세계의 3D TSV 디바이스 시장

Global 3D TSV Devices Market to Reach $27.7 Billion by 2030

The global market for 3D TSV Devices estimated at US$7.1 Billion in the year 2023, is expected to reach US$27.7 Billion by 2030, growing at a CAGR of 18.5% over the period 2023-2030. 3D TSV Devices Memory, one of the segments analyzed in the report, is expected to record 17.9% CAGR and reach US$8 Billion by the end of the analysis period. Growth in the MEMS segment is estimated at 19.5% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.1 Billion, While China is Forecast to Grow at 21.6% CAGR

The 3D TSV Devices market in the U.S. is estimated at US$1.1 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$8.4 Billion by the year 2030 trailing a CAGR of 21.6% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 14% and 15.4% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 14.1% CAGR.

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What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 68 Featured) -

• IBM Corporation
• Dai Nippon Printing Co., Ltd.
• Amkor Technology, Inc.
• ASM Pacific Technology Ltd.
• Globalfoundries, Inc.
• Himax Technologies, Inc.
• ASE Technology Holding Co., Ltd.
• FRT GmbH
• GS Nanotech
• GalaxyCore Inc.
• Gpixel, Inc.
• Heliotis AG
• Hill Technical Sales Corporation
• CORIAL
• Guangdong OPPO Mobile Telecommunications Corp., Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • 3D TSV Devices - Global Key Competitors Percentage Market Share in 2023 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
  • A Prelude to 3D TVS
  • Comparison of 3D TSV with Other 3D IC Integration Technologies: A Snapshot
  • Global Market Prospects & Outlook
  • Regional Analysis
  • Competitive Scenario
  • Foundries Stay Ahead in 3D TSV Device Manufacturing
  • IDMs Include 3D TSV Technology in their Wafer Processing Units
  • OSAT Companies Vie for Place in 3D TSV Landscape
  • Advantages & Limitations for Foundries, IDMs, and OSATs Operating in 3D TSV Landscape: A Snapshot
  • Recent Market Activity
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • 3D TSV Devices Market Strongly Influenced by Trends in Consumer Electronics Sector
  • Post Pandemic Recovery in CE Sector to Augment Prospects
  • Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
  • A Review of Key CE Products Driving Adoption of 3D TSV Technology
  • Smartphones
  • Tablet PCs
  • Uptrend in 3D IC Technology Augments Business Case
  • Fast Evolving 3D IC Technology to Spur Demand
  • Digital Transformation Drive to Steer Future Growth of 3D TSV Market
  • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
  • IoT Ecosystem to Rev Up Opportunities for 3D TSV Devices
  • Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
  • Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
  • AI Hardware: Potential New Growth Avenue
  • Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
  • Automobile Electronification Trends Widen the Addressable Market
  • Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
  • Post COVID Recovery to Revive Opportunities in Aerospace Sector
  • Sustained High Growth in ICT Sector Augurs Well
  • Ongoing Proliferation of Cloud-Based Applications to Encourage Adoption of 3D TSV Devices
  • Key Benefits Driving Adoption of Cloud Services of Large, Medium and Small Businesses
  • Growing Performance Requirements of Modern Data Centers to Extend Opportunities for 3D TSV Devices
  • Data Center Traffic Trends: A Complementary Review
  • 3D TSV Gaining Traction in DRAM Memory Sector
  • A Review of Next-Generation TSV-based DRAM Memory Solutions
  • Mobile DRAM - LPDDR3 Vs. Wide IO
  • Growing Market for MEMS to Fuel Market Expansion
  • Wearable Devices to Extend High-Quality Opportunities
  • 3D TSV Devices Sense large Opportunities in CMOS Image Sensors Vertical
  • Use of CMOS Image Sensor (CIS) by Sector & Device/Equipment
  • Imaging & Optoelectronics: An Important End-Use Segment for 3D TSV
  • 3D TSV Sees Growth in Advanced LED Packaging
  • 3D WLCSP: A Mature 3D TSV Segment
  • DRIE Bosch Process Gaining Prominence in TSV Implementation
  • System-Level Exploration and 3D Floorplanning Technique Enhance Performance of 3D IC Devices
  • Demand for Innovative Databases and Wireless Routing Augment Market Demand
  • Issues
• PRODUCT OVERVIEW
  • An Insight into Through-Silicon Via (TSV)
  • An Introduction to Through-silicon via (TSV) Devices
  • Benefits of 3D TSV Devices
  • Historical Timeline
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 2: World Historic Review for 3D TSV Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 3: World 15-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2024 & 2030
  • TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 5: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 6: World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 7: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 8: World Historic Review for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 9: World 15-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 10: World Recent Past, Current & Future Analysis for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 11: World Historic Review for CMOS Image Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 12: World 15-Year Perspective for CMOS Image Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 13: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 14: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 15: World 15-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 16: World Recent Past, Current & Future Analysis for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 17: World Historic Review for Advanced LED Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 18: World 15-Year Perspective for Advanced LED Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 19: World Recent Past, Current & Future Analysis for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 20: World Historic Review for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 21: World 15-Year Perspective for Other Products by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 22: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 23: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 24: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 25: World Recent Past, Current & Future Analysis for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 26: World Historic Review for Information & Communication Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 27: World 15-Year Perspective for Information & Communication Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 28: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 29: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 30: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 31: World Recent Past, Current & Future Analysis for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 32: World Historic Review for Military, Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 33: World 15-Year Perspective for Military, Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 34: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 35: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 36: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • TABLE 37: World 3D TSV Devices Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030

III. MARKET ANALYSIS

• UNITED STATES
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
  • Demand for Performance-Rich Consumer Electronics Puts Focus on 3D TSV Devices
  • Demand for MEMS Technologies in Mobile & Automotive Sector to Create Opportunities for 3D TSV Devices
  • TABLE 38: USA Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 39: USA Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 40: USA 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 41: USA Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 42: USA Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 43: USA 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• CANADA
  • TABLE 44: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 45: Canada Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 46: Canada 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 47: Canada Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 48: Canada Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 49: Canada 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• JAPAN
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
  • Market Overview
  • TABLE 50: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 51: Japan Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 52: Japan 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 53: Japan Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 54: Japan Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 55: Japan 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• CHINA
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
  • Market Overview
  • TABLE 56: China Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 57: China Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 58: China 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 59: China Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 60: China Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 61: China 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• EUROPE
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
  • TABLE 62: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • TABLE 63: Europe Historic Review for 3D TSV Devices by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 64: Europe 15-Year Perspective for 3D TSV Devices by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2024 & 2030
  • TABLE 65: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 66: Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 67: Europe 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 68: Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 69: Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 70: Europe 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• FRANCE
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
  • TABLE 71: France Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 72: France Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 73: France 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 74: France Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 75: France Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 76: France 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• GERMANY
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
  • TABLE 77: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 78: Germany Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 79: Germany 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 80: Germany Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 81: Germany Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 82: Germany 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• ITALY
  • TABLE 83: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 84: Italy Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 85: Italy 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 86: Italy Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 87: Italy Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 88: Italy 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• UNITED KINGDOM
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
  • TABLE 89: UK Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 90: UK Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 91: UK 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 92: UK Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 93: UK Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 94: UK 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• REST OF EUROPE
  • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 96: Rest of Europe Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 97: Rest of Europe 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 99: Rest of Europe Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 100: Rest of Europe 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• ASIA-PACIFIC
  • 3D TSV Devices Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
  • South Korea
  • Taiwan
  • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 102: Asia-Pacific Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 103: Asia-Pacific 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 105: Asia-Pacific Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 106: Asia-Pacific 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030
• REST OF WORLD
  • TABLE 107: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 108: Rest of World Historic Review for 3D TSV Devices by Product - Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 109: Rest of World 15-Year Perspective for 3D TSV Devices by Product - Percentage Breakdown of Value Sales for Memory, MEMS, CMOS Image Sensors, Imaging & Optoelectronics, Advanced LED Packaging and Other Products for the Years 2015, 2024 & 2030
  • TABLE 110: Rest of World Recent Past, Current & Future Analysis for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2023 through 2030 and % CAGR
  • TABLE 111: Rest of World Historic Review for 3D TSV Devices by End-Use - Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • TABLE 112: Rest of World 15-Year Perspective for 3D TSV Devices by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Information & Communication Technology, Automotive, Military, Aerospace & Defense and Other End-Uses for the Years 2015, 2024 & 2030

IV. COMPETITION