텔레매틱스 반도체 시장 : 시장 기회 및 촉진요인, 산업 동향 분석, 예측(2025-2034년)

The Global Telematics Semiconductors Market was valued at USD 14.9 billion in 2024 and is estimated to grow at a CAGR of 10.9% to reach USD 41.9 billion by 2034.

The rapid expansion is fueled by the surge in connected vehicle technologies, the integration of AI in telematics control units (TCUs), the adoption of vehicle-to-everything (V2X) communication systems, and the widespread use of embedded GNSS modules. Automakers are increasingly investing in high-performance, energy-efficient telematics semiconductors to support features like real-time tracking, fleet safety compliance, predictive analytics, over-the-air updates, and warranty optimization. As connected vehicle platforms and intelligent transportation networks evolve, telematics chips are becoming a core component of digital transformation across the mobility landscape. Automotive OEMs are incorporating telematics capabilities to align with safety regulations, improve operational efficiencies, and enable next-gen mobility-as-a-service models. Growing demand for secure, real-time data processing and better integration of vehicle systems has led to widespread adoption of advanced telematics SoCs, low-power wireless transceivers, and automotive-grade microcontrollers. This transition is further supported by the rise of smart mobility ecosystems and digital vehicle lifecycle platforms across multiple regions and vehicle segments.

The system-on-chip (SoC) solutions segment held 34.2% share and is expected to grow at a CAGR of 10.5% from 2025 through 2034. SoCs are increasingly favored due to their ability to combine processing, connectivity, and security features into a single compact solution. Their integrated architecture allows for improved performance, lower power consumption, and reduced hardware footprint. Automakers are turning to SoCs for their scalability, low-latency design, and ability to handle real-time data for applications such as predictive maintenance, vehicle diagnostics, location tracking, and OTA firmware updates. The increasing shift to connected vehicle architectures is further driving the demand for SoC-based telematics solutions.

The embedded telematics segment held a 55% share in 2024 and is expected to register a CAGR of 9.6% through 2034. Embedded solutions are gaining momentum among OEMs and large fleet operators due to their factory-installed nature, high reliability, and compliance with stringent data protection requirements. These integrated modules enable seamless tracking, remote diagnostics, and improved fleet governance across a wide range of vehicle platforms and geographical regions. Embedded telematics modules also support advanced vehicle electronics infrastructure and are considered essential for modern-day fleet management, especially in commercial and electric vehicle segments.

United States Telematics Semiconductors Market held an 83% share, generating USD 4.5 billion in 2024. The strong performance of the U.S. market is attributed to the fast adoption of connected vehicle platforms, regulatory emphasis on vehicle safety and data transparency, and rapid investments in next-gen telematics infrastructure. Increased use of AI-powered SoCs, V2X communication modules, and embedded chipsets is driving the integration of telematics across passenger cars, commercial fleets, and electric vehicles. The U.S. market continues to lead in terms of innovation, scalability, and real-time connectivity in the automotive semiconductor space.

Leading companies in the Global Telematics Semiconductors Market include Qualcomm, MediaTek, Renesas Electronics, STMicroelectronics, Analog Devices, Texas Instruments, Murata Manufacturing, Fibocom Wireless, NXP Semiconductors, and Infineon Technologies. To strengthen their foothold, companies operating in the telematics semiconductors space are focusing on a mix of technological innovation, strategic partnerships, and product portfolio expansion. Many are investing in the development of low-power, high-performance chipsets tailored to support AI-enabled telematics functions, cybersecurity, and V2X communication. Collaborations with automotive OEMs and Tier-1 suppliers help ensure tighter integration into vehicle platforms. Firms are also scaling R&D activities to shorten design cycles and enhance real-time processing capabilities.

Table of Contents

Chapter 1 Methodology

• 1.1 Market scope and definition
• 1.2 Research design
  • 1.2.1 Research approach
  • 1.2.2 Data collection methods
• 1.3 Data mining sources
  • 1.3.1 Global
  • 1.3.2 Regional/country
• 1.4 Base estimates and calculations
  • 1.4.1 Base year calculation
  • 1.4.2 Key trends for market estimation
• 1.5 Primary research and validation
  • 1.5.1 Primary sources
• 1.6 Forecast
• 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

• 2.1 Industry 360⁰ synopsis, 2021-2034
• 2.2 Key market trends
  • 2.2.1 Regional
  • 2.2.2 Type
  • 2.2.3 Connectivity
  • 2.2.4 Vehicle
• 2.3 TAM Analysis, 2025-2034
• 2.4 CXO perspectives: Strategic imperatives
  • 2.4.1 Key decision points for industry executives
  • 2.4.2 Critical success factors for market players
• 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
  • 3.1.1 Supplier landscape
    • 3.1.1.1 Chip Manufacturers
    • 3.1.1.2 Connectivity and Communication Module Providers
    • 3.1.1.3 Platform and Software Vendors
    • 3.1.1.4 Distributors and Aggregators
    • 3.1.1.5 OEMs
    • 3.1.1.6 System Integrators and Service Providers
    • 3.1.1.7 End use
  • 3.1.2 Profit margin analysis
  • 3.1.3 Value addition at each stage
  • 3.1.4 Factor affecting the value chain
  • 3.1.5 Disruptions
• 3.2 Industry impact forces
  • 3.2.1 Growth drivers
    • 3.2.1.1 Rapid connected vehicle adoption
    • 3.2.1.2 Regulatory push for safety and compliance
    • 3.2.1.3 OEM focus on operational efficiency
    • 3.2.1.4 Rising Demand for OTA and Cloud-Integrated Systems
  • 3.2.2 Industry pitfalls and challenges
    • 3.2.2.1 High development and integration costs
    • 3.2.2.2 Cybersecurity and data privacy risks
  • 3.2.3 Opportunities
    • 3.2.3.1 Emerging markets & regional expansion
    • 3.2.3.2 Integration with EV and autonomous platforms
    • 3.2.3.3 Shift to software-defined vehicles
    • 3.2.3.4 Growth of Mobility-as-a-Service (MaaS) and Fleet Telematics
• 3.3 Regulatory Landscape
  • 3.3.1 Global Regulatory Framework Overview
  • 3.3.2 Regional Compliance Requirements
  • 3.3.3 Emerging Regulatory Trends
  • 3.3.4 Regulatory Compliance Costs Analysis
  • 3.3.5 Impact of Policy Changes on Market Dynamics
• 3.4 Technology & Innovation Landscape
  • 3.4.1 Current Technological Trends
  • 3.4.2 Emerging Technologies Assessment
  • 3.4.3 Technology Adoption Curves
  • 3.4.4 Innovation Hotspots Analysis
  • 3.4.5 Technology Convergence Trends
  • 3.4.6 Disruptive Technology Impact
  • 3.4.7 R&D Investment Patterns
  • 3.4.8 Technology Roadmap Analysis
• 3.5 Pricing analysis
  • 3.5.1 By Region
  • 3.5.2 By Product
• 3.6 Patent analysis
• 3.7 Growth potential analysis
• 3.8 Porter’s analysis
• 3.9 PESTEL analysis
• 3.10 Sustainability & Environmental Aspects
  • 3.10.1 Sustainable Manufacturing Practices
  • 3.10.2 Waste Reduction Strategies
  • 3.10.3 Energy Efficiency in Production
  • 3.10.4 Eco-friendly Material Usage
  • 3.10.5 Circular Economy Implementation
  • 3.10.6 Environmental Compliance Costs
• 3.11 Risk Assessment Framework
  • 3.11.1 Technology Risk Analysis
  • 3.11.2 Supply Chain Risk Assessment
  • 3.11.3 Market Risk Evaluation
  • 3.11.4 Regulatory Risk Analysis
  • 3.11.5 Financial Risk Assessment
  • 3.11.6 Operational Risk Factors
  • 3.11.7 Risk Mitigation Strategies
• 3.12 Supply Chain Resilience Assessment
  • 3.12.1 Supply Chain Vulnerability Analysis
  • 3.12.2 Single Point of Failure Identification
  • 3.12.3 Diversification Strategies
  • 3.12.4 Supply Chain Transparency
  • 3.12.5 Risk Mitigation Frameworks
  • 3.12.6 Alternative Sourcing Options

Chapter 4 Competitive Landscape, 2024

• 4.1 Introduction
• 4.2 Company market share analysis
  • 4.2.1 North America
  • 4.2.2 Europe
  • 4.2.3 Asia Pacific
  • 4.2.4 LATAM
  • 4.2.5 MEA
• 4.3 Competitive analysis of major market players
• 4.4 Competitive positioning matrix
• 4.5 Strategic outlook matrix
• 4.6 Key developments
  • 4.6.1 Mergers & acquisitions
  • 4.6.2 Partnerships & collaborations
  • 4.6.3 New Product Launches
  • 4.6.4 Expansion Plans and funding

Chapter 5 Market Estimates & Forecast, By Type, 2021 - 2034 ($Bn, Units)

• 5.1 Key trends
• 5.2 Microcontrollers (MCUs)
• 5.3 System-on-Chip (SoC)
• 5.4 Communication ICs
• 5.5 Power Management ICs (PMICs)
• 5.6 Memory and Storage

Chapter 6 Market Estimates & Forecast, By Connectivity, 2021 - 2034 ($Bn, Units)

• 6.1 Key trends
• 6.2 Embedded
• 6.3 Tethered
• 6.4 Integrated

Chapter 7 Market Estimates & Forecast, By Vehicle, 2021 - 2034 ($Bn, Units)

• 7.1 Key trends
• 7.2 Passenger Vehicles
  • 7.2.1 Compact
  • 7.2.2 Mid-Size
  • 7.2.3 Luxury
  • 7.2.4 SUV
• 7.3 Commercial Vehicles
  • 7.3.1 Light Commercial Vehicles (LCV)
  • 7.3.2 Heavy Commercial Vehicles (HCV)
  • 7.3.3 Buses
• 7.4 Electric & Hybrid Vehicles

Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2034 ($Bn, Units)

• 8.1 Key trends
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 France
  • 8.3.3 UK
  • 8.3.4 Spain
  • 8.3.5 Italy
  • 8.3.6 Russia
  • 8.3.7 Nordics
• 8.4 Asia Pacific
  • 8.4.1 China
  • 8.4.2 India
  • 8.4.3 Japan
  • 8.4.4 South Korea
  • 8.4.5 ANZ
  • 8.4.6 Southeast Asia
• 8.5 Latin America
  • 8.5.1 Brazil
  • 8.5.2 Mexico
  • 8.5.3 Argentina
• 8.6 Middle East and Africa
  • 8.6.1 UAE
  • 8.6.2 Saudi Arabia
  • 8.6.3 South Africa

Chapter 9 Company Profiles

• 9.1 Global Players
  • 9.1.1 Analog Devices
  • 9.1.2 Broadcom
  • 9.1.3 Infineon Technologies
  • 9.1.4 Microchip Technology
  • 9.1.5 NXP Semiconductors
  • 9.1.6 ON Semiconductor
  • 9.1.7 Qualcomm
  • 9.1.8 Renesas Electronics
  • 9.1.9 STMicroelectronics
  • 9.1.10 Texas Instruments
• 9.2 Regional Players
  • 9.2.1 Fibocom Wireless
  • 9.2.2 MediaTek
  • 9.2.3 Murata Manufacturing
  • 9.2.4 Quectel Wireless Solutions
  • 9.2.5 ROHM Semiconductor
  • 9.2.6 Samsung Semiconductor
  • 9.2.7 Sierra Wireless
  • 9.2.8 Sony Semiconductor Solutions
  • 9.2.9 Telit Communications
  • 9.2.10 u-blox AG
• 9.3 Emerging Players
  • 9.3.1 Altair Semiconductor
  • 9.3.2 Cavli Wireless
  • 9.3.3 Nordic Semiconductor
  • 9.3.4 Sequans Communications
  • 9.3.5 Silicon Labs