세계의 IC 패키지용 솔더볼 시장 : 유형별, 애플리케이션별, 지역별, 동향 분석, 경쟁 구도, 예측(2019-2030년)

Global Solder Ball in Integrated Circuit Packaging Market Set to Surpass USD 157 Billion by 2030

Global Solder Ball in Integrated Circuit Packaging Market is thriving due to a rising demand for integrated circuits in miniaturized electronic devices, expansion in semiconductor manufacturing, advancements in packaging, rapid adoption of IoT, and automotive electronics applications.

BlueWeave Consulting, a leading strategic consulting and market research firm, in its recent study, estimated Global Solder Ball in Integrated Circuit Packaging Market size by value at USD 75.30 billion in 2023. During the forecast period between 2024 and 2030, BlueWeave expects Global Solder Ball in Integrated Circuit Packaging Market size to expand at a CAGR of 11.20% reaching a value of USD 157.20 billion by 2030. Global Solder Ball in Integrated Circuit (IC) Packaging Market is expanding due to an increasing demand for miniaturized electronic devices, adoption of advancements in semiconductor technology, 5G, IoT, AI, enhanced thermal management, and growing trends in the automotive electronics and consumer electronics sector. These factors contribute to reliable electrical connections and increased demand for solder balls in IC packaging.

Opportunity - Rising Demand for High-Performance Electronic Devices

Global Solder Ball in Integrated Circuit (IC) Packaging Market is experiencing a surge in growth, due to an increasing demand for high-performance electronic devices, driven by advancements in 5G, AI (artificial intelligence), and IoT (Internet of Things). Solder balls are crucial for connecting semiconductor devices to PCBs (printed circuit boards), enhancing thermal conductivity, electrical connectivity, and device efficiency, driving market expansion in telecommunications, consumer electronics, and automotive industries.

Impact of Escalating Geopolitical Tensions on Global Solder Ball in Integrated Circuit Packaging Market

Escalating geopolitical tensions could significantly impact Global Solder Ball in Integrated Circuit Packaging Market, leading to supply chain disruptions, shortages of raw materials, and increased costs for chipmakers. Strained relations between major hubs, unpredictable regulatory environments, and fluctuating demand due to economic slowdowns could further limit market growth and profitability for manufacturers.

BGA Application Segment Leads Global Solder Ball in IC Packaging Market

Ball Grid Array (BGA) segment holds the largest share of Global Solder Ball in Integrated Circuit Packaging Market by application. BGA is widely used due to its ability to provide high-density packaging and efficient heat dissipation, making it suitable for advanced electronic devices. Its popularity in consumer electronics, telecommunications, and automotive industries, where miniaturization and performance are critical, drives its dominance. Other packaging technologies like Chip Scale Package (CSP) and Wafer Level Chip Scale Package (WLCSP) are growing but do not yet match BGA's widespread application and market share.

Competitive Landscape

Global Solder Ball in Integrated Circuit Packaging Market is fiercely competitive, with numerous companies vying for a larger market share. Major companies in the market include Amtech, Alpha Assembly Solutions, Kester Solder, Senju Metal, Taiyo Nippon Sanso, Kucera Corporation, Nippon Electric Glass, Showa Denko, Alent Technologies, Umicore, and Indium Corporation. These companies use various strategies, including increasing investments in their R&D activities, mergers and acquisitions, joint ventures, collaborations, licensing agreements, and new product and service releases to further strengthen their position in Global Solder Ball in Integrated Circuit Packaging Market.

The in-depth analysis of the report provides information about growth potential, upcoming trends, and statistics of Global Solder Ball in Integrated Circuit Packaging Market. It also highlights the factors driving forecasts of total market size. The report promises to provide recent technological trends in Global Solder Ball in Integrated Circuit Packaging Market and industry insights to help decision-makers make sound strategic decisions. Further, the report also analyzes the growth drivers, challenges, and competitive dynamics of the market.

Table of Contents

1. Research Framework

• 1.1. Research Objective
• 1.2. Product Overview
• 1.3. Market Segmentation

2. Executive Summary

3. Global Solder Ball in Integrated Circuit Packaging Market Insights

• 3.1. Industry Value Chain Analysis
• 3.2. DROC Analysis
  • 3.2.1. Growth Drivers
    • 3.2.1.1. Miniaturization of Electronic Devices
    • 3.2.1.2. Growth in Semiconductor Industry
    • 3.2.1.3. Increasing Use of Electronic Devices in Various Industries
  • 3.2.2. Restraints
    • 3.2.2.1. Environmental Concerns
    • 3.2.2.2. Cost Pressures
  • 3.2.3. Opportunities
    • 3.2.3.1. Rising Demand for High-Performance Electronic Devices
    • 3.2.3.2. Technological Advancements in Solder Ball Production
  • 3.2.4. Challenges
    • 3.2.4.1. Competition from Alternative Interconnect Technologies
    • 3.2.4.2. Supply Chain Disruptions
• 3.3. Technological Advancements/Recent Developments
• 3.4. Regulatory Framework
• 3.5. Porter's Five Forces Analysis
  • 3.5.1. Bargaining Power of Suppliers
  • 3.5.2. Bargaining Power of Buyers
  • 3.5.3. Threat of New Entrants
  • 3.5.4. Threat of Substitutes
  • 3.5.5. Intensity of Rivalry

4. Global Solder Ball in Integrated Circuit Packaging Market: Marketing Strategies

5. Global Solder Ball in Integrated Circuit Packaging Market: Pricing Analysis

6. Global Solder Ball in Integrated Circuit Packaging Market: Geographical Analysis

• 6.1. Global Solder Ball in Integrated Circuit Packaging Market, Geographical Analysis, 2023
• 6.2. Global Solder Ball in Integrated Circuit Packaging Market, Market Attractiveness Analysis, 2024-2030

7. Global Solder Ball in Integrated Circuit Packaging Market Overview

• 7.1. Market Size & Forecast, 2019-2030
  • 7.1.1. By Value (USD Million)
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
    • 7.2.1.1. Lead Solder Balls
    • 7.2.1.2. Lead Free Solder Balls
  • 7.2.2. By Application
    • 7.2.2.1. BGA
    • 7.2.2.2. CSP & WLCSP
    • 7.2.2.3. Others
  • 7.2.3. By Region
    • 7.2.3.1. North America
    • 7.2.3.2. Europe
    • 7.2.3.3. Asia Pacific (APAC)
    • 7.2.3.4. Latin America (LATAM)
    • 7.2.3.5. Middle East and Africa (MEA)

8. North America Solder Ball in Integrated Circuit Packaging Market

• 8.1. Market Size & Forecast, 2019-2030
  • 8.1.1. By Value (USD Million)
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Application
  • 8.2.3. By Country
    • 8.2.3.1. United States
    • 8.2.3.1.1. By Type
    • 8.2.3.1.2. By Application
    • 8.2.3.2. Canada
    • 8.2.3.2.1. By Type
    • 8.2.3.2.2. By Application

9. Europe Solder Ball in Integrated Circuit Packaging Market

• 9.1. Market Size & Forecast, 2019-2030
  • 9.1.1. By Value (USD Million)
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Application
  • 9.2.3. By Country
    • 9.2.3.1. Germany
    • 9.2.3.1.1. By Type
    • 9.2.3.1.2. By Application
    • 9.2.3.2. United Kingdom
    • 9.2.3.2.1. By Type
    • 9.2.3.2.2. By Application
    • 9.2.3.3. Italy
    • 9.2.3.3.1. By Type
    • 9.2.3.3.2. By Application
    • 9.2.3.4. France
    • 9.2.3.4.1. By Type
    • 9.2.3.4.2. By Application
    • 9.2.3.5. Spain
    • 9.2.3.5.1. By Type
    • 9.2.3.5.2. By Application
    • 9.2.3.6. Belgium
    • 9.2.3.6.1. By Type
    • 9.2.3.6.2. By Application
    • 9.2.3.7. Russia
    • 9.2.3.7.1. By Type
    • 9.2.3.7.2. By Application
    • 9.2.3.8. The Netherlands
    • 9.2.3.8.1. By Type
    • 9.2.3.8.2. By Application
    • 9.2.3.9. Rest of Europe
    • 9.2.3.9.1. By Type
    • 9.2.3.9.2. By Application

10. Asia Pacific Solder Ball in Integrated Circuit Packaging Market

• 10.1. Market Size & Forecast, 2019-2030
  • 10.1.1. By Value (USD Million)
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Application
  • 10.2.3. By Country
    • 10.2.3.1. China
    • 10.2.3.1.1. By Type
    • 10.2.3.1.2. By Application
    • 10.2.3.2. India
    • 10.2.3.2.1. By Type
    • 10.2.3.2.2. By Application
    • 10.2.3.3. Japan
    • 10.2.3.3.1. By Type
    • 10.2.3.3.2. By Application
    • 10.2.3.4. South Korea
    • 10.2.3.4.1. By Type
    • 10.2.3.4.2. By Application
    • 10.2.3.5. Australia & New Zealand
    • 10.2.3.5.1. By Type
    • 10.2.3.5.2. By Application
    • 10.2.3.6. Indonesia
    • 10.2.3.6.1. By Type
    • 10.2.3.6.2. By Application
    • 10.2.3.7. Malaysia
    • 10.2.3.7.1. By Type
    • 10.2.3.7.2. By Application
    • 10.2.3.8. Singapore
    • 10.2.3.8.1. By Type
    • 10.2.3.8.2. By Application
    • 10.2.3.9. Vietnam
    • 10.2.3.9.1. By Type
    • 10.2.3.9.2. By Application
    • 10.2.3.10. Rest of APAC
    • 10.2.3.10.1. By Type
    • 10.2.3.10.2. By Application

11. Latin America Solder Ball in Integrated Circuit Packaging Market

• 11.1. Market Size & Forecast, 2019-2030
  • 11.1.1. By Value (USD Million)
• 11.2. Market Share & Forecast
  • 11.2.1. By Type
  • 11.2.2. By Application
  • 11.2.3. By Country
    • 11.2.3.1. Brazil
    • 11.2.3.1.1. By Type
    • 11.2.3.1.2. By Application
    • 11.2.3.2. Mexico
    • 11.2.3.2.1. By Type
    • 11.2.3.2.2. By Application
    • 11.2.3.3. Argentina
    • 11.2.3.3.1. By Type
    • 11.2.3.3.2. By Application
    • 11.2.3.4. Peru
    • 11.2.3.4.1. By Type
    • 11.2.3.4.2. By Application
    • 11.2.3.5. Rest of LATAM
    • 11.2.3.5.1. By Type
    • 11.2.3.5.2. By Application

12. Middle East & Africa Solder Ball in Integrated Circuit Packaging Market

• 12.1. Market Size & Forecast, 2019-2030
  • 12.1.1. By Value (USD Million)
• 12.2. Market Share & Forecast
  • 12.2.1. By Type
  • 12.2.2. By Application
  • 12.2.3. By Country
    • 12.2.3.1. Saudi Arabia
    • 12.2.3.1.1. By Type
    • 12.2.3.1.2. By Application
    • 12.2.3.2. UAE
    • 12.2.3.2.1. By Type
    • 12.2.3.2.2. By Application
    • 12.2.3.3. Qatar
    • 12.2.3.3.1. By Type
    • 12.2.3.3.2. By Application
    • 12.2.3.4. Kuwait
    • 12.2.3.4.1. By Type
    • 12.2.3.4.2. By Application
    • 12.2.3.5. South Africa
    • 12.2.3.5.1. By Type
    • 12.2.3.5.2. By Application
    • 12.2.3.6. Nigeria
    • 12.2.3.6.1. By Type
    • 12.2.3.6.2. By Application
    • 12.2.3.7. Algeria
    • 12.2.3.7.1. By Type
    • 12.2.3.7.2. By Application
    • 12.2.3.8. Rest of MEA
    • 12.2.3.8.1. By Type
    • 12.2.3.8.2. By Application

13. Competitive Landscape

• 13.1. List of Key Players and Their Offerings
• 13.2. Global Solder Ball in Integrated Circuit Packaging Company Market Share Analysis, 2023
• 13.3. Competitive Benchmarking, By Operating Parameters
• 13.4. Key Strategic Developments (Mergers, Acquisitions, Partnerships, etc.)

14. Impact of Escalating Geopolitical Tensions on Global Solder Ball in Integrated Circuit Packaging Market

15. Company Profiles (Company Overview, Financial Matrix, Competitive Landscape, Key Personnel, Key Competitors, Contact Address, Strategic Outlook, and SWOT Analysis)

• 15.1. Amtech
• 15.2. Alpha Assembly Solutions
• 15.3. Kester Solder
• 15.4. Senju Metal
• 15.5. Taiyo Nippon Sanso
• 15.6. Kucera Corporation
• 15.7. Nippon Electric Glass
• 15.8. Showa Denko
• 15.9. Alent Technologies
• 15.10. Umicore
• 15.11. Indium Corporation
• 15.12. Other Prominent Players

16. Key Strategic Recommendations

17. Research Methodology

• 17.1. Qualitative Research
  • 17.1.1. Primary & Secondary Research
• 17.2. Quantitative Research
• 17.3. Market Breakdown & Data Triangulation
  • 17.3.1. Secondary Research
  • 17.3.2. Primary Research
• 17.4. Breakdown of Primary Research Respondents, By Region
• 17.5. Assumptions & Limitations

*Financial information of non-listed companies can be provided as per availability.

**The segmentation and the companies are subject to modifications based on in-depth secondary research for the final deliverable.