차량용 네트워크 반도체 시장 : 시장 기회 및 성장 촉진요인, 산업 동향 분석, 예측(2025-2034년)

The Global In-Vehicle Networking Semiconductors Market was valued at USD 538.9 million in 2024 and is estimated to grow at a CAGR of 8.8% to reach USD 1.2 billion by 2034.

These semiconductors are revolutionizing the automotive electronics landscape by enabling seamless, high-speed communication between various subsystems in modern vehicles. Key factors fueling market expansion include the rapid shift toward vehicle electrification, the widespread integration of advanced driver-assistance systems (ADAS), enhanced infotainment technologies, and increasing vehicle architecture complexity. With innovation accelerating, manufacturers are prioritizing energy-efficient, AI-compatible, and security-focused semiconductor solutions. As companies shift their focus to chip localization and strengthen supply chain resilience in the post-pandemic era, regions like Asia and Europe are witnessing a surge in semiconductor manufacturing. Asia-Pacific holds the largest market share, accounting for 39% in 2024, thanks to its robust EV, electronics, and automotive sectors. The market landscape is shaped by continued investments in digital infrastructure and smart mobility by automakers and Tier-1 suppliers, driving demand for advanced networking solutions across connected and autonomous vehicles.

The passenger vehicles segment held a 60% share in 2024 and is expected to grow at a CAGR of 7.9% between 2025 and 2034. Increasing demand for in-car connectivity, safety features, and sophisticated software architecture is pushing automakers to rely more heavily on semiconductor integration in compact cars, sedans, and SUVs. As regulatory requirements tighten around safety, cybersecurity, and emissions, vehicle manufacturers are turning to semiconductors for real-time communication and reliable system coordination. These chips are becoming central to enabling next-generation features in passenger vehicles, positioning them as essential components in the evolving automotive ecosystem.

The controller area network (CAN) segment is projected to grow at a CAGR of 8.7% from 2025 to 2034. CAN-based semiconductors continue to be the preferred choice for real-time automotive networking due to their robust reliability, cost efficiency, and flexibility in adapting to a wide range of vehicle designs. These chips are particularly vital in supporting critical applications such as ADAS and connected car platforms, offering consistent performance in safety-centric environments. Their ability to integrate seamlessly across diverse systems makes them an indispensable component in automotive electronics.

Asia-Pacific In-Vehicle Networking Semiconductors Market held a 39% share in 2024. The region's dominance is supported by rapid advancements in vehicle electrification, increasing adoption of ADAS, and growing demand for connected and smart mobility solutions. Strong automotive and electronics manufacturing bases, along with supportive government policies and local OEM investments, continue to drive regional growth. Enhanced R&D initiatives and rising interest in autonomous and connected vehicles are further accelerating the need for high-performance networking chips in countries across Asia. Companies across the region are investing in scaling production and pushing innovation forward to meet evolving automotive requirements.

Major players like Microchip Technology, Renesas Electronics, Broadcom, Continental, Analog Devices, Qualcomm, Texas Instruments, and Elmos Semiconductor continue to shape the In-Vehicle Networking Semiconductors Market. To reinforce their position, companies in the in-vehicle networking semiconductors industry are adopting a range of strategic initiatives. Leading firms are focusing on designing scalable, low-power chipsets that support zonal architectures and multi-domain communication systems. Prioritizing AI-ready and cybersecurity-enhanced semiconductor solutions has become central as vehicles become increasingly software-defined. Additionally, players are investing heavily in localized production facilities and partnerships to enhance supply chain stability and address post-pandemic disruptions. Collaborations with OEMs and Tier-1 suppliers enable tailored solutions that align with regional regulations and customer demands.

Table of Contents

Chapter 1 Methodology

• 1.1 Market scope and definition
• 1.2 Research design
  • 1.2.1 Research approach
  • 1.2.2 Data collection methods
• 1.3 Data mining sources
  • 1.3.1 Global
  • 1.3.2 Regional/Country
• 1.4 Base estimates and calculations
  • 1.4.1 Base year calculation
  • 1.4.2 Key trends for market estimation
• 1.5 Primary research and validation
  • 1.5.1 Primary sources
• 1.6 Forecast model
• 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

• 2.1 Industry 360° synopsis, 2021 - 2034
• 2.2 Key market trends
  • 2.2.1 Regional
  • 2.2.2 Component
  • 2.2.3 Vehicle
  • 2.2.4 Communication Protocol
  • 2.2.5 Application
  • 2.2.6 Bandwidth
• 2.3 TAM Analysis, 2025-2034
• 2.4 CXO perspectives: Strategic imperatives
  • 2.4.1 Executive decision points
  • 2.4.2 Critical success factors
• 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
  • 3.1.1 Supplier landscape
  • 3.1.2 Profit margin analysis
  • 3.1.3 Cost structure
  • 3.1.4 Value addition at each stage
  • 3.1.5 Factor affecting the value chain
  • 3.1.6 Disruptions
• 3.2 Industry impact forces
  • 3.2.1.1 Growth drivers
  • 3.2.1.2 Shifts toward vehicle automation and ADAS
  • 3.2.1.3 Growing adoption of electric and hybrid vehicles
  • 3.2.1.4 Shift toward high-speed, centralized, and zonal vehicle architectures
  • 3.2.1.5 Increasing consumer preference for smart, feature-rich vehicles
  • 3.2.1.6 Regulatory focus on vehicle safety, cybersecurity, and communication reliability
  • 3.2.2 Industry pitfalls and challenges
    • 3.2.2.1 Electronic reliability under harsh automotive conditions
    • 3.2.2.2 Rapidly evolving communication protocols and standards
  • 3.2.3 Market opportunities
    • 3.2.3.1 Integration with electric and hybrid vehicle platforms
    • 3.2.3.2 Advancements in automotive Ethernet and high-speed networking chips
    • 3.2.3.3 Expansion of ADAS, autonomous, and connected vehicle technologies
    • 3.2.3.4 Rising adoption of software-defined and centralized vehicle architectures
• 3.3 Growth potential analysis
• 3.4 Regulatory landscape
  • 3.4.1 Regional automotive standards variations
  • 3.4.2 Type approval and homologation requirements
  • 3.4.3 Cybersecurity certification processes
  • 3.4.4 International standards harmonization
• 3.5 Porter's analysis
• 3.6 PESTEL analysis
• 3.7 Technology and innovation landscape
  • 3.7.1 Current technological trends
  • 3.7.2 Emerging technologies
• 3.8 Patent analysis
• 3.9 Cost breakdown analysis
• 3.10 Sustainability and environmental aspects
  • 3.10.1 Sustainable practices
  • 3.10.2 Waste reduction strategies
  • 3.10.3 Energy efficiency in production
  • 3.10.4 Eco-friendly Initiatives
• 3.11 Carbon footprint considerations
• 3.12 Future outlook and roadmap
  • 3.12.1 Next-generation networking protocols
  • 3.12.2. 6 G integration and ultra-low latency
  • 3.12.3 Quantum-safe cryptography implementation
  • 3.12.4 AI-driven network optimization
  • 3.12.5 Sustainable networking solutions
  • 3.12.6 Cross-industry convergence trends
  • 3.12.7 Regulatory evolution and standards development
  • 3.12.8 Market consolidation and partnership strategies
• 3.13 Protocol standardization and interoperability challenges
  • 3.13.1 Multi-protocol coexistence requirements
  • 3.13.2 Legacy protocol migration strategies
  • 3.13.3 Cross-vendor compatibility issues
  • 3.13.4 Standards body coordination complexity
• 3.14 Cost optimization vs performance trade-offs
  • 3.14.1 Network complexity vs cost analysis
  • 3.14.2 Component integration strategies
  • 3.14.3 Volume production economics
  • 3.14.4 Total system cost optimization

Chapter 4 Competitive Landscape, 2024

• 4.1 Introduction
• 4.2 Company market share analysis
  • 4.2.1 North America
  • 4.2.2 Europe
  • 4.2.3 Asia Pacific
  • 4.2.4 LATAM
  • 4.2.5 MEA
• 4.3 Competitive analysis of major market players
• 4.4 Competitive positioning matrix
• 4.5 Strategic outlook matrix
• 4.6 Key developments
  • 4.6.1 Mergers & acquisitions
  • 4.6.2 Partnerships & collaborations
  • 4.6.3 New Product Launches
  • 4.6.4 Expansion Plans and funding

Chapter 5 Market Estimates & Forecast, By Component, 2021 - 2034 (USD Mn, Units)

• 5.1 Key trends
• 5.2 Transceivers
• 5.3 Microcontrollers & processors
• 5.4 Network switches & bridges
• 5.5 Gateways / controllers
• 5.6 Memory & interface ICs
• 5.7 Others

Chapter 6 Market Estimates & Forecast, By Vehicle, 2021 - 2034 (USD Mn, Units)

• 6.1 Key trends
• 6.2 Passenger cars
  • 6.2.1 Hatchbacks
  • 6.2.2 Sedans
  • 6.2.3 SUVS
• 6.3 Commercial vehicles
  • 6.3.1 Light commercial vehicles
  • 6.3.2 Medium commercial vehicles
  • 6.3.3 Heavy commercial vehicles
• 6.4 Electric vehicles

Chapter 7 Market Estimates & Forecast, By Communication Protocol, 2021 - 2034 (USD Mn, Units)

• 7.1 Key trends
• 7.2 Controller area network (CAN)
• 7.3 Local interconnect network (LIN)
• 7.4 FlexRay
• 7.5 Media oriented systems transport (MOST)
• 7.6 Automotive ethernet
• 7.7 Other emerging protocols

Chapter 8 Market Estimates & Forecast, By Application, 2021 - 2034 (USD Mn, Units)

• 8.1 Key trends
• 8.2 Powertrain & chassis systems
• 8.3 Safety & ADAS (advanced driver assistance systems)
• 8.4 Infotainment & telematics
• 8.5 Body electronics & comfort systems
• 8.6 Battery management systems (BMS)
• 8.7 Autonomous vehicle data networking

Chapter 9 Market Estimates & Forecast, By Bandwidth, 2021 - 2034 (USD Mn, Units)

• 9.1 Key trends
• 9.2 Low-speed networks (up to 125 kbps)
• 9.3 Mid-speed networks (up to 1 Mbps)
• 9.4 High-speed networks (10 Mbps to 1 Gbps)
• 9.5 Ultra-high speed (>1 Gbps)

Chapter 10 Market Estimates & Forecast, By Region, 2021 - 2034 (USD Mn, Units)

• 10.1 Key trends
• 10.2 North America
  • 10.2.1 US
  • 10.2.2 Canada
• 10.3 Europe
  • 10.3.1 Germany
  • 10.3.2 UK
  • 10.3.3 France
  • 10.3.4 Italy
  • 10.3.5 Spain
  • 10.3.6 Russia
  • 10.3.7 Nordics
  • 10.3.8 Portugal
  • 10.3.9 Croatia
• 10.4 Asia Pacific
  • 10.4.1 China
  • 10.4.2 India
  • 10.4.3 Japan
  • 10.4.4 Australia
  • 10.4.5 South Korea
  • 10.4.6 Singapore
  • 10.4.7 Thailand
  • 10.4.8 Indonesia
• 10.5 Latin America
  • 10.5.1 Brazil
  • 10.5.2 Mexico
  • 10.5.3 Argentina
• 10.6 MEA
  • 10.6.1 South Africa
  • 10.6.2 Saudi Arabia
  • 10.6.3 UAE
  • 10.6.4 Turkey

Chapter 11 Company Profiles

• 11.1 Global Players
  • 11.1.1 Analog Devices
  • 11.1.2 Broadcom
  • 11.1.3 Infineon Technologies
  • 11.1.4 Marvell Technology
  • 11.1.5 NXP Semiconductors
  • 11.1.6 Qualcomm Technologies
  • 11.1.7 Renesas Electronics
  • 11.1.8 Texas Instruments
  • 11.1.9 Continental
  • 11.1.10 Elmos Semiconductor
• 11.2 Regional Players
  • 11.2.1 Cypress Semiconductor
  • 11.2.2 Maxim Integrated
  • 11.2.3 Melexis
  • 11.2.4 Microchip Technology
  • 11.2.5 ON Semiconductor
  • 11.2.6 Rohm Semiconductor
  • 11.2.7 STMicroelectronics
  • 11.2.8 Toshiba Electronic Devices
• 11.3 Emerging Players
  • 11.3.1 Aquantia
  • 11.3.2 ETAS
  • 11.3.3 Ethernovia
  • 11.3.4 Intrepid Control Systems
  • 11.3.5 Kvaser
  • 11.3.6 PEAK-System Technik
  • 11.3.7 Technica Engineering
  • 11.3.8 TTTech Auto
  • 11.3.9 Vector Informatik