공통 모드 초크 시장 분석 및 예측(-2035년) : 유형별, 제품 유형별, 기술별, 구성 부품별, 용도별, 재질별, 디바이스별, 최종 사용자별, 설치 유형별, 솔루션별

Common-mode Chokes Market is anticipated to expand from $662.3 million in 2024 to $1,110.1 million by 2034, growing at a CAGR of approximately 5.3%. The Common-mode Chokes Market encompasses components designed to attenuate electromagnetic interference in electrical circuits, enhancing signal integrity and reducing noise. These chokes are pivotal in automotive, industrial, and consumer electronics, where they ensure compliance with electromagnetic compatibility standards. The market is driven by rising electronic device proliferation and stringent regulatory requirements, fostering innovations in miniaturization and performance efficiency.

The Common-mode Chokes Market is experiencing robust growth, fueled by the increasing need for electromagnetic interference suppression in electronic devices. Among the segments, the automotive sector is the top performer, driven by the proliferation of electric vehicles and advanced driver-assistance systems. Consumer electronics, particularly in wearable devices and smartphones, follow closely, reflecting the demand for improved signal integrity and miniaturization.

In terms of sub-segments, the surface mount technology (SMT) chokes lead due to their ease of integration and space-saving design. Through-hole technology chokes, while traditional, remain significant, especially in applications requiring high durability and reliability. The industrial sector is also witnessing significant advancements, with automation and IoT integration driving the need for efficient noise suppression solutions.

The market is poised for further expansion as innovations in materials and design enhance the performance and efficiency of common-mode chokes, addressing the evolving needs of modern electronic systems.

The Common-mode Chokes Market is experiencing a dynamic shift in market share, largely attributed to strategic pricing and innovative product launches by key industry players. Companies are focusing on enhancing product performance and energy efficiency, which has led to a diversified product portfolio catering to a wide range of applications. The market is witnessing increased demand from sectors such as automotive, consumer electronics, and telecommunications. This trend is fueled by the growing need for electromagnetic interference suppression and improved signal integrity in electronic devices.

Competition benchmarking reveals a robust landscape where leading firms are investing in research and development to maintain a competitive edge. Regulatory influences, particularly in North America and Europe, are pivotal in shaping market dynamics, setting stringent standards for product quality and environmental compliance. The Asia-Pacific region is emerging as a significant player due to rapid industrialization and technological advancements. Enhanced manufacturing capabilities and strategic partnerships are driving growth, while challenges such as supply chain disruptions and fluctuating raw material prices persist.

Geographical Overview:

The Common-mode Chokes Market is witnessing notable growth across several regions, each exhibiting unique characteristics. North America remains a dominant player, driven by advancements in automotive and consumer electronics sectors. The region's robust technological infrastructure and increasing demand for electric vehicles bolster market expansion. Europe follows closely, with significant investments in renewable energy and electric vehicles fostering a conducive environment for common-mode chokes. The emphasis on reducing electromagnetic interference in industrial applications further enhances the market\u2019s prospects. In the Asia Pacific, rapid industrialization and urbanization are key growth drivers. Countries like China and India are emerging as lucrative markets due to their expanding automotive and electronics industries. The region's focus on sustainable energy solutions also propels market growth. Latin America and the Middle East & Africa present promising opportunities. Latin America's increasing industrial activities and the Middle East & Africa's growing investments in telecommunications and renewable energy sectors are pivotal in shaping market dynamics.

Key Trends and Drivers:

The Common-mode Chokes Market is experiencing robust growth, propelled by the escalating demand for electronic devices and the proliferation of wireless communication technologies. Key trends include the miniaturization of electronic components, which necessitates advanced electromagnetic interference (EMI) solutions to ensure device reliability and performance. The rise of electric vehicles (EVs) and renewable energy systems further amplifies the need for effective EMI mitigation, driving the adoption of common-mode chokes. Furthermore, the increasing complexity of automotive electronics and the shift towards autonomous driving technologies are significant drivers, as they require sophisticated noise suppression components. The growing emphasis on energy efficiency and regulatory compliance in electronic manufacturing also promotes the use of common-mode chokes. Opportunities abound in emerging markets where industrialization and digital transformation are accelerating. Companies that innovate in high-frequency and high-temperature applications are poised to capture substantial market share. The integration of Internet of Things (IoT) devices across various sectors is another critical driver, as it necessitates robust EMI solutions to maintain seamless connectivity and functionality. As industries continue to digitize, the demand for reliable and efficient EMI suppression components will persist, ensuring sustained growth for the common-mode chokes market.

US Tariff Impact:

The global tariff landscape, coupled with geopolitical risks, is intricately influencing the Common-mode Chokes Market, particularly in Japan, South Korea, China, and Taiwan. Japan and South Korea are strategically enhancing domestic production capabilities to mitigate tariff-induced cost increases and supply chain vulnerabilities. China's focus on self-reliance is intensifying, with significant investments in indigenous manufacturing to counteract export restrictions. Taiwan, a pivotal player in electronic components, faces geopolitical pressures that could disrupt its supply chain continuity. The parent market, encompassing electronic components, is witnessing robust growth driven by advancements in consumer electronics and automotive sectors. By 2035, market evolution will hinge on supply chain resilience and strategic regional partnerships. Concurrently, Middle East conflicts may exacerbate global energy price volatility, indirectly affecting manufacturing costs and supply chain dynamics.

Key Players:

Schaffner Group, Pulse Electronics, TDK Electronics, Wurth Elektronik, Murata Manufacturing, EPCOS, Laird Technologies, KEMET Corporation, Bourns, Vishay Intertechnology, Yageo Corporation, Taiyo Yuden, API Delevan, Coilcraft, Sumida Corporation, AVX Corporation, Bel Fuse, TE Connectivity, Panasonic Industry, TT Electronics

Research Scope:

• Estimates and forecasts the overall market size across type, application, and region.
• Provides detailed information and key takeaways on qualitative and quantitative trends, dynamics, business framework, competitive landscape, and company profiling.
• Identifies factors influencing market growth and challenges, opportunities, drivers, and restraints.
• Identifies factors that could limit company participation in international markets to help calibrate market share expectations and growth rates.
• Evaluates key development strategies like acquisitions, product launches, mergers, collaborations, business expansions, agreements, partnerships, and R&D activities.
• Analyzes smaller market segments strategically, focusing on their potential, growth patterns, and impact on the overall market.
• Outlines the competitive landscape, assessing business and corporate strategies to monitor and dissect competitive advancements.

Our research scope provides comprehensive market data, insights, and analysis across a variety of critical areas. We cover Local Market Analysis, assessing consumer demographics, purchasing behaviors, and market size within specific regions to identify growth opportunities. Our Local Competition Review offers a detailed evaluation of competitors, including their strengths, weaknesses, and market positioning. We also conduct Local Regulatory Reviews to ensure businesses comply with relevant laws and regulations. Industry Analysis provides an in-depth look at market dynamics, key players, and trends. Additionally, we offer Cross-Segmental Analysis to identify synergies between different market segments, as well as Production-Consumption and Demand-Supply Analysis to optimize supply chain efficiency. Our Import-Export Analysis helps businesses navigate global trade environments by evaluating trade flows and policies. These insights empower clients to make informed strategic decisions, mitigate risks, and capitalize on market opportunities.

TABLE OF CONTENTS

1 Executive Summary

• 1.1 Market Size and Forecast
• 1.2 Market Overview
• 1.3 Market Snapshot
• 1.4 Regional Snapshot
• 1.5 Strategic Recommendations
• 1.6 Analyst Notes

2 Market Highlights

• 2.1 Key Market Highlights by Type
• 2.2 Key Market Highlights by Product
• 2.3 Key Market Highlights by Technology
• 2.4 Key Market Highlights by Component
• 2.5 Key Market Highlights by Application
• 2.6 Key Market Highlights by Material Type
• 2.7 Key Market Highlights by Device
• 2.8 Key Market Highlights by End User
• 2.9 Key Market Highlights by Installation Type
• 2.10 Key Market Highlights by Solutions

3 Market Dynamics

• 3.1 Macroeconomic Analysis
• 3.2 Market Trends
• 3.3 Market Drivers
• 3.4 Market Opportunities
• 3.5 Market Restraints
• 3.6 CAGR Growth Analysis
• 3.7 Impact Analysis
• 3.8 Emerging Markets
• 3.9 Technology Roadmap
• 3.10 Strategic Frameworks
  • 3.10.1 PORTER's 5 Forces Model
  • 3.10.2 ANSOFF Matrix
  • 3.10.3 4P's Model
  • 3.10.4 PESTEL Analysis

4 Segment Analysis

• 4.1 Market Size & Forecast by Type (2020-2035)
  • 4.1.1 Toroidal
  • 4.1.2 Axial
  • 4.1.3 Radial
  • 4.1.4 SMD
  • 4.1.5 Common Mode
  • 4.1.6 Differential Mode
• 4.2 Market Size & Forecast by Product (2020-2035)
  • 4.2.1 Power Line Chokes
  • 4.2.2 Signal Line Chokes
  • 4.2.3 Data Line Chokes
• 4.3 Market Size & Forecast by Technology (2020-2035)
  • 4.3.1 Winding
  • 4.3.2 Multilayer
  • 4.3.3 Thin Film
  • 4.3.4 Thick Film
• 4.4 Market Size & Forecast by Component (2020-2035)
  • 4.4.1 Core
  • 4.4.2 Winding
  • 4.4.3 Shielding
  • 4.4.4 Encapsulation
• 4.5 Market Size & Forecast by Application (2020-2035)
  • 4.5.1 Consumer Electronics
  • 4.5.2 Automotive
  • 4.5.3 Industrial Equipment
  • 4.5.4 Telecommunication
  • 4.5.5 Medical Devices
  • 4.5.6 Renewable Energy
• 4.6 Market Size & Forecast by Material Type (2020-2035)
  • 4.6.1 Ferrite
  • 4.6.2 Iron Powder
  • 4.6.3 Nanocrystalline
• 4.7 Market Size & Forecast by Device (2020-2035)
  • 4.7.1 Transformers
  • 4.7.2 Inductors
  • 4.7.3 Filters
  • 4.7.4 Converters
• 4.8 Market Size & Forecast by End User (2020-2035)
  • 4.8.1 Manufacturing
  • 4.8.2 Automotive
  • 4.8.3 Aerospace
  • 4.8.4 Telecommunications
  • 4.8.5 Healthcare
  • 4.8.6 Consumer Electronics
• 4.9 Market Size & Forecast by Installation Type (2020-2035)
  • 4.9.1 Surface Mount
  • 4.9.2 Through Hole
• 4.10 Market Size & Forecast by Solutions (2020-2035)
  • 4.10.1 EMI Suppression
  • 4.10.2 Noise Reduction
  • 4.10.3 Signal Integrity
  • 4.10.4 Power Quality Improvement

5 Regional Analysis

• 5.1 Global Market Overview
• 5.2 North America Market Size (2020-2035)
  • 5.2.1 United States
    • 5.2.1.1 Type
    • 5.2.1.2 Product
    • 5.2.1.3 Technology
    • 5.2.1.4 Component
    • 5.2.1.5 Application
    • 5.2.1.6 Material Type
    • 5.2.1.7 Device
    • 5.2.1.8 End User
    • 5.2.1.9 Installation Type
    • 5.2.1.10 Solutions
  • 5.2.2 Canada
    • 5.2.2.1 Type
    • 5.2.2.2 Product
    • 5.2.2.3 Technology
    • 5.2.2.4 Component
    • 5.2.2.5 Application
    • 5.2.2.6 Material Type
    • 5.2.2.7 Device
    • 5.2.2.8 End User
    • 5.2.2.9 Installation Type
    • 5.2.2.10 Solutions
  • 5.2.3 Mexico
    • 5.2.3.1 Type
    • 5.2.3.2 Product
    • 5.2.3.3 Technology
    • 5.2.3.4 Component
    • 5.2.3.5 Application
    • 5.2.3.6 Material Type
    • 5.2.3.7 Device
    • 5.2.3.8 End User
    • 5.2.3.9 Installation Type
    • 5.2.3.10 Solutions
• 5.3 Latin America Market Size (2020-2035)
  • 5.3.1 Brazil
    • 5.3.1.1 Type
    • 5.3.1.2 Product
    • 5.3.1.3 Technology
    • 5.3.1.4 Component
    • 5.3.1.5 Application
    • 5.3.1.6 Material Type
    • 5.3.1.7 Device
    • 5.3.1.8 End User
    • 5.3.1.9 Installation Type
    • 5.3.1.10 Solutions
  • 5.3.2 Argentina
    • 5.3.2.1 Type
    • 5.3.2.2 Product
    • 5.3.2.3 Technology
    • 5.3.2.4 Component
    • 5.3.2.5 Application
    • 5.3.2.6 Material Type
    • 5.3.2.7 Device
    • 5.3.2.8 End User
    • 5.3.2.9 Installation Type
    • 5.3.2.10 Solutions
  • 5.3.3 Rest of Latin America
    • 5.3.3.1 Type
    • 5.3.3.2 Product
    • 5.3.3.3 Technology
    • 5.3.3.4 Component
    • 5.3.3.5 Application
    • 5.3.3.6 Material Type
    • 5.3.3.7 Device
    • 5.3.3.8 End User
    • 5.3.3.9 Installation Type
    • 5.3.3.10 Solutions
• 5.4 Asia-Pacific Market Size (2020-2035)
  • 5.4.1 China
    • 5.4.1.1 Type
    • 5.4.1.2 Product
    • 5.4.1.3 Technology
    • 5.4.1.4 Component
    • 5.4.1.5 Application
    • 5.4.1.6 Material Type
    • 5.4.1.7 Device
    • 5.4.1.8 End User
    • 5.4.1.9 Installation Type
    • 5.4.1.10 Solutions
  • 5.4.2 India
    • 5.4.2.1 Type
    • 5.4.2.2 Product
    • 5.4.2.3 Technology
    • 5.4.2.4 Component
    • 5.4.2.5 Application
    • 5.4.2.6 Material Type
    • 5.4.2.7 Device
    • 5.4.2.8 End User
    • 5.4.2.9 Installation Type
    • 5.4.2.10 Solutions
  • 5.4.3 South Korea
    • 5.4.3.1 Type
    • 5.4.3.2 Product
    • 5.4.3.3 Technology
    • 5.4.3.4 Component
    • 5.4.3.5 Application
    • 5.4.3.6 Material Type
    • 5.4.3.7 Device
    • 5.4.3.8 End User
    • 5.4.3.9 Installation Type
    • 5.4.3.10 Solutions
  • 5.4.4 Japan
    • 5.4.4.1 Type
    • 5.4.4.2 Product
    • 5.4.4.3 Technology
    • 5.4.4.4 Component
    • 5.4.4.5 Application
    • 5.4.4.6 Material Type
    • 5.4.4.7 Device
    • 5.4.4.8 End User
    • 5.4.4.9 Installation Type
    • 5.4.4.10 Solutions
  • 5.4.5 Australia
    • 5.4.5.1 Type
    • 5.4.5.2 Product
    • 5.4.5.3 Technology
    • 5.4.5.4 Component
    • 5.4.5.5 Application
    • 5.4.5.6 Material Type
    • 5.4.5.7 Device
    • 5.4.5.8 End User
    • 5.4.5.9 Installation Type
    • 5.4.5.10 Solutions
  • 5.4.6 Taiwan
    • 5.4.6.1 Type
    • 5.4.6.2 Product
    • 5.4.6.3 Technology
    • 5.4.6.4 Component
    • 5.4.6.5 Application
    • 5.4.6.6 Material Type
    • 5.4.6.7 Device
    • 5.4.6.8 End User
    • 5.4.6.9 Installation Type
    • 5.4.6.10 Solutions
  • 5.4.7 Rest of APAC
    • 5.4.7.1 Type
    • 5.4.7.2 Product
    • 5.4.7.3 Technology
    • 5.4.7.4 Component
    • 5.4.7.5 Application
    • 5.4.7.6 Material Type
    • 5.4.7.7 Device
    • 5.4.7.8 End User
    • 5.4.7.9 Installation Type
    • 5.4.7.10 Solutions
• 5.5 Europe Market Size (2020-2035)
  • 5.5.1 Germany
    • 5.5.1.1 Type
    • 5.5.1.2 Product
    • 5.5.1.3 Technology
    • 5.5.1.4 Component
    • 5.5.1.5 Application
    • 5.5.1.6 Material Type
    • 5.5.1.7 Device
    • 5.5.1.8 End User
    • 5.5.1.9 Installation Type
    • 5.5.1.10 Solutions
  • 5.5.2 France
    • 5.5.2.1 Type
    • 5.5.2.2 Product
    • 5.5.2.3 Technology
    • 5.5.2.4 Component
    • 5.5.2.5 Application
    • 5.5.2.6 Material Type
    • 5.5.2.7 Device
    • 5.5.2.8 End User
    • 5.5.2.9 Installation Type
    • 5.5.2.10 Solutions
  • 5.5.3 United Kingdom
    • 5.5.3.1 Type
    • 5.5.3.2 Product
    • 5.5.3.3 Technology
    • 5.5.3.4 Component
    • 5.5.3.5 Application
    • 5.5.3.6 Material Type
    • 5.5.3.7 Device
    • 5.5.3.8 End User
    • 5.5.3.9 Installation Type
    • 5.5.3.10 Solutions
  • 5.5.4 Spain
    • 5.5.4.1 Type
    • 5.5.4.2 Product
    • 5.5.4.3 Technology
    • 5.5.4.4 Component
    • 5.5.4.5 Application
    • 5.5.4.6 Material Type
    • 5.5.4.7 Device
    • 5.5.4.8 End User
    • 5.5.4.9 Installation Type
    • 5.5.4.10 Solutions
  • 5.5.5 Italy
    • 5.5.5.1 Type
    • 5.5.5.2 Product
    • 5.5.5.3 Technology
    • 5.5.5.4 Component
    • 5.5.5.5 Application
    • 5.5.5.6 Material Type
    • 5.5.5.7 Device
    • 5.5.5.8 End User
    • 5.5.5.9 Installation Type
    • 5.5.5.10 Solutions
  • 5.5.6 Rest of Europe
    • 5.5.6.1 Type
    • 5.5.6.2 Product
    • 5.5.6.3 Technology
    • 5.5.6.4 Component
    • 5.5.6.5 Application
    • 5.5.6.6 Material Type
    • 5.5.6.7 Device
    • 5.5.6.8 End User
    • 5.5.6.9 Installation Type
    • 5.5.6.10 Solutions
• 5.6 Middle East & Africa Market Size (2020-2035)
  • 5.6.1 Saudi Arabia
    • 5.6.1.1 Type
    • 5.6.1.2 Product
    • 5.6.1.3 Technology
    • 5.6.1.4 Component
    • 5.6.1.5 Application
    • 5.6.1.6 Material Type
    • 5.6.1.7 Device
    • 5.6.1.8 End User
    • 5.6.1.9 Installation Type
    • 5.6.1.10 Solutions
  • 5.6.2 United Arab Emirates
    • 5.6.2.1 Type
    • 5.6.2.2 Product
    • 5.6.2.3 Technology
    • 5.6.2.4 Component
    • 5.6.2.5 Application
    • 5.6.2.6 Material Type
    • 5.6.2.7 Device
    • 5.6.2.8 End User
    • 5.6.2.9 Installation Type
    • 5.6.2.10 Solutions
  • 5.6.3 South Africa
    • 5.6.3.1 Type
    • 5.6.3.2 Product
    • 5.6.3.3 Technology
    • 5.6.3.4 Component
    • 5.6.3.5 Application
    • 5.6.3.6 Material Type
    • 5.6.3.7 Device
    • 5.6.3.8 End User
    • 5.6.3.9 Installation Type
    • 5.6.3.10 Solutions
  • 5.6.4 Sub-Saharan Africa
    • 5.6.4.1 Type
    • 5.6.4.2 Product
    • 5.6.4.3 Technology
    • 5.6.4.4 Component
    • 5.6.4.5 Application
    • 5.6.4.6 Material Type
    • 5.6.4.7 Device
    • 5.6.4.8 End User
    • 5.6.4.9 Installation Type
    • 5.6.4.10 Solutions
  • 5.6.5 Rest of MEA
    • 5.6.5.1 Type
    • 5.6.5.2 Product
    • 5.6.5.3 Technology
    • 5.6.5.4 Component
    • 5.6.5.5 Application
    • 5.6.5.6 Material Type
    • 5.6.5.7 Device
    • 5.6.5.8 End User
    • 5.6.5.9 Installation Type
    • 5.6.5.10 Solutions

6 Market Strategy

• 6.1 Demand-Supply Gap Analysis
• 6.2 Trade & Logistics Constraints
• 6.3 Price-Cost-Margin Trends
• 6.4 Market Penetration
• 6.5 Consumer Analysis
• 6.6 Regulatory Snapshot

7 Competitive Intelligence

• 7.1 Market Positioning
• 7.2 Market Share
• 7.3 Competition Benchmarking
• 7.4 Top Company Strategies

8 Company Profiles

• 8.1 Schaffner Group
  • 8.1.1 Overview
  • 8.1.2 Product Summary
  • 8.1.3 Financial Performance
  • 8.1.4 SWOT Analysis
• 8.2 Pulse Electronics
  • 8.2.1 Overview
  • 8.2.2 Product Summary
  • 8.2.3 Financial Performance
  • 8.2.4 SWOT Analysis
• 8.3 TDK Electronics
  • 8.3.1 Overview
  • 8.3.2 Product Summary
  • 8.3.3 Financial Performance
  • 8.3.4 SWOT Analysis
• 8.4 Wurth Elektronik
  • 8.4.1 Overview
  • 8.4.2 Product Summary
  • 8.4.3 Financial Performance
  • 8.4.4 SWOT Analysis
• 8.5 Murata Manufacturing
  • 8.5.1 Overview
  • 8.5.2 Product Summary
  • 8.5.3 Financial Performance
  • 8.5.4 SWOT Analysis
• 8.6 EPCOS
  • 8.6.1 Overview
  • 8.6.2 Product Summary
  • 8.6.3 Financial Performance
  • 8.6.4 SWOT Analysis
• 8.7 Laird Technologies
  • 8.7.1 Overview
  • 8.7.2 Product Summary
  • 8.7.3 Financial Performance
  • 8.7.4 SWOT Analysis
• 8.8 KEMET Corporation
  • 8.8.1 Overview
  • 8.8.2 Product Summary
  • 8.8.3 Financial Performance
  • 8.8.4 SWOT Analysis
• 8.9 Bourns
  • 8.9.1 Overview
  • 8.9.2 Product Summary
  • 8.9.3 Financial Performance
  • 8.9.4 SWOT Analysis
• 8.10 Vishay Intertechnology
  • 8.10.1 Overview
  • 8.10.2 Product Summary
  • 8.10.3 Financial Performance
  • 8.10.4 SWOT Analysis
• 8.11 Yageo Corporation
  • 8.11.1 Overview
  • 8.11.2 Product Summary
  • 8.11.3 Financial Performance
  • 8.11.4 SWOT Analysis
• 8.12 Taiyo Yuden
  • 8.12.1 Overview
  • 8.12.2 Product Summary
  • 8.12.3 Financial Performance
  • 8.12.4 SWOT Analysis
• 8.13 API Delevan
  • 8.13.1 Overview
  • 8.13.2 Product Summary
  • 8.13.3 Financial Performance
  • 8.13.4 SWOT Analysis
• 8.14 Coilcraft
  • 8.14.1 Overview
  • 8.14.2 Product Summary
  • 8.14.3 Financial Performance
  • 8.14.4 SWOT Analysis
• 8.15 Sumida Corporation
  • 8.15.1 Overview
  • 8.15.2 Product Summary
  • 8.15.3 Financial Performance
  • 8.15.4 SWOT Analysis
• 8.16 AVX Corporation
  • 8.16.1 Overview
  • 8.16.2 Product Summary
  • 8.16.3 Financial Performance
  • 8.16.4 SWOT Analysis
• 8.17 Bel Fuse
  • 8.17.1 Overview
  • 8.17.2 Product Summary
  • 8.17.3 Financial Performance
  • 8.17.4 SWOT Analysis
• 8.18 TE Connectivity
  • 8.18.1 Overview
  • 8.18.2 Product Summary
  • 8.18.3 Financial Performance
  • 8.18.4 SWOT Analysis
• 8.19 Panasonic Industry
  • 8.19.1 Overview
  • 8.19.2 Product Summary
  • 8.19.3 Financial Performance
  • 8.19.4 SWOT Analysis
• 8.20 TT Electronics
  • 8.20.1 Overview
  • 8.20.2 Product Summary
  • 8.20.3 Financial Performance
  • 8.20.4 SWOT Analysis

9 About Us

• 9.1 About Us
• 9.2 Research Methodology
• 9.3 Research Workflow
• 9.4 Consulting Services
• 9.5 Our Clients
• 9.6 Client Testimonials
• 9.7 Contact Us