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Super Junction MOSFET Market By Type (Surface Mount Type, Through Hole Type ), By Application : Global Opportunity Analysis and Industry Forecast, 2023-2032

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Super Junction MOSFET Market-IMG1

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  • Alpha and Omega Semiconductor
  • Fuji Electric Co., Ltd.
  • IceMOS Technology Ltd.
  • Infineon Technologies AG
  • Magnachip
  • PANJIT
  • ROHM Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Vishay Intertechnology, Inc.
KSA 23.11.03

According to a new report published by Allied Market Research, titled, "Super Junction MOSFET Market," The super junction mosfet market was valued at $2.6 billion in 2022, and is estimated to reach $10.4 billion by 2032, growing at a CAGR of 15.1% from 2023 to 2032.

Super Junction MOSFET Market - IMG1

Super junction MOSFETs have widespread applications across multiple industries. They are commonly used in power electronics for switch-mode power supplies, motor drives, solar inverters, LED drivers, and other high-power industrial applications. Their efficient power conversion capabilities also make them suitable for renewable energy systems, electric vehicles, consumer electronics, and data centers.

Different sectors have diverse end users for Super Junction MOSFETs. In the automotive industry, electric vehicle manufacturers integrate Super junction MOSFETs into powertrains and battery management systems to enhance vehicle efficiency and performance. Industrial automation companies use Super junction MOSFETs in motor drives and high-power control systems, benefiting from their ability to handle high currents and voltages. The semiconductor industry incorporates SJ-MOSFETs in power management and voltage regulation circuits. Additionally, the energy sector leverages Super junction MOSFETs for renewable energy applications, such as solar and wind power converters. In the consumer electronics domain, manufacturers utilize Super junction MOSFETs to optimize power consumption and extend battery life in devices like smartphones and laptops.

Thus, super junction MOSFETs offer versatility and efficiency, enabling end users across various industries to improve their products and systems with better power management and performance. As the demand for energy-efficient and high-power electronics grows, Super junction MOSFETs adoption is expected to increase, driving further advancements and progress in the field.

The Super junction MOSFET market analysis is expected to expand significantly during the forecast period owing to increased dependence on electrical equipment and machinery, and increase in emphasis on power saving. In addition, during the forecast period, the Super junction MOSFET market is anticipated to benefit from increase in transition towards electric vehicles (EVs). On the contrary, the complex fabrication process associated with Super junction MOSFETs is the restraint for Super junction MOSFET market growth during the forecast period.

The global super junction MOSFET market is analyzed by type, application, and region. On the basis of type, the market is segmented into surface mount type (SMT), and through hole type (THT). In 2022, the surface mount type (SMT) segment dominated the market, and is expected to acquire major market share till 2032. Depending on application, the market is categorized into energy and power, consumer electronics, inverter and ups, electric vehicle, industrial system, and others. The electric vehicle segment acquired the largest share in 2022 and is expected to grow at a significant CAGR from 2023 to 2032.

Region-wise, the super junction MOSFET Market trends are analyzed across North America (the U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

Competitive analysis and profiles of the major global Super junction MOSFET market players that have been provided in the report include Alpha and Omega Semiconductor, Fuji Electric Co., Ltd., IceMOS Technology Ltd., Infineon Technologies, Magnachip, PANJIT, ROHM Semiconductors, STMicroelectronics, Toshiba Corporation, and Vishay Intertechnology. The key strategies adopted by the major players of the Super junction MOSFET market are product launch and business expansion.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the super junction mosfet market analysis from 2022 to 2032 to identify the prevailing super junction mosfet market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the super junction mosfet market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global super junction mosfet market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

  • Quarterly Update and* (only available with a corporate license, on listed price)
  • 5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
  • Free Upcoming Version on the Purchase of Five and Enterprise User License.
  • 16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
  • 15% Free Customization* (in case the scope or segment of the report does not match your requirements, 20% is equivalent to 3 working days of free work, applicable once)
  • Free data Pack on the Five and Enterprise User License. (Excel version of the report)
  • Free Updated report if the report is 6-12 months old or older.
  • 24-hour priority response*
  • Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline talk to the sales executive to know more)

  • Investment Opportunities
  • New Product Development/ Product Matrix of Key Players
  • Additional company profiles with specific to client's interest

Key Market Segments

By Type

  • Through Hole Type (THT)
  • Surface Mount Type (SMT)

By Application

  • Energy and Power
  • Consumer Electronics
  • Inverter and UPS
  • Electric Vehicle
  • Industrial System
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Gemany
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players:

    • Toshiba Corporation
    • Infineon Technologies AG
    • Magnachip
    • ROHM Co., Ltd.
    • Vishay Intertechnology, Inc.
    • IceMOS Technology Ltd.
    • STMicroelectronics N.V.
    • PANJIT
    • Alpha and Omega Semiconductor
    • Fuji Electric Co., Ltd.

TABLE OF CONTENTS

CHAPTER 1: INTRODUCTION

  • 1.1. Report description
  • 1.2. Key market segments
  • 1.3. Key benefits to the stakeholders
  • 1.4. Research methodology
    • 1.4.1. Primary research
    • 1.4.2. Secondary research
    • 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

  • 2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

  • 3.1. Market definition and scope
  • 3.2. Key findings
    • 3.2.1. Top impacting factors
    • 3.2.2. Top investment pockets
  • 3.3. Porter's five forces analysis
    • 3.3.1. Low bargaining power of suppliers
    • 3.3.2. Low threat of new entrants
    • 3.3.3. Low threat of substitutes
    • 3.3.4. Low intensity of rivalry
    • 3.3.5. Low bargaining power of buyers
  • 3.4. Market dynamics
    • 3.4.1. Drivers
      • 3.4.1.1. Increased dependence on electrical equipment and machinery
      • 3.4.1.2. Increase in emphasis on power saving
    • 3.4.2. Restraints
      • 3.4.2.1. Complex fabrication process
    • 3.4.3. Opportunities
      • 3.4.3.1. Increase in transition towards electric vehicles (EVs).

CHAPTER 4: SUPER JUNCTION MOSFET MARKET, BY TYPE

  • 4.1. Overview
    • 4.1.1. Market size and forecast
  • 4.2. Surface Mount Type (SMT)
    • 4.2.1. Key market trends, growth factors and opportunities
    • 4.2.2. Market size and forecast, by region
    • 4.2.3. Market share analysis by country
  • 4.3. Through Hole Type (THT)
    • 4.3.1. Key market trends, growth factors and opportunities
    • 4.3.2. Market size and forecast, by region
    • 4.3.3. Market share analysis by country

CHAPTER 5: SUPER JUNCTION MOSFET MARKET, BY APPLICATION

  • 5.1. Overview
    • 5.1.1. Market size and forecast
  • 5.2. Energy and Power
    • 5.2.1. Key market trends, growth factors and opportunities
    • 5.2.2. Market size and forecast, by region
    • 5.2.3. Market share analysis by country
  • 5.3. Consumer Electronics
    • 5.3.1. Key market trends, growth factors and opportunities
    • 5.3.2. Market size and forecast, by region
    • 5.3.3. Market share analysis by country
  • 5.4. Inverter and UPS
    • 5.4.1. Key market trends, growth factors and opportunities
    • 5.4.2. Market size and forecast, by region
    • 5.4.3. Market share analysis by country
  • 5.5. Electric Vehicle
    • 5.5.1. Key market trends, growth factors and opportunities
    • 5.5.2. Market size and forecast, by region
    • 5.5.3. Market share analysis by country
  • 5.6. Industrial System
    • 5.6.1. Key market trends, growth factors and opportunities
    • 5.6.2. Market size and forecast, by region
    • 5.6.3. Market share analysis by country
  • 5.7. Others
    • 5.7.1. Key market trends, growth factors and opportunities
    • 5.7.2. Market size and forecast, by region
    • 5.7.3. Market share analysis by country

CHAPTER 6: SUPER JUNCTION MOSFET MARKET, BY REGION

  • 6.1. Overview
    • 6.1.1. Market size and forecast By Region
  • 6.2. North America
    • 6.2.1. Key market trends, growth factors and opportunities
    • 6.2.2. Market size and forecast, by Type
    • 6.2.3. Market size and forecast, by Application
    • 6.2.4. Market size and forecast, by country
      • 6.2.4.1. U.S.
      • 6.2.4.1.1. Market size and forecast, by Type
      • 6.2.4.1.2. Market size and forecast, by Application
      • 6.2.4.2. Canada
      • 6.2.4.2.1. Market size and forecast, by Type
      • 6.2.4.2.2. Market size and forecast, by Application
      • 6.2.4.3. Mexico
      • 6.2.4.3.1. Market size and forecast, by Type
      • 6.2.4.3.2. Market size and forecast, by Application
  • 6.3. Europe
    • 6.3.1. Key market trends, growth factors and opportunities
    • 6.3.2. Market size and forecast, by Type
    • 6.3.3. Market size and forecast, by Application
    • 6.3.4. Market size and forecast, by country
      • 6.3.4.1. UK
      • 6.3.4.1.1. Market size and forecast, by Type
      • 6.3.4.1.2. Market size and forecast, by Application
      • 6.3.4.2. Gemany
      • 6.3.4.2.1. Market size and forecast, by Type
      • 6.3.4.2.2. Market size and forecast, by Application
      • 6.3.4.3. France
      • 6.3.4.3.1. Market size and forecast, by Type
      • 6.3.4.3.2. Market size and forecast, by Application
      • 6.3.4.4. Rest of Europe
      • 6.3.4.4.1. Market size and forecast, by Type
      • 6.3.4.4.2. Market size and forecast, by Application
  • 6.4. Asia-Pacific
    • 6.4.1. Key market trends, growth factors and opportunities
    • 6.4.2. Market size and forecast, by Type
    • 6.4.3. Market size and forecast, by Application
    • 6.4.4. Market size and forecast, by country
      • 6.4.4.1. China
      • 6.4.4.1.1. Market size and forecast, by Type
      • 6.4.4.1.2. Market size and forecast, by Application
      • 6.4.4.2. Japan
      • 6.4.4.2.1. Market size and forecast, by Type
      • 6.4.4.2.2. Market size and forecast, by Application
      • 6.4.4.3. India
      • 6.4.4.3.1. Market size and forecast, by Type
      • 6.4.4.3.2. Market size and forecast, by Application
      • 6.4.4.4. South Korea
      • 6.4.4.4.1. Market size and forecast, by Type
      • 6.4.4.4.2. Market size and forecast, by Application
      • 6.4.4.5. Rest of Asia-Pacific
      • 6.4.4.5.1. Market size and forecast, by Type
      • 6.4.4.5.2. Market size and forecast, by Application
  • 6.5. LAMEA
    • 6.5.1. Key market trends, growth factors and opportunities
    • 6.5.2. Market size and forecast, by Type
    • 6.5.3. Market size and forecast, by Application
    • 6.5.4. Market size and forecast, by country
      • 6.5.4.1. Latin America
      • 6.5.4.1.1. Market size and forecast, by Type
      • 6.5.4.1.2. Market size and forecast, by Application
      • 6.5.4.2. Middle East
      • 6.5.4.2.1. Market size and forecast, by Type
      • 6.5.4.2.2. Market size and forecast, by Application
      • 6.5.4.3. Africa
      • 6.5.4.3.1. Market size and forecast, by Type
      • 6.5.4.3.2. Market size and forecast, by Application

CHAPTER 7: COMPETITIVE LANDSCAPE

  • 7.1. Introduction
  • 7.2. Top winning strategies
  • 7.3. Product mapping of top 10 player
  • 7.4. Competitive dashboard
  • 7.5. Competitive heatmap
  • 7.6. Top player positioning, 2022

CHAPTER 8: COMPANY PROFILES

  • 8.1. Alpha and Omega Semiconductor
    • 8.1.1. Company overview
    • 8.1.2. Key executives
    • 8.1.3. Company snapshot
    • 8.1.4. Operating business segments
    • 8.1.5. Product portfolio
    • 8.1.6. Business performance
    • 8.1.7. Key strategic moves and developments
  • 8.2. Fuji Electric Co., Ltd.
    • 8.2.1. Company overview
    • 8.2.2. Key executives
    • 8.2.3. Company snapshot
    • 8.2.4. Operating business segments
    • 8.2.5. Product portfolio
    • 8.2.6. Business performance
  • 8.3. IceMOS Technology Ltd.
    • 8.3.1. Company overview
    • 8.3.2. Key executives
    • 8.3.3. Company snapshot
    • 8.3.4. Operating business segments
    • 8.3.5. Product portfolio
    • 8.3.6. Key strategic moves and developments
  • 8.4. Infineon Technologies AG
    • 8.4.1. Company overview
    • 8.4.2. Key executives
    • 8.4.3. Company snapshot
    • 8.4.4. Operating business segments
    • 8.4.5. Product portfolio
    • 8.4.6. Business performance
    • 8.4.7. Key strategic moves and developments
  • 8.5. Magnachip
    • 8.5.1. Company overview
    • 8.5.2. Key executives
    • 8.5.3. Company snapshot
    • 8.5.4. Operating business segments
    • 8.5.5. Product portfolio
    • 8.5.6. Business performance
    • 8.5.7. Key strategic moves and developments
  • 8.6. PANJIT
    • 8.6.1. Company overview
    • 8.6.2. Key executives
    • 8.6.3. Company snapshot
    • 8.6.4. Operating business segments
    • 8.6.5. Product portfolio
    • 8.6.6. Business performance
    • 8.6.7. Key strategic moves and developments
  • 8.7. ROHM Co., Ltd.
    • 8.7.1. Company overview
    • 8.7.2. Key executives
    • 8.7.3. Company snapshot
    • 8.7.4. Operating business segments
    • 8.7.5. Product portfolio
    • 8.7.6. Business performance
    • 8.7.7. Key strategic moves and developments
  • 8.8. STMicroelectronics N.V.
    • 8.8.1. Company overview
    • 8.8.2. Key executives
    • 8.8.3. Company snapshot
    • 8.8.4. Operating business segments
    • 8.8.5. Product portfolio
    • 8.8.6. Business performance
    • 8.8.7. Key strategic moves and developments
  • 8.9. Toshiba Corporation
    • 8.9.1. Company overview
    • 8.9.2. Key executives
    • 8.9.3. Company snapshot
    • 8.9.4. Operating business segments
    • 8.9.5. Product portfolio
    • 8.9.6. Business performance
    • 8.9.7. Key strategic moves and developments
  • 8.10. Vishay Intertechnology, Inc.
    • 8.10.1. Company overview
    • 8.10.2. Key executives
    • 8.10.3. Company snapshot
    • 8.10.4. Operating business segments
    • 8.10.5. Product portfolio
    • 8.10.6. Business performance
    • 8.10.7. Key strategic moves and developments
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