세계의 6G 시장(2026-2046년)

The global 6G market represents a transformational opportunity evolving from experimental deployments in 2026 through explosive commercial growth during 2030-2031 launch phases, before moderating to sustainable expansion as markets mature through 2046. This evolution reflects fundamental reimagining of wireless infrastructure driven by AI-native network architectures, distributed intelligence through Reconfigurable Intelligent Surfaces, and value-based connectivity models replacing traditional volume-driven pricing. Market composition shifts dramatically throughout the forecast period. Infrastructure hardware dominates early phases but services and devices progressively capture larger shares as the industry transitions from capital-intensive buildouts to recurring managed services, edge computing platforms, and mass-market device adoption. The services transformation proves particularly significant as operators successfully monetize AI-driven optimization, network slicing, and application enablement platforms generating predictable subscription revenues that eventually exceed infrastructure equipment spending.

Technology innovation fundamentally reshapes network economics. Reconfigurable Intelligent Surfaces revolutionize coverage extension through passive signal manipulation costing fractions of traditional base station deployments. Sub-terahertz components, thermal management solutions, and advanced materials address extreme technical challenges of operating at frequencies substantially higher than 5G, creating substantial opportunities for specialized component manufacturers and materials suppliers. Application diversity validates 6G's value proposition across multiple verticals. Enterprise automation, healthcare telemedicine, autonomous vehicles, extended reality experiences, and massive IoT deployments demonstrate compelling use cases that justify infrastructure investments. Industrial and enterprise applications drive early adoption with willingness to pay premium pricing for guaranteed ultra-low latency and reliability, while consumer applications accelerate later as device ecosystems mature and mass-market economics enable broad adoption.

The global 6G communications market is experiencing a transformative convergence of artificial intelligence and wireless infrastructure, exemplified by Nvidia's landmark $1 billion investment in Nokia and their strategic partnership to develop next-generation 6G cellular technology. This collaboration represents far more than a financial transaction-it signals the telecommunications industry's fundamental architectural shift toward AI-native networks where machine learning algorithms are embedded throughout every layer of the network stack, from physical layer signal processing to autonomous network orchestration.

The strategic importance of AI integration stems from 6G's unprecedented complexity. Operating at frequencies from 7 GHz through sub-terahertz bands (100-300 GHz), 6G networks must coordinate massive MIMO antenna arrays with thousands of elements, orchestrate hybrid terrestrial-satellite networks, and dynamically configure metamaterial RIS panels containing thousands of individually controllable elements. Manual network optimization at this scale proves impossible; only AI systems capable of processing vast sensor data streams and making microsecond-level decisions can achieve 6G's ambitious targets: peak rates exceeding 1 Tbps, latency below 100 microseconds, and energy efficiency 100 times greater than 5G.

"The Global 6G Market 2026-2046" provides authoritative intelligence on the emerging sixth-generation wireless communications market, delivering comprehensive analysis of technology roadmaps, market forecasts, enabling materials, and competitive dynamics shaping this $830 billion opportunity. This 380-page plus report addresses critical questions facing telecommunications operators, equipment vendors, semiconductor manufacturers, materials suppliers, and investors seeking to capitalize on the transformative shift from 5G to 6G networks expected to commercialize between 2028-2030.

The report delivers granular market forecasts segmented by infrastructure type (base stations, reconfigurable intelligent surfaces, customer premises equipment), devices (smartphones, AR/VR headsets, automotive modules, IoT sensors), components and materials (RF front-end semiconductors, advanced substrates, thermal management solutions), and services (network deployment, managed operations, edge computing platforms). Geographic analysis covers North America, Asia Pacific (China, Japan, South Korea, India), Europe, and emerging markets, with detailed assessment of regional deployment strategies, government funding initiatives, and spectrum allocation progress.

Extensive technical analysis evaluates critical enabling technologies including sub-terahertz semiconductors (InP, GaN, SiGe), reconfigurable intelligent surfaces and metamaterials, massive MIMO and cell-free architectures, AI-native network optimization, zero-energy devices and ambient backscatter communications, advanced packaging approaches (antenna-in-package, antenna-on-chip), and thermal management solutions addressing extreme heat dissipation challenges at 100-300 GHz frequencies. The report identifies technology readiness levels, development bottlenecks, and commercialization timelines for each critical component.

Market driver analysis examines application opportunities across autonomous vehicles, industrial automation, healthcare telemedicine, extended reality experiences, holographic communications, and persistent AR overlays-quantifying bandwidth requirements, latency constraints, and revenue potential for each vertical. Competitive landscape assessment profiles strategies of leading equipment vendors (Huawei, Nokia, Ericsson, Samsung), semiconductor manufacturers (Qualcomm, NXP, Renesas), innovative antenna and metamaterial specialists, and telecommunications operators planning 6G deployments.

Sustainability analysis addresses 6G's ambitious target of 100x improved energy efficiency versus 5G baseline, evaluating power consumption roadmaps, renewable energy integration strategies, and carbon footprint reduction pathways essential for environmental and economic viability. The report incorporates primary research from industry stakeholders, technical publications from standards bodies (3GPP, ITU-R), government research programs, patent analysis, and academic research, providing evidence-based projections through 2046.

Report Contents Include:

• Market Analysis & Forecasts:
  • Global 6G market revenue forecasts 2026-2046 with annual projections
  • Infrastructure market segmentation by deployment location and region
  • Device market forecasts by category with unit shipment projections
  • Components and materials market analysis by technology type
  • Services market evolution and recurring revenue opportunities
  • Application-specific market sizing across 10+ vertical segments
  • Regional market analysis with country-level detail for major markets
• Technology Assessment:
  • 6G radio system architecture and performance targets
  • Semiconductor technology comparison (InP, GaN, GaAs, SiGe, CMOS)
  • Reconfigurable intelligent surfaces (RIS) and metamaterial roadmaps
  • Phased array antenna technologies and packaging approaches
  • Advanced materials enabling 6G (low-loss dielectrics, thermal management)
  • MIMO evolution from massive to cell-free architectures
  • Zero-energy devices and battery elimination strategies
  • Non-terrestrial networks (satellites, HAPS, drones) integration
• Strategic Intelligence:
  • Government 6G programs and funding initiatives by country
  • Spectrum allocation status and World Radiocommunication Conference roadmap
  • Standards development timeline and technology readiness assessment
  • Competitive positioning of major equipment vendors and semiconductor suppliers
  • Deployment strategies comparing standalone versus non-standalone approaches
  • Open RAN evolution and regional adoption strategies
  • Sustainability targets and power efficiency improvement roadmaps
• Application Analysis:
  • Connected autonomous vehicle systems and cooperative perception
  • Industrial automation and Industry 4.0 applications
  • Healthcare solutions including remote surgery and patient monitoring
  • Extended reality (AR/VR/MR) market opportunities
  • Holographic communications technical requirements and market sizing
  • Persistent AR overlays and ambient intelligence infrastructure
  • Real-time digital twins for manufacturing and infrastructure
• Materials & Components:
  • Advanced substrate materials (LTCC, LCP, glass) for low-loss propagation
  • Thermal management solutions (phase change materials, graphene, diamond)
  • Metamaterials for RIS and electromagnetic manipulation
  • Transparent conductive materials for building-integrated deployments
  • Energy harvesting technologies for zero-power IoT devices
  • Packaging technologies (antenna-in-package, 3D integration)
  • Optical components for fiber-wireless convergence
• Companies Profiled include: AALTO HAPS, AGC Japan, Alcan Systems, Alibaba China, Alphacore, Ampleon, Apple, Atheraxon, Commscope, Echodyne, Ericsson, Fractal Antenna Systems, Freshwave, Fujitsu, Greenerwave, Huawei, Kymeta, Kyocera, LATYS Intelligence, LG Electronics, META, NEC Corporation, Nokia, NTT DoCoMo, NXP Semiconductors, NVIDIA, Omniflow, Orange France, Panasonic, Picocom, Pivotal Commware, Plasmonics, Qualcomm, Radi-Cool, Renesas Electronics Corporation, Samsung, Sekisui, SensorMetrix, SK telecom, Solvay, Sony, Teraview, TMYTEK, Vivo Mobile Communications, and ZTE.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

• 1.1. From 1G to 6G
• 1.2. The AI-Native 6G Revolution
• 1.3. Evolution from 5G Networks
  • 1.3.1. Limitations with 5G
  • 1.3.2. Benefits of 6G
  • 1.3.3. Advanced materials in 6G
  • 1.3.4. Recent hardware developments
• 1.4. The 6G Market in 2025
  • 1.4.1. Regional Market Activity
  • 1.4.2. Investment Landscape
  • 1.4.3. Market Constraints in 2025
• 1.5. Market outlook for 6G
  • 1.5.1. Growth of Mobile Traffic
    • 1.5.1.1. Optimistic Scenario
    • 1.5.1.2. Conservative Scenario
    • 1.5.1.3. Regional Divergence
    • 1.5.1.4. Implications for 6G
  • 1.5.2. Proliferation in Consumer Technology
    • 1.5.2.1. Smartphone Evolution
    • 1.5.2.2. Beyond Smartphones
  • 1.5.3. Industrial and Enterprise Transformation
  • 1.5.4. Economic Competitiveness
  • 1.5.5. Sustainability
    • 1.5.5.1. Energy Efficiency Imperative
• 1.6. Market drivers and trends
• 1.7. Market challenges and bottlenecks
  • 1.7.1. Critical Bottlenecks
• 1.8. Key Conclusions for 6G Communications Systems and Hardware
• 1.9. Roadmap
  • 1.9.1. Critical Path Analysis
• 1.10. Global Market Revenues to 2046
  • 1.10.1. 6G Infrastructure Market by Deployment Location
  • 1.10.2. 6G Infrastructure Market by Region
  • 1.10.3. 6G Base Station Market
  • 1.10.4. Reconfigurable Intelligent Surfaces (RIS) Market
  • 1.10.5. 6G Thermal Management Market
  • 1.10.6. 6G Application Markets
  • 1.10.7. 6G Device Market Forecast by Category
  • 1.10.8. 6G Components & Materials Market
  • 1.10.9. 6G Services Market
• 1.11. Applications
  • 1.11.1. Connected Autonomous Vehicle Systems
  • 1.11.2. Next Generation Industrial Automation
  • 1.11.3. Healthcare Solutions
  • 1.11.4. Immersive Extended Reality Experiences
• 1.12. Geographical Markets for 6G
  • 1.12.1. North America
  • 1.12.2. Asia Pacific
    • 1.12.2.1. China
    • 1.12.2.2. Japan
    • 1.12.2.3. South Korea
    • 1.12.2.4. India
  • 1.12.3. Europe
• 1.13. Main Market Players
• 1.14. 6G Projects by Country
• 1.15. Sustainability in 6G

2. INTRODUCTION

• 2.1. What is 6G?
• 2.2. Evolving Mobile Communications
• 2.3. 5G deployment
  • 2.3.1. Motivation for 6G
  • 2.3.2. Growth in Mobile Data Traffic
    • 2.3.2.1. Growth of Mobile Traffic Slows
  • 2.3.3. Future of Traffic
    • 2.3.3.1. Continued Exponential Growth (Optimist View)
    • 2.3.3.2. Structural Deceleration (Realist View)
    • 2.3.3.3. Plateau and Decline (Pessimist View)
  • 2.3.4. Traffic Growth Plateau in China
  • 2.3.5. Video Streaming
• 2.4. Multi-Dimensional Value Proposition
• 2.5. Potential 6G High-Value Applications
  • 2.5.1. Holographic Communication
  • 2.5.2. Persistent AR Overlays
  • 2.5.3. Cooperative Perception for Autonomous Systems
  • 2.5.4. Real-Time Digital Twins
• 2.6. Applications and Required Bandwidths
• 2.7. Artificial Intelligence's impact on network traffic
  • 2.7.1. AI Workload: On-Device vs Cloud
• 2.8. Autonomous vehicles
  • 2.8.1. Autonomous Vehicle Communications
  • 2.8.2. Cooperative Perception
  • 2.8.3. Vehicle platooning
• 2.9. 6G Rollout Timeline
  • 2.9.1. Regional Deployment Timeline
• 2.10. 6G Spectrum
  • 2.10.1. 6G Candidate Spectrum Bands
  • 2.10.2. Bands vs Bandwidth
  • 2.10.3. Bandwidth-Coverage Tradeoff
  • 2.10.4. 6G Spectrum and Deployment
    • 2.10.4.1. Economic Deployment Model
      • 2.10.4.1.1. Phase 1: Evolutionary 6G (2029-2034)
      • 2.10.4.1.2. Phase 2: Revolutionary 6G (2034-2040+)
• 2.11. Frequencies Beyond 100GHz
  • 2.11.1. Atmospheric Absorption Windows
  • 2.11.2. Sub-THz Application Viability
  • 2.11.3. 6G Applications
• 2.12. Technology Interdependencies
• 2.13. Global Trends

3. 6G RADIO SYSTEMS

• 3.1. Technical Targets for High Data-Rate 6G Radios
• 3.2. 6G Transceiver Architecture
• 3.3. Technical Elements in 6G Radio Systems
• 3.4. Bandwidth and Modulation
• 3.5. Bandwidth Requirements for Supporting 100 Gbps - 1 Tbps Radios
  • 3.5.1. Practical Bandwidth Allocation
• 3.6. Bandwidth and MIMO
• 3.7. 6G Radio Performance
• 3.8. Beyond 100 Gbps
• 3.9. Radio Link Range vs System Gain
• 3.10. Hardware Gap
• 3.11. Saturated Output Power vs Frequency
• 3.12. Power consumption
  • 3.12.1. Power Consumption of PA Scale with Frequency
  • 3.12.2. Power Consumption on the Transceiver Side (1, 2, 3)
    • 3.12.2.1. Receive Chain Power Analysis

4. BASE STATIONS AND NON-TERRESTRIAL NETWORKS

• 4.1. UM-MIMO and Vanishing Base Stations
  • 4.1.1. Sequence
  • 4.1.2. RIS-Enabled, Self-Powered 6G UM-MIMO Base Station Design
    • 4.1.2.1. System Architecture
    • 4.1.2.2. Power Management
    • 4.1.2.3. Performance Characteristics
  • 4.1.3. Base Station Power and Cooling
    • 4.1.3.1. Power Consumption Drivers
    • 4.1.3.2. Economic and Environmental Impact
    • 4.1.3.3. Solutions and Mitigation Strategies
  • 4.1.4. Semiconductor Technologies for 6G Base Stations
    • 4.1.4.1. Power Amplifiers
    • 4.1.4.2. Transceivers and Beamformers
    • 4.1.4.3. Baseband Processing
    • 4.1.4.4. RIS Control
  • 4.1.5. Base Station and MIMO Technology Advances
    • 4.1.5.1. Integrated Active Antenna Systems
    • 4.1.5.2. Open RAN Architecture
    • 4.1.5.3. AI and Machine Learning Integration
    • 4.1.5.4. Network Slicing
    • 4.1.5.5. Edge Computing Integration
• 4.2. Satellites and Drones
  • 4.2.1. How Satellites Benefit from 6G
  • 4.2.2. How 6G Benefits from Satellites
  • 4.2.3. Drone Integration Benefits
• 4.3. Internet of Drones
  • 4.3.1. Network Architecture
  • 4.3.2. Technical Challenges
  • 4.3.3. Market Outlook
• 4.4. High Altitude Platform Stations (HAPS)
  • 4.4.1. HAPS Platforms
  • 4.4.2. Communications Payload
  • 4.4.3. Advantages
  • 4.4.4. Challenges
  • 4.4.5. Status and Timeline
• 4.5. 6G Non-Terrestrial Networks (NTN)
  • 4.5.1. Connectivity Gap
    • 4.5.1.1. Dimensions of the Gap
    • 4.5.1.2. Quantification
    • 4.5.1.3. Regional Characteristics
  • 4.5.2. Development of LEO NTNs
    • 4.5.2.1. Major Constellations
    • 4.5.2.2. Technology Evolution
  • 4.5.3. NTN Technologies
    • 4.5.3.1. Geostationary Orbit (GEO) Satellites
    • 4.5.3.2. Medium Earth Orbit (MEO) Satellites
    • 4.5.3.3. Low Earth Orbit (LEO) Satellites
    • 4.5.3.4. Very Low Earth Orbit (VLEO)
  • 4.5.4. HAPS vs LEO vs GEO
    • 4.5.4.1. Deployment Speed and Flexibility
    • 4.5.4.2. Operational Complexity
    • 4.5.4.3. Coverage Characteristics
    • 4.5.4.4. Economic Models
  • 4.5.5. Direct to Cell (D2C)
    • 4.5.5.1. Technical Challenge
    • 4.5.5.2. Satellite Solutions
    • 4.5.5.3. Performance Expectations
    • 4.5.5.4. Market Positioning
  • 4.5.6. NTNs for D2C
    • 4.5.6.1. Link Budget Components
    • 4.5.6.2. HAPS Analysis
    • 4.5.6.3. LEO Analysis
    • 4.5.6.4. MEO and GEO Analysis
  • 4.5.7. Technologies for Non-Terrestrial Networks
    • 4.5.7.1. Satellite Bus and Platform Technologies
    • 4.5.7.2. Phased Array Antennas
    • 4.5.7.3. Satellite Payload Processing
    • 4.5.7.4. Inter-Satellite Optical Links
    • 4.5.7.5. Ground Segment Infrastructure

5. SEMICONDUCTORS FOR 6G

• 5.1. Introduction
• 5.2. RF Transistors Performance
• 5.3. Si-based Semiconductors
  • 5.3.1. CMOS
    • 5.3.1.1. Bulk vs SOI
    • 5.3.1.2. SiGe
• 5.4. GaAs and GaN
  • 5.4.1. GaN's Opportunity in 6G
  • 5.4.2. GaN-on-Si, SiC or Diamond for RF
  • 5.4.3. GaAs Positioning in 6G
  • 5.4.4. State-of-the-Art GaAs Based Amplifier
  • 5.4.5. GaAs vs GaN for RF Power Amplifiers
  • 5.4.6. Power Amplifier Technology Benchmarking
• 5.5. InP (Indium Phosphide)
  • 5.5.1. InP HEMT vs InP HBT
    • 5.5.1.1. InP Opportunities for 6G
  • 5.5.2. Heterogeneous Integration of InP with SiGe BiCMOS
• 5.6. Semiconductor Challenges for THz Communications
  • 5.6.1. Mitigation Strategies
• 5.7. Semiconductor Supply Chain

6. PHASE ARRAY ANTENNAS FOR 6G

• 6.1. Key 6G Antenna Requirements
• 6.2. Challenges in mmWave Phased Array Systems
  • 6.2.1. Primary Challenges
• 6.3. Antenna Architectures
• 6.4. Challenges in 6G Antennas
• 6.5. Power and Antenna Array Size
• 6.6. 5G Phased Array Antenna
• 6.7. Antenna Manufacturers
• 6.8. Technology Benchmarking
• 6.9. GHz Phased Array
• 6.10. Antenna Types
• 6.11. Phased Array Modules
  • 6.11.1. Technology Readiness Assessment

7. ADVANCED PACKAGING FOR 6G

• 7.1. Evolution Drivers
• 7.2. Packaging Requirements
  • 7.2.1. Electrical Performance Demands
  • 7.2.2. Thermal Management Imperatives
• 7.3. Antenna Packaging Technology Options
  • 7.3.1. Technology Selection Criteria
• 7.4. mmWave Antenna Integration
  • 7.4.1. Antenna-on-Board (AoB)
  • 7.4.2. Antenna-in-Package (AiP)
  • 7.4.3. Antenna-on-Chip (AoC)
  • 7.4.4. Performance Analysis
• 7.5. Next Generation Phased Array Targets
  • 7.5.1. System-Level Requirements Translation
  • 7.5.2. Technology Roadmap Implications
• 7.6. Antenna Packaging vs Operational Frequency
  • 7.6.1. Frequency-Dependent Loss Mechanisms
• 7.7. Integration Technologies
  • 7.7.1. Performance vs Cost
  • 7.7.2. Flexibility vs Optimization
• 7.8. Approaches to Integrate InP on CMOS
  • 7.8.1. Integration Challenge
  • 7.8.2. Die-to-Die Hybrid Assembly
  • 7.8.3. Wafer-Level Bonding
  • 7.8.4. Epitaxial Transfer
• 7.9. Antenna Integration Challenges
  • 7.9.1. Dimensional Tolerance Requirements
  • 7.9.2. Thermal Management Scaling
  • 7.9.3. Manufacturing Yield Economics
• 7.10. Substrate Materials for AiP
• 7.11. Antenna on Chip (AoC) for 6G
• 7.12. Evolution of Hardware Components from 5G to 6G

8. MATERIALS AND TECHNOLOGIES FOR 6G

• 8.1. Material Challenge Domains
  • 8.1.1. Material Property Interdependencies
• 8.2. 6G ZED Compounds and Carbon Allotropes
• 8.3. Thermal Cooling and Conductor Materials
• 8.4. Thermal Metamaterials for 6G
• 8.5. Ionogels for 6G
• 8.6. Advanced Heat Shielding and Thermal Insulation
• 8.7. Low-Loss Dielectrics
• 8.8. Optical and Sub-THz 6G Materials
• 8.9. Materials for Metamaterial-Based 6G RIS
• 8.10. Electrically-Functionalized Transparent Glass for 6G OTA, T-RIS
  • 8.10.1. Transparent Conductive Oxides (TCO)
  • 8.10.2. Metal Meshes
  • 8.10.3. Printed Silver Nanowires
  • 8.10.4. Graphene
• 8.11. Low-Loss Materials for mmWave and THz
• 8.12. Inorganic Compounds
  • 8.12.1. Overview
  • 8.12.2. Materials
• 8.13. Elements
  • 8.13.1. Overview
  • 8.13.2. Materials
• 8.14. Organic Compounds
  • 8.14.1. Overview
  • 8.14.2. Materials
• 8.15. 6G Dielectrics
  • 8.15.1. Overview
  • 8.15.2. Companies
  • 8.15.3. SWOT Analysis
• 8.16. Metamaterials
  • 8.16.1. Overview
  • 8.16.2. Metamaterials for RIS in Telecommunication
    • 8.16.2.1. RIS Operating Principles
  • 8.16.3. RIS Performance and Economics
    • 8.16.3.1. Passive Beamforming
    • 8.16.3.2. Hybrid Beamforming with RIS
    • 8.16.3.3. Adaptive Beamforming Techniques
  • 8.16.4. Applications
    • 8.16.4.1. Reconfigurable Antennas
    • 8.16.4.2. Wireless Sensing
    • 8.16.4.3. Wi-Fi/Bluetooth
    • 8.16.4.4. 5G and 6G Metasurfaces for Wireless Communications
      • 8.16.4.4.1. 5G Applications
      • 8.16.4.4.2. 6G Evolution
    • 8.16.4.5. Hypersurfaces
    • 8.16.4.6. Active Material Patterning
    • 8.16.4.7. Optical ENZ Metamaterials
    • 8.16.4.8. Liquid Crystal Polymers
      • 8.16.4.8.1. LCP Applications in 6G
• 8.17. Thermal Management
  • 8.17.1. Overview
  • 8.17.2. Thermal Materials and Structures for 6G
    • 8.17.2.1. Advanced Ceramics
    • 8.17.2.2. Diamond-based Materials
    • 8.17.2.3. Graphene and Carbon Nanotubes
    • 8.17.2.4. Phase Change Materials (PCMs)
    • 8.17.2.5. Advanced Polymers
    • 8.17.2.6. Metal Matrix Composites
    • 8.17.2.7. Two-Dimensional Materials
    • 8.17.2.8. Nanofluid Coolants
    • 8.17.2.9. Thermal Metamaterials
    • 8.17.2.10. Hydrogels
    • 8.17.2.11. Aerogels
    • 8.17.2.12. Pyrolytic Graphite
    • 8.17.2.13. Thermoelectrics
      • 8.17.2.13.1. Cooling Applications
      • 8.17.2.13.2. Energy Harvesting
• 8.18. Graphene and 2D Materials
  • 8.18.1. Overview
  • 8.18.2. Applications
    • 8.18.2.1. Supercapacitors, LiC and Pseudocapacitors
    • 8.18.2.2. Graphene Transistors
    • 8.18.2.3. Graphene THz Device Structures
• 8.19. Fiber Optics
  • 8.19.1. Overview
  • 8.19.2. Materials and Applications in 6G
    • 8.19.2.1. Key Optical Materials
    • 8.19.2.2. 6G Fiber-Wireless Architecture
• 8.20. Smart EM Devices
  • 8.20.1. Overview
  • 8.20.2. Technical Challenges
  • 8.20.3. Current Status
• 8.21. Photoactive Materials
  • 8.21.1. Overview
  • 8.21.2. Applications in 6G
    • 8.21.2.1. Optically-Controlled RIS
• 8.22. Silicon Carbide
  • 8.22.1. Overview
  • 8.22.2. Applications in 6G
    • 8.22.2.1. GaN-on-SiC Power Amplifiers
    • 8.22.2.2. Thermal Management
    • 8.22.2.3. RF Substrates
• 8.23. Phase-Change Materials
  • 8.23.1. Overview
  • 8.23.2. Applications in 6G
    • 8.23.2.1. Reconfigurable Metamaterials
    • 8.23.2.2. Reconfigurable Antennas
    • 8.23.2.3. RF Switches
      • 8.23.2.3.1. Commercialization Challenges
• 8.24. Vanadium Dioxide
  • 8.24.1. Overview
  • 8.24.2. Applications in 6G
    • 8.24.2.1. Ultrafast RF Switches
    • 8.24.2.2. Thermally-Triggered Devices
    • 8.24.2.3. Tunable Metamaterials
• 8.25. Micro-mechanics, MEMS and Microfluidics
  • 8.25.1. Overview
  • 8.25.2. Applications in 6G
    • 8.25.2.1. MEMS RF Switches
    • 8.25.2.2. MEMS Tunable Capacitors
    • 8.25.2.3. MEMS Phase Shifters
    • 8.25.2.4. Microfluidic Cooling
    • 8.25.2.5. Commercial Status
• 8.26. Solid State Cooling
  • 8.26.1. Overview
  • 8.26.2. Thermoelectric Cooling
  • 8.26.3. Electrocaloric and Magnetocaloric Cooling

9. MIMO FOR 6G

• 9.1. MIMO in Wireless Communications
  • 9.1.1. MIMO Evolution Timeline
• 9.2. Challenges with mMIMO
  • 9.2.1. Channel State Information Acquisition
  • 9.2.2. Computational Complexity
  • 9.2.3. Hardware Impairments
  • 9.2.4. Cost and Power Consumption
• 9.3. Distributed MIMO
  • 9.3.1. Architecture
  • 9.3.2. Benefits
  • 9.3.3. Challenges
• 9.4. Cell-free Massive MIMO (Large-Scale Distributed MIMO)
  • 9.4.1. Concept
  • 9.4.2. Network Topology
  • 9.4.3. Performance Benefits
• 9.5. 6G Massive MIMO
  • 9.5.1. Frequency-Specific Factors
  • 9.5.2. Processing Architecture
  • 9.5.3. AI/ML Integration
  • 9.5.4. Deployment Strategies
• 9.6. Cell-Free MIMO
  • 9.6.1. Cellular System Limitations
  • 9.6.2. Cell-Free Solutions
  • 9.6.3. Economic Considerations
  • 9.6.4. Interpretation
• 9.7. Benefits and Challenges of Cell-Free MIMO
  • 9.7.1. Benefits
  • 9.7.2. Challenges
• 9.8. Cell-Free Massive MIMO
  • 9.8.1. Overview
  • 9.8.2. Network MIMO (CoMP - Coordinated Multi-Point)
  • 9.8.3. Cell-Free mMIMO Distinctive Features
  • 9.8.4. Transition Strategy
  • 9.8.5. Commercial Readiness
  • 9.8.6. Market Projections

10. ZERO ENERGY DEVICES (ZED) AND BATTERY ELIMINATION

• 10.1. Overview
  • 10.1.1. Critical Success Factors
  • 10.1.2. Market Impact
• 10.2. ZED-Related Technology
  • 10.2.1. Technology Convergence
  • 10.2.2. Drivers for ZED and Battery-Free
    • 10.2.2.1. Operational Impossibility
    • 10.2.2.2. Economic Imperative
    • 10.2.2.3. Environmental Sustainability
    • 10.2.2.4. Reliability and Autonomy
    • 10.2.2.5. Lessons from Deployments
• 10.3. Zero-Energy and Battery-Free 6G
  • 10.3.1. Infrastructure
  • 10.3.2. Client Devices
• 10.4. Electricity consumption of wireless networks
  • 10.4.1. Network Energy Consumption Trends
  • 10.4.2. Energy Harvesting
• 10.5. Technologies
  • 10.5.1. On-Board Harvesting Technologies Compared and Prioritized
  • 10.5.2. 6G ZED Design Approaches
  • 10.5.3. Device Architecture
    • 10.5.3.1. System Integration
    • 10.5.3.2. Architecture Variants
  • 10.5.4. Energy Harvesting
    • 10.5.4.1. Power Management Optimization
    • 10.5.4.2. Transducer Efficiency
    • 10.5.4.3. Impedance Matching
  • 10.5.5. Device Battery-Free Storage
    • 10.5.5.1. Supercapacitors
    • 10.5.5.2. Lithium-Ion Capacitors (LIC)
    • 10.5.5.3. Selection Guidelines
    • 10.5.5.4. "Massless Energy" for ZED
      • 10.5.5.4.1. Performance
      • 10.5.5.4.2. 6G ZED Applications
      • 10.5.5.4.3. Challenges
      • 10.5.5.4.4. Status
  • 10.5.6. Ambient Backscatter Communications AmBC, Crowd Detectable CD-ZED, SWIPT
    • 10.5.6.1. Performance Characteristics
    • 10.5.6.2. 6G Integration
    • 10.5.6.3. Crowd Detectable CD-ZED
    • 10.5.6.4. Simultaneous Wireless Information and Power Transfer (SWIPT)
    • 10.5.6.5. Performance
• 10.6. 6G ZED Materials and Technologies
  • 10.6.1. Metamaterials
  • 10.6.2. IRS (Intelligent Reflecting Surfaces)
  • 10.6.3. RIS (Reconfigurable Intelligent Surfaces)
  • 10.6.4. Simultaneous Wireless Information and Power Transfer (SWIPT)
  • 10.6.5. Ambient Backscatter Communications (AmBC)
    • 10.6.5.1. Advanced AmBC Techniques
    • 10.6.5.2. 6G Native Integration
  • 10.6.6. Energy Harvesting for 6G
    • 10.6.6.1. Photovoltaics
      • 10.6.6.1.1. Technology Options
      • 10.6.6.1.2. Indoor Optimization
    • 10.6.6.2. Ambient RF
      • 10.6.6.2.1. Power Availability
      • 10.6.6.2.2. Rectifier Technology
      • 10.6.6.2.3. Multi-Band Harvesting
    • 10.6.6.3. Electrodynamic
      • 10.6.6.3.1. Characteristics
      • 10.6.6.3.2. Applications
    • 10.6.6.4. Piezoelectric materials
      • 10.6.6.4.1. Materials
      • 10.6.6.4.2. Harvester Designs
    • 10.6.6.5. Triboelectric nanogenerators (TENGs
      • 10.6.6.5.1. Operating Principle
      • 10.6.6.5.2. Performance
      • 10.6.6.5.3. 6G Applications
      • 10.6.6.5.4. Challenges
    • 10.6.6.6. Thermoelectric generators (TEGs)
      • 10.6.6.6.1. Performance
      • 10.6.6.6.2. Temperature Sources
      • 10.6.6.6.3. 6G ZED Applications
    • 10.6.6.7. Pyroelectric materials
      • 10.6.6.7.1. Mechanism
      • 10.6.6.7.2. Performance
      • 10.6.6.7.3. Applications
      • 10.6.6.7.4. Limitations
    • 10.6.6.8. Thermal Hydrovoltaic
      • 10.6.6.8.1. Mechanisms
      • 10.6.6.8.2. Performance
      • 10.6.6.8.3. Status
    • 10.6.6.9. Biofuel Cells
      • 10.6.6.9.1. Types
      • 10.6.6.9.2. Performance
      • 10.6.6.9.3. Applications
      • 10.6.6.9.4. Challenges
      • 10.6.6.9.5. Status
  • 10.6.7. Ultra-Low-Power Electronics
    • 10.6.7.1. Technologies
    • 10.6.7.2. Future Targets (2030)
    • 10.6.7.3. Design Techniques
    • 10.6.7.4. Supercapacitors
      • 10.6.7.4.1. Advanced Supercapacitor Technologies
    • 10.6.7.5. Hybrid Approaches
      • 10.6.7.5.1. Lithium-Ion Capacitors (LIC)
      • 10.6.7.5.2. Sodium-Ion Batteries
      • 10.6.7.5.3. Lithium Titanate (LTO) Batteries
    • 10.6.7.6. Pseudocapacitors
      • 10.6.7.6.1. Operating Principle
      • 10.6.7.6.2. Performance
      • 10.6.7.6.3. 6G ZED Applications
      • 10.6.7.6.4. Status
      • 10.6.7.6.5. Research Directions

11. 6G DEVELOPMENT ROADMAPS

• 11.1. Spectrum for 6G
• 11.2. US Federal Spectrum
• 11.3. Regulatory Status (2025)
• 11.4. Standalone vs Non-Standalone Rollout
• 11.5. Open RAN for 6G
  • 11.5.1. Regional Open RAN Positioning
• 11.6. Competition for Spectrum in Europe
  • 11.6.1. Key Challenges
• 11.7. Global 6G Government Initiatives
  • 11.7.1. Program Effectiveness Factors
• 11.8. 6G Development Roadmap - South Korea
  • 11.8.1. Technology Focus Areas
  • 11.8.2. South Korea - mmWave Challenges
• 11.9. 6G Development Roadmap - Japan
  • 11.9.1. Beyond 5G Program Structure
  • 11.9.2. Deployment Timeline and Market Strategy
• 11.10. Funding Models to Research the Next Mobile Communication Infrastructure
• 11.11. 6G Development Roadmap - US

12. COMPANY PROFILES

• 12.1. AALTO HAPS
• 12.2. AGC Japan
• 12.3. Alcan Systems
• 12.4. Alibaba China
• 12.5. Alphacore
• 12.6. Ampleon
• 12.7. Apple
• 12.8. Atheraxon
• 12.9. Commscope
• 12.10. Echodyne
• 12.11. Ericsson
• 12.12. Fractal Antenna Systems
• 12.13. Freshwave
• 12.14. Fujitsu
• 12.15. Greenerwave
• 12.16. Huawei
• 12.17. Kymeta
• 12.18. Kyocera
• 12.19. LATYS Intelligence
• 12.20. LG Electronics
• 12.21. META
• 12.22. NEC Corporation
• 12.23. Nokia
• 12.24. NTT DoCoMo
• 12.25. NXP Semiconductors
• 12.26. NVIDIA
• 12.27. Omniflow
• 12.28. Orange France
• 12.29. Panasonic
• 12.30. Picocom
• 12.31. Pivotal Commware
• 12.32. Plasmonics
• 12.33. Qualcomm
• 12.34. Radi-Cool
• 12.35. Renesas Electronics Corporation
• 12.36. Samsung
• 12.37. Sekisui
• 12.38. SensorMetrix
• 12.39. SK telecom
• 12.40. Solvay
• 12.41. Sony
• 12.42. Teraview
• 12.43. TMYTEK
• 12.44. Vivo Mobile Communications
• 12.45. ZTE

13. RESEARCH METHODOLOGY

14. REFERENCES