납땜 재료 시장 성장 기회, 성장 촉진요인, 산업 동향 분석 및 예측(2024-2032년)

The Global Solder Materials Market was valued at USD 4.7 billion in 2023 and is projected to reach grow at a CAGR of 3.4% from 2024 to 2032. This growth is largely driven by the increasing demand for electronics and consumer devices. As technology advances, particularly in areas such as wearables, smart devices, and IoT, the need for reliable solder materials has surged. Additionally, environmental regulations in regions like Europe and North America are accelerating the shift towards lead-free solder materials, encouraging manufacturers to adopt more eco-friendly alternatives and fueling market expansion. The solder materials market is categorized by product type, form, process, and application.

The market is segmented into lead-free and lead-based solder. Lead-free solder dominated the market with a value of USD 2.7 billion in 2023 and is projected to grow at a CAGR of 3.6% by 2032. This growth is mainly driven by environmental regulations that restrict the use of hazardous materials. Lead-free solder, often made from alloys like tin, silver, and copper, matches the performance of lead-based alternatives while being safer for the environment. The shift towards sustainable practices is further bolstered by consumers' increasing preference for eco-friendly electronics.

By form, the market is segmented into wire, bar, paste, preforms, and powder. In 2023, wire solder held a 40.2% share of the market, largely due to its extensive use in electronics manufacturing. Wire solder is essential for manual soldering and rework processes, ensuring reliable connections in PCBs across various industries. Despite growing automation in electronics production, the demand for wire solder remains strong, maintaining its dominant position in the market.

The market is also segmented by process, including screen printing, wave/reflow, and selective soldering. Wave/reflow soldering dominates due to its widespread application in the mass production of electronic components. This method delivers high precision and consistent quality, making it essential in manufacturing complex PCBs. The electronics sector leads the market, holding a 60% share.

The rising demand for reliable soldering in sectors, such as telecommunications and computing further supports this dominance. The increasing use of miniaturized components has solidified the electronics segment's leading position. The Asia Pacific region leads the solder materials market, attributed to a strong electronics manufacturing base. This region's advanced infrastructure and technology investments further contribute to its leadership in global market demand.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definition
• 1.2 Base estimates & calculations
• 1.3 Forecast calculation
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Industry 360° synopsis

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
  • 3.1.1 Key manufacturers
  • 3.1.2 Distributors
  • 3.1.3 Profit margins across the industry
• 3.2 Industry impact forces
  • 3.2.1 Growth drivers
  • 3.2.2 Market challenges
  • 3.2.3 Market opportunity
    • 3.2.3.1 New opportunities
    • 3.2.3.2 Growth potential analysis
• 3.3 Raw material landscape
  • 3.3.1.1 Manufacturing trends
  • 3.3.1.2 Technology evolution
  • 3.3.1.3 Sustainability in raw materials
• 3.4 Sustainable manufacturing
  • 3.4.1.1 Green practices
  • 3.4.1.2 Decarbonization
• 3.5 Pricing trends (USD/Ton), 2021 to 2032
  • 3.5.1.1 North America
  • 3.5.1.2 Europe
  • 3.5.1.3 Asia Pacific
  • 3.5.1.4 Latin America
  • 3.5.1.5 Middle East & Africa
• 3.6 Regulations & market impact
• 3.7 Porter's analysis
• 3.8 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

• 4.1 Introduction
• 4.2 Company matrix analysis
• 4.3 Company market share analysis
  • 4.3.1 Company Market share analysis by region
    • 4.3.1.1 North America
    • 4.3.1.2 Europe
    • 4.3.1.3 Asia Pacific
    • 4.3.1.4 Latin America
    • 4.3.1.5 Middle East Africa
• 4.4 Competitive positioning matrix
• 4.5 Strategic dashboard

Chapter 5 Market Size and Forecast, By Product Type, 2021-2032 (USD Billion, Kilo Tons)

• 5.1 Key trends
• 5.2 Lead-based solder
• 5.3 Lead-free solder

Chapter 6 Market Size and Forecast, By Form, 2021-2032 (USD Billion, Kilo Tons)

• 6.1 Key trends
• 6.2 Wire
• 6.3 Paste
• 6.4 Bar
• 6.5 Preforms
• 6.6 Powder

Chapter 7 Market Size and Forecast, By Process, 2021-2032 (USD Billion, Kilo Tons)

• 7.1 Key trends
• 7.2 Screen printing
• 7.3 Wave/reflow
• 7.4 Selective soldering

Chapter 8 Market Size and Forecast, By Application, 2021-2032 (USD Billion, Kilo Tons)

• 8.1 Key trends
• 8.2 Electronics
• 8.3 Automotive
• 8.4 Aerospace
• 8.5 Industrial

Chapter 9 Market Size and Forecast, By Region, 2021-2032 (USD Billion, Kilo Tons)

• 9.1 Key trends
• 9.2 North America
  • 9.2.1 U.S.
  • 9.2.2 Canada
• 9.3 Europe
  • 9.3.1 Germany
  • 9.3.2 UK
  • 9.3.3 France
  • 9.3.4 Italy
  • 9.3.5 Spain
• 9.4 Asia Pacific
  • 9.4.1 China
  • 9.4.2 India
  • 9.4.3 Japan
  • 9.4.4 South Korea
  • 9.4.5 Australia
• 9.5 Latin America
  • 9.5.1 Brazil
  • 9.5.2 Mexico
  • 9.5.3 Argentina
• 9.6 MEA
  • 9.6.1 Saudi Arabia
  • 9.6.2 UAE
  • 9.6.3 South Africa

Chapter 10 Company Profiles

• 10.1 Element Solution Inc
• 10.2 Fusion, Inc
• 10.3 Henkel AG & Co. KGaA.
• 10.4 Indium Corporation
• 10.5 Koki Company Limited
• 10.6 Lucas Milhaupt
• 10.7 Premier Industries
• 10.8 Qualitek International, Inc
• 10.9 Senju Metal Industry Co., Ltd
• 10.10 Shital Metals Pvt Ltd
• 10.11 Stannol GmbH Co. KG