![]() |
½ÃÀ庸°í¼
»óǰÄÚµå
1564043
¼¼°èÀÇ °¥·ýºñ¼Ò(GaAs) ¿þÀÌÆÛ ½ÃÀåGallium Arsenide (GaAs) Wafers |
°¥·ý ºñ¼Ò(GaAs) ¿þÀÌÆÛ ¼¼°è ½ÃÀåÀº 2030³â±îÁö 39¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù
2023³â¿¡ 18¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â °¥·ýºñ¼Ò(GaAs) ¿þÀÌÆÛ ¼¼°è ½ÃÀåÀº 2023-2030³âÀÇ ºÐ¼® ±â°£ µ¿¾È ¿¬Æò±Õ 11.7% ¼ºÀåÇÏ¿© 2030³â¿¡´Â 39¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ÀÌ º¸°í¼¿¡¼ ºÐ¼®ÇÑ ºÎ¹® Áß ÇϳªÀÎ ¹«¼± Á֯ļö ÀüÀÚ ¿ëµµ´Â CAGR 12.3%¸¦ ±â·ÏÇÏ¿© ºÐ¼® ±â°£ÀÌ ³¡³¯ ¶§±îÁö 18¾ï ´Þ·¯¿¡ µµ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ¸ð¹ÙÀÏ ÀåÄ¡ ¿ëµµ ºÎ¹®Àº ºÐ¼® ±â°£ µ¿¾È CAGR 11.9%ÀÇ ¼ºÀå·üÀ» ³ªÅ¸³¾ °ÍÀ¸·Î ÃßÁ¤µË´Ï´Ù.
¹Ì±¹ ½ÃÀåÀº 4¾ï 8,450¸¸ ´Þ·¯·Î ÃßÁ¤, Áß±¹Àº CAGR 11.1%·Î ¼ºÀå Àü¸Á
¹Ì±¹ÀÇ °¥·ýºñ¼Ò(GaAs) ¿þÀÌÆÛ ½ÃÀå ±Ô¸ð´Â 2023³â 4¾ï 8,450¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ °æÁ¦ ´ë±¹ÀÎ Áß±¹Àº 2023-2030³â ¿¬Æò±Õ 11.1%ÀÇ ¼ºÀå·üÀ» º¸À̸ç 2030³â¿¡´Â 5¾ï 9,420¸¸ ´Þ·¯ ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. ´Ù¸¥ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ª ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ºÐ¼® ±â°£ µ¿¾È °¢°¢ 10.1%¿Í 9.7%ÀÇ ¿¬Æò±Õ º¹ÇÕ ¼ºÀå·ü(CAGR)À» ³ªÅ¸³¾ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù. À¯·´¿¡¼´Â µ¶ÀÏÀÌ ¿¬Æò±Õ 8.3%ÀÇ ¼ºÀå·üÀ» º¸ÀÏ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
¼¼°è °¥·ýºñ¼Ò(GaAs) ¿þÀÌÆÛ ½ÃÀå - ÁÖ¿ä µ¿Çâ ¹× ÃËÁø¿äÀÎ ¿ä¾à
°¥·ýºñ¼Ò(GaAs) ¿þÀÌÆÛ°¡ ¹ÝµµÃ¼ »ê¾÷°ú °íÁÖÆÄ ÀüÀÚÁ¦Ç°À» ¾î¶»°Ô º¯È½Ãų °ÍÀΰ¡?
°¥·ýºñ¼Ò(GaAs) ¿þÀÌÆÛ´Â ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý ¹ÝµµÃ¼°¡ ºÎÁ·Çß´ø ºÐ¾ß¿¡¼ ¶Ù¾î³ ¼º´ÉÀ» Á¦°øÇÔÀ¸·Î½á ¹ÝµµÃ¼ »ê¾÷°ú °íÁÖÆÄ ÀüÀÚÁ¦Ç°¿¡ Çõ¸íÀ» ÀÏÀ¸Å°°í ÀÖ½À´Ï´Ù. GaAs ¿þÀÌÆÛ´Â ¶Ù¾î³ ÀüÀÚ À̵¿µµ·Î À¯¸íÇϸç, °í¼Ó ¹× °íÁÖÆÄ ¿ëµµ¿¡¼ ´õ ºü¸¥ ½ÅÈ£ ó¸®, ³·Àº Àü·Â ¼Òºñ, Çâ»óµÈ È¿À²À» °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. µû¶ó¼ GaAs ¹ÝµµÃ¼´Â °íÁÖÆÄ ¼º´É, ¼Óµµ ¹× ½Å·Ú¼ºÀÌ °¡Àå Áß¿äÇÑ Ã·´Ü Åë½Å, À§¼º ½Ã½ºÅÛ, ·¹ÀÌ´õ ±â¼ú ¹× ±¤ÀüÀÚ °øÇÐ ºÐ¾ß¿¡ ÀûÇÕÇϸç, GaAs ±â¹Ý ¹ÝµµÃ¼´Â žçÀüÁö ¹× LED Á¦Á¶¿¡µµ ÇʼöÀûÀ̸ç, ±× ¿µÇâ·ÂÀº ´Ù¾çÇÑ »ê¾÷ ºÐ¾ß¿¡¼ ´õ¿í È®´ëµÇ°í ÀÖ½À´Ï´Ù. ´Ù¾çÇÑ »ê¾÷¿¡¼ ±× ¿µÇâ·ÂÀÌ ´õ¿í È®´ëµÇ°í ÀÖ½À´Ï´Ù.
±âÁ¸ ½Ç¸®ÄÜ¿¡ ºñÇØ GaAs ¿þÀÌÆÛÀÇ ÁÖ¿ä ÀåÁ¡ Áß Çϳª´Â ¼º´É ÀúÇÏ ¾øÀÌ ´õ ³ôÀº Á֯ļö¿¡¼ ÀÛµ¿ÇÏ°í ´õ ³ôÀº Àü·Â ¹Ðµµ¸¦ Áö¿øÇÒ ¼ö ÀÖ´Ù´Â °Í. GaAs ¿þÀÌÆÛ´Â ¸¶ÀÌÅ©·ÎÆÄ ¹× ¹Ð¸®¹ÌÅÍÆÄ ¿ëµµ¿¡¼ ƯÈ÷ È¿°úÀûÀ̸ç, Àå°Å¸® °í¼Ó µ¥ÀÌÅÍ Àü¼ÛÀÌ ÇʼöÀûÀÎ Â÷¼¼´ë 5G ±â¼ú °³¹ß¿¡ ¸Å¿ì Áß¿äÇÕ´Ï´Ù. Àå°Å¸® °í¼Ó µ¥ÀÌÅÍ Àü¼ÛÀÌ ÇʼöÀûÀÎ Â÷¼¼´ë 5G ±â¼ú °³¹ß¿¡ ¸Å¿ì Áß¿äÇÕ´Ï´Ù. ¶ÇÇÑ, GaAs ¿þÀÌÆÛ´Â ¿°ú ¹æ»ç¼±ÀÇ ¿µÇâÀ» °ÅÀÇ ¹ÞÁö ¾Ê±â ¶§¹®¿¡ ¿¾ÇÇÑ È¯°æ Á¶°ÇÀÌ ¿ä±¸µÇ´Â Ç×°ø¿ìÁÖ ¹× ±º¿ë ¿ëµµ¿¡µµ ÀûÇÕÇÕ´Ï´Ù. °íÁÖÆÄ ¹× °íÈ¿À² µð¹ÙÀ̽º¿¡ ´ëÇÑ ¼ö¿ä°¡ Áö¼ÓÀûÀ¸·Î Áõ°¡ÇÔ¿¡ µû¶ó, GaAs ¿þÀÌÆÛ´Â Åë½Å ±â¼ú, ¹æÀ§ ½Ã½ºÅÛ, Àç»ý ¿¡³ÊÁö ¼Ö·ç¼ÇÀÇ ¹ßÀüÀ» °¡´ÉÇÏ°Ô ÇÏ´Â ¹ÝµµÃ¼¿¡ ÇʼöÀûÀÎ ¿ä¼Ò·Î ÀÚ¸®¸Å±èÇϰí ÀÖ½À´Ï´Ù.
GaAs ¿þÀÌÆÛÀÇ ¼º´ÉÀ» Çâ»ó½ÃŰ´Â ±â¼ú ¹ßÀüÀº ¾î¶² ±â¼ú ¹ßÀüÀÌ Àִ°¡?
GaAs ¿þÀÌÆÛÀÇ Á¦Á¶ ¹× ÀÀ¿ë ºÐ¾ßÀÇ ±â¼ú ¹ßÀüÀº ±× ¼º´ÉÀ» Å©°Ô Çâ»ó½ÃŰ°í ´Ù¾çÇÑ Ã·´Ü ±â¼ú ºÐ¾ß¿¡¼ ±× Ȱ¿ëÀ» È®´ëÇϰí ÀÖ½À´Ï´Ù. °¡Àå Áß¿äÇÑ ¹ßÀü Áß Çϳª´Â °áÇÔÀÌ ÀûÀº °íǰÁú GaAs °áÁ¤À» ¼ºÀå½ÃŰ´Â µ¥ »ç¿ëµÇ´Â ºÐÀÚ¼± ¿¡ÇÇÅýÃ(MBE) ¹× À¯±â ±Ý¼Ó ÈÇÐ ±â»ó ¼ºÀå(MOCVD) °øÁ¤ÀÇ °³¼±ÀÔ´Ï´Ù. ÀÌ·¯ÇÑ Ã·´Ü Á¦Á¶ ±â¼úÀº GaAs ¿þÀÌÆÛÀÇ ±ÕÀÏÇÑ °áÁ¤ ±¸Á¶¸¦ º¸ÀåÇÏ°í ºÒ¼ø¹° ¼ö¸¦ ÁÙÀ̸ç Á¦ÀÛ¿¡ »ç¿ëµÇ´Â ÀåÄ¡ÀÇ Àü¹ÝÀûÀÎ È¿À²°ú ¼º´ÉÀ» Çâ»ó½Ãŵ´Ï´Ù. MBE¿Í MOCVD´Â ´õ ¾ã°í Á¤¹ÐÇÑ GaAs ÃþÀÇ Á¦Á¶¸¦ °¡´ÉÇϰÔÇÏ¿© ´õ ÀÛ°í, ´õ ºü¸£°í, ´õ È¿À²ÀûÀÎ ´õ ÀÛ°í, ´õ ºü¸£°í, ´õ È¿À²ÀûÀÎ ¹ÝµµÃ¼¸¦ °³¹ßÇÒ ¼ö ÀÖ°Ô µÇ¾ú½À´Ï´Ù.
¶Ç ´Ù¸¥ Áß¿äÇÑ ¹ßÀüÀº GaAs ±â¹Ý °íÀüÀÚ À̵¿µµ Æ®·£Áö½ºÅÍ(HEMT)¿Í ÀÌÁ¾ Á¢ÇÕ ¹ÙÀÌÆú¶ó Æ®·£Áö½ºÅÍ(HBT)ÀÇ °³¹ß·Î, °íÁÖÆÄ ¹× °íÀü·Â ¿ëµµ¿¡¼ ¶Ù¾î³ ¼º´ÉÀ» ¹ßÈÖÇÏ´Â GaAs ¿þÀÌÆÛ·Î Á¦ÀÛµÈ ÀÌµé ¼ÒÀÚ´Â ½ºÀ§Äª ¼Óµµ¸¦ ³ôÀ̰í Àü·Â È¿À²À» Çâ»ó½ÃÄÑ À§¼º Åë½Å ½Ã½ºÅÛ, ¹«¼± ³×Æ®¿öÅ©, ±º¿ë ·¹ÀÌ´õ ½Ã½ºÅÛ¿¡ »ç¿ëÇϱ⿡ ÀûÇÕÇÕ´Ï´Ù. ƯÈ÷ GaAs HEMT´Â Åë½Å Àåºñ ¹× ·¹ÀÌ´õ ±â¼ú¿¡¼ ½ÅÈ£ÀÇ ¼±¸íµµ¸¦ Çâ»ó½ÃŰ´Â µ¥ ÇʼöÀûÀÎ ÀúÀâÀ½ ÁõÆø±â Á¦Á¶¿¡ ÇʼöÀûÀÎ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Çõ½ÅÀ» ÅëÇØ GaAs ¿þÀÌÆÛ´Â ¼Óµµ, Àü·Â, È¿À²¼ºÀÌ Áß¿äÇÑ ¿ëµµ¿¡¼ µ¶º¸ÀûÀÎ ¼º´ÉÀ» ¹ßÈÖÇϸç ÷´Ü ÀüÀÚÁ¦Ç°¿¡¼ ±× ¿ªÇÒÀ» È®°íÈ÷ Çϰí ÀÖ½À´Ï´Ù.
¶ÇÇÑ, GaAs ¿þÀÌÆÛ´Â Å¾籤À» Àü±â·Î º¯È¯ÇÏ´Â °íÈ¿À² ´ÙÁßÁ¢ÇÕ Å¾çÀüÁö °³¹ß¿¡ Á¡Á¡ ´õ ¸¹ÀÌ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ Å¾çÀüÁö´Â Àü·Â È¿À²ÀÌ Áß¿äÇÑ ¿ìÁÖ ÀÀ¿ë ºÐ¾ß¿¡¼ ÀÚÁÖ »ç¿ëµÇ¸ç, GaAs ¹× ±âŸ ¹ÝµµÃ¼ Àç·áÀÇ ¿©·¯ ÃþÀ¸·Î ±¸¼ºµÇ¾î ÀÖÀ¸¸ç, °¢ ÃþÀº ¼·Î ´Ù¸¥ ½ºÆåÆ®·³ÀÇ ÇÞºûÀ» Æ÷ÂøÇϵµ·Ï Á¶Á¤µË´Ï´Ù. ÀÌ·¯ÇÑ ÃþÀ» ½×¾Æ ¿Ã¸®¸é ´ÙÁßÁ¢ÇÕ Å¾çÀüÁö´Â ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý žçÀüÁöº¸´Ù ÈξÀ ´õ ³ôÀº È¿À²À» ´Þ¼ºÇÒ ¼ö ÀÖ¾î ÀΰøÀ§¼º ¹× ±âŸ Ç×°ø¿ìÁÖ ºÐ¾ß¿¡ »ç¿ëÇϱ⿡ ÀÌ»óÀûÀÔ´Ï´Ù. Àç»ý ¿¡³ÊÁö ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó GaAs ±â¹Ý žçÀüÁö ±â¼úÀÇ ¹ßÀüÀº Áö»ó°ú ¿ìÁÖ °ø°£¿¡¼ ž翡³ÊÁö È¿À²À» Çâ»ó½ÃŰ´Â µ¥ Áß¿äÇÑ ¿ªÇÒÀ» ÇÒ Áغñ°¡ µÇ¾î ÀÖ½À´Ï´Ù.
5G, À§¼ºÅë½Å, ±¹¹æ±â¼úÀÇ ¼ºÀåÀ» µÞ¹ÞħÇÏ´Â GaAs ¿þÀÌÆÛ¶õ?
GaAs ¿þÀÌÆÛ´Â 5G ³×Æ®¿öÅ©, À§¼º Åë½Å ¹× ¹æÀ§ ±â¼úÀÇ ¼ºÀåÀ» Áö¿øÇÏ´Â µ¥ ÀÖ¾î ÀÌ·¯ÇÑ Ã·´Ü ½Ã½ºÅÛ¿¡ ÇÊ¿äÇÑ °íÁÖÆÄ ±â´ÉÀ» Á¦°øÇÔÀ¸·Î½á Áß¿äÇÑ ¿ªÇÒÀ» Çϰí ÀÖ½À´Ï´Ù. Åë½Å ºÐ¾ß¿¡¼ GaAs ¿þÀÌÆÛ´Â 5G ÀÎÇÁ¶ó °³¹ß¿¡ ÇʼöÀûÀÎ ¿ä¼Ò·Î, ´õ ºü¸¥ µ¥ÀÌÅÍ Àü¼Û, ´õ ³ôÀº ½ÅÈ£ °µµ, ´õ ³·Àº Áö¿¬À» °¡´ÉÇÏ°Ô Çϸç, GaAsÀÇ ³ôÀº ÀüÀÚ À̵¿¼ºÀ¸·Î ÀÎÇØ 5G ³×Æ®¿öÅ©¿¡ ÇʼöÀûÀÎ ¸¶ÀÌÅ©·ÎÆÄ ¹× ¹Ð¸®¹ÌÅÍÆÄ Á֯ļö¿¡¼ ¶Ù¾î³ ¼º´ÉÀ» ¹ßÈÖÇÕ´Ï´Ù. ¹ÝµµÃ¼´Â Àü·Â ÁõÆø±â, ÀúÀâÀ½ ÁõÆø±â, ½ºÀ§Ä¡ µî 5G Åë½Å ½Ã½ºÅÛÀÇ ¼Óµµ¿Í È¿À²¼ºÀ» À¯ÁöÇÏ´Â µ¥ ÇʼöÀûÀÎ ÁÖ¿ä ºÎǰ¿¡ »ç¿ëµË´Ï´Ù.
À§¼º Åë½Å¿¡¼ GaAs ¿þÀÌÆÛ´Â ¿ìÁÖ °ø°£ÀÇ È¤µ¶ÇÑ È¯°æ¿¡¼µµ ¾ÈÁ¤ÀûÀ¸·Î ÀÛµ¿ÇÏ´Â ºÎǰÀ» ¸¸µå´Â µ¥ ÇʼöÀûÀ̸ç, GaAsÀÇ ³»¹æ»ç¼±¼ºÀº ±ØÇÑÀÇ ¿Âµµ¿Í ¿ìÁÖ¼±À» °ßµ®¾ß ÇÏ´Â À§¼ºÀÇ Å¾çÀüÁö ¹× Åë½Å ½Ã½ºÅÛ¿¡ ÀûÇÕÇÑ ¼ÒÀçÀÔ´Ï´Ù. ÁõÆø±â ¹× Æ®·£½Ã¹ö¿Í °°Àº GaAs ±â¹Ý ÀåÄ¡´Â À§¼ºÀÌ ½ÅÈ£ÀÇ ¿È¸¦ ÃÖ¼ÒÈÇÏ¸é¼ Àå°Å¸® µ¥ÀÌÅÍ Àü¼ÛÀ» °¡´ÉÇÏ°Ô Çϰí, À§¼º À§Ä¡ È®ÀÎ ½Ã½ºÅÛ(GPS), ±â»ó ¿¹º¸, À§¼º ÀÎÅÍ³Ý ¼ºñ½º µîÀÇ ¿ëµµ¸¦ Áö¿øÇÕ´Ï´Ù. À§¼º º°ÀÚ¸®ÀÇ ±Ô¸ð¿Í Á߿伺ÀÌ Ä¿Áü¿¡ µû¶ó, GaAs ¿þÀÌÆÛ´Â ½Å·ÚÇÒ ¼ö ÀÖ´Â °í¼º´É À§¼º Åë½ÅÀ» °¡´ÉÇÏ°Ô ÇÏ´Â ±â¹Ý ±â¼ú·Î ÀÚ¸®¸Å±èÇÒ °ÍÀÔ´Ï´Ù.
¹æÀ§ ±â¼ú¿¡¼ GaAs ¿þÀÌÆÛ´Â °íÁÖÆÄ ¼º´É°ú °¡È¤ÇÑ È¯°æ¿¡¼ÀÇ ³»¼ºÀÌ ÇÊ¿äÇÑ Ã·´Ü ·¹ÀÌ´õ ¹× ÀüÀÚÀü ½Ã½ºÅÛ °³¹ß¿¡ »ç¿ëµÇ¸ç, GaAs ±â¹Ý ·¹ÀÌ´õ ½Ã½ºÅÛÀº ´õ ³ªÀº ÇØ»óµµ¿Í ¹üÀ§¸¦ Á¦°øÇÏ¿© ±º»ç ¿ä¿øÀÌ ´õ ¸Õ °Å¸®¿¡¼ ´õ ³ôÀº Á¤È®µµ·Î ¹°Ã¼¸¦ °¨ÁöÇÒ ¼ö ÀÖµµ·Ï ÇÕ´Ï´Ù. ´õ ¸Õ °Å¸®¿¡¼ ´õ ³ôÀº Á¤È®µµ·Î ¹°Ã¼¸¦ °¨ÁöÇÒ ¼ö ÀÖ½À´Ï´Ù. ¶ÇÇÑ GaAs ±¸¼º ¿ä¼Ò´Â ÀûÀÇ ½ÅÈ£¸¦ ¹æÇØÇϰųª °¡·Îç ¼öÀÖ´Â ÀüÀÚÀü ½Ã½ºÅÛ¿¡ »ç¿ëµÇ¾î °ø°Ý°ú ¹æ¾î ÀÛÀü ¸ðµÎ¿¡¼ ±º»ç·Â¿¡ Àü¼úÀû ¿ìÀ§¸¦ Á¦°øÇÕ´Ï´Ù. °íÁ֯ļö¿¡¼ ÀÛµ¿ÇÏ°í ±ØÇÑÀÇ È¯°æ Á¶°Ç¿¡¼ ÀÛµ¿ÇÏ´Â GaAs ¿þÀÌÆÛÀÇ ´É·ÂÀº ¹Ì»çÀÏ À¯µµ ½Ã½ºÅÛ¿¡¼ ¾ÈÀüÇÑ ±º¿ë Åë½Å¿¡ À̸£±â±îÁö Áß¿äÇÑ ±¹¹æ ÀÀ¿ë ºÐ¾ß¿¡ ÇʼöÀûÀÔ´Ï´Ù.
¹«¾ùÀÌ GaAs ¿þÀÌÆÛ ½ÃÀåÀÇ ¼ºÀåÀ» ÁÖµµÇϰí Àִ°¡?
°íÁÖÆÄ µð¹ÙÀ̽º¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, 5G ÀÎÇÁ¶ó È®´ë, Àç»ý ¿¡³ÊÁö ±â¼ú¿¡¼ÀÇ GaAs Ȱ¿ë È®´ë µî ¿©·¯ °¡Áö ¿äÀÎÀÌ GaAs ¿þÀÌÆÛ ½ÃÀåÀÇ ¼ºÀåÀ» °¡¼ÓÇϰí ÀÖ½À´Ï´Ù. ÁÖ¿ä ÃËÁø¿äÀÎ Áß Çϳª´Â ½Ç¸®ÄÜ ±â¹Ý ´ëüǰº¸´Ù ´õ ³ôÀº Á֯ļö¿¡¼ ÀÛµ¿ÇÏ´Â °í¼º´É ¹ÝµµÃ¼¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡·Î, GaAs ¿þÀÌÆÛ´Â À̵¿ Åë½Å, À§¼º ½Ã½ºÅÛ, ·¹ÀÌ´õ ±â¼ú°ú °°Àº °íÁÖÆÄ ¿ëµµ¿¡¼ ³ôÀº È¿À²À» ¹ßÈÖÇÏ¿© °í¼ÓÀÇ ¾ÈÁ¤ÀûÀÎ µ¥ÀÌÅÍ Àü¼Û¿¡ ÀÇÁ¸ÇÏ´Â »ê¾÷¿¡¼ Áß¿äÇÑ ¼ÒÀç°¡ µÇ°í ÀÖ½À´Ï´Ù. ÀÇÁ¸ÇÏ´Â »ê¾÷¿¡¼ Áß¿äÇÑ ¼ÒÀç°¡ µÇ°í ÀÖ½À´Ï´Ù. ´õ ºü¸¥ ¸ð¹ÙÀÏ ³×Æ®¿öÅ©¿Í ¿¬°á¼º Çâ»ó¿¡ ´ëÇÑ ¼ÒºñÀÚ ¼ö¿ä°¡ °è¼Ó Áõ°¡ÇÔ¿¡ µû¶ó Åë½Å ºÐ¾ß¿¡¼ GaAs ¿þÀÌÆÛ¿¡ ´ëÇÑ ¼ö¿ä´Â ƯÈ÷ 5G ±â¼ú µµÀÔ°ú ÇÔ²² ´õ¿í È®´ëµÉ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
±¹¹æ ¹× Ç×°ø¿ìÁÖ »ê¾÷¿¡¼ÀÇ GaAs ¿þÀÌÆÛ Ã¤Åõµ ½ÃÀå ¼ºÀå¿¡ ±â¿©Çϰí ÀÖ½À´Ï´Ù. ÀÌµé »ê¾÷Àº °¡È¤ÇÑ È¯°æ Á¶°ÇÀ» °ßµð°í °íÁÖÆÄ¿¡¼ ÀÛµ¿ÇÏ´Â Àç·á°¡ ÇÊ¿äÇϱ⠶§¹®¿¡ GaAs´Â ÷´Ü Åë½Å ½Ã½ºÅÛ ¹× ·¹ÀÌ´õ ½Ã½ºÅÛ¿¡ ÀûÇÕÇÕ´Ï´Ù. ±¹°¡ ¾Èº¸¿Í ±¹¹æ Çö´ëÈ¿¡ ´ëÇÑ °ü½ÉÀÌ ³ô¾ÆÁö¸é¼ ƯÈ÷ ÀüÀÚÀü, ¹Ì»çÀÏ ¹æ¾î, ¾ÈÀüÇÑ ±º¿ë Åë½Å ½Ã½ºÅÛ°ú °°Àº ÀÀ¿ë ºÐ¾ß¿¡¼ GaAs ±â¹Ý ºÎǰ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù. Àü ¼¼°è Á¤ºÎ°¡ ±¹¹æ ÀÎÇÁ¶ó ¾÷±×·¹À̵忡 ÅõÀÚÇÔ¿¡ µû¶ó GaAs ¿þÀÌÆÛ¿¡ ´ëÇÑ ¼ö¿ä°¡ Å©°Ô Áõ°¡ÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
Àç»ý¿¡³ÊÁö ±â¼ú, ƯÈ÷ ž籤 ¹ßÀüÀÇ ºÎ»óµµ GaAs ¿þÀÌÆÛ ½ÃÀåÀÇ ¼ºÀåÀ» °¡¼ÓÇÏ´Â ¿äÀÎÀ¸·Î, GaAs ±â¹Ý ´ÙÁßÁ¢ÇÕ Å¾çÀüÁö´Â °¡Àå È¿À²ÀûÀΠžçÀüÁö ±â¼ú Áß ÇϳªÀ̸ç, ÀΰøÀ§¼ºÀ̳ª ¿ìÁÖ Á¤°ÅÀå°ú °°Àº ¿ìÁÖ ±â¹Ý ¿ëµµ¿¡ »ç¿ëÇϱ⿡ ÀÌ»óÀûÀÔ´Ï´Ù. ÀÌ»óÀûÀÔ´Ï´Ù. ÀÌ Å¾çÀüÁö´Â Áý±¤Çü ÅÂ¾ç¿ ¹ßÀü(CSP) ½Ã½ºÅÛ°ú °°ÀÌ È¿À²¼ºÀÌ Áß¿äÇÑ Áö»ó ÀÀ¿ë ºÐ¾ß¿¡¼µµ »ç¿ëÀÌ °í·ÁµÇ°í ÀÖ½À´Ï´Ù. Àü ¼¼°èÀûÀ¸·Î Àç»ý ¿¡³ÊÁö¿¡ ´ëÇÑ °ü½ÉÀÌ ³ô¾ÆÁö´Â °¡¿îµ¥, GaAs ¿þÀÌÆÛ´Â Å¾翡³ÊÁö ±â¼úÀÇ È¿À²¼º°ú ½ÇÇà °¡´É¼ºÀ» Çâ»ó½ÃŰ°í ½ÃÀå ¼ºÀåÀ» ´õ¿í ÃËÁøÇÏ´Â µ¥ Å« ¿ªÇÒÀ» ÇÒ °ÍÀ¸·Î ¿¹»óµË´Ï´Ù.
GaAs ¿þÀÌÆÛÀÇ ¹ßÀüÀ» Á¿ìÇÒ ÇâÈÄ µ¿ÇâÀº?
¹Ì¼¼ÈÀÇ ÁøÀü, ÇÏÀ̺긮µå ¹ÝµµÃ¼ ±â¼ú¿¡ ´ëÇÑ ¼ö¿ä Áõ°¡, ¼º´É Çâ»óÀ» À§ÇÑ GaAs¿Í ´Ù¸¥ Àç·á¿ÍÀÇ ÅëÇÕ µî ¸î °¡Áö »õ·Î¿î Æ®·»µå°¡ GaAs ¿þÀÌÆÛÀÇ ¹Ì·¡ ¹ßÀüÀ» Çü¼ºÇϰí ÀÖ½À´Ï´Ù. °¡Àå Áß¿äÇÑ Æ®·»µå Áß Çϳª´Â ¼ÒÇüÈ ¹× °í¼º´É ÀüÀÚ±â±â¿¡ ´ëÇÑ ¼ö¿ä·Î ÀÎÇÑ ¼ÒÇüÈ ÃßÁøÀÔ´Ï´Ù. ¸ð¹ÙÀÏ ±â±â, ¿þ¾î·¯ºí ±â¼ú ¹× IoT ±â±â°¡ ¼ÒÇüȵʿ¡ µû¶ó À̸¦ ±¸µ¿ÇÏ´Â ¹ÝµµÃ¼µµ ¼º´É ÀúÇÏ ¾øÀÌ ¼ÒÇü鵃 Çʿ䰡 ÀÖ½À´Ï´Ù. ¿ì¼öÇÑ ÀüÀÚ À̵¿µµ¿Í °íÁÖÆÄ ¼º´ÉÀ» °¡Áø GaAs ¿þÀÌÆÛ´Â ÀÌ·¯ÇÑ Ãß¼¼¿¡ ÀûÇÕÇÕ´Ï´Ù. ´õ ÀÛ°í È¿À²ÀûÀÎ GaAs ±â¹Ý ºÎǰÀÇ °³¹ßÀº Â÷¼¼´ë ÀüÀÚÁ¦Ç°, ƯÈ÷ 5G ³×Æ®¿öÅ© ¹× ÷´Ü Åë½Å Àåºñ ¼ö¿ä¸¦ ÃæÁ·½ÃŰ´Â µ¥ ÇʼöÀûÀÔ´Ï´Ù.
¶Ç ´Ù¸¥ Áß¿äÇÑ Æ®·»µå´Â GaAsÀÇ ÀåÁ¡À» ½Ç¸®Äܰú °°Àº ´Ù¸¥ Àç·á¿Í °áÇÕÇÏ¿© º¸´Ù ´ÙÀç´Ù´ÉÇÏ°í °í¼º´ÉÀÇ µð¹ÙÀ̽º¸¦ ±¸ÇöÇÏ´Â ÇÏÀ̺긮µå ¹ÝµµÃ¼ ±â¼ú¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡Çϰí ÀÖ´Ù´Â Á¡ÀÔ´Ï´Ù. ½Ç¸®ÄÜ-°Ô¸£¸¶´½(SiGe)°ú GaAsÀÇ ÇÏÀ̺긮µå´Â ½Ç¸®ÄÜÀÇ ºñ¿ë È¿À²¼º°ú GaAsÀÇ ¿ì¼öÇÑ Á֯ļö ¼º´ÉÀ̶ó´Â µÎ °¡Áö ÀåÁ¡À» ¸ðµÎ Á¦°øÇÒ ¼ö Àֱ⠶§¹®¿¡ ÀÌ¹Ì ¿¬±¸°¡ ÁøÇàµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ÇÏÀ̺긮µå ±â¼úÀº ·¹ÀÌ´õ ½Ã½ºÅÛ, À§¼º Åë½Å, 5G ³×Æ®¿öÅ©¿Í °°Àº °íÁÖÆÄ ¿ëµµ¸¦ À§ÇÑ º¸´Ù È¿À²ÀûÀÌ°í ºñ¿ë È¿À²ÀûÀÎ ºÎǰÀ» °³¹ßÇÏ´Â µ¥ Áß¿äÇÑ ¿ªÇÒÀ» ÇÒ °ÍÀ¸·Î ±â´ëµË´Ï´Ù.
GaAs¿Í Àεã ÀÎȹ°(InP) ¹× ÁúȰ¥·ý(GaN)°ú °°Àº ´Ù¸¥ ¹ÝµµÃ¼ Àç·á¿ÍÀÇ ÅëÇÕÀº GaAs ±â¹Ý µð¹ÙÀ̽ºÀÇ ¼º´É Çâ»óÀ» ¾à¼ÓÇÏ´Â Ãß¼¼·Î, Á¦Á¶¾÷ü´Â GaAs¸¦ ÀÌ·¯ÇÑ Àç·á¿Í °áÇÕÇÏ¿© ´õ¿í ºü¸£°í Àü·Â È¿À²ÀûÀÌ¸ç ³»¿¼ºÀÌ ¶Ù¾î³ ¹ÝµµÃ¼¸¦ ¸¸µé ¼ö ÀÖ½À´Ï´Ù. ÇÒ ¼ö ÀÖ½À´Ï´Ù. ÀÌ´Â Àü·Â ÁõÆø±â³ª °í¼Ó µ¥ÀÌÅÍ Àü¼Û°ú °°ÀÌ ³ôÀº Àü·Â ¹Ðµµ¿Í ±ØÇÑÀÇ ¿Âµµ¸¦ °ßµô ¼ö ÀÖ´Â ´É·ÂÀÌ Áß¿äÇÑ ¿ëµµ¿¡¼ ƯÈ÷ Áß¿äÇÕ´Ï´Ù. ÀÌ ºÐ¾ßÀÇ ¿¬±¸ °³¹ßÀÌ ÁøÇàµÊ¿¡ µû¶ó, GaAs¿Í ´Ù¸¥ ÷´Ü ¼ÒÀç¿ÍÀÇ °áÇÕÀº °í¼º´É ÀüÀÚ ¹× Åë½Å ±â¼úÀÇ »õ·Î¿î °¡´É¼ºÀ» ¿¾îÁÙ °ÍÀ¸·Î º¸ÀÔ´Ï´Ù.
ÀÌ·¯ÇÑ Ãß¼¼¿¡ µû¶ó GaAs ¿þÀÌÆÛÀÇ ¹Ì·¡´Â ¼ÒÇüÈ, ÇÏÀ̺긮µå ±â¼ú ¹× Àç·á ÅëÇÕÀÇ Çõ½Å¿¡ ÀÇÇØ Á¤ÀÇµÉ °ÍÀÔ´Ï´Ù. ÀÌ·¯ÇÑ ¹ßÀüÀ¸·Î GaAs ¿þÀÌÆÛ´Â Åë½Å¿¡¼ ±¹¹æ, Àç»ý ¿¡³ÊÁö¿¡ À̸£±â±îÁö ´Ù¾çÇÑ »ê¾÷¿¡¼ °íÁÖÆÄ, °í¼º´É ¹ÝµµÃ¼ÀÇ ÇÙ½É ±¸¼º ¿ä¼Ò·Î ÀÚ¸®¸Å±èÇÒ ¼ö ÀÖÀ» °ÍÀÔ´Ï´Ù.
Global Gallium Arsenide (GaAs) Wafers Market to Reach US$3.9 Billion by 2030
The global market for Gallium Arsenide (GaAs) Wafers estimated at US$1.8 Billion in the year 2023, is expected to reach US$3.9 Billion by 2030, growing at a CAGR of 11.7% over the analysis period 2023-2030. Radio Frequency Electronics Application, one of the segments analyzed in the report, is expected to record a 12.3% CAGR and reach US$1.8 Billion by the end of the analysis period. Growth in the Mobile Devices Application segment is estimated at 11.9% CAGR over the analysis period.
The U.S. Market is Estimated at US$484.5 Million While China is Forecast to Grow at 11.1% CAGR
The Gallium Arsenide (GaAs) Wafers market in the U.S. is estimated at US$484.5 Million in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$594.2 Million by the year 2030 trailing a CAGR of 11.1% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 10.1% and 9.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 8.3% CAGR.
Global Gallium Arsenide (GaAs) Wafers Market - Key Trends and Drivers Summarized
How Are Gallium Arsenide (GaAs) Wafers Transforming the Semiconductor Industry and High-Frequency Electronics?
Gallium Arsenide (GaAs) wafers are revolutionizing the semiconductor industry and high-frequency electronics by offering superior performance in areas where traditional silicon-based semiconductors fall short. Known for their exceptional electron mobility, GaAs wafers enable faster signal processing, lower power consumption, and enhanced efficiency in high-speed and high-frequency applications. This makes them ideal for use in advanced telecommunications, satellite systems, radar technology, and optoelectronics, where high-frequency performance, speed, and reliability are paramount. GaAs-based semiconductors are also critical in the production of solar cells and light-emitting diodes (LEDs), further extending their impact across multiple industries.
One of the key advantages of GaAs wafers over traditional silicon is their ability to operate at higher frequencies and handle higher power densities without significant performance degradation. GaAs wafers are particularly effective in microwave and millimeter-wave applications, making them crucial in the development of next-generation 5G technology, where rapid data transmission over long distances is essential. Furthermore, GaAs wafers are less susceptible to heat and radiation damage, making them an excellent choice for aerospace and military applications, where environmental conditions can be extreme. As the demand for high-frequency, high-efficiency devices continues to grow, GaAs wafers are becoming an integral part of the semiconductor landscape, enabling advancements in communication technologies, defense systems, and renewable energy solutions.
What Technological Advancements Are Enhancing the Performance of GaAs Wafers?
Technological advancements in the production and application of GaAs wafers are significantly enhancing their performance and expanding their use across a variety of high-tech sectors. One of the most critical developments is the refinement of molecular beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD) processes, which are used to grow high-quality GaAs crystals with fewer defects. These advanced fabrication techniques ensure that GaAs wafers have uniform crystal structures, reducing the number of impurities and enhancing the overall efficiency and performance of the devices they are used to create. MBE and MOCVD have allowed for the production of thinner and more precise GaAs layers, enabling the development of smaller, faster, and more efficient semiconductors.
Another significant advancement is the development of GaAs-based high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), which offer superior performance in high-frequency and high-power applications. These devices, built on GaAs wafers, allow for faster switching speeds and greater power efficiency, making them ideal for use in satellite communication systems, wireless networks, and military radar systems. GaAs HEMTs, in particular, have become essential in the production of low-noise amplifiers, which are critical for improving signal clarity in communication devices and radar technologies. These innovations have cemented the role of GaAs wafers in cutting-edge electronics, offering unparalleled performance in applications where speed, power, and efficiency are crucial.
Furthermore, GaAs wafers are increasingly being used in the development of multi-junction solar cells, which are highly efficient at converting sunlight into electricity. These solar cells, often used in space applications where power efficiency is critical, consist of multiple layers of GaAs and other semiconductor materials, each tuned to capture a different spectrum of sunlight. By stacking these layers, multi-junction solar cells can achieve significantly higher efficiency than traditional silicon-based solar cells, making them ideal for use in satellites and other aerospace applications. As demand for renewable energy solutions grows, advancements in GaAs-based solar technology are poised to play a critical role in improving solar energy efficiency both on Earth and in space.
How Are GaAs Wafers Supporting the Growth of 5G, Satellite Communication, and Defense Technologies?
GaAs wafers are playing a crucial role in supporting the growth of 5G networks, satellite communication, and defense technologies by providing the high-frequency capabilities required for these advanced systems. In the telecommunications sector, GaAs wafers are integral to the development of 5G infrastructure, enabling faster data transmission, improved signal strength, and lower latency. The high electron mobility of GaAs allows for superior performance in microwave and millimeter-wave frequencies, which are essential for 5G networks. GaAs-based semiconductors are used in key components such as power amplifiers, low-noise amplifiers, and switches, all of which are critical for maintaining the speed and efficiency of 5G communication systems.
In satellite communication, GaAs wafers are essential for building components that can operate reliably in the harsh environment of space. The radiation resistance of GaAs makes it a preferred material for satellite solar cells and communication systems, which must withstand extreme temperatures and cosmic radiation. GaAs-based devices, such as amplifiers and transceivers, ensure that satellites can transmit data over long distances with minimal signal degradation, supporting applications like global positioning systems (GPS), weather forecasting, and satellite internet services. As satellite constellations grow in size and importance, GaAs wafers will continue to be a foundational technology for enabling reliable, high-performance satellite communications.
In defense technologies, GaAs wafers are used to develop advanced radar and electronic warfare systems that require high-frequency performance and resilience in extreme environments. GaAs-based radar systems offer better resolution and range, allowing military operators to detect objects with greater accuracy at longer distances. Additionally, GaAs components are used in electronic warfare systems that can jam or intercept enemy signals, giving military forces a tactical advantage in both offensive and defensive operations. The ability of GaAs wafers to function at high frequencies and handle extreme environmental conditions makes them indispensable in critical defense applications, from missile guidance systems to secure military communications.
What’s Driving the Growth of the GaAs Wafer Market?
Several factors are driving the growth of the GaAs wafer market, including the increasing demand for high-frequency devices, the expansion of 5G infrastructure, and the growing use of GaAs in renewable energy technologies. One of the primary drivers is the growing need for high-performance semiconductors that can operate at higher frequencies than silicon-based alternatives. GaAs wafers are highly efficient in high-frequency applications such as mobile communication, satellite systems, and radar technologies, making them a critical material for industries that rely on fast and reliable data transmission. As consumer demand for faster mobile networks and improved connectivity continues to rise, the need for GaAs wafers in telecommunications will expand, particularly in the rollout of 5G technology.
The adoption of GaAs wafers in the defense and aerospace industries is also contributing to market growth. These industries require materials that can withstand harsh environmental conditions and operate at high frequencies, making GaAs a preferred choice for advanced communication and radar systems. The increased focus on national security and defense modernization is driving demand for GaAs-based components, particularly in applications like electronic warfare, missile defense, and secure military communication systems. As governments around the world invest in upgrading their defense infrastructure, the demand for GaAs wafers is expected to increase significantly.
The rise of renewable energy technologies, particularly in solar power, is another factor fueling the growth of the GaAs wafer market. GaAs-based multi-junction solar cells are among the most efficient solar technologies available, making them ideal for use in space-based applications like satellites and space stations. These solar cells are also being explored for use in terrestrial applications where efficiency is critical, such as in concentrated solar power (CSP) systems. As the global push toward renewable energy intensifies, GaAs wafers are poised to play a major role in improving the efficiency and viability of solar energy technologies, further driving market growth.
What Future Trends Are Shaping the Development of GaAs Wafers?
Several emerging trends are shaping the future development of GaAs wafers, including advancements in miniaturization, the growing demand for hybrid semiconductor technologies, and the integration of GaAs with other materials for enhanced performance. One of the most significant trends is the push toward miniaturization, driven by the need for smaller, more powerful electronic devices. As mobile devices, wearable technology, and IoT devices become more compact, the semiconductors that power them must also shrink in size without sacrificing performance. GaAs wafers, with their superior electron mobility and high-frequency performance, are well-suited for this trend. The development of smaller, more efficient GaAs-based components will be essential for meeting the demands of next-generation electronics, particularly in 5G networks and advanced communication devices.
Another key trend is the growing demand for hybrid semiconductor technologies that combine the strengths of GaAs with other materials, such as silicon, to create more versatile and high-performing devices. Silicon-germanium (SiGe) and GaAs hybrids are already being explored for their potential to offer the best of both worlds: the cost-effectiveness of silicon and the superior frequency performance of GaAs. These hybrid technologies are expected to play a critical role in the development of more efficient and cost-effective components for high-frequency applications, including radar systems, satellite communications, and 5G networks.
The integration of GaAs with other semiconductor materials, such as indium phosphide (InP) and gallium nitride (GaN), is another trend that promises to enhance the performance of GaAs-based devices. By combining GaAs with these materials, manufacturers can create semiconductors that offer even greater speed, power efficiency, and heat resistance. This is particularly important in applications such as power amplifiers and high-speed data transmission, where the ability to handle high power densities and extreme temperatures is critical. As research and development in this area continue, the combination of GaAs with other advanced materials will unlock new possibilities for high-performance electronics and telecommunications technologies.
As these trends evolve, the future of GaAs wafers will be defined by innovations in miniaturization, hybrid technologies, and material integration. These advancements will enable GaAs wafers to remain a critical component of high-frequency, high-performance semiconductors across industries ranging from telecommunications to defense and renewable energy
Select Competitors (Total 12 Featured) -