 4.3.3 Market analysis by country
  • 4.4 VME BUS
    • 4.4.1 Key market trends, growth factors and opportunities
    • 4.4.2 Market size and forecast, by region
    • 4.4.3 Market analysis by country
  • 4.5 Compact-PCI (Board & Serial)
    • 4.5.1 Key market trends, growth factors and opportunities
    • 4.5.2 Market size and forecast, by region
    • 4.5.3 Market analysis by country
  • 4.6 Others
    • 4.6.1 Key market trends, growth factors and opportunities
    • 4.6.2 Market size and forecast, by region
    • 4.6.3 Market analysis by country

CHAPTER 5: MILITARY EMBEDDED SYSTEM MARKET, BY COMPONENT

  • 5.1 Overview
    • 5.1.1 Market size and forecast
  • 5.2 Hardware
    • 5.2.1 Key market trends, growth factors and opportunities
    • 5.2.2 Market size and forecast, by region
    • 5.2.3 Market analysis by country
  • 5.3 Software
    • 5.3.1 Key market trends, growth factors and opportunities
    • 5.3.2 Market size and forecast, by region
    • 5.3.3 Market analysis by country

CHAPTER 6: MILITARY EMBEDDED SYSTEM MARKET, BY PLATFORM

  • 6.1 Overview
    • 6.1.1 Market size and forecast
  • 6.2 Airborne
    • 6.2.1 Key market trends, growth factors and opportunities
    • 6.2.2 Market size and forecast, by region
    • 6.2.3 Market analysis by country
  • 6.3 Land
    • 6.3.1 Key market trends, growth factors and opportunities
    • 6.3.2 Market size and forecast, by region
    • 6.3.3 Market analysis by country
  • 6.4 Naval
    • 6.4.1 Key market trends, growth factors and opportunities
    • 6.4.2 Market size and forecast, by region
    • 6.4.3 Market analysis by country
  • 6.5 Space
    • 6.5.1 Key market trends, growth factors and opportunities
    • 6.5.2 Market size and forecast, by region
    • 6.5.3 Market analysis by country

CHAPTER 7: MILITARY EMBEDDED SYSTEM MARKET, BY APPLICATION

  • 7.1 Overview
    • 7.1.1 Market size and forecast
  • 7.2 Radar
    • 7.2.1 Key market trends, growth factors and opportunities
    • 7.2.2 Market size and forecast, by region
    • 7.2.3 Market analysis by country
  • 7.3 Command & Control
    • 7.3.1 Key market trends, growth factors and opportunities
    • 7.3.2 Market size and forecast, by region
    • 7.3.3 Market analysis by country
  • 7.4 Avionics
    • 7.4.1 Key market trends, growth factors and opportunities
    • 7.4.2 Market size and forecast, by region
    • 7.4.3 Market analysis by country
  • 7.5 Electronic Warfare
    • 7.5.1 Key market trends, growth factors and opportunities
    • 7.5.2 Market size and forecast, by region
    • 7.5.3 Market analysis by country
  • 7.6 Communication & Navigation
    • 7.6.1 Key market trends, growth factors and opportunities
    • 7.6.2 Market size and forecast, by region
    • 7.6.3 Market analysis by country
  • 7.7 Weapon Fire Control System
    • 7.7.1 Key market trends, growth factors and opportunities
    • 7.7.2 Market size and forecast, by region
    • 7.7.3 Market analysis by country
  • 7.8 Others
    • 7.8.1 Key market trends, growth factors and opportunities
    • 7.8.2 Market size and forecast, by region
    • 7.8.3 Market analysis by country

CHAPTER 8: MILITARY EMBEDDED SYSTEM MARKET, BY REGION

  • 8.1 Overview
    • 8.1.1 Market size and forecast
  • 8.2 North America
    • 8.2.1 Key trends and opportunities
    • 8.2.2 North America Market size and forecast, by Product Type
    • 8.2.3 North America Market size and forecast, by Component
    • 8.2.4 North America Market size and forecast, by Platform
    • 8.2.5 North America Market size and forecast, by Application
    • 8.2.6 North America Market size and forecast, by country
      • 8.2.6.1 U.S.
      • 8.2.6.1.1 Market size and forecast, by Product Type
      • 8.2.6.1.2 Market size and forecast, by Component
      • 8.2.6.1.3 Market size and forecast, by Platform
      • 8.2.6.1.4 Market size and forecast, by Application
      • 8.2.6.2 Canada
      • 8.2.6.2.1 Market size and forecast, by Product Type
      • 8.2.6.2.2 Market size and forecast, by Component
      • 8.2.6.2.3 Market size and forecast, by Platform
      • 8.2.6.2.4 Market size and forecast, by Application
      • 8.2.6.3 Mexico
      • 8.2.6.3.1 Market size and forecast, by Product Type
      • 8.2.6.3.2 Market size and forecast, by Component
      • 8.2.6.3.3 Market size and forecast, by Platform
      • 8.2.6.3.4 Market size and forecast, by Application
  • 8.3 Europe
    • 8.3.1 Key trends and opportunities
    • 8.3.2 Europe Market size and forecast, by Product Type
    • 8.3.3 Europe Market size and forecast, by Component
    • 8.3.4 Europe Market size and forecast, by Platform
    • 8.3.5 Europe Market size and forecast, by Application
    • 8.3.6 Europe Market size and forecast, by country
      • 8.3.6.1 UK
      • 8.3.6.1.1 Market size and forecast, by Product Type
      • 8.3.6.1.2 Market size and forecast, by Component
      • 8.3.6.1.3 Market size and forecast, by Platform
      • 8.3.6.1.4 Market size and forecast, by Application
      • 8.3.6.2 Germany
      • 8.3.6.2.1 Market size and forecast, by Product Type
      • 8.3.6.2.2 Market size and forecast, by Component
      • 8.3.6.2.3 Market size and forecast, by Platform
      • 8.3.6.2.4 Market size and forecast, by Application
      • 8.3.6.3 France
      • 8.3.6.3.1 Market size and forecast, by Product Type
      • 8.3.6.3.2 Market size and forecast, by Component
      • 8.3.6.3.3 Market size and forecast, by Platform
      • 8.3.6.3.4 Market size and forecast, by Application
      • 8.3.6.4 Spain
      • 8.3.6.4.1 Market size and forecast, by Product Type
      • 8.3.6.4.2 Market size and forecast, by Component
      • 8.3.6.4.3 Market size and forecast, by Platform
      • 8.3.6.4.4 Market size and forecast, by Application
      • 8.3.6.5 Italy
      • 8.3.6.5.1 Market size and forecast, by Product Type
      • 8.3.6.5.2 Market size and forecast, by Component
      • 8.3.6.5.3 Market size and forecast, by Platform
      • 8.3.6.5.4 Market size and forecast, by Application
      • 8.3.6.6 Rest of Europe
      • 8.3.6.6.1 Market size and forecast, by Product Type
      • 8.3.6.6.2 Market size and forecast, by Component
      • 8.3.6.6.3 Market size and forecast, by Platform
      • 8.3.6.6.4 Market size and forecast, by Application
  • 8.4 Asia-Pacific
    • 8.4.1 Key trends and opportunities
    • 8.4.2 Asia-Pacific Market size and forecast, by Product Type
    • 8.4.3 Asia-Pacific Market size and forecast, by Component
    • 8.4.4 Asia-Pacific Market size and forecast, by Platform
    • 8.4.5 Asia-Pacific Market size and forecast, by Application
    • 8.4.6 Asia-Pacific Market size and forecast, by country
      • 8.4.6.1 China
      • 8.4.6.1.1 Market size and forecast, by Product Type
      • 8.4.6.1.2 Market size and forecast, by Component
      • 8.4.6.1.3 Market size and forecast, by Platform
      • 8.4.6.1.4 Market size and forecast, by Application
      • 8.4.6.2 India
      • 8.4.6.2.1 Market size and forecast, by Product Type
      • 8.4.6.2.2 Market size and forecast, by Component
      • 8.4.6.2.3 Market size and forecast, by Platform
      • 8.4.6.2.4 Market size and forecast, by Application
      • 8.4.6.3 Japan
      • 8.4.6.3.1 Market size and forecast, by Product Type
      • 8.4.6.3.2 Market size and forecast, by Component
      • 8.4.6.3.3 Market size and forecast, by Platform
      • 8.4.6.3.4 Market size and forecast, by Application
      • 8.4.6.4 South Korea
      • 8.4.6.4.1 Market size and forecast, by Product Type
      • 8.4.6.4.2 Market size and forecast, by Component
      • 8.4.6.4.3 Market size and forecast, by Platform
      • 8.4.6.4.4 Market size and forecast, by Application
      • 8.4.6.5 Australia
      • 8.4.6.5.1 Market size and forecast, by Product Type
      • 8.4.6.5.2 Market size and forecast, by Component
      • 8.4.6.5.3 Market size and forecast, by Platform
      • 8.4.6.5.4 Market size and forecast, by Application
      • 8.4.6.6 Rest of Asia-Pacific
      • 8.4.6.6.1 Market size and forecast, by Product Type
      • 8.4.6.6.2 Market size and forecast, by Component
      • 8.4.6.6.3 Market size and forecast, by Platform
      • 8.4.6.6.4 Market size and forecast, by Application
  • 8.5 LAMEA
    • 8.5.1 Key trends and opportunities
    • 8.5.2 LAMEA Market size and forecast, by Product Type
    • 8.5.3 LAMEA Market size and forecast, by Component
    • 8.5.4 LAMEA Market size and forecast, by Platform
    • 8.5.5 LAMEA Market size and forecast, by Application
    • 8.5.6 LAMEA Market size and forecast, by country
      • 8.5.6.1 Brazil
      • 8.5.6.1.1 Market size and forecast, by Product Type
      • 8.5.6.1.2 Market size and forecast, by Component
      • 8.5.6.1.3 Market size and forecast, by Platform
      • 8.5.6.1.4 Market size and forecast, by Application
      • 8.5.6.2 UAE
      • 8.5.6.2.1 Market size and forecast, by Product Type
      • 8.5.6.2.2 Market size and forecast, by Component
      • 8.5.6.2.3 Market size and forecast, by Platform
      • 8.5.6.2.4 Market size and forecast, by Application
      • 8.5.6.3 Saudi Arabia
      • 8.5.6.3.1 Market size and forecast, by Product Type
      • 8.5.6.3.2 Market size and forecast, by Component
      • 8.5.6.3.3 Market size and forecast, by Platform
      • 8.5.6.3.4 Market size and forecast, by Application
      • 8.5.6.4 South Africa
      • 8.5.6.4.1 Market size and forecast, by Product Type
      • 8.5.6.4.2 Market size and forecast, by Component
      • 8.5.6.4.3 Market size and forecast, by Platform
      • 8.5.6.4.4 Market size and forecast, by Application
      • 8.5.6.5 Rest of LAMEA
      • 8.5.6.5.1 Market size and forecast, by Product Type
      • 8.5.6.5.2 Market size and forecast, by Component
      • 8.5.6.5.3 Market size and forecast, by Platform
      • 8.5.6.5.4 Market size and forecast, by Application

CHAPTER 9: COMPANY LANDSCAPE

  • 9.1. Introduction
  • 9.2. Top winning strategies
  • 9.3. Product Mapping of Top 10 Player
  • 9.4. Competitive Dashboard
  • 9.5. Competitive Heatmap
  • 9.6. Key developments

CHAPTER 10: COMPANY PROFILES

  • 10.1 Xilinx Inc.
    • 10.1.1 Company overview
    • 10.1.2 Company snapshot
    • 10.1.3 Operating business segments
    • 10.1.4 Product portfolio
    • 10.1.5 Business performance
    • 10.1.6 Key strategic moves and developments
  • 10.2 General Micro Systems
    • 10.2.1 Company overview
    • 10.2.2 Company snapshot
    • 10.2.3 Operating business segments
    • 10.2.4 Product portfolio
    • 10.2.5 Business performance
    • 10.2.6 Key strategic moves and developments
  • 10.3 BAE Systems
    • 10.3.1 Company overview
    • 10.3.2 Company snapshot
    • 10.3.3 Operating business segments
    • 10.3.4 Product portfolio
    • 10.3.5 Business performance
    • 10.3.6 Key strategic moves and developments
  • 10.4 Intel Corporation
    • 10.4.1 Company overview
    • 10.4.2 Company snapshot
    • 10.4.3 Operating business segments
    • 10.4.4 Product portfolio
    • 10.4.5 Business performance
    • 10.4.6 Key strategic moves and developments
  • 10.5 Kontron AG
    • 10.5.1 Company overview
    • 10.5.2 Company snapshot
    • 10.5.3 Operating business segments
    • 10.5.4 Product portfolio
    • 10.5.5 Business performance
    • 10.5.6 Key strategic moves and developments
  • 10.6 Curtiss-Wright Corporation
    • 10.6.1 Company overview
    • 10.6.2 Company snapshot
    • 10.6.3 Operating business segments
    • 10.6.4 Product portfolio
    • 10.6.5 Business performance
    • 10.6.6 Key strategic moves and developments
  • 10.7 Radisys Corporation
    • 10.7.1 Company overview
    • 10.7.2 Company snapshot
    • 10.7.3 Operating business segments
    • 10.7.4 Product portfolio
    • 10.7.5 Business performance
    • 10.7.6 Key strategic moves and developments
  • 10.8 Telephonics Corporation
    • 10.8.1 Company overview
    • 10.8.2 Company snapshot
    • 10.8.3 Operating business segments
    • 10.8.4 Product portfolio
    • 10.8.5 Business performance
    • 10.8.6 Key strategic moves and developments
  • 10.9 Microsemi Corporation
    • 10.9.1 Company overview
    • 10.9.2 Company snapshot
    • 10.9.3 Operating business segments
    • 10.9.4 Product portfolio
    • 10.9.5 Business performance
    • 10.9.6 Key strategic moves and developments
  • 10.10 Abaco Systems
    • 10.10.1 Company overview
    • 10.10.2 Company snapshot
    • 10.10.3 Operating business segments
    • 10.10.4 Product portfolio
    • 10.10.5 Business performance
    • 10.10.6 Key strategic moves and developments
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