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Àü±â ¹è¼± »óÈ£ Á¢¼Ó ½Ã½ºÅÛ ½ÃÀå ±âȸ, ¼ºÀå ÃËÁø¿äÀÎ, »ê¾÷ µ¿Ç⠺м® ¹× ¿¹Ãø(2025-2034³â)Electrical Wiring Interconnection System (EWIS) Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034 |
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½ÃÀå ¹üÀ§ | |
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½ÃÀÛ ¿¬µµ | 2024³â |
¿¹Ãø ¿¬µµ | 2025-2034³â |
½ÃÀÛ ±Ý¾× | 81¾ï ´Þ·¯ |
¿¹Ãø ±Ý¾× | 129¾ï ´Þ·¯ |
CAGR | 4.9% |
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¿ëµµº°·Î´Â ¾Æºñ¿À´Ð½º ºÎ¹®ÀÌ 2024³â¿¡ 27.9%ÀÇ Á¡À¯À²À» Â÷ÁöÇß½À´Ï´Ù. ¶ó¿ìÆÃ, ÀüÀڱ⠰£¼· Â÷Æó ¹× µðÁöÅÐ ´ë½Ãº¸µå¿ÍÀÇ ÅëÇÕÀº ƯÈ÷ ±º¿ë±â ¹× ¹Î°£±â¿¡¼ Ç¥ÁØÀÌ µÇ°í ÀÖÀ¸¸ç, ÀÌ·¯ÇÑ ½Ã½ºÅÛÀº °í±Þ Ç×°ø±â ¼ºê½Ã½ºÅÛ ³»¿¡¼ ÀϰüµÈ Àü·Â È帧°ú µ¥ÀÌÅÍ ¿¬°á¼ºÀ» º¸ÀåÇÕ´Ï´Ù.
¹Ì±¹ÀÇ Àü±â ¹è¼± »óÈ£ Á¢¼Ó ½Ã½ºÅÛ ½ÃÀåÀº Ç×°ø¿ìÁÖ ¹× ¹æÀ§ ºÐ¾ßÀÇ È®´ë·Î 2024³â¿¡ 15¾ï ´Þ·¯¸¦ âÃâÇß½À´Ï´Ù. ¿¹»ê Áõ°¡¿¡ ÁÖ·ÂÇϰí ÀÖÀ¸¸ç, °í±Þ EWIS ¹èÆ÷¸¦ Áö¿øÇÕ´Ï´Ù.
TE Connectivity, Collins Aerospace, Honeywell International Inc. Amphenol Corporation, Safran µîÀÇ ´ë±â¾÷Àº RandD ½Ã¼³ÀÇ È®Àå, °æ·® Àç·áÀÇ ±â¼ú Çõ½Å¿¡ ´ëÇÑ ÅõÀÚ, ¸ðµâ ¼³°è ´É·ÂÀÇ °È µîÀÇ Àü·«À» ä¿ëÇϰí ÀÖ½À´Ï´Ù.
The Global Electrical Wiring Interconnection System Market was valued at USD 8.1 billion in 2024 and is estimated to grow at a CAGR of 4.9% to reach USD 12.9 billion by 2034, driven by the rapid transition toward all-electric and more-electric aircraft playing a central role in driving this growth. Increased demand for integrated electric systems in aviation, combined with the rising use of in-flight entertainment and real-time connectivity systems, is reshaping wiring infrastructure. The emergence of Urban Air Mobility (UAM) platforms and electric vertical takeoff and landing (eVTOL) aircraft are accelerating innovation across the EWIS landscape. These aircraft require lightweight, high-performance wiring capable of handling complex electrical and data transmission tasks. Rising interest in sustainable aviation and enhanced electrification is increasing dependency on advanced wiring systems that integrate seamlessly with evolving flight technologies.
However, the industry faces pressure due to elevated material costs from tariffs on aluminum, copper, and steel. These metals are critical to producing EWIS components, including connectors, cables, and enclosures. As a result, manufacturers and end-users are experiencing increased production costs. In addition, tariffs on electronic and semiconductor imports from China are hampering supply chains and affecting the development of next-gen EWIS components, particularly those used in digital systems and automated aircraft platforms.
Market Scope | |
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Start Year | 2024 |
Forecast Year | 2025-2034 |
Start Value | $8.1 Billion |
Forecast Value | $12.9 Billion |
CAGR | 4.9% |
The wire and cables segment generated USD 2.8 billion in 2024, largely due to demand for advanced materials that offer thermal resistance, signal fidelity, and lightweight designs. As modern aircraft increasingly incorporate digital and electric technologies, there's a heightened requirement for high-performance wiring systems, including fiber optics and power distribution solutions. Innovations in insulation and shielding technologies enable safer and more efficient operations while helping reduce overall aircraft weight.
In terms of application, the avionics segment held a 27.9% share in 2024. With the digital transformation of cockpit controls, communication systems, and flight data processing, the demand for reliable and compact EWIS is growing significantly. Precision routing, electromagnetic interference shielding, and integration with digital dashboards are now standard, especially in military and commercial fleets. These systems ensure consistent power flow and data connectivity within advanced aircraft subsystems.
U.S. Electrical Wiring Interconnection System (EWIS) Market generated USD 1.5 billion in 2024 due to its expanding aerospace and defense sectors. The country's focus on more electric aircraft, increasing urban air mobility projects, and rising defense budgets support advanced EWIS deployment. Investments in automation and modular wiring systems, along with strong OEM and supplier networks, continue to fuel national demand.
Leading players such as TE Connectivity, Collins Aerospace, Honeywell International Inc., Amphenol Corporation, and Safran are adopting strategies like expanding RandD facilities, investing in lightweight material innovation, and enhancing modular design capabilities. Many are forming strategic partnerships with aircraft manufacturers and defense agencies to co-develop next-gen solutions. Companies focus on digital integration, smart diagnostics, and scalable wiring systems that support rapid aircraft assembly and long-term operational reliability.