![]() |
½ÃÀ庸°í¼
»óǰÄÚµå
1538913
¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀå-À¯Çüº°, ÃÖÁ¾ ¿ëµµº° : ±âȸ ºÐ¼® ¹× »ê¾÷ ¿¹Ãø(2024-2033³â)Thermoset Molding Compound Market By Type, By End-Use : Global Opportunity Analysis and Industry Forecast, 2024-2033 |
¿°æÈ¼º ¼ºÇü Àç·á(Thermoset Molding Compound) ½ÃÀå ±Ô¸ð´Â 2023³â¿¡ 117¾ï ´Þ·¯·Î Æò°¡µÇ¾ú°í, 2024³âºÎÅÍ 2033³â¿¡ °ÉÃÄ CAGR 6.3%·Î ¼ºÀåÇÏ¿© 2033³â¿¡´Â 215¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ°í ÀÖ½À´Ï´Ù.
¿°æÈ¼º ¼ºÇü Àç·á´Â ¿°ú ¾Ð·ÂÀ» °¡ÇÏ¿© °íü Á¦Ç°À» ¼ºÇüÇÏ´Â Á¦Á¶ °øÁ¤¿¡¼ »ç¿ëµÇ´Â Àç·áÀÇ ±×·ìÀ» ÀǹÌÇÕ´Ï´Ù. ÀÌ·¯ÇÑ Àç·á´Â ¼ºÇü Áß¿¡ ÈÇÐ ¹ÝÀÀÀ» ÀÏÀ¸ÄÑ µ¹ÀÌų ¼ö ¾ø´Â °æÈ¸¦ ÀÏÀ¸Åµ´Ï´Ù. ¿°æÈ¼º ¼ºÇü Àç·á´Â ¿¡Æø½Ã ¼öÁö, Æä³î ¼öÁö, Æú¸®¿¡½ºÅ׸£ ¼öÁö µîÀ» Æ÷ÇÔÇϸç, °¢°¢ ÃÖÁ¾ ¿ëµµ¿¡ ÇÊ¿äÇÑ Æ¯Á¤ ±â°èÀû, ¿Àû, Àü±âÀû Ư¼º¿¡ µû¶ó ¼±Åõ˴ϴÙ. ¿°æÈ¼º ¼ºÇü Àç·á´Â ³»±¸¼º, ³»¿¼º, Ä¡¼ö ¾ÈÁ¤¼ºÀ¸·Î ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, ÀüÀÚ, °ÇÃà µî »ê¾÷¿¡¼ »ç¿ëµË´Ï´Ù.
Àü±âÀÚµ¿Â÷(EV), ½ÅÀç»ý¿¡³ÊÁö½Ã½ºÅÛ, ½º¸¶Æ®±â¼ú¿¡ ´ëÇÑ µ¿ÇâÀº Àü±â ¹× ÀüÀÚ¿ëµµ¿¡¼ ¿°æÈ¼º ¼ºÇü Àç·á ¼ö¿ä¸¦ ´õ¿í ÃËÁøÇÕ´Ï´Ù. ÀÌ·¯ÇÑ »ê¾÷ÀÌ Áö¼ÓÀûÀ¸·Î ¼ºÀåÇÔ¿¡ µû¶ó ¾ö°ÝÇÑ »ç¿ë Á¶°Ç ÇÏ¿¡¼ °í¼º´É, ³ôÀº ½Å·Ú¼º ¹× ±ä ¼ö¸íÀ» ½ÇÇöÇϴ ÷´Ü Àç·á¿¡ ´ëÇÑ ¿ä±¸°¡ Ä¿Áö°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¸ðµç ¿äÀεéÀº ¿¹Ãø ±â°£ µ¿¾È ¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀå ¼ö¿ä¸¦ ÃËÁøÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
¿°æÈ¼º ¼ºÇüÀç·áÀÇ »ý»ê¿¡´Â ȯ°æ¡¤¾ÈÀü±ÔÁ¦ÀÇ ¾ö°ÝÇÑ Áؼö°¡ ÇÊ¿äÇϰí, ÄÄÇöóÀ̾𽺠´ëÃ¥À̳ª Æó±â¹° °ü¸® ½Ã½ºÅÛ¿¡ ´ëÇÑ ÅõÀÚ°¡ ÇÊ¿äÇÕ´Ï´Ù. ÀÌ ÄÄÇöóÀ̾𽺠ºñ¿ëÀº »ó´çÇϸç Áö¿ª¿¡ µû¶ó ´Ù¸£¹Ç·Î Á¦Á¶¾÷ü°¡ »ý»ê ½Ã¼³À» ¼³¸³ÇÏ´Â À§Ä¡¿¡ ¿µÇâÀ» ¹ÌĨ´Ï´Ù. ¶ÇÇÑ Ãʱ⠺ñ¿ëÀÇ ³ôÀÌ´Â ¼Ò±Ô¸ð Á¦Á¶¾÷ü³ª ½ÅÈï ±â¾÷¿¡ ºÒ±ÕÇüÇÑ ¿µÇâÀ» ÁÖ¾î ½ÃÀå ÁøÀÔÀ̳ª »ç¾÷ È®´ë¸¦ ¹æÇØÇÕ´Ï´Ù. ÀÌ·¯ÇÑ ÁøÀÔÀ庮Àº »ê¾÷ ³» °æÀï°ú Çõ½ÅÀ» Á¦ÇÑÇÏ°í ½ÃÀå Àüü ¼ºÀå°ú ±â¼ú Áøº¸¸¦ ´ÊÃß°í ÀÖ½À´Ï´Ù.
ÀçȰ¿ë ±â¼úÀÇ ¹ßÀüÀ¸·Î ¿°¡¼Ò¼º ÇÃ¶ó½ºÆ½¿¡ ºñÇØ Á¦ÇÑÀûÀ̱â´Â ÇÏÁö¸¸ ¿°æÈ¼º ¼ºÇü Àç·áÀÇ Àç°¡°øÀÌ °¡´ÉÇØÁ³½À´Ï´Ù. ºÐ¼â, ¿ºÐÇØ ¶Ç´Â ÈÇÐÀû ÀçȰ¿ë°ú °°Àº ±â¼úÀ» ÅëÇØ ±ÍÁßÇÑ ¼ººÐÀ» ȸ¼öÇϰųª °æÈµÈ ¿°æÈ¼º ¼ÒÀ縦 2Â÷ Á¦Ç°À¸·Î ÀüȯÇÏ¿© Æó±â¹° ¹× ¸Å¸³Áö ºÎ´ãÀ» ÁÙÀÏ ¼ö ÀÖ´Â ¹æ¹ýÀÌ ¸ð»öµÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ, ±ÔÁ¦ ÇÁ·¹ÀÓ¿öÅ©¿Í ¼ÒºñÀÚ ¼±È£µµ´Â Áö¼Ó °¡´ÉÇϰí ȯ°æÀûÀ¸·Î Ã¥ÀÓ°¨ ÀÖ´Â Á¦Ç°À» Á¡Á¡ ´õ ¼±È£Çϰí ÀÖ½À´Ï´Ù. ¿°æÈ¼º ¼ºÇü Àç·áÀÇ Áö¼Ó °¡´É¼º ÀÎÁõÀ» °ÈÇϱâ À§ÇØ ¿¬±¸ °³¹ß¿¡ ÅõÀÚÇÏ´Â ±â¾÷Àº °æÀï ¿ìÀ§¸¦ È®º¸Çϰí ģȯ°æ ´ë¾È¿¡ ´ëÇÑ ÁøÈÇÏ´Â ½ÃÀå ¼ö¿ä¸¦ ÃæÁ·ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¸ðµç ¿äÀÎÀº ¿¹Ãø ±â°£ µ¿¾È ¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀå¿¡ »õ·Î¿î ¼ºÀå ±âȸ¸¦ Á¦°øÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀåÀº À¯Çü, ÃÖÁ¾ ¿ëµµ, Áö¿ªÀ¸·Î ±¸ºÐµË´Ï´Ù. À¯Çüº°·Î ½ÃÀåÀº Æä³î ¼öÁö, ¿¡Æø½Ã ¼öÁö, Æú¸® ¿¡½ºÅ׸£ ¼öÁö, ¿ä¼Ò Æ÷¸§¾Ëµ¥È÷µå, ¸á¶ó¹Î Æ÷¸§ ¾Ëµ¥È÷µå µîÀ¸·Î ³ª´¹´Ï´Ù. ÃÖÁ¾ ¿ëµµº°·Î ½ÃÀåÀº ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, Àü±â ¹× ÀüÀÚ, ±âŸ·Î ±¸ºÐµË´Ï´Ù. Áö¿ªº°·Î ½ÃÀåÀº ºÏ¹Ì, À¯·´, ¾Æ½Ã¾Æ ÅÂÆò¾ç, LAMEA·Î ¼¼ºÐÈ µÇ¾î ºÐ¼®µË´Ï´Ù.
À¯Çüº°·Î ½ÃÀåÀº Æä³î ¼öÁö, ¿¡Æø½Ã ¼öÁö, Æú¸® ¿¡½ºÅ׸£ ¼öÁö, ¿ä¼Ò Æ÷¸§¾Ëµ¥È÷µå, ¸á¶ó¹Î Æ÷¸§ ¾Ëµ¥È÷µå µîÀ¸·Î ³ª´¹´Ï´Ù. Æä³î ¼öÁö ºÎ¹®Àº 2023³â ¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀå Á¡À¯À²ÀÇ 3ºÐÀÇ 1 ÀÌ»óÀ» Â÷ÁöÇϸç, ¿¹Ãø ±â°£ µ¿¾È¿¡µµ ¿ìÀ§¸¦ À¯ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ºñ¿ë È¿°ú´Â ¿°æÈ¼º ¼ºÇü Àç·á¿¡ Æä³î ¼öÁö°¡ äÅõǴ Áß¿äÇÑ ¿ä¼ÒÀÔ´Ï´Ù. ´Ù¸¥ °í¼º´É ¼öÁö¿¡ ºñÇØ Æä³î ¼öÁö´Â Á¦Á¶¾÷ü¿¡°Ô ¸Å·ÂÀûÀÎ ºñ¿ë°ú ¼º´ÉÀÇ ±ÕÇüÀ» Á¦°øÇÕ´Ï´Ù. Æä³î ¼öÁö´Â ºñ±³Àû Àúºñ¿ëÀ¸·Î Á¦Á¶ÇÒ ¼ö ÀÖ°í, ¶ÇÇÑ ¼º´ÉÀÌ ³ô±â ¶§¹®¿¡ °æÁ¦ÀûÀ¸·Î ½ÇÇà °¡´ÉÇÑ °íǰÁúÀÇ ºÎǰÀ» Á¦Á¶ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ ºñ¿ë ¿ìÀ§¿Í ³»±¸¼º°ú ¼º´ÉÀ¸·Î Æä³î ¼öÁö´Â ½ÃÀå¿¡¼ °æÀï·ÂÀÖ´Â ¿É¼ÇÀÌ µÇ¾ú½À´Ï´Ù.
½ÃÀåÀº ÃÖÁ¾ ¿ëµµº°·Î ÀÚµ¿Â÷, Ç×°ø¿ìÁÖ, Àü±â ¹× ÀüÀÚ, ±âŸ·Î ±¸ºÐµË´Ï´Ù. Àü±â ¹× ÀüÀÚ ºÐ¾ß´Â 2023³â ¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀå Á¡À¯À²ÀÇ Àý¹Ý ÀÌÇϸ¦ Â÷ÁöÇϰí ÀÖÀ¸¸ç, ¿¹Ãø ±â°£ µ¿¾È¿¡µµ ±× ¿ìÀ§¼ºÀ» À¯ÁöÇÒ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù. 5G, Àü±âÀÚµ¿Â÷(EV), ½º¸¶Æ® µð¹ÙÀ̽º µî ÷´Ü±â¼úÀÇ ´ëµÎµµ ¿°æÈ¼º ¼ºÇü Àç·á ¼ö¿ä¸¦ ¹Ð¾î ¿Ã¸®°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ±â¼úÀº °í¿Â¿¡ °ßµð°í ÈÇй°Áú¿¡ ³ëÃâÀ» °ßµð¸ç Àå±âÀûÀÎ ½Å·Ú¼ºÀ» Á¦°øÇÏ´Â ºÎǰÀÌ ÇÊ¿äÇÕ´Ï´Ù. ¿°æÈ¼º Àç·á´Â ¿ ¾ÈÁ¤¼º, ³»ÈÇмº ¹× ³»±¸¼ºÀ¸·Î ÀÎÇØ ÀÌ·¯ÇÑ ¿ä±¸ »çÇ×ÀÇ ±î´Ù·Î¿î ¿ëµµ¿¡ ÀûÇÕÇÕ´Ï´Ù. ¿¹¸¦ µé¾î, Àü±âÀÚµ¿Â÷´Â ¸ðÅÍ ºÎǰ, ¹èÅ͸® ÄÉÀ̽Ì, ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ¿°æÈ¼º ¼ºÇü Àç·á¸¦ »ç¿ëÇϰí ÀÖÀ¸¸ç, ³ôÀº ¼º´ÉÀÌ ÀÚµ¿Â÷ ÀüüÀÇ È¿À²¼º°ú ¾ÈÀü¼º¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù.
Áö¿ªº°·Î º¼ ¶§ ½ÃÀåÀº ºÏ¹Ì, À¯·´, ¾Æ½Ã¾Æ ÅÂÆò¾ç, ³²¹Ì, Áßµ¿, ¾ÆÇÁ¸®Ä«·Î ¼¼ºÐÈ µÇ¾î ºÐ¼®µË´Ï´Ù. ¾Æ½Ã¾Æ ÅÂÆò¾çÀº 2023³â ¿°æÈ¼º ¼ºÇü Àç·á ½ÃÀå Á¡À¯À²ÀÇ Àý¹Ý ÀÌÇϸ¦ Â÷ÁöÇϸç, ¿¹Ãø ±â°£ µ¿¾È¿¡µµ ¿ìÀ§¸¦ À¯ÁöÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¾Æ½Ã¾Æ ÅÂÆò¾ç ±¹°¡ÀÇ ±Þ¼ÓÇÑ µµ½ÃÈ¿Í ÀÎÇÁ¶ó Á¤ºñ´Â ¿°æÈ¼º ¼ºÇü Àç·á ¼ö¿ä¸¦ ÃËÁøÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Àç·á´Â °¡È¤ÇÑ È¯°æ Á¶°ÇÀ» °ßµð´Â Àü±â Àý¿¬Ã¼, ÆÄÀÌÇÁ, ±¸Á¶ ºÎǰ µî ³»±¸¼º ÀÖ´Â ºÎǰÀ» Á¦Á¶ÇÏ´Â °Ç¼³ ÀÀ¿ë ºÐ¾ß¿¡¼ ¸Å¿ì Áß¿äÇÕ´Ï´Ù. ¶ÇÇÑ, dz·Â Åͺó°ú žç ÀüÁöÆÇ°ú °°Àº Àç»ý °¡´É ¿¡³ÊÁö ÀÎÇÁ¶ó¿¡ ´ëÇÑ ÅõÀÚ Áõ°¡´Â ¿°æÈ¼º Àç·á ¼ö¿ä¸¦ ÃËÁøÇÕ´Ï´Ù.
ÁÖ¿ä Á¶»ç °á°ú
ÀÌ º¸°í¼¿¡¼ °¡´ÉÇÑ ¸ÂÃã¼³Á¤(Ãß°¡ ºñ¿ë ¹× ±â°£ ÇÊ¿ä)
The global thermoset molding compound market size was valued at $11.7 billion in 2023, and is projected to reach $21.5 billion by 2033, growing at a CAGR of 6.3% from 2024 to 2033.
Thermoset molding compounds refer to a class of materials used in manufacturing processes where heat and pressure are applied to shape and form a solid product. These materials undergo a chemical reaction during molding that irreversibly cures them into a hardened state. Thermoset molding compounds include epoxy resins, phenolic resins, and polyester resins, each chosen for specific mechanical, thermal, or electrical properties required for the end application. Thermoset molding compounds are used in industries such as automotive, aerospace, electronics, and construction due to their durability, heat resistance, and dimensional stability.
The trend towards electric vehicles (EVs), renewable energy systems, and smart technologies has further boosted the demand for thermoset molding compounds in electrical and electronic applications. As these industries continue to grow, there is an increase in the need for advanced materials that deliver high performance, reliability, and longevity under demanding operating conditions. All these factors are expected to drive the demand for thermoset molding compound market during the forecast period.
The production of thermoset molding compounds requires stringent adherence to environmental and safety regulations, necessitating investments in compliance measures and waste management systems. This compliance cost is substantial and varies across different regions, influencing where manufacturers choose to establish their production facilities. In addition, the high initial costs impact smaller manufacturers and startups disproportionately, limiting their ability to enter the market or expand operations. This barrier to entry restricts competition and innovation within the industry, slowing overall market growth and technological advancement.
Advancements in recycling technologies are enabling the reprocessing of thermoset molding compounds, albeit to a limited extent compared to thermoplastics. Techniques such as grinding, pyrolysis, or chemical recycling are being explored to recover valuable components or convert cured thermoset materials into secondary products, reducing waste and landfill burdens. Moreover, regulatory frameworks and consumer preferences increasingly favor sustainable and environmentally responsible products. Companies investing in research and development to enhance the sustainability credentials of their thermoset molding compounds gain competitive advantages and meet evolving market demands for greener alternatives. All these factors are anticipated to offer new growth opportunities for the thermoset molding compound market during the forecast period.
The thermoset molding compound market is segmented into type, end-use, and region. On the basis of type, the market is divided into phenolic resin, epoxy resin, polyester resin, urea formaldehyde, melamine formaldehyde, and others. By end-use, the market is segmented into automotive, aerospace, electrical and electronics, and others. Region-wise, the market is analyzed across North America, Europe, Asia-Pacific and LAMEA.
On the basis of type, the market is divided into phenolic resin, epoxy resin, polyester resin, urea formaldehyde, melamine formaldehyde, and others. The phenolic resin segment accounted for more than one-third of the thermoset molding compound market share in 2023 and is expected to maintain its dominance during the forecast period. Cost-effectiveness is a crucial factor contributing to the adaption of phenolic resins in thermoset molding compounds. Compared to other high-performance resins, phenolic resins offer a balance of cost and performance that is attractive to manufacturers. Their relatively low cost of production, coupled with their robust performance attributes, allows for the production of economically viable and high-quality components. This cost advantage, along with their durability and performance, makes phenolic resins a competitive option in the market.
By end-use, the market is segmented into automotive, aerospace, electrical and electronics, and others. The electrical and electronics segment accounted for less than half of the thermoset molding compound market share in 2023 and is expected to maintain its dominance during the forecast period. The rise of advanced technologies such as 5G, electric vehicles (EVs), and smart devices is also propelling the demand for thermoset molding compounds. These technologies require components that withstand high temperatures, resist chemical exposure, and provide long-term reliability. Thermoset materials are well-suited for these demanding applications due to their thermal stability, chemical resistance, and durability. For instance, in electric vehicles, thermoset compounds are used in motor components, battery casings, and power electronics, where their high performance contributes to the overall efficiency and safety of the vehicle.
Region-wise, the market is analyzed across North America, Europe, Asia-Pacific and LAMEA. Asia-Pacific accounted for less than half of the thermoset molding compound market share in 2023 and is expected to maintain its dominance during the forecast period. Rapid urbanization and infrastructure development across Asia-Pacific countries are fueling demand for thermoset molding compounds. These materials are crucial in construction applications for manufacturing durable components such as electrical insulators, pipes, and structural parts that withstand harsh environmental conditions. Furthermore, increases in investments in renewable energy infrastructure such as wind turbines and solar panels are boosting the demand for thermoset materials.
Key players in the thermoset molding compound market include BASF SE, Rebling, SBHPP, Huntsman Corporation, Kyocera Corporation, Evonik Industries AG, Kolon Industries Inc., Plastics Engineering Company (PLENCO), HEXION INC., and Eastman Chemical Company.
Key findings of the study
Additional benefits you will get with this purchase are:
Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)