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Microelectromechanical Systems (MEMS) Technology: Current and Future Markets

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  • AMPHENOL CORP.
  • ADOLF WURTH GMBH & CO.
  • ANALOG DEVICES INC.
  • BROADCOM INC.
  • GOERTEK INC.
  • HONEYWELL INTERNATIONAL INC.
  • INFINEON TECHNOLOGIES AG
  • KNOWLES CORP.
  • MEMSIC SEMICONDUCTOR(WUXI) CO. LTD.
  • MURATA MANUFACTURING CO. LTD.
  • NXP SEMICONDUCTORS N.V.
  • QORVO INC.
  • ROBERT BOSCH GMBH
  • SAFRAN S.A.
  • SENSATA TECHNOLOGIES INC.
  • SILICON SENSING SYSTEMS LTD.
  • SITIME CORP.
  • STMICROELECTRONICS N.V.
  • TDK CORP.
  • TE CONNECTIVITY LTD.
  • TEXAS INSTRUMENTS INC.

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KSM 23.10.04

Highlights:

The global microelectromechanical systems (MEMS) technology market should reach $41.5 billion by 2028 from $28.5 billion in 2023 at a compound annual growth rate (CAGR) of 7.8% for the forecast period of 2023 to 2028.

North American MEMS technology market is expected to grow from $9.0 billion in 2023 to $13.2 billion in 2028 at a CAGR of 7.9% for the forecast period of 2023 to 2028.

Asia-Pacific MEMS technology market is expected to grow from $11.0 billion in 2023 to $16.7 billion in 2028 at a CAGR of 8.7% for the forecast period of 2023 to 2028.

Report Scope:

In this report, the MEMS market was segmented by device type, application and region. The report provides an overview of the global MEMS market and analyzes market trends. Using 2022 as the base year, the report provides estimated market data for the forecast period, 2023 through 2028.

Revenue forecasts for this period are segmented into -

  • Device Type: sensors and actuators.
  • Application: automotive, consumer electronics, defense/aerospace, industrial, life science, telecom/communications and others.
  • Region: North America is segmented into the U.S., Canada and Mexico; Europe is segmented into the UK, France, Germany and Rest of Europe; Asia-Pacific (APAC) is segmented into China, Japan, India and Rest of Asia-Pacific; Rest of the World is segmented into Middle East, Africa and Latin America.

This report was prepared in a simple, easy-to-understand format, with a number of tables and charts/figures. The scope of the report includes a detailed study of global and regional markets for MEMS, with reasons given for variations in the growth of the industry in certain regions. The report examines each component of MEMS technology, determines current market size and estimates its future market. The report also analyzes the market from the manufacturers' viewpoint, as well as that of the final consumer. A number of technical issues arising from MEMS technologies are discussed and solutions are indicated.

Report Includes:

  • 37 data tables and 28 additional tables
  • An overview of the current and future global market for microelectromechanical systems (MEMS) technology
  • An estimate of the market size and analyses of market trends, with data from 2022, estimates for 2023 and projection of CAGRs through 2028
  • A discussion of the market potential for MEMS technology based on device type, application and region
  • An analysis of the market dynamics, including growth drivers, inhibitors and opportunities, and insights into the regulatory environments impacting the market
  • Examinations of ESG developments; a patent activity; mergers and acquisitions (M&A) and venture fundings; and emerging MEMS technologies
  • Profile descriptions of the leading market players in the market of the industry, including Amphenol Corp., GoerTek Inc., Knowles Corp., NXP Semiconductors N.V. and Sensata Technologies Inc.

Table of Contents

Chapter 1 Introduction

  • Study Goals and Objectives
  • Reasons for Doing the Study
  • Scope of Report
  • What's New in This Update?
  • Research Methodology
  • Information Sources
  • Geographic Breakdown

Chapter 2 Summary and Highlights

  • Market Outlook
  • Market Summary and Highlights

Chapter 3 Market Overview

  • Overview
  • MEMS Manufacturing Technologies
  • Micromachining
  • Etching
  • Laser Microfabrication
  • Powder Blasting
  • Micro-molding
  • Hot Embossing Lithography (HEL)
  • Computer Aided Design (CAD)
  • MEMS Packaging
  • Value Chain Analysis
  • Research and Development (R&D)
  • Design and Simulation
  • Fabrication and Manufacturing
  • Packaging and Assembly
  • Testing and Quality Control
  • Distribution and Sales
  • Integration into End Products
  • End Users
  • Porter's Five Forces Analysis
  • Threat of New Entrants
  • Bargaining Power of Suppliers
  • Bargaining Power of Buyers
  • Threat of Substitutes
  • Intensity of Competitive Rivalry

Chapter 4 Market Dynamics

  • Overview
  • Market Drivers
  • High Adoption Rate of MEMS, Consumer Electronics Devices
  • Rising Popularity of Internet of Things (IoT) in Manufacturing Industry
  • Market Challenges
  • Lack of Standardized Fabrication Processes for MEMS
  • Substitution of MEMS, by Nano Electromechanical Systems (NEMS)
  • Market Opportunities
  • High Growth in Automotive Applications
  • Rising Use of Radio Frequency (RF) MEMS

Chapter 5 Market Breakdown by Material

  • Overview
  • Silicon
  • Polymer
  • Metals

Chapter 6 Market Breakdown by Device Type

  • Overview
  • Sensors
  • Inertial Sensors
  • Pressure Sensors
  • Microphones
  • Environmental Sensors
  • Optical Sensors
  • Other Sensor Types
  • Actuators
  • Optical Actuators
  • Microfluidics
  • Radio Frequency (RF)
  • Other Actuator Types

Chapter 7 Market Breakdown by Application

  • Overview
  • Consumer Electronics
  • Automotive
  • Life Sciences
  • Industrial
  • Others

Chapter 8 Market Breakdown by Region

  • Overview
  • North American Market Outlook
  • European Market Outlook
  • Asia-Pacific (APAC) Market Outlook
  • Rest of the World Market Outlook

Chapter 9 Environmental, Social and Governance (ESG) Developments

  • Overview
  • ESG Performance in MEMS Market
  • Environmental Impact
  • Social Responsibility
  • Governance
  • Current Status of ESG in the MEMS Market
  • Consumer Attitudes Towards ESG in MEMS Market
  • Case Study
  • Concluding Remarks from BCC

Chapter 10 Emerging Technologies and Developments

  • Overview
  • Key Emerging Trends/Technologies for MEMS
  • Miniaturization
  • Next-Generation Micromirrors
  • Biosensors/Bioinformatics
  • Nanomaterials in MEMS
  • Development of MEMS Technology

Chapter 11 Patent Review and New Developments

  • Overview
  • Recently Granted Patents (Dec. 2022-Jan. 2023)

Chapter 12 M&A and Venture Funding Outlook

  • Overview
  • M&A Analysis
  • Venture Capital Fundings in MEMS Industry

Chapter 13 Competitive Landscape

  • Overview
  • Players Market Share Analysis
  • MEMS Foundry Services
  • Strategic Analysis

Chapter 14 Company Profiles

  • AMPHENOL CORP.
  • ADOLF WURTH GMBH & CO.
  • ANALOG DEVICES INC.
  • BROADCOM INC.
  • GOERTEK INC.
  • HONEYWELL INTERNATIONAL INC.
  • INFINEON TECHNOLOGIES AG
  • KNOWLES CORP.
  • MEMSIC SEMICONDUCTOR (WUXI) CO. LTD.
  • MURATA MANUFACTURING CO. LTD.
  • NXP SEMICONDUCTORS N.V.
  • QORVO INC.
  • ROBERT BOSCH GMBH
  • SAFRAN S.A.
  • SENSATA TECHNOLOGIES INC.
  • SILICON SENSING SYSTEMS LTD.
  • SITIME CORP.
  • STMICROELECTRONICS N.V.
  • TDK CORP.
  • TE CONNECTIVITY LTD.
  • TEXAS INSTRUMENTS INC.

Chapter 15 Appendix: Acronyms

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