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Global Wafer Substrate Market 2024

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LSH 24.05.17

The Wafer Substrate market is poised for remarkable growth, projected to surpass USD 25 billion by 2030, with a compelling CAGR of approximately 6.5% from a value of USD 15 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Wafer Substrate.

This report provides a deep dive into the following points in this detailed assessment of Wafer Substrate Market:

Product Overview

Overview of key materials used as wafer substrate:

  • Silicon
  • Silicon Carbide
  • Gallium Arsenide
  • Gallium Nitride, etc.

Global Wafer Substrate Market Overview

Insight into the current (2022) and forecasted (2030) global market for Wafer Substrate including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Silicon, Silicon Carbide, Gallium Arsenide, Gallium Nitride, etc.,

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Purity, Defect Rate, Cost per chip, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Sumco, Siltronic, SK Siltron, Episil Precision, Soitec, etc.

Patent overview:

Analyzing about 15+ patent families by key assignees in the last 4-5 years. Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

  • 1.1 Report Overview
  • 1.2 Product Focus
  • 1.3 Methodology

2. Process Overview

  • 2.1 Thin Film Molding
  • 2.2 Photolithography
  • 2.3 Etching
  • 2.4 Doping
  • 2.5 CMP
  • 2.6 Dicing
  • 2.7 Wire Bonding
  • 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

  • 5.1 Wafer Substrate

5. Patent Overview

6. Market Outlook

7. Annexure

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