반도체 제조 조사 리뷰(2025년)

The global market for semiconductor chips was valued at $737.2 billion in 2025 and is estimated to reach $1.6 trillion by 2030, at a compound annual growth rate (CAGR) of 16.1% from 2025 through 2030.

The global market for thermal management (TM) technologies was valued at $19.8 billion in 2025 and is estimated to reach $30 billion by 2030, at a CAGR of 8.6% from 2025 through 2030.

The global market for semiconductor silicon wafers was valued at $14.6 billion in 2025 and is estimated to reach $20.2 billion by 2030, at a CAGR of 6.7% from 2025 through 2030.

The semiconductor industry, as the backbone of modern infrastructure, is expanding worldwide, driven by increased demand for high-performance computing solutions and AI-enabled applications. This surge is supported by the growing demand for advanced networking and compute-intensive solutions, including Artificial Intelligence (AI), Machine Learning (ML), and Internet of Things (IoT). Advances in chip design, including the development of smaller node sizes such as 2nm and 3nm, are offering new opportunities for next-generation computing and high-performance applications. As organizations shift toward AI-centric solutions, the demand for semiconductor chips dedicated to AI and ML applications is increasing across industries, including healthcare, automotive, retail, and financial services, as they offer high-performance computing and faster data processing.

Rising geopolitical tensions are increasing the need for resilient, localized supply chains and are driving investments in domestic semiconductor manufacturing. The growing demand for electric vehicles (EVs), 5G networks, advanced driver-assistance systems (ADAS), and AI chipsets is creating significant business opportunities for semiconductor manufacturers and foundries.

Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. This 2025 Research Review of semiconductor manufacturing provides a sampling of the type of quantitative market information, analysis, and guidance that BCC Research has been developing since its inception in 1971 to help its customers make informed business decisions. This Research Review includes highlights and excerpts from the following reports published by BCC Research in 2025:

• SMC024P The Global Market for Thermal Management Technologies
• SMC071E Thermal Interface Materials: Technologies, Applications and Global Markets
• SMC082E Global Markets for Roll-to-Roll Technologies for Flexible Devices
• SMC112B Global Semiconductor Silicon Wafer Market
• SMC114B Semiconductor Devices for High-Temperature Applications: Market Opportunities
• SMC138A Gallium Nitride (GaN) Powered Charger: Global Markets
• SMC131C Semiconductor Chips: Applications and Impact of Shortage
• SMC139A Chip-on-Board LED: Global Markets
• SMC140A Global Digital Isolators Market

After you survey the excerpts in this Research Review, we encourage you to follow up on these topics by checking out the full market research reports associated with each topic. BCC Research looks forward to serving your market intelligence needs in the future.

Table of Contents

Chapter 1 Foreword

• Research Review Scope

Chapter 2 The Global Market for Thermal Management Technologies (SMC024P)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Market Overview
• Future Outlook
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Regulatory Landscape
• Regulatory Scenario of TM Systems
• Emerging Technologies
• Nanostructured Materials
• Smart Fibers and Textiles
• Global Thermal Management Technologies Market, by Device
• Key Takeaways
• Convection Cooling Devices
• Conduction Cooling Devices
• Hybrid Cooling Devices
• Advanced Cooling Devices
• Global Thermal Management Technologies Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Environmental, Social and Governance (ESG) Perspective
• Key Takeaways
• Environmental Impact
• Social Impact
• Governance Impact
• Current Status of ESG in the TM Technologies Market
• Concluding Remarks from BCC

Chapter 3 Thermal Interface Materials: Technologies, Applications and Global Markets (SMC071E)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Market Overview
• Future Outlook
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Regulatory Landscape
• Regulatory Scenario
• Emerging Technologies
• Graphene-Based TIMs
• Global Thermal Interface Materials Market, by Material Type
• Key Takeaways
• Polymer Composites
• Metals
• Phase-Change Materials
• Global Thermal Interface Materials Markets, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Environmental, Social and Governance Perspective
• Key Takeaways
• Overview
• Environmental Impact
• Social Impact
• Governance Impact
• Status of ESG in the TIMs Market
• Concluding Remarks from BCC

Chapter 4 Global Markets for Roll-to-Roll Technologies for Flexible Devices (SMC082E)

• Market Outlook
• Scope of Report
• Market Summary
• Technological Advances and Applications
• Market Dynamics and Growth Factors
• Future Trends and Developments
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Market and Technology Overview
• R2R Versus Batch Processes
• Future Outlook
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Emerging Technologies and Developments
• Organic Electronics
• Global R2R Technologies for Flexible Devices Market, by Process Category
• Key Takeaways
• Subtractive Method
• Additive Method
• Global R2R Technologies for Flexible Devices Market by Deposition Method
• Key Takeaways
• Thick Film
• Thin Film
• Global R2R Technologies for Flexible Devices Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the R2R Technologies for Flexible Devices Industry: An ESG Perspective
• Overview
• Key ESG Issues in the R2R Technologies in the Flexible Devices Industry
• ESG Performance Analysis
• Current Status of ESG in the Global Market

Chapter 5 Global Semiconductor Silicon Wafer Market (SMC112B)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Market Overview
• Future Outlook
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Regulatory Landscape
• Regulatory Scenario for Semiconductor Silicon Wafers
• Emerging Technologies
• Next-Generation AI and HPC Chips
• Global Semiconductor Silicon Wafer Market, by Wafer Size
• Key Takeaways
• 300 mm
• 200-mm
• 100-mm
• Others
• Global Semiconductor Silicon Wafer Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Environmental, Social and Governance Perspective
• Key Takeaways
• Environmental Impact
• Social Impact
• Governance Impact
• Status of ESG in the Semiconductor Silicon Wafer Market
• Concluding Remarks from BCC

Chapter 6 Semiconductor Devices for High-Temperature Applications: Market Opportunities (SMC114B)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Market Overview
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Emerging Trends and Technologies
• Packaging Innovations Enabling Reliable High-Temperature Semiconductor Operation
• Global Semiconductor Devices for High-Temperature Applications Market, by Materials
• Key Takeaways
• Silicon
• III-V materials
• Global Semiconductor Devices for High-Temperature Applications Market, by Operating Temperature
• Key Takeaways
• 126°C to 250°C
• Higher than 250°C
• Global Semiconductor Devices for High-Temperature Applications Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the Semiconductor Devices for High- Temperature Applications Industry: An ESG Perspective
• Key Takeaways
• Key ESG Issues in the Semiconductor Devices for High-Temperature Applications Market
• ESG Performance Analysis
• Current Status of ESG in the Semiconductor Devices for High-Temperature Applications Market
• Concluding Remarks from BCC Research

Chapter 7 Gallium Nitride (GaN) Powered Chargers: Global Markets (SMC138A)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Market Overview
• Future Expectations
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Emerging Trends and Technologies
• Multi-Channel NTC Sensor Technology with Real-Time Thermal Monitoring
• Global Gallium Nitride (GaN) Powered Chargers Market, by Device Type
• Key Takeaways
• Smartphones and Tablets
• Laptops
• Multi-devices
• Others
• Global Gallium Nitride (GaN) Powered Chargers Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the GaN-Powered Chargers Industry: ESG Perspective
• Key ESG Issues in the GaN-Powered Chargers Market
• ESG Performance Analysis
• Current Status of ESG in the GaN-Powered Chargers Market
• Concluding Remarks from BCC Research

Chapter 8 Semiconductor Chips: Applications and Impact of Shortage (SMC131C)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Current Market Overview
• Future Outlook
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Emerging Technologies
• 3D Chip Stacking (3D ICs)
• Global Semiconductor Chip Market, by Type
• Key Takeaways
• Logic ICs
• Memory Chips
• Analog ICs
• Microprocessors
• Sensors
• Other Types
• Global Semiconductor Chips Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Latin America
• Middle East and Africa
• Environmental, Social, and Governance (ESG) Perspective
• ESG Performance in the Semiconductor Chip Industry
• Status of ESG in the Semiconductor Chip Industry
• Concluding Remarks from BCC Research

Chapter 9 Chip-on-Board LED: Global Markets (SMC139A)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segment Analysis
• Regional Analysis
• Conclusion
• Current Market Overview
• Future Outlook
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Regulatory Landscape
• Overview
• Regulatory Scenario of Chip-on-Board LEDs
• Emerging Technologies
• Flip-Chip COB Designs
• Global Chip-on-Board LED Market, by Product Type
• Key Takeaways
• COB LED Modules
• COB LED Arrays
• COB LED Components
• Global Chip-on-Board LED Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 10 Global Digital Isolators Market (SMC140A)

• Market Outlook
• Scope of Report
• Market Summary
• Market Dynamics and Growth Factors
• Emerging Technologies
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Current Market Overview
• Future Expectations
• Market Dynamics
• Market Drivers
• Market Restraints
• Market Opportunities
• Regulatory Landscape
• Overview
• Emerging Technologies
• Automotive-driven Innovation
• Global Digital Isolators Market, by Technology
• Key Takeaways
• Capacitive
• Magnetic
• GMR
• Global Digital Isolators Market, by Data Speed
• Key Takeaways
• 11 to 100 Mbps
• 101 to 150 Mbps
• Up to 10 Mbps
• Above 150 Mbps
• Global Digital Isolators Market, by Region
• Key Takeaways
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the Digital Isolators Industry: ESG Perspective
• ESG Performance in the Semiconductor Chip Industry
• Status of ESG in the Semiconductor Chip Industry
• Concluding Remarks from BCC Research

Chapter 11 Appendix

• Methodology
• Analyst's Credentials