세계의 첨단 마이크로일렉트로닉스 및 나노일렉트로닉스 시장(2024-2035년)

Advanced micro- and nanoelectronics refer to the study, design, and fabrication of advanced electronic devices and systems at the micro- and nanoscale levels. These fields encompass a wide range of technologies and applications, leveraging the unique properties and behaviours of materials and structures at these scale levels. Microelectronics deals with the development of electronic devices and components with dimensions ranging from a few micrometers (10^-6 meters) to a few millimeters. It includes the design and manufacture of integrated circuits (ICs), microprocessors, microcontrollers, and other microscale electronic devices. Nanoelectronics focuses on the manipulation and exploitation of materials, devices, and systems at the nanoscale level, typically ranging from 1 to 100 nanometers (10-9 meters). This field explores the unique physical, chemical, and electrical properties that emerge at the nanoscale, enabling the creation of novel electronic devices and systems with enhanced performance, efficiency, and functionality. Ongoing miniaturization combined with performance improvements and increasing functionality as well as the integration of novel materials, radically new device concepts and new applications are pushing technological limits further and further. As such, micro- and nanoelectronics is the key and enabling technology for innovation in all areas of life. Megatrends such as artificial intelligence or the metaverse as well as critical infrastructures such as power plants or telecommunications networks, are heavily dependent on micro- and nanoelectronics.

Advanced micro- and nanoelectronics are driving innovations across industries, from consumer electronics and computing to healthcare, energy, and advanced manufacturing. This in-depth market report provides a comprehensive analysis of the global advanced micro- and nanoelectronics landscape, including market sizing, emerging trends, key drivers and opportunities, competitive landscape, and future outlook.

The report includes a detailed introduction to advanced micro- and nanoelectronics, covering definitions, importance, applications, and major market segments such as consumer electronics, computing, communications, automotive, aerospace and defense, healthcare, energy, industrial automation, Internet of Things (IoT), and optoelectronics.

A core focus is on the device technology driving micro- and nanoelectronics innovations, including transistors (FinFETs, Gate-All-Around FETs, Tunnel FETs, Carbon Nanotube FETs), integrated circuits, MEMS devices, nanoelectronic structures (carbon nanotubes, graphene, quantum dots), optoelectronic devices (LEDs, lasers, photodetectors), and energy storage/conversion devices. Market sizing and forecasts are provided for each device type through 2035.

The report also covers the electronic circuits and architectures powering today's systems, examining analog and mixed-signal circuits, microprocessors/microcontrollers, FPGAs, ASICs, System-on-Chip designs, memory architectures (DRAM, SRAM, emerging non-volatile), and advanced interconnects/packaging technologies like 3D ICs, chiplets, fan-outs, and silicon interposers. Emerging technologies like spintronics, molecular electronics, neuromorphic computing, and 3D printed electronics are analyzed regarding their current status, applications, key players, and future potential.

The market analysis section covers key trends, applications, and market forecasts across industries:

• Consumer Electronics (smartphones, wearables, home appliances)
• Computing and Data Storage
• Communications
• Automotive Electronics (ADAS, displays, sensors)
• Aerospace & Defense
• Healthcare and Biomedical (imaging, biosensors, wearables, implantables)
• Energy and Power (solar cells, energy harvesting, power management)
• Industrial Automation
• IoT (smart home, cities, sensor networks)
• Optoelectronics (displays, lighting, photonics)
• Sustainable Electronics
• Smart Packaging Electronics

Over 1,000 company profiles are included, covering start-ups to industry leaders across devices, circuits, packaging, end-use applications, and enabling technologies. Companies profiled include 3DSEMI, Ambarella, MD (Advanced Micro Devices), Aspinity, Atantares, BeFC, C3 Nano, Canatu, Cellid, CHASM, ChipMOS, Chiral Nano, Diamfab, Efficient Computer, Electroninks, Elephantech, Eliyan Corporation, e-peas Semiconductors, Esperanto Technologies, Floadia Corporation, FononTech, Heraeus Epurio, Gaianixx, Genomika, Inkron Oy (Nagase), Innatera Nanosystems, Inuchip, Lotus Microsystems, Lumotive, Lux Semiconductors, MICLEDI Microdisplays, Myrias Optics, Nanopower Semiconductor, NeoLogic, NEO Semiconductor, Neuroph, Numem, Ookuma Diamond Device, Oriole Networks, Panmnesia, Point2 Technology, Pragmatic Semiconductor, Printoptix, PseudolithIC, PVNanoCell, Quinas Technology, Quintessent, RAAAM Memory Technologies, Rapidus, SiFive, SiPearl , Silicon Box, SK hynix, Swave Photonics, SynSense, tacterion GmbH, Tactotek, Taiwan Semiconductor Manufacturing Company (TSMC), TopoLogic, TracXon, Voltera, VoxelSensors, WeeBit Nano, Wise Integration, Xymox Technologies, Inc., Ynvisible and ZeroPoint Technologies AB.

With insights into the latest market developments, disruptive technologies, competitive strategies, and opportunities across applications, this report is an invaluable resource for companies, investors, and professionals navigating the dynamic micro- and nanoelectronics space.

TABLE OF CONTENTS

1. RESEARCH METHODOLOGY

2. INTRODUCTION

• 2.1. Definition of Advanced Micro- and Nanoelectronics
• 2.2. The evolution of electronics
• 2.3. Global government semiconductors funding and initiatives
• 2.4. Market segments
  • 2.4.1. Consumer Electronics
  • 2.4.2. Computing and Data Storage
  • 2.4.3. Communications
  • 2.4.4. Automotive Electronics
  • 2.4.5. Aerospace and Defense
  • 2.4.6. Healthcare and Biomedical
  • 2.4.7. Energy and Power
  • 2.4.8. Industrial Automation
  • 2.4.9. Internet of Things (IoT)
  • 2.4.10. Optoelectronics
• 2.5. Device Technology
  • 2.5.1. Transistors
  • 2.5.2. Integrated Circuits (ICs)
  • 2.5.3. Micro-Electro-Mechanical Systems (MEMS)
  • 2.5.4. Nanoelectronics
  • 2.5.5. Optoelectronics
  • 2.5.6. Energy Storage and Conversion
• 2.6. Electronic Circuits and Architectures
  • 2.6.1. Analog Circuits
  • 2.6.2. Digital circuits
  • 2.6.3. Mixed-Signal Circuits
  • 2.6.4. Microprocessors and Microcontrollers
  • 2.6.5. Field-Programmable Gate Arrays (FPGAs)
  • 2.6.6. Application-Specific Integrated Circuits (ASICs)
  • 2.6.7. System-on-Chip (SoC)
  • 2.6.8. Memory Architectures
  • 2.6.9. Interconnects and Packaging

3. TECHNOLOGY ANALYSIS

• 3.1. DEVICE TECHNOLOGY
  • 3.1.1. Transistors
    • 3.1.1.1. FinFET (Fin Field-Effect Transistor)
    • 3.1.1.2. Gate-All-Around FET
    • 3.1.1.3. Tunnel FET (TFET)
    • 3.1.1.4. Carbon Nanotube FET (CNTFET)
    • 3.1.1.5. Graphene FET
    • 3.1.1.6. Negative Capacitance FET (NC-FET)
    • 3.1.1.7. Spin FET
    • 3.1.1.8. Global market size
  • 3.1.2. Micro-Electro-Mechanical Systems (MEMS)
    • 3.1.2.1. Inertial Sensors
    • 3.1.2.2. Pressure Sensors
    • 3.1.2.3. Microfluidics
    • 3.1.2.4. RF MEMS
    • 3.1.2.5. Optical MEMS
    • 3.1.2.6. Energy Harvesting MEMS
    • 3.1.2.7. Global market size
  • 3.1.3. Nanoelectronics
    • 3.1.3.1. Carbon Nanotubes (CNTs)
      • 3.1.3.1.1. Wearable technologies and flexible displays
        • 3.1.3.1.1.1. Applications
        • 3.1.3.1.1.2. Companies
      • 3.1.3.1.2. Transistors and ICs
        • 3.1.3.1.2.1. Applications
        • 3.1.3.1.2.2. Companies
      • 3.1.3.1.3. Memory
        • 3.1.3.1.3.1. Applications
        • 3.1.3.1.3.2. Companies
    • 3.1.3.2. Graphene
      • 3.1.3.2.1. Transparent conductive films
        • 3.1.3.2.1.1. Applications
        • 3.1.3.2.1.2. Companies
      • 3.1.3.2.2. Transistors and ICs
        • 3.1.3.2.2.1. Applications
        • 3.1.3.2.2.2. Companies
      • 3.1.3.2.3. Thermal management
        • 3.1.3.2.3.1. Applications
        • 3.1.3.2.3.2. Market players
      • 3.1.3.2.4. Memory
        • 3.1.3.2.4.1. Applications
        • 3.1.3.2.4.2. Companies
    • 3.1.3.3. Molybdenum disulfide
    • 3.1.3.4. Quantum Dots
    • 3.1.3.5. Nanowires
    • 3.1.3.6. Topological Insulators
    • 3.1.3.7. Spintronic Devices
    • 3.1.3.8. Memristors
    • 3.1.3.9. Ferroelectric FETs
    • 3.1.3.10. Global market size
  • 3.1.4. Optoelectronics devices
    • 3.1.4.1. Light-Emitting Diodes (LEDs)
    • 3.1.4.2. Laser Diodes
    • 3.1.4.3. Photodetectors
    • 3.1.4.4. Optical Modulators
    • 3.1.4.5. Optical Waveguides
    • 3.1.4.6. Optoelectronic Integrated Circuits (OEICs)
    • 3.1.4.7. Quantum Dot Optoelectronics
    • 3.1.4.8. Quantum Cascade Lasers (QCLs)
    • 3.1.4.9. Photonic Integrated Circuits (PICs)
    • 3.1.4.10. Micro-LEDs
    • 3.1.4.11. Mini-LEDs
    • 3.1.4.12. Global market size
  • 3.1.5. Energy Storage and Conversion Devices
    • 3.1.5.1. Lithium-Ion Batteries
    • 3.1.5.2. Supercapacitors
    • 3.1.5.3. Thin-Film Batteries
    • 3.1.5.4. Microbatteries
    • 3.1.5.5. Microfluidic Fuel Cells
    • 3.1.5.6. Piezoelectric Energy Harvesters
    • 3.1.5.7. Thermoelectric Energy Harvesters
    • 3.1.5.8. Hybrid Energy Storage Systems
    • 3.1.5.9. Photovoltaic (PV) Cells
    • 3.1.5.10. Printed Batteries
    • 3.1.5.11. Flexible Batteries
    • 3.1.5.12. Global market size
• 3.2. ELECTRONIC CIRCUITS AND ARCHITECTURES
  • 3.2.1. Integrated Circuits (ICs)
    • 3.2.1.1. System-on-Chip (SoC)
    • 3.2.1.2. 3D Integrated Circuits
    • 3.2.1.3. Neuromorphic Circuits
    • 3.2.1.4. Quantum Integrated Circuits
    • 3.2.1.5. Heterogeneous Integration
    • 3.2.1.6. Monolithic 3D Integration
    • 3.2.1.7. Global market size
  • 3.2.2. Microprocessors and Microcontrollers
    • 3.2.2.1. Types
    • 3.2.2.2. Global market size
  • 3.2.3. Memory Architectures
    • 3.2.3.1. Dynamic RAM (DRAM)
      • 3.2.3.1.1. High Bandwidth Memory (HBM)
      • 3.2.3.1.2. 4F2 DRAM
      • 3.2.3.1.3. Monolithic 3D DRAM
      • 3.2.3.1.4. DDR4-to-DDR5
    • 3.2.3.2. Hybrid Memory Cube (HMC
    • 3.2.3.3. Static RAM (SRAM)
    • 3.2.3.4. Flash Memory
    • 3.2.3.5. Resistive RAM (ReRAM)
    • 3.2.3.6. Phase-Change Memory (PCM)
    • 3.2.3.7. Ferroelectric RAM (FeRAM)
    • 3.2.3.8. Magnetoresistive RAM (MRAM)
    • 3.2.3.9. Global market size
  • 3.2.4. Interconnects and Packaging
    • 3.2.4.1. Wafer Level Packaging
      • 3.2.4.1.1. Wafer Level Fan-Out Packaging
        • 3.2.4.1.1.1. Overview
        • 3.2.4.1.1.2. Advantages
        • 3.2.4.1.1.3. Applications
      • 3.2.4.1.2. Wafer Level Fan-In Packaging
        • 3.2.4.1.2.1. Overview
        • 3.2.4.1.2.2. Advantages
        • 3.2.4.1.2.3. Applications
      • 3.2.4.1.3. Other Types of WLP
        • 3.2.4.1.3.1. Cu-Pillar Flip Chip
        • 3.2.4.1.3.2. Embedded Wafer Level BGA (eWLB)
        • 3.2.4.1.3.3. Chip-last FO-WLP
        • 3.2.4.1.3.4. Wafer-on-Wafer (WoW)
    • 3.2.4.2. Flip-Chip Packaging
    • 3.2.4.3. Chiplets
      • 3.2.4.3.1. AMD EPYC and Ryzen processor families
      • 3.2.4.3.2. Disaggregation Needs
    • 3.2.4.4. Advanced Substrates
    • 3.2.4.5. 2.5D packaging
      • 3.2.4.5.1. Silicon Interposer 2.5D
        • 3.2.4.5.1.1. Through Si Via (TSV)
        • 3.2.4.5.1.2. (SiO2) based redistribution layers (RDLs)
      • 3.2.4.5.2. 2.5D Organic-based packaging
        • 3.2.4.5.2.1. Chip-first and chip-last fan-out packaging
        • 3.2.4.5.2.2. Organic substrates
        • 3.2.4.5.2.3. Organic RDL
      • 3.2.4.5.3. 2.5D glass-based packaging
        • 3.2.4.5.3.1. Benefits
        • 3.2.4.5.3.2. Glass Si interposers in advanced packaging
        • 3.2.4.5.3.3. Glass material properties
        • 3.2.4.5.3.4. 2/2 micrometer-m line/space metal pitch on glass substrates
        • 3.2.4.5.3.5. 3D Glass Panel Embedding (GPE) packaging
        • 3.2.4.5.3.6. Thermal management
        • 3.2.4.5.3.7. Polymer dielectric films
      • 3.2.4.5.4. 2.5D vs. 3D Packaging
        • 3.2.4.5.4.1. Benefits
        • 3.2.4.5.4.2. Challenges
        • 3.2.4.5.4.3. Trends
        • 3.2.4.5.4.4. Market players
      • 3.2.4.6. 3D packaging
        • 3.2.4.6.1. Conventional 3D packaging
        • 3.2.4.6.2. Advanced 3D Packaging with through-silicon vias (TSVs)
        • 3.2.4.6.3. Three-dimensional (3D) hybrid bonding
          • 3.2.4.6.3.1. Devices using hybrid bonding
        • 3.2.4.6.4. 3D Microbump technology
          • 3.2.4.6.4.1. Technologies
          • 3.2.4.6.4.2. Challenges
          • 3.2.4.6.4.3. Bumpless copper-to-copper (Cu-Cu) hybrid bonding
        • 3.2.4.6.5. Trends
      • 3.2.4.7. Monolithic 3D
        • 3.2.4.7.1. Transitioning from 2D Systems
        • 3.2.4.7.2. Motivation for developing monolithic 3D manufacturing
        • 3.2.4.7.3. Improved M3D Interconnect Density
        • 3.2.4.7.4. Heterogenous 3D vs Monolithic 3D
        • 3.2.4.7.5. 2D Materials
    • 3.2.4.8. Global market size
• 3.3. SYSTEM DESIGN AND APPLICATION
  • 3.3.1. Embedded Systems
  • 3.3.2. Internet of Things (IoT) Systems
  • 3.3.3. Wearable and Implantable Systems
• 3.4. OTHER TECHNOLOGIES
  • 3.4.1. Spintronics
    • 3.4.1.1. Overview
    • 3.4.1.2. Applications
    • 3.4.1.3. Companies
  • 3.4.2. Molecular Electronics
    • 3.4.2.1. Overview
    • 3.4.2.2. Applications
    • 3.4.2.3. Companies
  • 3.4.3. Neuromorphic Computing
    • 3.4.3.1. Overview
    • 3.4.3.2. Applications
    • 3.4.3.3. Companies
  • 3.4.4. 3D printed electronics
    • 3.4.4.1. Overview
    • 3.4.4.2. Applications
    • 3.4.4.3. Companies

4. MARKET ANALYSIS

• 4.1. Industry 4.0 and Smart Manufacturing
• 4.2. Integration with Artificial Intelligence (AI)
• 4.3. Internet of Things (IoT) and Connected Devices
• 4.4. Consumer Electronics
  • 4.4.1. Trends
  • 4.4.2. Markets and applications
    • 4.4.2.1. Smartphones
    • 4.4.2.2. Tablets and laptops
    • 4.4.2.3. Wearables
      • 4.4.2.3.1. Wrist-worn wearables
        • 4.4.2.3.1.1. Sensing
        • 4.4.2.3.1.2. Actuating
      • 4.4.2.3.2. Health monitoring
      • 4.4.2.3.3. Sports and fitness
        • 4.4.2.3.3.1. Wearable devices and apparel
        • 4.4.2.3.3.2. Skin patches
        • 4.4.2.3.3.3. Products
      • 4.4.2.3.4. Hearables
        • 4.4.2.3.4.1. Assistive Hearables
        • 4.4.2.3.4.2. Biometric Monitoring
        • 4.4.2.3.4.3. Health & Fitness Hearables
        • 4.4.2.3.4.4. Multimedia Hearables
        • 4.4.2.3.4.5. Artificial Intelligence (AI)
        • 4.4.2.3.4.6. Companies and products
      • 4.4.2.3.5. Sleep trackers and wearable monitors
        • 4.4.2.3.5.1. Built in function in smart watches and fitness trackers
        • 4.4.2.3.5.2. Smart rings
        • 4.4.2.3.5.3. Headbands
        • 4.4.2.3.5.4. Sleep monitoring devices
        • 4.4.2.3.5.5. Companies and products
      • 4.4.2.3.6. VR and AR headsets
      • 4.4.2.3.7. Companies
    • 4.4.2.4. E-Textiles
      • 4.4.2.4.1. Embedded e-textiles
      • 4.4.2.4.2. Laminated e-textiles
    • 4.4.2.5. Home appliances
  • 4.4.3. Global market size
• 4.5. Computing and Data Storage
  • 4.5.1. Microprocessors
    • 4.5.1.1. Trends
    • 4.5.1.2. Markets and applications
    • 4.5.1.3. Companies
  • 4.5.2. Memory devices
    • 4.5.2.1. NAND flash and DRAM memory
    • 4.5.2.2. Solid-State Drive (SSD) and Memory Module
    • 4.5.2.3. Hybrid bonding
    • 4.5.2.4. Monolithic 3D DRAM
    • 4.5.2.5. Stand-Alone NOR Flash
    • 4.5.2.6. Emerging Non-Volatile Memory Technologies
    • 4.5.2.7. Other Memory Technologies
    • 4.5.2.8. Markets and applications
    • 4.5.2.9. Companies
  • 4.5.3. Global market size
• 4.6. Communications (5G and 6G)
  • 4.6.1. Trends
  • 4.6.2. Markets and applications
    • 4.6.2.1. Wireless communication systems
    • 4.6.2.2. Networking devices
    • 4.6.2.3. Optical communications
    • 4.6.2.4. 5G and Beyond
    • 4.6.2.5. Photonic Integrated Circuits (PICs)
    • 4.6.2.6. Quantum Communication
    • 4.6.2.7. Energy Harvesting
  • 4.6.3. Global market size
• 4.7. Automotive Electronics
  • 4.7.1. Trends
  • 4.7.2. Markets and applications
    • 4.7.2.1. Advanced driver assistance systems (ADAS)
    • 4.7.2.2. Displays
      • 4.7.2.2.1. Infotainment systems
      • 4.7.2.2.2. Instrument cluster displays
      • 4.7.2.2.3. Head-Up Displays (HUD)
      • 4.7.2.2.4. Flexible and curved displays
      • 4.7.2.2.5. Smart mirrors and pillar displays
      • 4.7.2.2.6. 3D displays
      • 4.7.2.2.7. Transparent displays
      • 4.7.2.2.8. Micro and MiniLED displays
    • 4.7.2.3. Sensors
  • 4.7.3. Global market size
• 4.8. Aerospace and Defense
  • 4.8.1. Trends
  • 4.8.2. Markets and applications
    • 4.8.2.1. Avionics
    • 4.8.2.2. Navigation Systems
    • 4.8.2.3. Radar Systems
    • 4.8.2.4. Satellite Communication
  • 4.8.3. Global market size
• 4.9. Healthcare and Biomedical
  • 4.9.1. Trends
  • 4.9.2. Markets and applications
    • 4.9.2.1. Medical Imaging
    • 4.9.2.2. Biosensors
    • 4.9.2.3. Medical Wearables
      • 4.9.2.3.1. Wearable and health monitoring and rehabilitation
        • 4.9.2.3.1.1. Companies and products
      • 4.9.2.3.2. Electronic skin patches
      • 4.9.2.3.3. Temperature and respiratory rate monitoring
        • 4.9.2.3.3.1. Companies and products
      • 4.9.2.3.4. Continuous glucose monitoring (CGM)
      • 4.9.2.3.5. Minimally-invasive CGM sensors
      • 4.9.2.3.6. Non-invasive CGM sensors
        • 4.9.2.3.6.1. Commercial devices
        • 4.9.2.3.6.2. Companies and products
      • 4.9.2.3.7. Cardiovascular monitoring
        • 4.9.2.3.7.1. ECG sensors
        • 4.9.2.3.7.2. Companies and products
        • 4.9.2.3.7.3. PPG sensors
          • 4.9.2.3.7.3.1. Companies and products
      • 4.9.2.3.8. Pregnancy and newborn monitoring
        • 4.9.2.3.8.1. Companies and products
      • 4.9.2.3.9. Hydration sensors
        • 4.9.2.3.9.1. Companies and products
      • 4.9.2.3.10. Wearable sweat sensors (medical and sports)
        • 4.9.2.3.10.1. Companies and products
      • 4.9.2.3.11. Wearable drug delivery
        • 4.9.2.3.11.1. Companies and products
    • 4.9.2.4. Implantable Devices
  • 4.9.3. Global market size
• 4.10. Energy and Power
  • 4.10.1. Trends
  • 4.10.2. Markets and applications
    • 4.10.2.1. Solar Cells
    • 4.10.2.2. Energy Harvesting Devices
    • 4.10.2.3. Power Management Systems
  • 4.10.3. Global market size
• 4.11. Industrial Automation
  • 4.11.1. Trends
  • 4.11.2. Markets and applications
    • 4.11.2.1. Industrial Control Systems
    • 4.11.2.2. Robotics
    • 4.11.2.3. Automation Equipment
  • 4.11.3. Global market size
• 4.12. Internet of Things (IoT)
  • 4.12.1. Trends
  • 4.12.2. Markets and applications
    • 4.12.2.1. Smart homes
    • 4.12.2.2. Smart cities
    • 4.12.2.3. Connected devices
    • 4.12.2.4. Sensor networks
  • 4.12.3. Global market size
• 4.13. Optoelectronics
  • 4.13.1. Trends
  • 4.13.2. Markets and applications
    • 4.13.2.1. Displays
      • 4.13.2.1.1. Organic LCDs (OLCDs)
      • 4.13.2.1.2. Flexible AMOLEDs
      • 4.13.2.1.3. Perovskite OLEDs
      • 4.13.2.1.4. Flexible PMOLED (Passive Matrix OLED)
      • 4.13.2.1.5. Flexible and foldable microLED
      • 4.13.2.1.6. Quantum dots
      • 4.13.2.1.7. Metamaterials
      • 4.13.2.1.8. Global market size
    • 4.13.2.2. Lighting
      • 4.13.2.2.1. Overview
      • 4.13.2.2.2. Global market size
    • 4.13.2.3. Photonics
      • 4.13.2.3.1. Overview
      • 4.13.2.3.2. Global market size
    • 4.13.2.4. Optical interconnects
      • 4.13.2.4.1. Overview
      • 4.13.2.4.2. Global market size
• 4.14. Green and Sustainable Electronics
  • 4.14.1. Trends
  • 4.14.2. Markets and applications
  • 4.14.3. Global market size
    • 4.14.3.1. Sustainable PCBs
    • 4.14.3.2. Sustainable ICs
• 4.15. Smart Packaging Electronics
  • 4.15.1. Trends
  • 4.15.2. Markets and applications
  • 4.15.3. Global market size

5. COMPANY PROFILES (967 company profiles)

6. REFERENCES