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세계의 3D IC 시장 : 최종사용 부문별, 기판 종류별, 제조 공정별, 제품별, 지역별 - 규모, 점유율, 전망, 기회 분석

3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

리서치사 Coherent Market Insights
발행일 2020년 06월 상품 코드 948381
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세계의 3D IC 시장 : 최종사용 부문별, 기판 종류별, 제조 공정별, 제품별, 지역별 - 규모, 점유율, 전망, 기회 분석 3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027
발행일 : 2020년 06월 페이지 정보 : 영문

세계의 3D IC 시장은 에너지 효율에 관한 인식 확산과 IoT(사물인터넷) 보급, 모바일 디바이스용 고성능이고 컴팩트한 IC 수요 증가 등의 요인으로 향후에도 확대 경향이 계속될 것으로 보입니다.

세계의 3D IC(삼차원 집적회로) 시장에 대해 분석했으며, 기술 개요, 시장의 기본 구조 및 성장 촉진·억제요인, 전체적인 시장 규모 전망(과거 3년간·향후 8년간), 최종사용 부문별·기판 종류별·제조 공정별·제품별·지역별 상세 동향, 주요 기업 개요·실적·전략 계획 등을 조사했습니다.

제1장 분석 목적과 가정

제2장 시장 개요

  • 분석 개요
  • 주요 요약
  • COM(Coherent Opportunity Map : 시장 기회 맵)

제3장 시장 역학, 규제, 동향 분석

  • 시장 역학
    • 시장 성장 촉진요인
    • 시장 성장 억제요인
    • 시장 기회
  • 규제 시나리오
  • 업계 동향
  • 기업 인수합병(M&A)
  • 신제품 인증/출시

제4장 신종 코로나바이러스 감염증(COVID-19) : 3D IC 시장에 대한 영향

  • 단기적·장기적 영향 : 지역별

제5장 세계의 3D IC 시장 : 최종사용 부문별

  • 서론
  • 가전
  • 정보 통신 기술(ITC)
  • 수송기계(자동차, 항공우주)
  • 기타(바이오메디컬, 연구개발(R&D))

제6장 세계의 3D IC 시장 : 기판 종류별

  • 서론
  • SOI(Silicon on insulator)
  • 벌크 실리콘

제7장 세계의 3D IC 시장 : 제조 공정별

  • 서론
  • 빔 재결정
  • 웨이퍼 본딩
  • 실리콘 에피택셜 성장
  • 고상 성장

제8장 세계의 3D IC 시장 : 제품별

  • 서론
  • MEMS/센서
  • RF SiP
  • 옵토일렉트로닉스/이미징
  • 메모리(3D 스택)
  • 로직(3D SiP/SoC)
  • HB LED

제9장 세계의 3D IC 시장 : 지역별

  • 서론
  • 북미
  • 유럽
  • 아시아태평양
  • 라틴아메리카
  • 중동 및 아프리카

제10장 경쟁 상황

  • 기업 개요
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • MonolithIC 3D Inc.
    • XILINX, Inc.
    • Elpida Memory, Inc.
    • Micron Technology, Inc.
    • The 3M Company,
    • Ziptronix, Inc.
    • STATS ChipPAC Ltd.
    • United Microelectronics Corporation
    • Tezzaron Semiconductor Corporation

제11장 부록

KSM 20.07.30

Title:
3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D)), by Substrate Type (Silicon on insulator(SOI), Bulk silicon), by Fabrication Process ( Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027.

3D IC is a metal-oxide-semiconductor (MOS) integrated circuit which is produced by stacking silicon wafers or dies and connecting them vertically. These 3D ICs are manufactured by using different processes such as beam re-crystallization, wafer bonding, and solid-phase crystallization. Three dimensional integrated circuit (3D IC) are used to offer high performance, low power consumption, efficiency and increased functionality in the electronic devices. 3D ICs are used in Consumer electronics, communication technologies and military. 3D ICs are majorly used in consumer electronic devices owing to increasing trend towards compact sizes and high efficiency.

Market Dynamics

Rising awareness for energy efficient and propagation of internet of things (IoT) is expected to drive the growth of 3D ICs market over the forecast period. This is attributed to increasing demand of (IoT) devices in the market. Manufacturers are innovating their products with the help of these 3D ICs. 3D ICs are advanced technology solutions which aids in designing and development of the latest products. Manufacturers are continuously improving the consumer products by reducing the size of the devices. Moreover, these smart devices provides various features such as durability, efficiency in speed and good memory. This is expected to drive the demand of 3D ICs market over the forecast period.

Furthermore, increase in the demand for high performance and compact ICs in laptop, tablets, mobile devices, Smart TVs are also expected to drive the growth of 3D ICs market over the forecast period. Manufacturers are improving these devices by using these 3D ICs to offer high bandwidth and high performance to the end users. Additionally, the rising demand for automated products and high functionality devices are encouraging OEMs to integrate 3D ICs in their devices, which will further create lucrative opportunities for this market.

Market Taxonomy

This report segments the global 3D ICs market on the basis of end-use sectors, substrate type, fabrication process, product and region. On the basis of end-use sectors 3D ICs market is segmented into Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D). On the basis of substrate type, the global 3D ICs market is segmented into Silicon on insulator (SOI), Bulk silicon. On the basis of fabrication process, the global 3D ICs market is segmented into Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization. On the basis of product, the global 3D ICs market is segmented into MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED. On the basis of region, the global 3D ICs market is segmented into North America, Europe, Asia Pacific, ROW.

Key features of the study:

  • This report provides an in-depth analysis of the global 3D ICs market and provides market size (US$ million) and compound annual growth rate (CAGR %) for the forecast period (2020-2027), considering 2019 as the base year.
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrix for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, regional outlook, and competitive strategy adopted by leading players
  • It profiles leading players in the global 3D ICs market based on the following parameters - regulatory landscape, company overview, financial performance, product portfolio, geographical presence, distribution strategies, key developments and strategies, and future plans
  • Key companies covered in the global automotive cockpit electronics market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.
  • The market players are focusing on strategic collaborations to innovate and launch new products to meet the increasing needs and requirements of consumers.
  • Insights from this report would allow marketers and management authorities of companies to make informed decision regarding future product launches, technology upgradation, market expansion, and marketing tactics
  • The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through the various strategy matrices used in analyzing the global 3D ICs market.

Detailed Segmentation:

  • Global 3D ICs Market, By End-Use Sectors:
    • Consumer electronics
    • Information and communication technology
    • Transport (automotive and aerospace)
    • Military
    • Others(Biomedical applications and R&D)
  • Global 3D ICs Market, By Substrate Type:
    • Silicon on insulator(SOI)
    • Bulk silicon
  • Global 3D ICs Market, By Fabrication Process:
    • Beam re-crystallization
    • Wafer bonding
    • Silicon epitaxial growth
    • Solid phase crystallization
  • Global 3D ICs Market, By Process:
    • MEMS and Sensor
    • RF SiP
    • Optoelectronics and imaging
    • Memories (3D Stacks)
    • Logic (3D Sip/Soc)
    • HB LED
  • Global 3D ICs Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Rest of World
  • Company Profiles
    • Taiwan Semiconductor Manufacturing Company, Ltd.*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
      • Future Plans
    • MonolithIC 3D Inc.
    • XILINX, Inc.
    • Elpida Memory, Inc.
    • (Micron Technology, Inc.)
    • The 3M Company
    • Ziptronix, Inc.
    • STATS ChipPAC Ltd.
    • United Microelectronics Corporation
    • Tezzaron Semiconductor Corporation

Browse all the market data tables and figures on "Global 3D ICs Market- Forecast to 2027"

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By End-Use Sectors
    • Market Snippet, By Substrate Type
    • Market Snippet, By Fabrication Process
    • Market Snippet, By Process
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New System Launch/Approval

4. Impact of COVID-19 Pandemic on 3D ICs Market

  • Short Term and Long Term Impact, By Region
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa

5. Global 3D ICs Market, By End- Use Sectors, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • Consumer electronics
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Information and communication technology
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Transport (automotive and aerospace)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Military
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Others (Biomedical applications and R&D)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

6. Global 3D ICs Market, By Substrate Type, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • Silicon on insulator (SOI)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Bulk silicon
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

7. Global 3D ICs Market, By Fabrication Process, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • Beam re-crystallization
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Wafer bonding
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Silicon epitaxial growth
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Solid phase crystallization
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

8. Global 3D ICs Market, By Process, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, 2019 and 2027 (%)
    • Segment Trends
  • MEMS and Sensor
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • RF SiP
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Optoelectronics and imaging
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Memories (3D Stacks)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • Logic (3D Sip/Soc)
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)
  • HB LED
    • Introduction
    • Market Size and Forecast, 2020-2027, (US$ Million)

9. Global 3D ICs Market, By Region, 2017-2027 (US$ Million)

  • Introduction
    • Market Share Analysis, By Region, 2019 and 2027 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.S.
    • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • U.K.
    • Germany
    • Italy
    • France
    • Russia
    • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • India
    • Japan
    • ASEAN
    • Australia
    • South Korea
    • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • Brazil
    • Argentina
    • Mexico
    • Rest of Latin America
  • Middle East and Africa
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Million)
    • Market Size and Forecast, By Process, 2020-2027 (US$ Million)
    • Market Share Analysis, By Country, 2019 and 2027 (%)
    • GCC Countries
    • South Africa
    • Rest of the Middle East and Africa

10. Competitive Landscape

  • Company Profiles
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • MonolithIC 3D Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • XILINX, Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Elpida Memory, Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • (Micron Technology, Inc.)
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • The 3M Company,
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Ziptronix, Inc.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • STATS ChipPAC Ltd.
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • United Microelectronics Corporation
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates
    • Tezzaron Semiconductor Corporation
    • Company Overview
    • Product Portfolio
    • Financial Performance
    • Key Strategies
    • Recent Developments/Updates

11. Section

  • References
  • Research Methodology
  • About Us and Sales Contact
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