전력 관리 IC 시장(2027-2037년)

Power management ICs are among the least visible but most strategic components in modern electronics. They convert, regulate, protect and monitor every voltage rail, from a smartphone’s battery to an AI accelerator drawing more than a thousand amps. After a sharp correction in 2023 and a flat 2024, the market has entered a strong recovery led by artificial intelligence. Power design has moved from a supporting role to a primary constraint on system performance. The clearest change is in the data center. AI rack power is rising very quickly, from roughly 150kW for current GPU platforms toward 600kW and eventually megawatt-class racks. To cope, the industry is moving from 12V and 48V distribution to 800V high-voltage DC architectures, with NVIDIA working alongside a broad ecosystem of power semiconductor suppliers. Close to the processor, multiphase controllers, smart power stages and vertical power delivery are now refreshed every year, keeping pace with each new GPU generation. Consolidation reflects the stakes. Analog Devices acquired Empower Semiconductor in 2026 for its integrated voltage regulator and silicon capacitor technology, and Texas Instruments agreed to acquire Silicon Labs.

Manufacturing has become an equally important part of the story. The leading foundries are cutting 8-inch capacity, shifting investment toward advanced logic, memory and packaging. That has tightened the supply of BCD processes, the industry’s main platform, and triggered price increases in 2025–2026. Integrated manufacturers are responding with 300mm analog and power fabs, including Texas Instruments in Sherman and Lehi and Infineon’s new Smart Power Fab in Dresden. Meanwhile, Chinese foundries and fabless designers are expanding fast under localisation policies.

In vehicles, demand is being reshaped by 800V platforms, zonal architectures, ADAS compute and stricter battery-safety rules such as China’s GB 38031-2025. Each of these adds gate drivers, isolated power, battery monitoring ICs and functionally safe PMICs per vehicle. Robotics, and humanoid robots in particular, is emerging as the next wave of demand, needing compact, efficient drive and power conversion in every joint. Consumer electronics is maturing, and growth there now tracks rising power draw from on-device AI rather than unit volumes.

Looking ahead, the market will be shaped by several forces:

• integration moving from the circuit board into the processor package
• gallium nitride entering integrated power ICs
• BCD processes migrating to finer nodes on 300mm wafers
• intensifying competition from Chinese suppliers
• geopolitics pushing supply chains toward regional self-sufficiency

Suppliers that combine process capability, packaging know-how and early alignment with AI platforms are best positioned through 2037. The Global Power Management IC Market 2027–2037 is a comprehensive analysis of the semiconductors that convert, regulate and protect power across every electronic system. Power management has become a strategic bottleneck. AI data centres are moving toward megawatt racks and 800V HVDC distribution, vehicles are adopting 800V platforms and zonal architectures, and robotics is creating demand for dense, efficient power conversion at every joint. At the same time, capacity is being restructured: 8-inch fabs are closing, BCD processes are migrating to 300mm wafers and finer nodes, and the 2025–2026 repricing cycle has changed supplier economics.

The report provides ten-year forecasts by application, IC type, process platform, BCD technology node, wafer size and region, supported by unit shipments, average selling prices and wafer demand. It explains the technology shifts redefining the industry, including vertical power delivery, integrated voltage regulators, digital multiphase control, GaN power ICs, BCD-on-SOI for isolated gate drivers, and new packaging and passive-integration approaches. Applications are analysed in depth, with content-per-system estimates for AI racks, vehicles by powertrain, smartphones and humanoid robots.

The supply-chain analysis covers integrated, fab-lite and fabless business models, the BCD foundry landscape and capacity, regional supply chains in the US, Europe, Japan and China, and the effects of export controls, tariffs and localisation policy. The competitive analysis ranks the leading suppliers, maps leadership by IC type and application, tracks mergers, acquisitions and partnerships, and assesses how Chinese challengers are moving into automotive, industrial and data centre markets. Bear, base and bull scenarios, a sensitivity analysis and strategic recommendations support planning for suppliers, foundries, OEMs, hyperscalers and investors. The report ends with 63 detailed company profiles.

Report contents include:

• Research scope, PMIC definitions, segmentation and methodology
• Executive summary with headline forecasts, key findings, and winners and losers
• PMIC technology landscape:
• converter topologies
• LDMOS and smart power stages
• BCD, BCD-on-SOI, CMOS and GaN platforms
• isolation and integration
• vertical power delivery and integrated voltage regulators
• packaging and the roadmap to 2037
• Market dynamics: drivers, restraints, trends, pricing and the 2025–2026 repricing cycle
• Applications:
• AI data centres and 800V HVDC
• communications infrastructure
• automotive, covering 800V, zonal architectures, ADAS and battery management
• industrial and robotics
• consumer and mobile
• medical, aerospace and defence
• emerging applications
• Supply chain, manufacturing, BCD foundry capacity, the 8-inch to 12-inch transition and geopolitics
• Competitive landscape: market shares, concentration, M&A and partnership deal log, strategies
• Regional analysis by region of consumption and by supplier headquarters
• Ten-year forecasts, 2027–2037, by application, IC type, platform, node, wafers, units, ASP and region
• Scenarios, sensitivities, leading indicators and strategic recommendations
• 63 company profiles including 3PEAK, Allegro MicroSystems, Alpha and Omega Semiconductor, Analog Devices, Apple, Awinic Technology, Cambridge GaN Devices, CanSemi, Chipown Microelectronics, Cirrus Logic, DB HiTek, Diodes Incorporated, e-peas, Efficient Power Conversion (EPC), Empower Semiconductor, Ferric, GlobalFoundries, GTA Semiconductor, Halo Microelectronics, Hua Hong Semiconductor, Infineon Technologies, Innoscience, Joulwatt Technology, LX Semicon, Maxic Technology, MediaTek/Richtek, Microchip Technology, Monolithic Power Systems, Navitas Semiconductor, Nexchip, Nexperia, Nisshinbo Micro Devices, Nordic Semiconductor and more... Each of the company profiles includes a key-facts panel (founding year, headquarters, ownership, employees, revenue, manufacturing model, CEO and core focus), why the company matters to the PMIC market, a company description, its power management portfolio or platform technology, manufacturing and process capabilities, recent developments for 2025–2026, a supporting data table, a Future Markets view of its strategic significance, its competitive context, and its website.
• Companion Excel data workbook

Table of Contents

1. Research Scope and Methodology

• 1.1 Report Scope and Objectives
• 1.2 Definition of a Power Management IC
  • 1.2.1 Boundary cases
• 1.3 Segmentation Framework
• 1.4 IC Type Definitions
• 1.5 Research Methodology
  • 1.5.1 Route 1: bottom-up content per system
  • 1.5.2 Route 2: supplier triangulation
  • 1.5.3 Route 3: top-down cross-check
  • 1.5.4 Base-year calibration
  • 1.5.5 Forecast construction
  • 1.5.6 Primary and secondary sources
• 1.6 Key Assumptions
  • 1.6.1 Currency, rounding and limitations
• 1.7 Definitions and Glossary
• 1.8 Companies Cited in this Report

2. Executive Summary

• 2.1 Market Context: From Correction to an AI-Led Recovery
• 2.2 Total Market Size and Forecast
• 2.3 Market by Application
• 2.4 Market by IC Type
• 2.5 Market by Process Platform and Technology Node
• 2.6 Market by Region
• 2.7 Competitive Summary
• 2.8 Technology Summary
• 2.9 Pricing, Capacity and the 2026 Repricing
• 2.10 AI Data Center: The Swing Factor
• 2.11 Key Trends 2027–2037
• 2.12 Winners and Losers
• 2.13 Implications for Stakeholders

3. PMIC Technology Landscape

• 3.1 PMIC Architecture Fundamentals
  • 3.1.1 Linear versus switching regulation
  • 3.1.2 Converter topologies
  • 3.1.3 Control schemes and digital interfaces
  • 3.1.4 Figures of merit
• 3.2 Power Device Technology inside PMICs
  • 3.2.1 LDMOS figures of merit and trade-offs
  • 3.2.2 High-side versus low-side optimisation
  • 3.2.3 DrMOS and smart power stages
• 3.3 Process Platforms
  • 3.3.1 BCD: origin and evolution
  • 3.3.2 BCD-on-SOI
  • 3.3.3 CMOS and advanced-node PMICs
  • 3.3.4 Bipolar, BiCMOS and high-voltage specialty processes
  • 3.3.5 GaN-on-Si integrated power ICs
  • 3.3.6 SiC gate-drive ecosystems
  • 3.3.7 From 200mm to 300mm
• 3.4 Isolation Technologies
• 3.5 Integration Trends
  • 3.5.1 Battery ICs with integrated impedance spectroscopy
  • 3.5.2 Digital power and telemetry
  • 3.5.3 Passive component integration
• 3.6 Power Delivery Architectures for AI Compute
  • 3.6.1 The power delivery chain from grid to chip
  • 3.6.2 Lateral versus vertical power delivery
  • 3.6.3 48V intermediate bus conversion
  • 3.6.4 Memory power: DDR5, MRDIMM and HBM
• 3.7 Application-Specific PMIC Architectures
  • 3.7.1 Mobile and wearable PMICs
  • 3.7.2 Automotive PMICs and system basis chips
  • 3.7.3 Gate drivers for SiC, GaN and IGBT power stages
  • 3.7.4 Robotics and humanoid power
• 3.8 Packaging, Thermal Management and Reliability
• 3.9 Technology Roadmap 2027–2037
  • 3.9.1 Technology challenges

4. Market Dynamics: Drivers, Restraints and Trends

• 4.1 From Correction to Recovery: The 2020–2026 Cycle
• 4.2 Market Drivers
  • 4.2.1 AI data center power density
  • 4.2.2 Vehicle electrification, 800V platforms and zonal architectures
  • 4.2.3 Robotics and humanoids
  • 4.2.4 On-device AI and rising power draw in consumer devices
  • 4.2.5 Energy transition and industrial electrification
  • 4.2.6 5G-Advanced and 6G infrastructure
  • 4.2.7 Functional safety, regulation and efficiency standards
• 4.3 Market Restraints and Challenges
  • 4.3.1 8-inch capacity contraction and foundry repricing
  • 4.3.2 Consumer maturity and the memory cost squeeze
  • 4.3.3 Chinese price competition and localisation
  • 4.3.4 Captive design and integration into the processor
  • 4.3.5 Geopolitics, export controls and supply-chain fragmentation
  • 4.3.6 Electric-vehicle slowdown in the US and Europe
  • 4.3.7 Analog design talent and qualification cycles
• 4.4 Impact and Timing of Drivers and Restraints
• 4.5 Pricing and ASP Dynamics
• 4.6 Key Trends 2027–2037
  • 4.6.1 An annual power design cycle in the data center
  • 4.6.2 From 48V to 800V HVDC
  • 4.6.3 Vertical power delivery and integrated voltage regulation
  • 4.6.4 Digital, telemetry-rich power
  • 4.6.5 GaN integration
  • 4.6.6 BCD node migration and the 200mm-to-300mm transition
  • 4.6.7 SOI for isolated and high-voltage drivers
  • 4.6.8 China localisation
  • 4.6.9 Integration of sensing, protection and passives
  • 4.6.10 Functional safety as a baseline
  • 4.6.11 Repricing and value-based pricing
• 4.7 Sources of Growth, 2027–2037
• 4.8 Supply–Demand Balance and Lead Times
• 4.9 Demand Drivers by Application

5. Markets and Applications

• 5.1 AI Data Centers and Computing Infrastructure
  • 5.1.1 The data center power delivery chain
  • 5.1.2 Rack power and accelerator power trajectory
  • 5.1.3 PMIC content per accelerator and per rack
  • 5.1.4 Sub-segment forecast
  • 5.1.5 Accelerator and GPU core power
  • 5.1.6 CPU, board and point-of-load regulation
  • 5.1.7 Memory power: DDR5, MRDIMM, LPDDR modules, SSD and HBM
  • 5.1.8 48 V intermediate bus conversion, hot-swap and eFuse
  • 5.1.9 PSU, battery backup and 800 VDC conversion
  • 5.1.10 Networking, optics and storage power
  • 5.1.11 Power-stage technology, packaging and thermal requirements
  • 5.1.12 Telemetry, reliability and fault management
  • 5.1.13 Custom AI silicon, regional deployment and localisation
  • 5.1.14 Supplier performance and investment signals
  • 5.1.15 Outlook, risks and strategic implications
• 5.2 Communications Infrastructure
  • 5.2.1 Radio access networks: 5G-Advanced and 6G
  • 5.2.2 Small cells, Open RAN and private networks
  • 5.2.3 Optical transport, fixed access and satellite ground systems
• 5.3 Automotive and Mobility
  • 5.3.1 Market size and sub-segment forecast
  • 5.3.2 PMIC content per vehicle by powertrain
  • 5.3.3 xEV powertrain: gate drivers and isolated power
  • 5.3.4 Battery management: analog front ends and battery ICs
  • 5.3.5 ADAS, domain and central compute PMICs
  • 5.3.6 Body, zonal architectures and system basis chips
  • 5.3.7 Cockpit, infotainment, lighting and chassis
  • 5.3.8 Qualification, functional safety and barriers to entry
  • 5.3.9 Regional dynamics
  • 5.3.10 Supplier landscape
  • 5.3.11 Pricing, commercial vehicles and adjacent mobility
• 5.4 Industrial and Robotics
  • 5.4.1 Factory automation and motor drives
  • 5.4.2 Energy: solar, storage and EV charging
  • 5.4.3 Robotics and humanoids
  • 5.4.4 Test and measurement, building automation, IoT and power tools
  • 5.4.5 Competitive dynamics in industrial PMICs
• 5.5 Consumer and Mobile
  • 5.5.1 Smartphones
  • 5.5.2 PCs, notebooks and tablets
  • 5.5.3 Wearables, hearables, home devices and chargers
  • 5.5.4 Competitive landscape in consumer PMICs
• 5.6 Medical, Aerospace and Defence
• 5.7 Emerging Applications

6. Supply Chain, Manufacturing and Capacity

• 6.1 The PMIC value chain
• 6.2 Business models: IDM, fab-lite and fabless
• 6.3 The BCD foundry landscape
• 6.4 Capacity: the 8-inch contraction and structural BCD tightness
• 6.5 The 2025–2026 repricing
• 6.6 The migration to 300mm
• 6.7 PMIC wafer demand
  • 6.7.1 BCD technology node migration
• 6.8 China's BCD capacity build-out
• 6.9 Packaging, assembly and test
• 6.10 Geopolitics, trade and supply security
  • 6.10.1 Regional supply-chain profiles
• 6.11 Supply-chain risk assessment
• 6.12 Application-focused supply chains
  • 6.12.1 Data center and AI infrastructure
  • 6.12.2 Automotive
  • 6.12.3 Robotics and humanoids
• 6.13 Lead times, inventory and allocation behaviour
• 6.14 Foundry and IDM strategic responses
• 6.15 Process technology roadmap at the supply-chain level

7. Competitive Landscape

• 7.1 Market Concentration
• 7.2 Supplier Ranking
• 7.3 Leadership by IC Type
• 7.4 Leadership by Application
• 7.5 The Fastest Movers
• 7.6 Share by Supplier Headquarters Region
• 7.7 Business Models: IDM, Fab-Lite and Fabless
• 7.8 Strategic Themes
  • 7.8.1 Portfolio Breadth versus Focus
  • 7.8.2 Digital Power, Telemetry and Software
  • 7.8.3 Reference-Design Alliances and the NVIDIA 800 VDC Ecosystem
  • 7.8.4 Captive Design and SoC Bundling
• 7.9 M&A, Investments and Partnerships 2023–2026
• 7.10 Barriers to Entry
• 7.11 Design-Win Dynamics
• 7.12 Profiles of the Leading Six: Strengths and Vulnerabilities
• 7.13 Outlook: Share Shifts 2027–2037

8. Regional Analysis

• 8.1 Regional overview
• 8.2 China
• 8.3 Rest of Asia-Pacific
• 8.4 North America
• 8.5 Europe
• 8.6 Japan
• 8.7 Rest of World
• 8.8 Supplier geography: who supplies the world's PMICs
• 8.9 Regional trade flows
• 8.10 Regional growth comparison
• 8.11 China: market by application
• 8.12 Regional competitive dynamics
• 8.13 Regional outlook summary

9. Market Forecast 2027–2037

• 9.1 Forecast Summary
• 9.2 Forecast by Application
  • 9.2.1 Growth phases
  • 9.2.2 Data center and AI infrastructure
  • 9.2.3 Automotive and mobility
  • 9.2.4 Consumer and mobile
  • 9.2.5 Industrial and robotics
  • 9.2.6 Communications infrastructure and medical, aerospace and defence
• 9.3 Forecast by IC Type
• 9.4 Forecast by Process Platform
• 9.5 Wafer Demand and Manufacturing Metrics
• 9.6 Units and Average Selling Price
• 9.7 Forecast by Region
• 9.8 Forecast Risks and Confidence

10. Scenarios, Sensitivities and Strategic Outlook

• 10.1 Scenario Framework
• 10.2 Base Case
• 10.3 Bull Case
• 10.4 Bear Case
• 10.5 Scenario Outcomes by Application
• 10.6 Implications for Pricing, Margins and Capacity
• 10.7 Risks Outside the Scenarios
• 10.8 Sensitivity Analysis
• 10.9 Leading Indicators to Watch
• 10.10 Strategic Recommendations
  • 10.10.1 For PMIC suppliers
  • 10.10.2 For foundries and manufacturing partners
• 10.11 Analyst Watch List
• 10.12 Beyond
• 10.13 Conclusion and Outlook