샘플 요청 목록

 카트 문의
시장보고서
상품코드
1793949

세계의 웨이퍼 제조 시장

Wafer Fabrication
발행일: | 리서치사: Market Glass, Inc. (Formerly Global Industry Analysts, Inc.) | 페이지 정보: 영문 384 Pages | 배송안내 : 1-2일 (영업일 기준)

    
    
    



※ 본 상품은 영문 자료로 한글과 영문 목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문 목차를 참고해주시기 바랍니다.

세계의 웨이퍼 제조 시장은 2030년까지 1,012억 달러에 도달

2024년에 730억 달러로 추정되는 세계의 웨이퍼 제조 시장은 2024-2030년에 CAGR 5.6%로 성장하며, 2030년에는 1,012억 달러에 달할 것으로 예측됩니다. 이 리포트에서 분석한 부문의 하나인 65nm은 CAGR 6.5%를 기록하며, 분석 기간 종료까지 292억 달러에 달할 것으로 예상됩니다. 45nm 부문의 성장률은 분석 기간 중 CAGR 5.9%로 추정됩니다.

미국 시장은 추정 199억 달러, 중국은 CAGR 9.0%로 성장 예측

미국의 웨이퍼 제조 시장은 2024년에 199억 달러로 추정됩니다. 세계 2위의 경제대국인 중국은 2030년까지 205억 달러의 시장 규모에 달할 것으로 예측되며, 분석 기간인 2024-2030년의 CAGR은 9.0%입니다. 기타 주목할 만한 지역별 시장으로는 일본과 캐나다가 있으며, 분석 기간 중 CAGR은 각각 2.7%와 5.6%로 예측됩니다. 유럽에서는 독일이 CAGR 3.7%로 성장할 것으로 예측됩니다.

세계의 웨이퍼 제조 시장 - 주요 동향과 촉진요인 정리

웨이퍼 제조는 현대 반도체 혁신의 토대를 어떻게 구축하고 있는가?

웨이퍼 제조는 반도체 산업의 핵심으로, 스마트폰과 컴퓨터에서 자동차, 산업 기계에 이르기까지 모든 것에 전력을 공급하는 집적회로와 마이크로 전자 장치를 만드는 데 있으며, 매우 중요한 역할을 하고 있습니다. 이 공정은 초청정 환경에서 이루어지는 여러 복잡한 공정을 포함하며, 실리콘 웨이퍼가 포토리소그래피, 에칭, 도핑, 증착, 메탈라이제이션을 통해 기능성 칩으로 재탄생하는 과정입니다. 각 웨이퍼에는 수천 개의 칩이 포함될 수 있으며, 제조시 요구되는 정밀도는 높은 수율과 성능을 보장하기 위해 매우 중요합니다. 전자소자의 소형화, 고속화, 에너지 효율 향상에 따라 웨이퍼 제조 기술은 노드 크기 축소와 트랜지스터 밀도 향상에 대한 요구에 부응하기 위해 끊임없이 진화해야 합니다. 극자외선(EUV)과 같은 첨단 리소그래피 기술은 현재 5나노미터 이하의 제조를 가능하게 하는 첨단 리소그래피 기술을 채택하여 제조업체들이 무어의 법칙의 한계를 뛰어넘을 수 있도록 하고 있습니다. 또한 재료 과학의 혁신은 실리콘 카바이드(SiC)와 질화갈륨(GaN)과 같이 고성능 용도에 우수한 열적 및 전기적 특성을 제공하는 기존 실리콘 웨이퍼를 대체할 수 있는 재료들을 도입하고 있습니다. 주조는 또한 정확도를 높이고, 결함을 줄이고, 전반적인 생산성을 향상시키기 위해 자동화, AI 기반 공정 제어, 스마트 분석에 많은 투자를 하고 있습니다. 그 결과, 웨이퍼 제조는 단순한 제조 활동이 아니라 여러 산업과 세계 경제의 기술 진보를 지원하는 첨단 전략적 프로세스가 되었습니다.

웨이퍼 제조 공정에 혁명을 가져올 기술 발전은 무엇인가?

웨이퍼 제조 공정은 정밀도를 높이고, 비용을 절감하고, 생산 주기를 단축하는 것을 목표로 하는 일련의 기술적 진보를 통해 혁명을 일으키고 있습니다. 가장 혁신적인 개발 중 하나는 극자외선(EUV) 리소그래피의 통합입니다. 이를 통해 제조업체는 전례 없는 정밀도로 7나노미터 이하로 회로를 인쇄할 수 있습니다. 이 능력은 인공지능, 5G, 고성능 컴퓨팅에 사용되는 고급 프로세서 개발에 필수적입니다. EUV와 함께 원자층 증착(ALD) 및 화학적 기계적 평탄화(CMP) 기술은 웨이퍼 제조 중 층의 균일성과 무결성을 향상시키기 위해 개선되고 있습니다. 장비 제조업체들도 깊이, 각도, 균일성을 더 잘 제어할 수 있는 차세대 에칭 시스템이나 이온 주입 장치를 도입하고 있습니다. 한편, 실리콘 카바이드와 질화 갈륨 기판의 사용이 증가하고 있으며, 특히 고온 성능이 중요한 자동차 및 항공우주 산업에서 파워 일렉트로닉스의 응용 범위가 확대되고 있습니다. 머신러닝을 통한 스마트 제조 기술은 예지보전, 수율 최적화, 실시간 공정 조정을 가능하게 하여 웨이퍼 제조 라인을 보다 효율적이고 탄력적으로 만들고 있습니다. 또한 클린룸 설계 및 오염 제어의 발전은 그 어느 때보다 섬세하고 컴팩트한 칩 구조의 제조를 지원하고 있습니다. 이러한 기술 혁신은 제조업체가 소비자와 산업계 수요를 따라잡을 수 있게 해줄 뿐만 아니라, 세계 디지털 전환을 촉진하는 차세대 반도체 혁신의 물결을 주도하고 있습니다.

세계 반도체 대기업이 전 세계에서 웨이퍼 생산 능력을 확대하는 이유는 무엇인가?

세계 반도체 기업은 CE(Consumer Electronics), 자동차 시스템, 데이터센터, 그리고 인공지능, 사물인터넷 등 신기술 분야의 폭발적인 칩 수요에 대응하기 위해 웨이퍼 생산 능력을 빠르게 확장하고 있습니다. 세계 경제의 거의 모든 분야에서 디지털화가 진행됨에 따라 공급망에 전례 없는 압력이 가해져 기존 제조 능력의 취약성을 드러내는 칩 부족이 발생하고 있습니다. 이에 대응하기 위해 주요 주조 및 집적 장치 제조업체들은 미국, 유럽, 대만, 한국, 중국 등지에서 수십억 달러를 투자하여 새로운 제조 공장, 일명 팹(Fab)에 투자하고 있습니다. 이러한 투자는 상업적 고려뿐만 아니라 정부가 칩 생산의 현지화 및 공급망 강건성 확보를 요구하는 지정학적 요인에 의해서도 추진되고 있습니다. 민관 파트너십, 정부 인센티브, 국가 안보 정책이 이러한 확장을 가속화하고 있으며, 새로운 시설은 레거시 노드 생산과 최첨단 공정 기술 모두에 초점을 맞추었습니다. 기업은 또한 전력반도체, 차량용 칩, 센서에 특화된 공장을 건설하여 기술력을 다각화하고 있습니다. 300mm 웨이퍼 프로세싱으로의 전환과 향후 더 큰 웨이퍼의 도입으로 규모의 경제가 실현되어 칩당 제조비용을 절감할 수 있을 것으로 기대됩니다. 또한 인력 격차를 해소하고 첨단 반도체 제조를 위한 지속가능한 생태계를 구축하기 위해 인력 개발 및 세계 협력을 위한 노력이 시작되고 있습니다. 이러한 세계 웨이퍼 생산 능력의 급증은 단순히 단기적인 공급 부족에 대한 대응이 아니라, 현대 세계의 디지털 인프라를 미래에도 지속하기 위한 전략적 노력입니다.

웨이퍼 제조 산업의 미래를 좌우할 시장 동력과 전략 동향은?

웨이퍼 제조 시장의 성장은 시장 역학, 기술 발전, 공공 및 민간 이해관계자들의 전략적 계획이 복합적으로 작용하여 이루어지고 있습니다. 핵심 원동력 중 하나는 웨어러블 건강 모니터와 스마트홈 기기에서 자율주행 자동차 및 양자 컴퓨팅 시스템에 이르기까지 전자제품이 삶의 모든 측면에 통합되고 있다는 점입니다. 이러한 수요의 폭발적인 증가는 다양한 디바이스 아키텍처와 성능 사양을 지원할 수 있는 견고하고 확장 가능한 웨이퍼 제조 인프라를 필요로 합니다. 시장을 재편하는 또 다른 동향은 산업 환경에서의 기존 IT와 운영 기술의 융합으로, 고유한 열적 특성과 성능 특성을 가진 맞춤형 칩에 대한 새로운 수요가 창출되고 있습니다. 또한 환경적 지속가능성도 중요한 고려사항으로 떠오르고 있으며, 팹에서 유해물질을 책임감 있게 관리하고 물과 에너지 소비를 줄이는 친환경 제조 방식을 채택하도록 독려하고 있습니다. 파운드리, 장비 공급업체, 대학, 설계 사무소 간의 전략적 협업은 기술 혁신을 촉진하고 차세대 칩 시장 출시 시간을 단축하고 있습니다. 지적 재산권의 안전성, 공급망 투명성, 지역 자급자족은 경쟁이 치열하고 지정학적으로 민감한 산업에서 중요한 차별화 요소가 되고 있습니다. 또한 벤처캐피털과 정부의 자금 지원은 3D 스태킹, 칩렛, 광집적과 같은 혁신적인 웨이퍼 레벨 기술을 개발하는 스타트업과 연구소에 점점 더 많이 집중되고 있습니다. 이러한 추세와 함께 웨이퍼 제조는 반도체 산업뿐만 아니라 전 세계 연결성, 자동화, 디지털 인텔리전스 발전에 필수적인 기술 발전의 중심축으로 자리매김하고 있습니다.

부문

사이즈(65nm, 45nm, 32nm, 22nm, 14nm, 10nm, 7nm); 제조 프로세스(Back End of Line Processing, Front End of Line Processing); 최종사용자(Integrated Device Manufacturer End-use, Foundry End-use, Memory End-use)

조사 대상 기업의 예

  • Applied Materials, Inc.
  • ASML Holding N.V.
  • Canon Inc.
  • DB HiTek Co., Ltd.
  • Fujitsu Semiconductor Limited
  • GlobalFoundries Inc.
  • Hua Hong Semiconductor Limited
  • Infineon Technologies AG
  • Intel Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Micron Technology, Inc.
  • Nikon Corporation
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation(SMIC)
  • SK hynix Inc.
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company(TSMC)
  • Texas Instruments Incorporated

AI 통합

당사는 유효한 전문가용 컨텐츠와 AI 툴에 의해 시장 정보와 경쟁 정보를 변혁하고 있습니다.

Global Industry Analysts는 LLM나 업계 고유 SLM를 조회하는 일반적인 규범에 따르는 대신에, 비디오 기록, 블로그, 검색 엔진 조사, 방대한 양 기업, 제품/서비스, 시장 데이터 등, 전 세계 전문가로부터 수집한 컨텐츠 리포지토리를 구축했습니다.

관세 영향 계수

Global Industry Analysts는 본사 소재지, 제조거점, 수출입(완제품 및 OEM)을 기준으로 기업의 경쟁력 변화를 예측했습니다. 이러한 복잡하고 다면적인 시장 역학은 수입원가(COGS) 증가, 수익성 하락, 공급망 재편 등 미시적, 거시적 시장 역학 중에서도 특히 경쟁사들에게 영향을 미칠 것으로 예측됩니다.

목차

제1장 조사 방법

제2장 개요

  • 시장 개요
  • 주요 기업
  • 시장 동향과 촉진요인
  • 세계 시장 전망

제3장 시장 분석

  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 스페인
  • 러시아
  • 기타 유럽
  • 아시아태평양
  • 호주
  • 인도
  • 한국
  • 기타 아시아태평양
  • 라틴아메리카
  • 아르헨티나
  • 브라질
  • 멕시코
  • 기타 라틴아메리카
  • 중동
  • 이란
  • 이스라엘
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동
  • 아프리카

제4장 경쟁

KSA 25.08.28

Global Wafer Fabrication Market to Reach US$101.2 Billion by 2030

The global market for Wafer Fabrication estimated at US$73.0 Billion in the year 2024, is expected to reach US$101.2 Billion by 2030, growing at a CAGR of 5.6% over the analysis period 2024-2030. 65 nm, one of the segments analyzed in the report, is expected to record a 6.5% CAGR and reach US$29.2 Billion by the end of the analysis period. Growth in the 45 nm segment is estimated at 5.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$19.9 Billion While China is Forecast to Grow at 9.0% CAGR

The Wafer Fabrication market in the U.S. is estimated at US$19.9 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$20.5 Billion by the year 2030 trailing a CAGR of 9.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.7% and 5.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 3.7% CAGR.

Global Wafer Fabrication Market - Key Trends & Drivers Summarized

How Is Wafer Fabrication Laying the Foundation for Modern Semiconductor Innovation?

Wafer fabrication is the cornerstone of the semiconductor industry, playing a pivotal role in the creation of integrated circuits and microelectronic devices that power everything from smartphones and computers to automobiles and industrial machinery. The process involves multiple complex steps carried out in ultra-clean environments, where silicon wafers are transformed into functional chips through photolithography, etching, doping, deposition, and metallization. Each wafer can contain thousands of individual chips, and the precision required during fabrication is critical to ensure high yield and performance. As electronic devices become smaller, faster, and more energy-efficient, wafer fabrication techniques must continually evolve to meet the demands of shrinking node sizes and increased transistor density. Advanced lithography technologies such as extreme ultraviolet (EUV) are now being adopted to enable sub-5-nanometer production, allowing manufacturers to push the limits of Moore's Law. Additionally, innovations in materials science are introducing alternatives to traditional silicon wafers, including silicon carbide (SiC) and gallium nitride (GaN), which offer better thermal and electrical properties for high-performance applications. Foundries are also investing heavily in automation, AI-driven process control, and smart analytics to enhance precision, reduce defects, and improve overall productivity. As a result, wafer fabrication is not just a manufacturing activity but a highly strategic process that underpins technological advancement across multiple industries and global economies.

What Technological Advancements Are Revolutionizing the Wafer Fabrication Process?

The wafer fabrication process is being revolutionized by a series of technological advancements that aim to increase precision, reduce costs, and accelerate production cycles. One of the most transformative developments is the integration of extreme ultraviolet (EUV) lithography, which enables manufacturers to print circuits at sub-7-nanometer geometries with unprecedented accuracy. This capability is essential for developing advanced processors used in artificial intelligence, 5G, and high-performance computing. Alongside EUV, atomic layer deposition (ALD) and chemical mechanical planarization (CMP) techniques are being refined to improve the uniformity and integrity of layers during wafer construction. Equipment manufacturers are also introducing next-generation etching systems and ion implantation tools that offer better control over depth, angle, and uniformity. Meanwhile, the increasing use of silicon carbide and gallium nitride substrates is expanding the range of applications for power electronics, especially in automotive and aerospace industries where high-temperature performance is critical. Smart manufacturing technologies powered by machine learning are enabling predictive maintenance, yield optimization, and real-time process adjustments, making wafer fabrication lines more efficient and resilient. Additionally, advances in cleanroom design and contamination control are supporting the production of ever more delicate and compact chip structures. These innovations are not only enabling manufacturers to keep pace with consumer and industrial demands but are also driving the next wave of semiconductor breakthroughs that will fuel global digital transformation.

Why Are Global Semiconductor Giants Scaling Up Wafer Fabrication Capacity Worldwide?

Global semiconductor companies are rapidly scaling up wafer fabrication capacity to meet the explosive demand for chips across consumer electronics, automotive systems, data centers, and emerging technologies such as artificial intelligence and the Internet of Things. The increasing digitization of nearly every sector of the global economy has created unprecedented pressure on supply chains, leading to chip shortages that have exposed vulnerabilities in existing manufacturing capacity. In response, leading foundries and integrated device manufacturers are investing billions of dollars in new fabrication plants, also known as fabs, in regions such as the United States, Europe, Taiwan, South Korea, and China. These investments are being driven not only by commercial considerations but also by geopolitical factors, as governments seek to localize chip production and ensure supply chain resilience. Public-private partnerships, government incentives, and national security policies are accelerating this expansion, with new facilities focusing on both legacy node production and cutting-edge process technologies. Companies are also diversifying their technological capabilities by building specialized fabs for power semiconductors, automotive-grade chips, and sensors. The move toward 300mm wafer processing and the introduction of even larger wafers in the future are expected to improve economies of scale and reduce per-chip manufacturing costs. Moreover, workforce development and global collaboration efforts are being launched to address the talent gap and create a sustainable ecosystem for advanced semiconductor manufacturing. This global surge in wafer fabrication capacity is not just a reaction to short-term shortages but a strategic initiative to future-proof the digital infrastructure of the modern world.

What Market Forces and Strategic Trends Are Shaping the Future of the Wafer Fabrication Industry?

The growth in the wafer fabrication market is being driven by a mix of market dynamics, technological evolution, and strategic planning by both public and private stakeholders. One of the central forces is the rising integration of electronics into every facet of life, from wearable health monitors and smart home devices to autonomous vehicles and quantum computing systems. This explosion in demand requires a robust and scalable wafer production infrastructure capable of supporting diverse device architectures and performance specifications. Another trend reshaping the market is the convergence of traditional IT with operational technologies in industrial environments, which is creating new demand for custom chips with unique thermal and performance characteristics. Environmental sustainability is also emerging as a key consideration, prompting fabs to adopt green manufacturing practices that reduce water and energy consumption while managing hazardous materials responsibly. Strategic collaborations between foundries, equipment suppliers, universities, and design firms are fostering innovation and accelerating time to market for next-generation chips. Intellectual property security, supply chain transparency, and regional self-sufficiency are becoming critical differentiators in a highly competitive and geopolitically sensitive industry. Additionally, venture capital and government funding are increasingly directed toward startups and research labs developing breakthrough wafer-level technologies such as 3D stacking, chiplets, and photonic integration. These combined trends are positioning wafer fabrication as a central pillar of technological progress, essential not just for the semiconductor industry but for the advancement of global connectivity, automation, and digital intelligence.

SCOPE OF STUDY:

The report analyzes the Wafer Fabrication market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Size (65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm, 7 nm); Fabrication Process (Back End of Line Processing, Front End of Line Processing); End-Use (Integrated Device Manufacturer End-Use, Foundry End-Use, Memory End-Use)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

  • Applied Materials, Inc.
  • ASML Holding N.V.
  • Canon Inc.
  • DB HiTek Co., Ltd.
  • Fujitsu Semiconductor Limited
  • GlobalFoundries Inc.
  • Hua Hong Semiconductor Limited
  • Infineon Technologies AG
  • Intel Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Micron Technology, Inc.
  • Nikon Corporation
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • SK hynix Inc.
  • STMicroelectronics N.V.
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • Texas Instruments Incorporated

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Wafer Fabrication - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Global Semiconductor Demand Surge Throws the Spotlight on Wafer Fabrication Capacity Constraints
    • Proliferation of Advanced Nodes Drives Investment in Sub Ten Nanometer Process Technologies
    • How AI and HPC Applications Are Accelerating Development of High Performance Logic Wafers
    • National Security and Tech Sovereignty Agendas Propel Onshoring of Fab Facilities Across Key Regions
    • Push for Automotive Grade Semiconductors Strengthens the Case for 300mm Wafer Process Optimization
    • Rising Costs of Lithography and EUV Integration Influence Strategic Fab Partnership Models
    • Here's How Chiplet Architectures and Heterogeneous Integration Are Reshaping Fabrication Requirements
    • Emergence of Gallium Nitride and Silicon Carbide Expands the Scope of Compound Semiconductor Fabs
    • Sustainability Pressures in Manufacturing Drive Adoption of Energy Efficient and Low Waste Fab Processes
    • Growth in IoT and Edge Devices Increases Demand for Mature Node and Mixed Signal Wafer Production
    • Talent Shortages in Engineering and Cleanroom Operations Challenge Scaling Efforts in New Fab Projects
    • Geopolitical Tensions and Export Controls Shape Global Investment Strategies in Fab Location and Equipment Sourcing
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Wafer Fabrication Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Wafer Fabrication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 4: World 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for 65 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for 65 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 7: World 16-Year Perspective for 65 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for 45 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for 45 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 10: World 16-Year Perspective for 45 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for 32 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for 32 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 13: World 16-Year Perspective for 32 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for 22 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for 22 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 16: World 16-Year Perspective for 22 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for 14 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for 14 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 19: World 16-Year Perspective for 14 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for 10 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for 10 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 22: World 16-Year Perspective for 10 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for 7 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for 7 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 25: World 16-Year Perspective for 7 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Integrated Device Manufacturer End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 28: World 16-Year Perspective for Integrated Device Manufacturer End-Use by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Foundry End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Foundry End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 31: World 16-Year Perspective for Foundry End-Use by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Memory End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Memory End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 34: World 16-Year Perspective for Memory End-Use by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for Back End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for Back End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 37: World 16-Year Perspective for Back End of Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 38: World Recent Past, Current & Future Analysis for Front End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 39: World Historic Review for Front End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 40: World 16-Year Perspective for Front End of Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 41: USA Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 43: USA 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 46: USA 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 47: USA Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: USA Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 49: USA 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • CANADA
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 52: Canada 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 55: Canada 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 56: Canada Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Canada Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 58: Canada 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • JAPAN
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 61: Japan 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 64: Japan 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 65: Japan Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Japan Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 67: Japan 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • CHINA
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 68: China Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 70: China 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 73: China 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 74: China Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: China Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 76: China 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • EUROPE
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Wafer Fabrication by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 79: Europe 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 82: Europe 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 85: Europe 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 86: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Europe Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 88: Europe 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • FRANCE
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 89: France Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 91: France 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 94: France 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 95: France Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: France Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 97: France 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • GERMANY
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 100: Germany 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 103: Germany 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 104: Germany Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Germany Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 106: Germany 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • ITALY
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 109: Italy 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 112: Italy 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 113: Italy Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Italy Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 115: Italy 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • UNITED KINGDOM
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 116: UK Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 118: UK 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 121: UK 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 122: UK Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: UK Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 124: UK 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • SPAIN
    • TABLE 125: Spain Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Spain Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 127: Spain 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 128: Spain Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Spain Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 130: Spain 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 131: Spain Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Spain Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 133: Spain 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • RUSSIA
    • TABLE 134: Russia Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Russia Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 136: Russia 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 137: Russia Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Russia Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 139: Russia 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 140: Russia Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Russia Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 142: Russia 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • REST OF EUROPE
    • TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of Europe Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 145: Rest of Europe 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 146: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of Europe Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 148: Rest of Europe 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 149: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Rest of Europe Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 151: Rest of Europe 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • ASIA-PACIFIC
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 153: Asia-Pacific Historic Review for Wafer Fabrication by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 154: Asia-Pacific 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
    • TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 156: Asia-Pacific Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 157: Asia-Pacific 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 158: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 159: Asia-Pacific Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 160: Asia-Pacific 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 161: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 162: Asia-Pacific Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 163: Asia-Pacific 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • AUSTRALIA
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 164: Australia Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 165: Australia Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 166: Australia 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 167: Australia Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 168: Australia Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 169: Australia 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 170: Australia Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 171: Australia Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 172: Australia 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • INDIA
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 173: India Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 174: India Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 175: India 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 176: India Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 177: India Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 178: India 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 179: India Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 180: India Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 181: India 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • SOUTH KOREA
    • TABLE 182: South Korea Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 183: South Korea Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 184: South Korea 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 185: South Korea Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 186: South Korea Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 187: South Korea 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 188: South Korea Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 189: South Korea Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 190: South Korea 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 191: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 192: Rest of Asia-Pacific Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 193: Rest of Asia-Pacific 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 194: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 195: Rest of Asia-Pacific Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 196: Rest of Asia-Pacific 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 197: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 198: Rest of Asia-Pacific Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 199: Rest of Asia-Pacific 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • LATIN AMERICA
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 200: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 201: Latin America Historic Review for Wafer Fabrication by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 202: Latin America 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
    • TABLE 203: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 204: Latin America Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 205: Latin America 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 206: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 207: Latin America Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 208: Latin America 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 209: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 210: Latin America Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 211: Latin America 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • ARGENTINA
    • TABLE 212: Argentina Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 213: Argentina Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 214: Argentina 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 215: Argentina Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 216: Argentina Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 217: Argentina 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 218: Argentina Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 219: Argentina Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 220: Argentina 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • BRAZIL
    • TABLE 221: Brazil Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 222: Brazil Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 223: Brazil 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 224: Brazil Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 225: Brazil Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 226: Brazil 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 227: Brazil Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 228: Brazil Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 229: Brazil 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • MEXICO
    • TABLE 230: Mexico Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 231: Mexico Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 232: Mexico 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 233: Mexico Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 234: Mexico Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 235: Mexico 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 236: Mexico Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 237: Mexico Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 238: Mexico 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 239: Rest of Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 240: Rest of Latin America Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 241: Rest of Latin America 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 242: Rest of Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 243: Rest of Latin America Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 244: Rest of Latin America 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 245: Rest of Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 246: Rest of Latin America Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 247: Rest of Latin America 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • MIDDLE EAST
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 248: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 249: Middle East Historic Review for Wafer Fabrication by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 250: Middle East 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
    • TABLE 251: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 252: Middle East Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 253: Middle East 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 254: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 255: Middle East Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 256: Middle East 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 257: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 258: Middle East Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 259: Middle East 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • IRAN
    • TABLE 260: Iran Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 261: Iran Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 262: Iran 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 263: Iran Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 264: Iran Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 265: Iran 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 266: Iran Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 267: Iran Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 268: Iran 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • ISRAEL
    • TABLE 269: Israel Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 270: Israel Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 271: Israel 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 272: Israel Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 273: Israel Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 274: Israel 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 275: Israel Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 276: Israel Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 277: Israel 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • SAUDI ARABIA
    • TABLE 278: Saudi Arabia Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 279: Saudi Arabia Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 280: Saudi Arabia 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 281: Saudi Arabia Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 282: Saudi Arabia Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 283: Saudi Arabia 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 284: Saudi Arabia Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 285: Saudi Arabia Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 286: Saudi Arabia 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 287: UAE Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 288: UAE Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 289: UAE 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 290: UAE Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 291: UAE Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 292: UAE 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 293: UAE Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 294: UAE Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 295: UAE 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 296: Rest of Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 297: Rest of Middle East Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 298: Rest of Middle East 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 299: Rest of Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 300: Rest of Middle East Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 301: Rest of Middle East 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 302: Rest of Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 303: Rest of Middle East Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 304: Rest of Middle East 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
  • AFRICA
    • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 305: Africa Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 306: Africa Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 307: Africa 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
    • TABLE 308: Africa Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 309: Africa Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 310: Africa 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
    • TABLE 311: Africa Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 312: Africa Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 313: Africa 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030

IV. COMPETITION

샘플 요청 목록
0 건의 상품을 선택 중
목록 보기
전체삭제