질화갈륨 소자 시장 분석과 예측 : 용도별, 유형별, 기술별, 구성 부품별, 소자별, 최종 사용자별, 프로세스별, 제품별, 기능별(2035년)

Gallium Nitride Device Market is anticipated to expand from $4.1 billion in 2025 to $6.3 billion by 2035, growing at a CAGR of approximately 17.5%. The Gallium Nitride Device Market is anticipated to expand from $4,132.4 million in 2025 to $20,643.0 million by 2035, growing at a CAGR of approximately 17.5% from 2026 to 2035.

Gallium nitride (GaN) has consolidated its position as a core wide-bandgap platform for next-generation power and RF electronics, with policy, technology, and application pull now reinforcing one another across major regions. Government roadmaps and funding frameworks explicitly single out wide-bandgap power electronics, including GaN, as critical for national energy efficiency and semiconductor resilience; the U.S. Department of Energy's Advanced Materials and Manufacturing Technologies Office (AMMTO) Wide Bandgap Power Electronics Strategic Framework (draft released 2025) identifies WBG devices as essential to cutting conversion losses in transportation, grid, and data-center systems, framing targeted support for automotive inverters, chargers, and renewables as high-impact deployment arenas.

In Europe, the 2023-2024 implementation of the EU Chips Act and Chips Joint Undertaking channels more than EUR 11 billion of public funding into advanced semiconductor pilot lines, including a dedicated Wide Bandgap (WBG) Pilot Line to industrialize GaN and related technologies as part of Europe's sovereignty agenda. On the corporate side, Infineon's 2023 Annual Report explicitly states that GaN is "on the brink of a breakthrough" in mobile charging, data-center power supplies, residential solar inverters, and on-board EV chargers, and positions GaN as a key growth lever alongside SiC in its power portfolio.

Technologically, peer-reviewed work underlines GaN's intrinsic advantages: GaN's wide bandgap of about 3.4 eV, high critical field, and high electron mobility enable faster switching, higher power density, and greater efficiency than silicon in both power conversion and RF amplification. These fundamentals are translating into visible trends. In power electronics, recent studies on GaN-based grid-connected PV inverters and multi-converter renewable systems demonstrate efficiency gains that support higher-frequency, higher-power operation and more compact passives, directly targeting solar and microgrid applications.

In RF, GaN power amplifiers have become central to 5G massive-MIMO and radar front-ends, with commercial GaN PAs such as Qorvo's QPA0524, released in 2023, optimized for 5G communications and defense radar in C-band and adjacent spectra. Looking ahead, strategic opportunities cluster around three axes: first, EV and charging infrastructure, where DOE-backed vertical GaN programs for vehicle electrification and corporate messaging from Infineon point to GaN enabling more efficient, higher-power onboard chargers and DC fast chargers; second, renewables and grid, where GaN-based inverters for PV and hybrid AC/DC microgrids promise step-change efficiency and power-density improvements that align with government clean-energy targets; and third, 6G-era RF systems, where international white papers on RF enabling 6G (2023-2024) foresee stringent power efficiency and bandwidth demands in sub-THz and mmWave regimes that favor high-power-density GaN front-ends for joint communication-sensing, advanced radar, and RF energy applications.

Segment Overview

Based on the Functionality segmentation of the GaN device market, the market is segmented into High-Frequency, High-Power, High-Efficiency, and Hybrid GaN devices. Among these, High-Frequency GaN devices lead the functionality segment, primarily due to their critical role in 5G base stations, RF front-end modules, radar, satellite communications, and defense electronics. GaN's high electron mobility enables operation at millimeter-wave frequencies with superior power density and lower losses than silicon or GaAs. For example, in February 2023, NXP Semiconductors expanded its RF GaN portfolio for 5G massive-MIMO base stations, targeting high-frequency macro and small-cell infrastructure, while in July 2024, Qorvo announced new multi-year defense RF GaN supply contracts, reinforcing the dominance of this segment in high-frequency mission-critical applications. High-Power GaN devices represent the next strongest growth segment, supported by electric vehicles, renewable energy systems, fast DC chargers, and industrial power supplies. GaN's ability to handle high voltages at elevated temperatures allows higher power density and smaller system footprints. As an illustration, Infineon Technologies launched its 650 V CoolGaN(TM) power transistor generation in March 2024, aimed at EV onboard chargers and solar inverters, while Wolfspeed expanded its Mohawk Valley GaN fab capacity in August 2023 to meet rising demand from automotive and energy customers, highlighting sustained investment momentum in high-power GaN. High-Efficiency GaN devices are gaining rapid traction in consumer electronics, data centers, and telecom power supplies, where efficiency improvements directly reduce heat, size, and operating costs. GaN enables higher switching frequencies and lower conduction losses, making it ideal for compact fast chargers and server power units. For instance, Navitas Semiconductor secured new funding-backed design wins in May 2023 for GaNFast(TM) ICs in data-center power architectures, and Anker Innovations launched a new GaN-based ultra-compact fast-charging adapter lineup in January 2024, demonstrating how efficiency-focused GaN is reshaping mainstream consumer and enterprise power solutions.

Based on the Product segment packaging of the GaN device market, the market is segmented into Surface-Mount, Through-Hole, Chip-Scale Package, and Bare Die. Electrification of mobility, fast-charging consumer electronics, renewable energy power systems, and high-frequency data-center power architectures are jointly driving demand across all four GaN packaging sub-segments, creating opportunities from consumer to industrial applications. Surface-Mount packages lead the GaN device market. These compact, automated-assembly-friendly formats dominate high-volume manufacturing for consumer, automotive, telecom, and data-center power supplies because they offer high power density, thermal performance, and cost-effective production. For example, Renesas launched new 650 V GaN FETs in July 2025 - available in surface-mount-friendly TOLT and TOLL configurations marking a major product rollout after its acquisition of Transphorm's GaN technology in 2024. This broadened Renesas' GaN portfolio across consumer to industrial power conversion applications. Surface-mount GaN devices are also key in partnerships accelerating their use. onsemi announced in December 2025 a strategic collaboration with GlobalFoundries to co-develop advanced 650 V GaN power products that will use efficient packaging suitable for surface-mount applications across AI data centers, EV charging, industrial, and aerospace systems, with samples planned in early 2026.

Chip-Scale Packages are the fastest-growing sub-segment, driven by ultra-compact consumer chargers, automotive electronics, and high-frequency power supplies requiring minimal parasitic effects. For instance, companies like Navitas Semiconductor - known for GaNFast chip-level power ICs - showcased new 12 kW GaN & SiC power platforms with high efficiency in May 2025, underscoring how compact devices push both performance and density for data-center and AI compute applications. Chip-scale implementations are further supported by manufacturing capacity expansions such as Texas Instruments' October 2024 announcement of quadrupling GaN semiconductor capacity in Japan, enabling broader deployment of highly integrated, small-footprint GaN chips across consumer and industrial markets. Through-Hole packages show moderate growth and remain relevant mainly for legacy industrial applications and high-reliability segments where mechanical robustness is critical. For example, Renesas' Gen IV GaN launches include TO-247 (through-hole) options alongside surface-mount offerings, ensuring availability for high-power industrial converters and motor drives where traditional board assembly is still prevalent.

Geographical Overview

Based on region, the GaN device market is studied across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Asia-Pacific dominated the market in 2025. The region's growth is driven by strong demand from consumer electronics, electric vehicles, and telecommunications. China is leading GaN adoption in power electronics and fast-charging applications, with GaN-based power devices deployed in consumer chargers and industrial systems in January 2025. Japan is advancing GaN technology for automotive and industrial systems, integrating GaN power modules into EV powertrains and factory automation equipment in March 2025. South Korea is adopting GaN for telecom and data center infrastructure, implementing GaN RF and power devices in 5G base stations and server power supplies in May 2025. India is increasing GaN use in renewable energy and power management, introducing GaN-based converters for solar inverters and grid applications in July 2025.

North America is emerging as a major hub for the GaN device market, holding a market share of 30%. The region is driven by high-efficiency power electronics and RF applications across automotive, telecom, and industrial sectors. The United States is spearheading adoption: in March 2025, next-generation GaN FETs were introduced for higher voltage operation in EVs and industrial converters; in July 2025, compact GaN RF transistors enhanced 5G network and satellite communication performance; and in September 2025, GaN-based power modules demonstrated reduced cooling requirements and longer lifetimes.

Europe's GaN device market is expanding at a CAGR of 16.5% due to rising adoption in power electronics, electric mobility, and telecommunications. Germany is advancing GaN adoption in automotive and industrial power systems, implementing GaN-based power electronics in EV powertrains in February 2025. France is integrating high-frequency GaN RF devices into aerospace and defense radar systems in April 2025. Italy and Spain are leveraging GaN in renewable energy systems, deploying GaN-based inverters and converters for solar and wind applications in August 2025.

The Latin American GaN device market, valued at USD 240.5 million in 2025, is growing due to increasing adoption in power electronics, renewable energy, and telecommunications. Brazil is leading adoption for renewable energy and industrial applications, introducing GaN-based power modules for solar inverters and industrial drives in February 2025. Chile is deploying GaN-based converters for high-efficiency power conversion in June 2025. Argentina and Colombia are integrating GaN RF transistors into 5G networks and wireless systems in August 2025.

In the Middle East and Africa, the GaN device market is growing at a CAGR of 18.2%, driven by investments in energy-efficient power electronics, telecommunications infrastructure, and renewable energy systems. The Middle East is adopting GaN devices in solar power plants and smart grids in February 2025. Gulf countries are implementing GaN RF devices in 5G base stations and satellite communication systems in April 2025. Israel is integrating high-performance GaN RF and power devices into defense and aerospace systems in June 2025. Africa is gradually deploying GaN-based converters for solar installations and off-grid power systems in August 2025.

Key Trends and Drivers

Rising Demand for Energy Efficiency and High Power Density Driving GaN Device Adoption-

The growing focus on energy-efficient and high-performance electronics is fueling demand for gallium nitride (GaN) devices across consumer electronics, data centers, telecom, and industrial equipment. GaN semiconductors offer significantly lower conduction losses, higher switching frequencies, and superior thermal performance compared with traditional silicon MOSFETs, enabling more efficient power conversion and reduced energy consumption. As devices shrink while delivering higher power outputs, GaN allows designers to use smaller passive components, reduce cooling requirements, and achieve higher power density, supporting compact and lightweight system architectures. Between 2023 and 2025, leading companies such as Infineon, Navitas Semiconductor, Power Integrations, and Wise Integration expanded GaN power IC and discrete portfolios to meet these efficiency-driven demands in fast chargers, server power supplies, EV chargers, and industrial converters. Consequently, GaN devices are increasingly preferred in applications where energy efficiency, thermal management, and space optimization are critical design priorities.

Electrification of Automotive and Industrial Systems Driving GaN Device Adoption-

The rapid global shift toward electrification in automotive and industrial sectors is significantly boosting demand for high-performance power electronics capable of operating at higher voltages and frequencies than conventional silicon solutions. Gallium nitride (GaN) devices provide faster switching speeds, superior efficiency, and higher power density, enabling compact, lightweight power stages in EV onboard chargers, DC-DC converters, and industrial automation systems. With efficiencies reaching 96-98% and enhanced thermal performance, GaN-based solutions help OEMs extend EV driving range, reduce system weight, and improve overall energy conversion. By 2023, automotive GaN onboard chargers surpassed 2 million units, highlighting widespread adoption in new EV designs. Leading semiconductor companies, including STMicroelectronics, Transphorm, Infineon, and ROHM Semiconductor, are advancing high-voltage and automotive-grade GaN devices through new launches, strategic partnerships, and capacity expansions, solidifying GaN as a critical enabling technology for next-generation electric mobility and industrial electrification.

Research Scope

• Estimates and forecasts the overall market size across application, type, technology, component, device, end user, process, product, functioanlity and region.
• Provides detailed information and key takeaways on qualitative and quantitative trends, dynamics, business framework, competitive landscape, and company profiling.
• Identifies factors influencing market growth and challenges, opportunities, drivers, and restraints.
• Identifies factors that could limit company participation in international markets to help calibrate market share expectations and growth rates.
• Evaluates key development strategies like acquisitions, product launches, mergers, collaborations, business expansions, agreements, partnerships, and R&D activities.
• Analyzes smaller market segments strategically, focusing on their potential, growth patterns, and impact on the overall market.
• Outlines the competitive landscape, assessing business and corporate strategies to monitor and dissect competitive advancements.

TABLE OF CONTENTS

1 Executive Summary

• 1.1 Market Size and Forecast
• 1.2 Market Overview
• 1.3 Market Snapshot
• 1.4 Regional Snapshot
• 1.5 Strategic Recommendations
• 1.6 Analyst Notes

2 Market Highlights

• 2.1 Key Market Highlights by Application
• 2.2 Key Market Highlights by Type
• 2.3 Key Market Highlights by Technology
• 2.4 Key Market Highlights by Component
• 2.5 Key Market Highlights by Device
• 2.6 Key Market Highlights by End User
• 2.7 Key Market Highlights by Process
• 2.8 Key Market Highlights by Product
• 2.9 Key Market Highlights by Functionality

3 Market Dynamics

• 3.1 Macroeconomic Analysis
• 3.2 Market Trends
• 3.3 Market Drivers
• 3.4 Market Opportunities
• 3.5 Market Restraints
• 3.6 CAGR Growth Analysis
• 3.7 Impact Analysis
• 3.8 Emerging Markets
• 3.9 Technology Roadmap
• 3.10 Strategic Frameworks
  • 3.10.1 PORTER's 5 Forces Model
  • 3.10.2 ANSOFF Matrix
  • 3.10.3 4P's Model
  • 3.10.4 PESTEL Analysis

4 Segment Analysis

• 4.1 Market Size & Forecast by Application (2020-2035)
  • 4.1.1 Telecommunications & ICT
  • 4.1.2 Automotive & E-Mobility
  • 4.1.3 Consumer Electronics
  • 4.1.4 Industrial & Power Systems
  • 4.1.5 Defense & Aerospace
  • 4.1.6 Energy & Renewable Energy Systems
  • 4.1.7 Others Applications
• 4.2 Market Size & Forecast by Type (2020-2035)
  • 4.2.1 Optoelectronic Devices
  • 4.2.2 Discrete Power Devices
  • 4.2.3 Integrated Power Devices
  • 4.2.4 Discrete RF Devices
  • 4.2.5 Integrated RF Devices
• 4.3 Market Size & Forecast by Technology (2020-2035)
  • 4.3.1 GaN-on-SiC
  • 4.3.2 GaN-on-Si
  • 4.3.3 GaN-on-Sapphire
  • 4.3.4 Bulk GaN
• 4.4 Market Size & Forecast by Component (2020-2035)
  • 4.4.1 Transistors
  • 4.4.2 Diodes
  • 4.4.3 MMICs
  • 4.4.4 Integrated Modules (ICs)
  • 4.4.5 Amplifier Components
• 4.5 Market Size & Forecast by Device (2020-2035)
  • 4.5.1 Power Semiconductors
  • 4.5.2 RF Semiconductors
  • 4.5.3 Opto-Semiconductors
• 4.6 Market Size & Forecast by End User (2020-2035)
  • 4.6.1 OEMs
  • 4.6.2 Tier-1 Integrators
  • 4.6.3 Foundries/IDMs
  • 4.6.4 Contract Manufacturers
  • 4.6.5 Research & Academics
• 4.7 Market Size & Forecast by Process (2020-2035)
  • 4.7.1 MOCVD
  • 4.7.2 HVPE
• 4.8 Market Size & Forecast by Product (2020-2035)
  • 4.8.1 Surface-Mount
  • 4.8.2 Through-Hole
  • 4.8.3 Chip-Scale Package
  • 4.8.4 Bare Die
• 4.9 Market Size & Forecast by Functionality (2020-2035)
  • 4.9.1 High-Frequency
  • 4.9.2 High-Power
  • 4.9.3 High-Efficiency
  • 4.9.4 Hybrid5 Regional Analysis
• 5.1 Global Market Overview
• 5.2 North America Market Size (2020-2035)
  • 5.2.1 United States
    • 5.2.1.1 Application
    • 5.2.1.2 Type
    • 5.2.1.3 Technology
    • 5.2.1.4 Component
    • 5.2.1.5 Device
    • 5.2.1.6 End User
    • 5.2.1.7 Process
    • 5.2.1.8 Product
    • 5.2.1.9 Functionality
  • 5.2.2 Canada
    • 5.2.2.1 Application
    • 5.2.2.2 Type
    • 5.2.2.3 Technology
    • 5.2.2.4 Component
    • 5.2.2.5 Device
    • 5.2.2.6 End User
    • 5.2.2.7 Process
    • 5.2.2.8 Product
    • 5.2.2.9 Functionality
  • 5.2.3 Mexico
    • 5.2.3.1 Application
    • 5.2.3.2 Type
    • 5.2.3.3 Technology
    • 5.2.3.4 Component
    • 5.2.3.5 Device
    • 5.2.3.6 End User
    • 5.2.3.7 Process
    • 5.2.3.8 Product
    • 5.2.3.9 Functionality
• 5.3 Latin America Market Size (2020-2035)
  • 5.3.1 Brazil
    • 5.3.1.1 Application
    • 5.3.1.2 Type
    • 5.3.1.3 Technology
    • 5.3.1.4 Component
    • 5.3.1.5 Device
    • 5.3.1.6 End User
    • 5.3.1.7 Process
    • 5.3.1.8 Product
    • 5.3.1.9 Functionality
  • 5.3.2 Argentina
    • 5.3.2.1 Application
    • 5.3.2.2 Type
    • 5.3.2.3 Technology
    • 5.3.2.4 Component
    • 5.3.2.5 Device
    • 5.3.2.6 End User
    • 5.3.2.7 Process
    • 5.3.2.8 Product
    • 5.3.2.9 Functionality
  • 5.3.3 Rest of Latin America
    • 5.3.3.1 Application
    • 5.3.3.2 Type
    • 5.3.3.3 Technology
    • 5.3.3.4 Component
    • 5.3.3.5 Device
    • 5.3.3.6 End User
    • 5.3.3.7 Process
    • 5.3.3.8 Product
    • 5.3.3.9 Functionality
• 5.4 Asia-Pacific Market Size (2020-2035)
  • 5.4.1 China
    • 5.4.1.1 Application
    • 5.4.1.2 Type
    • 5.4.1.3 Technology
    • 5.4.1.4 Component
    • 5.4.1.5 Device
    • 5.4.1.6 End User
    • 5.4.1.7 Process
    • 5.4.1.8 Product
    • 5.4.1.9 Functionality
  • 5.4.2 India
    • 5.4.2.1 Application
    • 5.4.2.2 Type
    • 5.4.2.3 Technology
    • 5.4.2.4 Component
    • 5.4.2.5 Device
    • 5.4.2.6 End User
    • 5.4.2.7 Process
    • 5.4.2.8 Product
    • 5.4.2.9 Functionality
  • 5.4.3 South Korea
    • 5.4.3.1 Application
    • 5.4.3.2 Type
    • 5.4.3.3 Technology
    • 5.4.3.4 Component
    • 5.4.3.5 Device
    • 5.4.3.6 End User
    • 5.4.3.7 Process
    • 5.4.3.8 Product
    • 5.4.3.9 Functionality
  • 5.4.4 Japan
    • 5.4.4.1 Application
    • 5.4.4.2 Type
    • 5.4.4.3 Technology
    • 5.4.4.4 Component
    • 5.4.4.5 Device
    • 5.4.4.6 End User
    • 5.4.4.7 Process
    • 5.4.4.8 Product
    • 5.4.4.9 Functionality
  • 5.4.5 Australia
    • 5.4.5.1 Application
    • 5.4.5.2 Type
    • 5.4.5.3 Technology
    • 5.4.5.4 Component
    • 5.4.5.5 Device
    • 5.4.5.6 End User
    • 5.4.5.7 Process
    • 5.4.5.8 Product
    • 5.4.5.9 Functionality
  • 5.4.6 Taiwan
    • 5.4.6.1 Application
    • 5.4.6.2 Type
    • 5.4.6.3 Technology
    • 5.4.6.4 Component
    • 5.4.6.5 Device
    • 5.4.6.6 End User
    • 5.4.6.7 Process
    • 5.4.6.8 Product
    • 5.4.6.9 Functionality
  • 5.4.7 Rest of APAC
    • 5.4.7.1 Application
    • 5.4.7.2 Type
    • 5.4.7.3 Technology
    • 5.4.7.4 Component
    • 5.4.7.5 Device
    • 5.4.7.6 End User
    • 5.4.7.7 Process
    • 5.4.7.8 Product
    • 5.4.7.9 Functionality
• 5.5 Europe Market Size (2020-2035)
  • 5.5.1 Germany
    • 5.5.1.1 Application
    • 5.5.1.2 Type
    • 5.5.1.3 Technology
    • 5.5.1.4 Component
    • 5.5.1.5 Device
    • 5.5.1.6 End User
    • 5.5.1.7 Process
    • 5.5.1.8 Product
    • 5.5.1.9 Functionality
  • 5.5.2 France
    • 5.5.2.1 Application
    • 5.5.2.2 Type
    • 5.5.2.3 Technology
    • 5.5.2.4 Component
    • 5.5.2.5 Device
    • 5.5.2.6 End User
    • 5.5.2.7 Process
    • 5.5.2.8 Product
    • 5.5.2.9 Functionality
  • 5.5.3 United Kingdom
    • 5.5.3.1 Application
    • 5.5.3.2 Type
    • 5.5.3.3 Technology
    • 5.5.3.4 Component
    • 5.5.3.5 Device
    • 5.5.3.6 End User
    • 5.5.3.7 Process
    • 5.5.3.8 Product
    • 5.5.3.9 Functionality
  • 5.5.4 Spain
    • 5.5.4.1 Application
    • 5.5.4.2 Type
    • 5.5.4.3 Technology
    • 5.5.4.4 Component
    • 5.5.4.5 Device
    • 5.5.4.6 End User
    • 5.5.4.7 Process
    • 5.5.4.8 Product
    • 5.5.4.9 Functionality
  • 5.5.5 Italy
    • 5.5.5.1 Application
    • 5.5.5.2 Type
    • 5.5.5.3 Technology
    • 5.5.5.4 Component
    • 5.5.5.5 Device
    • 5.5.5.6 End User
    • 5.5.5.7 Process
    • 5.5.5.8 Product
    • 5.5.5.9 Functionality
  • 5.5.6 Rest of Europe
    • 5.5.6.1 Application
    • 5.5.6.2 Type
    • 5.5.6.3 Technology
    • 5.5.6.4 Component
    • 5.5.6.5 Device
    • 5.5.6.6 End User
    • 5.5.6.7 Process
    • 5.5.6.8 Product
    • 5.5.6.9 Functionality
• 5.6 Middle East & Africa Market Size (2020-2035)
  • 5.6.1 Saudi Arabia
    • 5.6.1.1 Application
    • 5.6.1.2 Type
    • 5.6.1.3 Technology
    • 5.6.1.4 Component
    • 5.6.1.5 Device
    • 5.6.1.6 End User
    • 5.6.1.7 Process
    • 5.6.1.8 Product
    • 5.6.1.9 Functionality
  • 5.6.2 United Arab Emirates
    • 5.6.2.1 Application
    • 5.6.2.2 Type
    • 5.6.2.3 Technology
    • 5.6.2.4 Component
    • 5.6.2.5 Device
    • 5.6.2.6 End User
    • 5.6.2.7 Process
    • 5.6.2.8 Product
    • 5.6.2.9 Functionality
  • 5.6.3 South Africa
    • 5.6.3.1 Application
    • 5.6.3.2 Type
    • 5.6.3.3 Technology
    • 5.6.3.4 Component
    • 5.6.3.5 Device
    • 5.6.3.6 End User
    • 5.6.3.7 Process
    • 5.6.3.8 Product
    • 5.6.3.9 Functionality
  • 5.6.4 Sub-Saharan Africa
    • 5.6.4.1 Application
    • 5.6.4.2 Type
    • 5.6.4.3 Technology
    • 5.6.4.4 Component
    • 5.6.4.5 Device
    • 5.6.4.6 End User
    • 5.6.4.7 Process
    • 5.6.4.8 Product
    • 5.6.4.9 Functionality
  • 5.6.5 Rest of MEA
    • 5.6.5.1 Application
    • 5.6.5.2 Type
    • 5.6.5.3 Technology
    • 5.6.5.4 Component
    • 5.6.5.5 Device
    • 5.6.5.6 End User
    • 5.6.5.7 Process
    • 5.6.5.8 Product
    • 5.6.5.9 Functionality6 Market Strategy
• 6.1 Demand-Supply Gap Analysis
• 6.2 Trade & Logistics Constraints
• 6.3 Price-Cost-Margin Trends
• 6.4 Market Penetration
• 6.5 Consumer Analysis
• 6.6 Regulatory Snapshot

7 Competitive Intelligence

• 7.1 Market Positioning
• 7.2 Market Share
• 7.3 Competition Benchmarking
• 7.4 Top Company Strategies

8 Company Profiles

• 8.1 Navitas Semiconductor
  • 8.1.1 Overview
  • 8.1.2 Product Summary
  • 8.1.3 Financial Performance
  • 8.1.4 SWOT Analysis
• 8.2 Renesas Electronics Corporation
  • 8.2.1 Overview
  • 8.2.2 Product Summary
  • 8.2.3 Financial Performance
  • 8.2.4 SWOT Analysis
• 8.3 VisIC Technologies, Inc.
  • 8.3.1 Overview
  • 8.3.2 Product Summary
  • 8.3.3 Financial Performance
  • 8.3.4 SWOT Analysis
• 8.4 Qorvo, Inc.
  • 8.4.1 Overview
  • 8.4.2 Product Summary
  • 8.4.3 Financial Performance
  • 8.4.4 SWOT Analysis
• 8.5 Efficient Power Conversion Corporation
  • 8.5.1 Overview
  • 8.5.2 Product Summary
  • 8.5.3 Financial Performance
  • 8.5.4 SWOT Analysis
• 8.6 Infineon Technologies AG
  • 8.6.1 Overview
  • 8.6.2 Product Summary
  • 8.6.3 Financial Performance
  • 8.6.4 SWOT Analysis
• 8.7 Texas Instruments (TI)
  • 8.7.1 Overview
  • 8.7.2 Product Summary
  • 8.7.3 Financial Performance
  • 8.7.4 SWOT Analysis
• 8.8 GaNpower
  • 8.8.1 Overview
  • 8.8.2 Product Summary
  • 8.8.3 Financial Performance
  • 8.8.4 SWOT Analysis
• 8.9 Panasonic Holdings Corporation
  • 8.9.1 Overview
  • 8.9.2 Product Summary
  • 8.9.3 Financial Performance
  • 8.9.4 SWOT Analysis
• 8.10 Wingtech Technology Co., Ltd
  • 8.10.1 Overview
  • 8.10.2 Product Summary
  • 8.10.3 Financial Performance
  • 8.10.4 SWOT Analysis
• 8.11 ROHM Co., Ltd.
  • 8.11.1 Overview
  • 8.11.2 Product Summary
  • 8.11.3 Financial Performance
  • 8.11.4 SWOT Analysis
• 8.12 Wolfspeed, Inc.
  • 8.12.1 Overview
  • 8.12.2 Product Summary
  • 8.12.3 Financial Performance
  • 8.12.4 SWOT Analysis
• 8.13 Ampleon
  • 8.13.1 Overview
  • 8.13.2 Product Summary
  • 8.13.3 Financial Performance
  • 8.13.4 SWOT Analysis
• 8.14 Power Integrations, Inc.
  • 8.14.1 Overview
  • 8.14.2 Product Summary
  • 8.14.3 Financial Performance
  • 8.14.4 SWOT Analysis
• 8.15 Analog Devices, Inc.
  • 8.15.1 Overview
  • 8.15.2 Product Summary
  • 8.15.3 Financial Performance
  • 8.15.4 SWOT Analysis
• 8.16 Sumitomo Electric Industries, Ltd
  • 8.16.1 Overview
  • 8.16.2 Product Summary
  • 8.16.3 Financial Performance
  • 8.16.4 SWOT Analysis
• 8.17 Innoscience Technology Holding
  • 8.17.1 Overview
  • 8.17.2 Product Summary
  • 8.17.3 Financial Performance
  • 8.17.4 SWOT Analysis
• 8.18 Exagon
  • 8.18.1 Overview
  • 8.18.2 Product Summary
  • 8.18.3 Financial Performance
  • 8.18.4 SWOT Analysis
• 8.19 EPC Space LLC
  • 8.19.1 Overview
  • 8.19.2 Product Summary
  • 8.19.3 Financial Performance
  • 8.19.4 SWOT Analysis
• 8.20 Wise Integration
  • 8.20.1 Overview
  • 8.20.2 Product Summary
  • 8.20.3 Financial Performance
  • 8.20.4 SWOT Analysis

9 About Us

• 9.1 About Us
• 9.2 Research Methodology
• 9.3 Research Workflow
• 9.4 Consulting Services
• 9.5 Our Clients
• 9.6 Client Testimonials
• 9.7 Contact Us