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Metal Core PCB (MCPCB) Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 to 2032

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  • ABP Electronics Limited
  • Advanced Circuits, Inc.
  • Aoshikang Technology Co., Ltd.
  • AT&S Austria Technologie & Systemtechnik AG
  • Best Technology
  • Cirexx International
  • Epec, LLC.
  • ExPlus Co.
  • Focus Technology Co., Ltd.
  • Fujikura Ltd.
  • HuanYu Future Technologies Co., Ltd.
  • Infineon
  • Insulectro
  • Isola Group
  • Meyer Burger Technology AG
  • Mitsubishi Materials Corporation
  • RIGIFLEX TECHNOLOGY INC.
  • Sierra Circuits, Inc.
  • Technotronix
  • Viasion Technology Co., Ltd.
KSA 25.01.08

The Global Metal Core PCB (MCPCB) Market was valued at USD 13.7 billion in 2023 and is projected to grow at a CAGR of 4% from 2024 to 2032. This growth is primarily driven by the global shift towards energy-efficient lighting solutions, which has significantly increased the demand for Light Emitting Diode (LED) technology. Metal core PCBs are crucial in LED applications as they efficiently manage heat dissipation. As LED lighting systems continue to replace fluorescent bulbs and traditional incandescent in various settings, including residential, commercial, and automotive, the demand for MCPCBs with enhanced thermal management features is on the rise. The ongoing expansion of smart lighting and automotive lighting, especially in the context of electric vehicles, is further fueling this market growth, solidifying the role of MCPCBs as vital components in modern energy-efficient lighting solutions.

In the automotive sector, the demand for metal core PCBs is also increasing due to the industry's rapid technological advancements. Innovations such as electric vehicles (EVs), autonomous driving systems, and advanced driver-assistance systems (ADAS) require durable and heat-resistant electronic components. Metal core PCBs excel in this regard, thanks to their exceptional heat dissipation properties. The integration of high-power electronics in vehicles, including systems for battery management and power conversion, is a significant driver of growth within the MCPCB market.

The market can be categorized based on layer type into single-layer, double-layer, and multi-layer MCPCBs. The single-layer MCPCB segment is anticipated to grow at a CAGR of over 3% during the forecast period. Single-layer MCPCBs consist of a single conductive copper layer mounted on a metal core, typically aluminum or copper, with an insulating dielectric layer in between. These boards are ideal for applications that prioritize heat dissipation with minimal circuit complexity, making them a cost-effective choice for industries such as LED lighting, automotive lighting, and consumer electronics.

Market Scope
Start Year2023
Forecast Year2024-2032
Start Value$13.7 Billion
Forecast Value$ 20 Billion
CAGR4%

Additionally, the market can be segmented by core material into aluminum core PCBs, copper core PCBs, and other metal core PCBs. The aluminum core segment is expected to reach USD 9 billion by 2032. Aluminum core PCBs are favored for their excellent thermal conductivity, lightweight nature, and cost-effectiveness, making them ideal for applications that require efficient heat dissipation without adding significant weight. The Asia-Pacific region led the global MCPCB market in 2023, accounting for over 30% of the total share. This region's dominance is attributed to its robust electronics and manufacturing sectors, with major players relying on MCPCBs for effective heat management.

The U.S. market is also experiencing strong growth, driven by increasing demand from the automotive and telecommunications industries, particularly related to 5G infrastructure and renewable energy projects.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Factor affecting the value chain
    • 3.1.2 Profit margin analysis
    • 3.1.3 Disruptions
    • 3.1.4 Future outlook
    • 3.1.5 Manufacturers
    • 3.1.6 Distributors
  • 3.2 Supplier landscape
  • 3.3 Profit margin analysis
  • 3.4 Key news & initiatives
  • 3.5 Regulatory landscape
  • 3.6 Impact forces
    • 3.6.1 Growth drivers
      • 3.6.1.1 Increasing demand for LED lighting
      • 3.6.1.2 Rising adoption in automotive electronics
      • 3.6.1.3 Expansion of consumer electronics market
      • 3.6.1.4 Advancements in telecommunications and 5G infrastructure
    • 3.6.2 Industry pitfalls & challenges
      • 3.6.2.1 High manufacturing costs
      • 3.6.2.2 Competition of emerging technologies
  • 3.7 Growth potential analysis
  • 3.8 Porter's analysis
  • 3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Aluminum core PCBs
  • 5.3 Copper core PCBs
  • 5.4 Other metal core PCBs

Chapter 6 Market Estimates & Forecast, By Layer Type, 2021-2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Single-Layer MCPCBs
  • 6.3 Double-Layer MCPCBs
  • 6.4 Multi-layer MCPCBs

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

  • 7.1 Key trends
  • 7.2 LED lighting
  • 7.3 Power converters
  • 7.4 Electric vehicles
  • 7.5 Solar panels
  • 7.6 Telecommunications equipment
  • 7.7 Automotive electronics
  • 7.8 Consumer electronics
  • 7.9 Aerospace and defense
  • 7.10 Medical devices
  • 7.11 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 UK
    • 8.3.2 Germany
    • 8.3.3 France
    • 8.3.4 Italy
    • 8.3.5 Spain
    • 8.3.6 Russia
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 South Korea
    • 8.4.5 Australia
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
  • 8.6 MEA
    • 8.6.1 South Africa
    • 8.6.2 Saudi Arabia
    • 8.6.3 UAE

Chapter 9 Company Profiles

  • 9.1 ABP Electronics Limited
  • 9.2 Advanced Circuits, Inc.
  • 9.3 Aoshikang Technology Co., Ltd.
  • 9.4 AT&S Austria Technologie & Systemtechnik AG
  • 9.5 Best Technology
  • 9.6 Cirexx International
  • 9.7 Epec, LLC.
  • 9.8 ExPlus Co.
  • 9.9 Focus Technology Co., Ltd.
  • 9.10 Fujikura Ltd.
  • 9.11 HuanYu Future Technologies Co., Ltd.
  • 9.12 Infineon
  • 9.13 Insulectro
  • 9.14 Isola Group
  • 9.15 Meyer Burger Technology AG
  • 9.16 Mitsubishi Materials Corporation
  • 9.17 RIGIFLEX TECHNOLOGY INC.
  • 9.18 Sierra Circuits, Inc.
  • 9.19 Technotronix
  • 9.20 Viasion Technology Co., Ltd.
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