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Global CMP Materials Market 2024

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LSH 24.05.17

The Chemical Mechanical Planarization (CMP) materials market is poised for remarkable growth, projected to surpass USD 6.5 billion by 2030, with a compelling CAGR of approximately 8% from a value of USD 3.7 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for CMP materials.

This report provides a deep dive into the following points in this detailed assessment of materials for Chemical Mechanical Planarization:

Product Overview

Defining the major components used in CMP:

  • CMP Pads
  • CMP Slurries

Global Chemical Mechanical Planarization Market Overview

Insight on current (2022) and forecasted (2030) global market for CMP materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used ; Polymers, Metals, Ceramics, etc.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Polishing and Removal rate, Planarity, and Uniformity

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including 3M, Dow, Merck, Resonac, DuPont, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

  • 1.1 Report Overview
  • 1.2 Product Focus
  • 1.3 Methodology

2. Process Overview

  • 2.1 Thin Film Molding
  • 2.2 Photolithography
  • 2.3 Etching
  • 2.4 Doping
  • 2.5 CMP
  • 2.6 Dicing
  • 2.7 Wire Bonding
  • 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

  • 5.1 Materials for CMP (Slurries & pads)

5. Patent Overview

6. Market Outlook

7. Annexure

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