½ÃÀ庸°í¼­
»óǰÄÚµå
1400609

EMI/RFI : Àç·á ¹× ±â¼ú

EMI/RFI: Materials and Technologies

¹ßÇàÀÏ: | ¸®¼­Ä¡»ç: BCC Research | ÆäÀÌÁö Á¤º¸: ¿µ¹® 255 Pages | ¹è¼Û¾È³» : Áï½Ã¹è¼Û

    
    
    



¡Ø º» »óǰÀº ¿µ¹® ÀÚ·á·Î Çѱ۰ú ¿µ¹® ¸ñÂ÷¿¡ ºÒÀÏÄ¡ÇÏ´Â ³»¿ëÀÌ ÀÖÀ» °æ¿ì ¿µ¹®À» ¿ì¼±ÇÕ´Ï´Ù. Á¤È®ÇÑ °ËÅ並 À§ÇØ ¿µ¹® ¸ñÂ÷¸¦ Âü°íÇØÁֽñ⠹ٶø´Ï´Ù.

¼¼°èÀÇ EMI/RFI Àç·á ¹× ±â¼ú ½ÃÀå ±Ô¸ð´Â 2023³â 74¾ï ´Þ·¯¿¡¼­ ¿¹Ãø ±â°£ Áß 4.6%ÀÇ CAGR·Î ÃßÀÌÇϸç, 2028³â¸»¿¡´Â 92¾ï ´Þ·¯ ±Ô¸ð·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Àüµµ¼º ÄÚÆÃ ºÎ¹®Àº 2023³â 28¾ï ´Þ·¯¿¡¼­ 3.6%ÀÇ CAGR·Î ÃßÀÌÇϸç, 2028³â¸»¿¡´Â 33¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ ¶ó¹Ì³×ÀÌÆ®/Å×ÀÌÇÁ/Æ÷ÀÏ ºÎ¹®Àº 2023³â 4¾ï 3,450¸¸ ´Þ·¯¿¡¼­ 5.8%ÀÇ CAGR·Î ÃßÀÌÇϸç, 2028³â¸»¿¡´Â 5¾ï 7,510¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ°í ÀÖ½À´Ï´Ù.

¼¼°èÀÇ EMI/RFI Àç·á ¹× ±â¼ú ½ÃÀåÀ» Á¶»çÇßÀ¸¸ç, ½ÃÀåÀÇ Á¤ÀÇ¡¤°³¿ä, ½ÃÀå ¿µÇâ¿äÀÎ ¹× ½ÃÀå ±âȸÀÇ ºÐ¼®, ½Çµå ¸ÞÄ¿´ÏÁò, ½Çµå ±â¼ú¡¤Àç·áÀÇ µ¿Çâ, ½ÃÀå ±Ô¸ðÀÇ ÃßÀÌ¡¤¿¹Ãø, °¢Á¾ ±¸ºÐ¡¤Áö¿ªº° »ó¼¼ ºÐ¼®, ESG µ¿Çâ, °æÀï ±¸µµ, ÁÖ¿ä ±â¾÷ÀÇ °³¿ä µîÀ» Á¤¸®ÇÏ¿© ÀüÇØµå¸³´Ï´Ù.

¸ñÂ÷

Á¦1Àå ¼­·Ð

Á¦2Àå ¿ä¾à¡¤ÇÏÀ̶óÀÌÆ®

  • ½ÃÀå Àü¸Á
  • ¿ä¾à ÇÏÀ̶óÀÌÆ®
  • ½ÃÀå ±Ô¸ð

Á¦3Àå ½ÃÀå °³¿ä

  • °³¿ä
  • EMI/RFI ½ÃÀåÀÌ Á÷¸éÇÏ´Â ÁÖ¿ä °úÁ¦
  • ½ÃÀå¿¡ ¿µÇâÀ» ¹ÌÄ¡´Â °Å½Ã°æÁ¦Àû ¿äÀÎ
  • °æÁ¦¼ºÀå°ú ÆÒµ¥¹Í ÈÄ ½ÃÀå¿¡ ´ëÇÑ ¿µÇâ
  • ÀüÀÚÀû ÄÄÇöóÀ̾ð½º
  • ÀüÀÚ ±Ô°Ý
  • EMC ±Ô°Ý/±ÔÁ¦ÀÇ ¸ñÀû
  • ±âº» °³³ä
  • ÄÄÇöóÀ̾𽺠Å×½ºÆ®¿Í ÀÎÁõ
  • ±ÔÁ¦ ¹× Ç¥ÁØÈ­ ±â°ü°ú Áöħ
  • FCC ¿ä°Ç
  • ±âŸ ȯ°æ ±ÔÁ¦
  • Extended EMC ±ÔÁ¦

Á¦4Àå ½ÃÀå ¿ªÇÐ

  • ½ÃÀå ÃËÁø¿äÀÎ
  • Åë½Å ³×Æ®¿öÅ©ÀÇ Áøº¸¿¡ ÀÇÇØ EMI/RFI ½Çµå ¼ö¿ä°¡ Áõ°¡ Àü¸Á
  • ¹æÀ§¡¤Ç×°ø¿ìÁÖ¿ë EMI/RFI ½Çµå ¼Ö·ç¼Ç
  • ÀÇ·á±â±â¿ë EMI/RFI ½Çµå¿¡ ´ëÇÑ ¼ö¿äÀÇ Áõ°¡
  • Àü±âÀÚµ¿Â÷ÀÇ º¸±Þ°ú Â÷·® ±Ùó ÀüÀÚ ÄÁÅÙÃ÷ÀÇ ºñÀ² Áõ°¡
  • ½ÃÀåÀÌ ÇØ°áÇØ¾ß ÇÒ °úÁ¦
  • ´Ù¾çÇÑ ÀüÀÚ±â±âÀÇ ¼ÒÇüÈ­¿Í EMI/RFI ½Çµå °£ Æ®·¹ÀÌµå ¿ÀÇÁ
  • ÀüÀÚ Á¦Ç°ÀÇ Æó±â¿¡ °üÇÑ È¯°æ ¹®Á¦
  • ¼¼°èÀÇ Å×½ºÆ®¿Í ÀÎÁõÀÇ º¹À⼺
  • ½ÃÀå µ¿Çâ°ú ±âȸ
  • µ¥ÀÌÅͼ¾ÅÍ »óÈ£ Á¢¼ÓÀÇ È®´ë¿¡ ÀÇÇÑ Å¬¶ó¿ìµå ¼­ºñ½º ¼ö¿äÀÇ Áõ°¡
  • ģȯ°æ EMI/RFI Àç·á
  • ÀçȰ¿ë

Á¦5Àå EMI/RFI : ±âº» °³³ä

  • ±âÈ£¡¤¿ë¾î
  • ÀüÀÚ ¿¡³ÊÁö
  • ¹æ»ç¼±
  • Àüµµ
  • ÀÓÇÇ´ø½º
  • Á¤Àü ¹æÀü
  • ÀüÀÚÀå
  • ÀüÀÚÆÄ¡¤¹«¼± Á֯ļö °£¼·
  • Á¤ÀÇ¡¤¹üÀ§

Á¦6Àå ½Çµå ¸ÞÄ¿´ÏÁò

  • °³¿ä
  • ¹è°æ
  • EMI Â÷ÆóÀÇ °³¿ä
  • ½Çµå È¿°ú
  • °¨¼è
  • ÀüÀÚ ÀûÇÕ¼º
  • ÀüÀÚÆÄ Á¦¾î
  • ½Çµå ¼º´É
  • Èí¼ö
  • ¹Ý»çÀ²
  • Åõ°ú¼º
  • °¥¹Ù´Ð ºÎ½Ä°ú ±Ý¼ÓÀÇ ÀûÇÕ¼º
  • ÀüµµÀ²°ú ÀúÇ×À²ÀÇ °ü°è
  • EMI/RFI ¹× Á¤Àü±âÀÇ ¿µÇâ
  • ¹«¼± Á֯ļö ¹üÀ§ÀÇ Á߿伺
  • EMI/RFI ¹é±×¶ó¿îµåÀÇ Á¦¾î

Á¦7Àå ½Çµå ±â¼ú°ú Àç·á

  • °³¿ä
  • ¸ÞÅ»¶óÀÌÁ¦ÀÌ¼Ç ÇÁ·Î¼¼½º : °³¿ä
  • ¸ÞÅ»¶óÀÌÁ¦ÀÌ¼Ç Àç·á
  • ½Çµå È¿°úÀÇ °³¿ä : ÄÚÆÃ À¯Çüº°
  • Àüµµ¼º ÇÃ¶ó½ºÆ½
  • ¹è°æ
  • ¹èÇÕ ¿É¼Ç
  • Àüµµ¼º ÇÃ¶ó½ºÆ½
  • ÇÃ¶ó½ºÆ½ÀÇ À¯Àü Ư¼º
  • ÇÃ¶ó½ºÆ½ÀÌ Àüµµ¼ºÀ» °®°Ô ÇÏ´Â ±â¼ú
  • Àüµµ¼º Àç·áÀÇ À¯Çü
  • ±â´É
  • Àüµµ¼º ÷°¡Á¦ÀÇ ¼±ÅÃ
  • ÀüµµÀ² ½ÃÇè
  • Àüµµ¼º ÇÃ¶ó½ºÆ½ÀÇ ÀåÁ¡¡¤´ÜÁ¡
  • Àüµµ¼º ÇÃ¶ó½ºÆ½ ¹èÇÕ
  • Àüµµ¼º ÇÃ¶ó½ºÆ½ÀÇ Á¦Á¶ ±â¾÷
  • Àüµµ¼º ÇÃ¶ó½ºÆ½ ÷°¡Á¦
  • ź¼Ò³ª³ëÆ©ºê
  • Àüµµ¼º Çʸ§
  • Àüµµ¼º Çʸ§ »ç¾÷ȸ»ç
  • Àüµµ¼º Çʸ§ÀÇ ÃÖ±Ù ¹ßÀü
  • °íÀ¯ Àüµµ¼º Æú¸®¸Ó
  • Æú¸®¾Æ´Ò¸°
  • Àü¸Á
  • ICPÀÇ ÀüµµÀ²°ú ±Ý¼Ó, ¹ÝµµÃ¼, Àý¿¬Ã¼ ÀüµµÀ²ÀÇ ºñ±³
  • ó¸® ¿É¼Ç
  • ÃÖ±Ù EMI Â÷ÆóÀÇ °³¹ß
  • Àüµµ¼º ¿¤¶ó½ºÅä¸Ó
  • EMI °ü·Ã ±â¼ú°ú ¿ëµµ
  • Àüµµ¼º ÄÚÆÃ
  • ¹è°æ
  • Àüµµ¼º ÄÚÆÃÀÇ ¿ëµµ
  • EMI Â÷Æó È­ÇÕ¹°°ú ±âŸ Àüµµ¼º ÄÚÆÃ°úÀÇ ºñ±³
  • Àüµµ¼º ÄÚÆÃÀÇ ¹®Á¦
  • Àüµµ¼º ÄÚÆÃÀÇ ºñ±³
  • ´ëü Àüµµ¼º ÄÚÆÃÀÇ ¼º´É
  • ÀåÁ¡¡¤´ÜÁ¡
  • ÄÚÆÃ ¹ÙÀδõ
  • ¿ëÁ¦ ±â¹Ý Àüµµ¼º ÄÚÆÃ°ú ¼ö¼º Àüµµ¼º ÄÚÆÃÀÇ ºñ±³
  • ±¸¸®, ´ÏÄÌ, ÀºÀÇ »ç¿ë·®
  • Àü±âµµ±Ý ÄÚÆÃ
  • ¹«ÀüÇØ µµ±Ý
  • °³¿ä
  • ½Çµå È¿°úÀÇ ÃøÁ¤
  • ´ÙÀÌ·ºÆ® Ç÷¹ÀÌÆ®
  • ¹«ÀüÇØ µµ±Ý¿¡ Á¾»çÇÏ´Â ±â¾÷
  • ¹«ÀüÇØ µµ±ÝÀÇ È¯°æ ¹®Á¦
  • ±º¿ë »ç¾ç
  • ±âŸ »ç¾ç
  • Áø°ø ÁõÂø
  • ¹è°æ
  • ±â¼ú
  • Àå´ÜÁ¡
  • ¾÷°èÀÇ Å×½ºÆ® ¹æ¹ý
  • Áø°ø ÁõÂø ÇÁ·Î¼¼½º
  • Áø°ø ÁõÂø¿¡ Á¾»çÇÏ´Â ±â¾÷
  • Àüµµ¼º ÄÚÆÃ
  • ±¸¸®
  • Àº
  • ´ÏÄÌ
  • °ü·Ã ±â¼ú
  • ¿ëÁ¦¿Í ¼ö¼ºÀÇ Â÷ÀÌ
  • ÆäÀÎÆ® µÎ²²
  • ±âŸ º¯¼ö
  • Àüµµ¼º ÆäÀÎÆ® µµÆ÷
  • ½Çµå ¼º´É
  • Àüµµ¼º ÆäÀÎÆ® ÇÃ¶ó½ºÆ½
  • Àüµµ¼º ÆäÀÎÆ® ¾÷Á¾ ÁöÁ¤
  • Àüµµ¼º ÆäÀÎÆ® ±â¼ú¿¡¼­ ¾ö¼±µÈ ±â¼úÀû Áøº¸
  • ÇÁ·Î±×·¥À» Áö¿øÇϱâ À§ÇÑ ¼¼°è¿¡ ¾×¼¼½º °¡´ÉÇÑ ÀÎÇÁ¶ó
  • ÀϹÝÀûÀÎ ÆäÀÎÆ® ÇÃ¶ó½ºÆ½
  • ¿ë»ç
  • ±â¼ú
  • ÀåÁ¡¡¤´ÜÁ¡
  • ÇÁ·Î¼¼½ºÀÇ °³¼±
  • ±¹Á¦ ¿ë»ç Çùȸ
  • ¶ó¹Ì³×ÀÌÆ®¡¤±Ý¼ÓÈ­ Æ÷ÀÏ¡¤Å×ÀÌÇÁ
  • Ç÷º¼­ºí Æ÷ÀÏ ¶ó¹Ì³×ÀÌÆ®
  • ±Ý¼Ó Á¢Âø Å×ÀÌÇÁ
  • ÆÐºê¸¯ Å×ÀÌÇÁ
  • Æä¶óÀÌÆ®
  • ¹è°æ
  • ÇÁ·ÎÆÛƼ
  • EMI ¾ïÁ¦¸¦ À§ÇÑ Æä¶óÀÌÆ®ÀÇ ¼±ÅÃ
  • Æä¶óÀÌÆ® Çü»ó°ú ¿ëµµ
  • ¼ÒÇÁÆ® Æä¶óÀÌÆ® ÆÇ¸Å ±â¾÷
  • ÃÖ±Ù °³¹ß
  • ÆÛÆ÷¸Õ½ºÀÇ ºñ±³
  • EMC Â÷Æó¿Í ÃÖÁ¾»ç¿ëÀÚÀÇ ¿ä°Ç

Á¦8Àå ½Çµå ÄÄÆ÷³ÍÆ®

  • °³½ºÅ¶
  • ±â¼ú
  • EMI °³½ºÅ¶À» Æò°¡ÇÒ ¶§ Áß¿äÇÑ ±â´É
  • ÇÁ·ÎÆÛƼ
  • °³½ºÅ¶ À¯ÇüÀÇ ¼±ÅÃ
  • °³½ºÅ¶ À¯Çü : ÀçÁúº°
  • ±â¼úÀû ¹× »ó¾÷Àû °í·Á»çÇ×
  • ¼³Ä¡ ºñ¿ë
  • °íÁÖÆÄ¿ë ½Çµå °³½ºÅ¶
  • Å×½ºÆ®
  • EMI Â÷Æó¿¡¼­ °³½ºÅ¶ÀÇ ¼³°è»ó °í·Á»çÇ×
  • ÇÊÅÍ
  • Ãß°¡ ±â¼ú Á¤º¸
  • ÇÊÅÍ ¼±ÅÃÀÇ °¡À̵å¶óÀÎ
  • ¿ëµµ
  • ¼Õ½ÇÀÌ ¸¹Àº ¼±·Î ¶Ç´Â ºÐ»ê ÇÊÅÍ
  • Ä¿³ØÅÍ¿Í ÄÉÀ̺í
  • ÄÉÀÌºí ±¸Á¶
  • EMI ÄÉÀÌºí ½Çµå ¹× Èí¼öÀç
  • À©µµ¿ìÁî
  • Àç·á
  • ½Çµå ¼º´É
  • Àç·áÀÇ Àå´ÜÁ¡
  • Á¤ºñ¿Í ÆÛÆ÷¸Õ½º ¹®Á¦
  • ¿£Å¬·ÎÀú
  • °úÁ¦
  • ±â¼ú ¹®Á¦
  • ¹Ì°ü
  • °³±¸ºÎÀÇ ½Çµå
  • EMI ´©Ãâ
  • Àå´ÜÁ¡
  • ¿£Å¬·ÎÀú ¼³°è °í·Á»çÇ×
  • EMI¿Í ½Çµå ¿£Å¬·ÎÀúÀÇ ¹®Á¦ : ¿ä¾à
  • °ÇÃà Â÷Æó
  • ¹è°æ
  • ½Çµå ·ë ±¸Á¶ÀÇ À¯Çü
  • ÄÄÆ÷³ÍÆ®
  • ±âŸ ½Çµå ÄÄÆ÷³ÍÆ®
  • Braids
  • Æ÷ÀÏ ½Çµå
  • Á¢ÂøÁ¦

Á¦9Àå EMI/RFI Àç·á ¹× ±â¼ú ½ÃÀå : Á¤·®Àû Ãø¸é

  • °³¿ä
  • EMI/RFI ½Çµå ½ÃÀå : ¹æ¹ýº°
  • º¼·ý
  • °¡Ä¡
  • ±Ý¼Ó ijºñ´Ö ½ÃÀå ¿¹Ãø
  • Àüµµ¼º ÇÃ¶ó½ºÆ½ ½ÃÀå ¿¹Ãø
  • ±âŸ EMI/RFI ½Çµå Á¦Ç° ½ÃÀå ¿¹Ãø

Á¦10Àå ÁÖ¿ä EMI/RFI ½Çµå Á¦Ç°ÀÇ Ãß°¡ ÆÐÅÏ¡¤»ç¿ë¹ý

  • Àüµµ¼º ÄÚÆÃ
  • ¶ó¹Ì³×ÀÌÆ®¿Í Å×ÀÌÇÁ
  • Àüµµ¼º ÇÃ¶ó½ºÆ½ ¹× ¿¤¶ó½ºÅä¸Ó
  • ±âŸ ½Çµå

Á¦11Àå »ê¾÷/½Çµå ÀÎÅÍÆäÀ̽º

  • ÀÏ·ºÆ®·Î´Ð½º »ê¾÷
  • ÀÏ·ºÆ®·Î´Ð½º ¾÷°èÀÇ µ¿Çâ
  • EMI Â÷ÆóÀÇ µ¿Çâ
  • ¿î¼Û
  • ÀÚµ¿Â÷
  • Ç×°ø±â
  • µå·Ð
  • ÇコÄÉ¾î »ê¾÷
  • ÀÇ·á¿ë ÀÓÇöõÆ®ÀÇ ÀáÀçÀû EMI ¹®Á¦
  • ÀÇ·á ¾÷°è¿¡¼­ EMI ¹®Á¦¸¦ ÃÖ¼ÒÇÑÀ¸·Î ¾ïÁ¦Çϱâ À§ÇÑ ³ë·Â
  • º´¿ø¿¡¼­ ÈÞ´ëÆùÀÇ ¸®½ºÅ© ÃÖ¼ÒÈ­¿Í ÀÌÁ¡ ÃÖ´ëÈ­
  • º´¿ø¿¡¼­ ¹«¼± ÀüÀÚ±â±âÀÇ ¿µÇâ
  • º´¿øÀÇ Áß¿äÇÑ EMI ¿¡¾î¸®¾î
  • º´¿ø EMCÀÇ °ü¸®
  • ÀÇ·á±â±â ½Çµå¿¡ »ç¿ëµÇ´Â ¼ÒÀç
  • ÀÇ·á¿ë EMC ±Ô°Ý
  • °¡ÀüÁ¦Ç°
  • °³¿ä
  • EMC ÄÄÇöóÀ̾ð½º
  • ±âŸ ¼ÒºñÀÚ¿ë Á¦Ç°
  • ±º¿ëµµ
  • ³ôÀº °£¼·ÀÇ °¡´É¼º
  • Ãë¾àÇÑ ½Ã½ºÅÛ

Á¦12Àå EMI/RFI Àç·á ¹× ±â¼ú ½ÃÀåÀÇ Áö¼Ó°¡´É¼º

  • ÀÌ»êȭź¼Ò ¹èÃâ·®À» »è°¨Çϱâ À§ÇÑ ÀÏ·ºÆ®·Î´Ð½º ºÐ¾ßÀÇ Áö¼Ó°¡´ÉÇÑ Á¦Á¶
  • EMI/RFI Àç·á ½ÃÀå¿¡¼­ ESGÀÇ Á߿伺
  • ESG Æò°¡¿Í ÁöÇ¥ : µ¥ÀÌÅÍÀÇ ÀÌÇØ
  • EMI/RFI Àç·á ¹× ±â¼ú ½ÃÀå¿¡¼­ ESGÀÇ ÇöȲ
  • ESG ½ºÄÚ¾î ºÐ¼®
  • ESG ¸®½ºÅ© ±Ô¸ð, ÀͽºÆ÷Àú ±Ô¸ð, °ü¸® ±Ô¸ð
  • BCC¿¡ ÀÇÇÑ °á·Ð

Á¦13Àå °æÀï ±¸µµ

  • º¥´õ ºÐ¼®
  • ÁÖ¿ä Àü·«Àû °³¹ß
  • ÃÖ±Ù µ¿Çâ : ÁÖ¿ä ±â¾÷º°

Á¦14Àå ±â¾÷ °³¿ä

  • ÁÖ¿ä ±â¾÷ÀÇ °³¿ä
  • 3M
  • CTS CORP.
  • THE DOW CHEMICAL CO.
  • DUPONT DE NEMOURS INC.
  • HENKEL AG & CO. KGAA
  • LEADER TECH INC.
  • PARKER HANNIFIN CORP.
  • PPG INDUSTRIES INC.
  • RTP CO.
  • SCHAFFNER HOLDING AG
  • Profiles of Other Key Players
  • AD-VANCE MAGNETICS
  • A.K. STAMPING CO. INC.
  • ALCO TECHNOLOGIES
  • AMUNEAL MANUFACTURING CORP.
  • CHANG GU CHUAN TECHNOLOGY CO. LTD.
  • CHANGZHOU PIONEER ELECTRONIC CO. LTD.
  • CHINA EMI SHIELDING MATERIALS CO. LTD.
  • COILCRAFT INC.
  • CYBERSHIELD INC.
  • ELASTOMERIC SPECIALTIES INC.
  • ETS-LINDGREN L.P.
  • FERRONICS INC.
  • FUJIPOLY AMERICA CORP.
  • GREENE RUBBER CO.
  • JINAN EMI SHIELDING TECHNOLOGY CO. LTD.
  • KITAGAWA INDUSTRIES AMERICA INC.
  • MACDERMID ENTHONE INC.
  • MAGNETIC SHIELD CORP.
  • MAJR PRODUCTS
  • MARIAN INC.
  • MARTEK INC.
  • MICROSORB TECHNOLOGIES
  • MUSHIELD CO. INC.
  • OMEGA SHIELDING PRODUCTS INC.
  • ORION INDUSTRIES INC.
  • PREMIX THERMOPLASTICS
  • PRESSCUT INDUSTRIES INC.
  • SAS INDUSTRIES INC.
  • SCHLEGEL ELECTRONIC MATERIALS
  • SHIELDEX US
  • STOCKWELL ELASTOMERICS INC.
  • SWIFT TEXTILE METALIZING LLC
  • TDK RF SOLUTIONS INC.
  • TECH-ETCH INC.
  • THRUST INDUSTRIES
  • VTI VACUUM TECHNOLOGIES
  • THE ZIPPERTUBING CO.

Á¦15Àå ºÎ·Ï : µÎÀÚ¾î

KSA 24.01.12

Highlights:

The global market for EMI/RFI materials and technologies is expected to increase from $7.4 billion in 2023 to $9.2 billion by the end of 2028, with a compound annual growth rate (CAGR) of 4.6% during the forecast period of 2023-2028.

Conductive coatings market for EMI/RFI materials and technologies is expected to increase from $2.8 billion in 2023 to $3.3 billion by the end of 2028, with a CAGR of 3.6% during the forecast period of 2023-2028.

Laminates/tapes/foils market for EMI/RFI materials and technologies is expected to increase from $434.5 million in 2023 to $575.1 million by the end of 2028, with a CAGR of 5.8% during the forecast period of 2023-2028.

Report Scope:

This report segments the EMI/RFI materials and technologies market based on shielding method and region. The report provides an overview of the global EMI/RFI technologies market and analyzes market trends. Using 2022 as the base year, the report provides estimated market data for the forecast period 2023 through 2028.

The EMI/RFI materials and technologies market is segmented by shielding method and region into the following -

  • Shielding method: conductive coatings, metal cabinets, conductive plastics, laminates/tapes/foils and miscellaneous.
  • Region: North America, Europe and Asia-Pacific.

Technologies and materials specific to EMI/RFI shielding are also identified and analyzed in terms of their impact on plastics and the other materials. Trends in components and devices used in the electronics medical, automotive, and consumer products industries are also included in the report.

This report also discusses the current state of the electronics industry as well as other related industries, the market for plastics-based shielding options, key participants, shielding technologies, materials, shielding components, global developments, and examples of global regulatory standards and environmental issues confronting the electronic shielding business.

The report explains the relevant and upcoming technologies, and it covers the qualitative aspects of the market in broad detail. The scope of the report covers an overview of the global market for EMI/RFI materials and technologies and an analysis of the global market trends. The sales values are presented in U.S. dollars. The estimated values used are based on manufacturers' total revenues.

Furthermore, the study also discusses market dynamics such as drivers, restraints, opportunities and challenges. It also examines new and emerging trends and their impact on current and future market dynamics.

Report Includes:

  • 39 data tables and 68 additional tables
  • An overview of the global market landscape related to the materials and technologies of electromagnetic interference (EMI) and radio-frequency interference (RFI)
  • In-depth analysis of global market trends, featuring historical revenue data for 2022, estimated figures for 2023, as well as forecasts for 2028. This analysis includes projections of Compound Annual Growth Rates (CAGRs) spanning through 2028
  • Evaluation of the current market size and revenue growth prospects specific to materials and technologies of electromagnetic interference (EMI) and radio-frequency interference (RFI), accompanied by a comprehensive market share analysis categorized by type, and geographical region
  • Coverage of issues surrounding the ever-increasing frequencies being encountered along with the proliferation of wireless devices that may result in the shifting of shielding options
  • Assessment of the impact of other technologies, such as bluetooth, absorptive EMI, and fiber optics
  • Discussion of trends in components and devices used in electronics and other industries, such as medical, automotive, and consumer products
  • Examination of the current state of the electronics and other industries, the market for plastics-based shielding options, key participants, shielding technologies, patents, materials, shielding components, and a time line of global developments
  • Information on basic concepts, compliance testing and certification related to the industry and insights into regulatory and standards bodies and directives and U.S. food and drug administration requirement
  • Company profiles of major players within the industry, including 3M, The Dow Chemical Co., Parker-Hannifin Corp., and PPG Industries Inc.

Table of Contents

Chapter 1 Introduction

  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • What's New in this Update?
  • Methodology
  • Information Sources
  • Geographic Breakdown
  • Segmentation Breakdown

Chapter 2 Summary and Highlights

  • Market Outlook
  • Summary Highlights
  • Market Size

Chapter 3 Market Overview

  • Overview
  • Major Issues Confronting the EMI/RFI Market
  • Macroeconomic Factors Impacting Market
  • Economic Growth and Post-Pandemic Impact on the Market
  • Electromagnetic Compliance
  • Electronic Standards
  • Purpose of EMC Standards/Regulations
  • Basic Concepts
  • Compliance Testing and Certification
  • Regulatory and Standards Bodies and Directives
  • The Federal Communications Commission Requirements
  • Other Environmental Regulations
  • Extended EMC Regulations

Chapter 4 Market Dynamics

  • Market Drivers
  • Advancement of Telecom Networks Will Increase EMI/RFI Shielding Demand
  • EMI/RFI Shielding Solutions for Defense and Aerospace Applications
  • Rising Demand for EMI/RFI Protection for Medical Devices and Equipment
  • Rising Adoption of Electric Vehicles and Increasing Percentage of Electronic Content per Vehicle
  • Market Challenges
  • Trade-Off Between Miniaturization and EMI/RFI Shielding of Various Electronic Devices
  • Environmental Issues Regarding Disposal of Electronic Items
  • Complexities of Global Testing and Certifications
  • Market Trends and Opportunities
  • Rising Demand for Cloud Services Due to Growth in Data Center Interconnect
  • Environmentally Friendly EMI/RFI Materials
  • Recycling

Chapter 5 EMI/RFI: Basic Concepts

  • Symbols and Terminology
  • Electromagnetic Energy
  • Radiation
  • Conduction
  • Impedance
  • Electrostatic Discharge
  • Electromagnetic Fields
  • Electromagnetic and Radio Frequency Interference
  • Definitions and Ranges

Chapter 6 Shielding Mechanisms

  • Overview
  • Background
  • EMI Shielding Overview
  • Shielding Effectiveness
  • Attenuation
  • Electromagnetic Compatibility
  • EM Control
  • Shielding Performance
  • Absorption
  • Reflectance
  • Permeability
  • Galvanic Corrosion and Metals Compatibility
  • Relationship between Conductivity and Resistivity
  • Effects of EMI/RFI and Static Electricity
  • Importance of Radio Frequency Ranges
  • Controlling EMI/RFI Background

Chapter 7 Shielding Technologies and Materials

  • Overview
  • Metallization Processes Overview
  • Metallization Materials
  • Shielding Effectiveness Overview, by Coating Type
  • Conductive Plastics
  • Background
  • Formulation Options
  • Conductive Plastics
  • Dielectric Properties of Plastics
  • Techniques for Making Plastics Conductive
  • Conductive Material Types
  • Functions
  • Conductive Additive Selection
  • Conductivity Tests
  • Advantages and Disadvantages of Conductive Plastics
  • Compounding Conductive Plastics
  • Companies Producing Conductive Plastics
  • Conductive Plastic Additives
  • Carbon Nanotubes
  • Conductive Films
  • Companies Operating in Conductive Films
  • Recent Developments in Conductive Films
  • Inherently Conductive Polymers
  • Polyanilines
  • Prospects
  • Conductivities of ICPs Compared with That of Metals, Semiconductors and Insulators
  • Processing Options
  • Recent EMI Shielding Developments
  • Conductive Elastomers
  • Technology and Applications Related to EMI
    • Recent Developments
  • Conductive Coatings
  • Background
  • Electrically Conductive Coating Applications
  • EMI Shielding Compounds Compared with Other Conductive Coatings
  • Conductive Coating Issues
  • Comparison of Conductive Coatings
  • Performance of Alternate Conductive Coatings
  • Advantages and Disadvantages
  • Coating Binders
  • Solvent-Based versus Waterborne Conductive Coatings
  • Copper, Nickel and Silver Usage
  • Electroplated Coatings
    • Recent Developments
  • Electroless Plating
  • Overview
  • Measuring Shielding Effectiveness
  • Direct Plate
  • Companies Involved in Electroless Plating
  • Environmental Issues with Electroless Plating
  • Military Specifications
  • Other Specifications
    • Recent Developments
  • Vacuum Metallization
  • Background
  • Technology
  • Advantages and Disadvantages
  • Industry Test Methods
  • Vacuum Metallization Processes
  • Companies Involved in Vacuum Metallizing
  • Conductive Paints
  • Copper
  • Silver
  • Nickel
  • Technologies Involved
  • Solvent Versus Waterborne
  • Paint Thicknesses
  • Other Variables
  • Conductive Paint Application
  • Shielding Performance
  • Conductive Painted Plastics
  • Conductive Paint Specifying Industries
  • Selected Technical Advances in Conductive Paint Technology
  • Globally Accessible Infrastructure to Support Programs
  • Common Painted Plastics
  • Thermal Spray
  • Technology
  • Advantages and Disadvantages
  • Improvements in the Process
  • International Thermal Spray Association
  • Laminates, Metallized Foils and Tapes
  • Flexible Foil Laminates
  • Adhesive Metal Tapes
  • Fabric Tapes
  • Ferrites
  • Background
  • Properties
  • Choosing Ferrites for EMI Suppression
  • Ferrite Shapes and Applications
  • Companies Marketing Soft Ferrites
  • Recent Development
  • Performance Comparisons
  • EMC Shielding and End-User Requirements

Chapter 8 Shielding Components

  • Gaskets
  • Technology
  • Essential Features When Evaluating EMI Gaskets
  • Properties
  • Selecting Gasket Types
  • Gasket Types by Material
  • Technical and Commercial Considerations
  • Installation Costs
  • Shielding Gaskets for Higher Frequencies
  • Testing
  • Design Considerations for Gaskets in EMI Shielding
  • Filters
  • Additional Technical Information
  • Guidelines for Filter Selection
  • Applications
  • Lossy Line or Dissipative Filters
  • Connectors and Cables
  • Cable Construction
  • EMI Cable Shielding and Absorbing Materials
  • Windows
  • Materials
  • Shielding Performance
  • Material Advantages and Disadvantages
  • Maintenance and Performance Issues
  • Enclosures
  • Challenges
  • Technology Issues
  • Aesthetics
  • Shielding of Apertures
  • EMI Leakage
  • Advantages and Disadvantages
  • Enclosure Design Considerations
  • Summing Up the Issues of EMI and Shielded Enclosures
  • Architectural Shielding
  • Background
  • Shielded Room Construction Types
  • Components
  • Other Shielding Components
  • Braids
  • Foil Shields
  • Adhesives

Chapter 9 Quantitative Aspects of EMI/RFI Materials and Technologies Market

  • Overview
  • EMI/RFI Shielding Market by Method
  • Volumes
  • Value
  • Metal Cabinet Market Estimates
  • Conductive Plastics Market Estimates
  • Miscellaneous EMI/RFI Shielding Product Market Estimates

Chapter 10 Additional Patterns and Usage of Selected EMI/RFI Shielding Products

  • Conductive Coatings
  • Laminates and Tapes
  • Conductive Plastics and Elastomers
  • Miscellaneous Shielding

Chapter 11 Industry/Shielding Interface

  • Electronics Industry
  • Trends in the Electronics Industry
  • EMI Shielding Trends
  • Transportation Industry
  • Automobiles
  • Aircraft Industry
  • Drones
  • Healthcare Industry
  • Potential EMI Problems with Medical Implants
  • Efforts to Minimize EMI Problems in the Medical Industry
  • Minimizing Risk and Maximizing Benefits of Mobile Phones in Hospitals
  • Wireless Electronic Equipment Effects in Hospitals
  • Critical Hospital EMI Areas
  • Managing Hospital EMC
  • Materials Used for Shielding Medical Devices
  • Medical EMC Standards
    • Recent Developments
  • Appliances
  • Overview
  • EMC Compliance
  • Other Consumer Products
  • Military Applications
  • High Potential for Interference
  • Vulnerable Systems

Chapter 12 Sustainability in the EMI/RFI Materials and Technologies Market

  • Sustainable Manufacturing for the Electronics Sector to Reduce Carbon Emissions
  • Importance of ESG in the EMI/RFI Materials Market
  • ESG Ratings and Metrics: Understanding the Data
  • Current Status of ESG in the Market for EMI/RFI Materials and Technologies
  • ESG Score Analysis
  • ESG Risk Scale, Exposure Scale and Management Scale
  • Concluding Remarks from BCC

Chapter 13 Competitive Landscape

  • Introduction
  • Vendor Analysis
  • Major Strategic Developments
  • Recent Developments by Key Players

Chapter 14 Company Profiles

  • Profiles of Key Players
  • 3M
  • CTS CORP.
  • THE DOW CHEMICAL CO.
  • DUPONT DE NEMOURS INC.
  • HENKEL AG & CO. KGAA
  • LEADER TECH INC.
  • PARKER HANNIFIN CORP.
  • PPG INDUSTRIES INC.
  • RTP CO.
  • SCHAFFNER HOLDING AG
  • Profiles of Other Key Players
  • AD-VANCE MAGNETICS
  • A.K. STAMPING CO. INC.
  • ALCO TECHNOLOGIES
  • AMUNEAL MANUFACTURING CORP.
  • CHANG GU CHUAN TECHNOLOGY CO. LTD.
  • CHANGZHOU PIONEER ELECTRONIC CO. LTD.
  • CHINA EMI SHIELDING MATERIALS CO. LTD.
  • COILCRAFT INC.
  • CYBERSHIELD INC.
  • ELASTOMERIC SPECIALTIES INC.
  • ETS-LINDGREN L.P.
  • FERRONICS INC.
  • FUJIPOLY AMERICA CORP.
  • GREENE RUBBER CO.
  • JINAN EMI SHIELDING TECHNOLOGY CO. LTD.
  • KITAGAWA INDUSTRIES AMERICA INC.
  • MACDERMID ENTHONE INC.
  • MAGNETIC SHIELD CORP.
  • MAJR PRODUCTS
  • MARIAN INC.
  • MARTEK INC.
  • MICROSORB TECHNOLOGIES
  • MUSHIELD CO. INC.
  • OMEGA SHIELDING PRODUCTS INC.
  • ORION INDUSTRIES INC.
  • PREMIX THERMOPLASTICS
  • PRESSCUT INDUSTRIES INC.
  • SAS INDUSTRIES INC.
  • SCHLEGEL ELECTRONIC MATERIALS
  • SHIELDEX US
  • STOCKWELL ELASTOMERICS INC.
  • SWIFT TEXTILE METALIZING LLC
  • TDK RF SOLUTIONS INC.
  • TECH-ETCH INC.
  • THRUST INDUSTRIES
  • VTI VACUUM TECHNOLOGIES
  • THE ZIPPERTUBING CO.

Chapter 15 Appendix: Acronyms

»ùÇà ¿äû ¸ñ·Ï
0 °ÇÀÇ »óǰÀ» ¼±Åà Áß
¸ñ·Ï º¸±â
Àüü»èÁ¦