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세계의 반도체 첨단 패키징 시장

Semiconductor Advanced Packaging

리서치사 Global Industry Analysts, Inc.
발행일 2022년 01월 상품 코드 941223
페이지 정보 영문 243 Pages
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세계의 반도체 첨단 패키징 시장 Semiconductor Advanced Packaging
발행일 : 2022년 01월 페이지 정보 : 영문 243 Pages

본 상품은 영문 자료로 한글과 영문목차에 불일치하는 내용이 있을 경우 영문을 우선합니다. 정확한 검토를 위해 영문목차를 참고해주시기 바랍니다.

COVID-19 위기에서 2020년 세계의 반도체 첨단 패키징 시장은 320억 달러로 예측되고, 2020-2027년의 분석 기간 중 4.7%의 CAGR로 성장하며 2027년까지 442억 달러에 달할 것으로 예측되고 있습니다. 이 조사에서 분석된 부문의 하나인 플립칩은 4.5%의 CAGR로 성장하며 분석 기간말까지 344억 달러에 달할 것으로 예측되고 있습니다.

반도체 첨단 패키징 시장을 조사했으며, 시장의 정의와 개요, 시장 성장에 대한 각종 영향요인 분석, 시장 규모의 추이와 예측, 각종 부문·지역·주요 국가별 상세 분석, 경쟁 환경, 주요 기업 개요 등을 정리하여 전해드립니다.

조사 대상 기업의 예

  • Amkor Technology, Inc.
  • ASE Technology Holding, Co., Ltd.
  • China Wafer Level CSP Co., Ltd.
  • ChipMOS Technologies, Inc.
  • FlipChip International LLC
  • HANA Micron Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • King Yuan Electronics Corp.(KYEC)
  • Nepes Corporation
  • Powertech Technology, Inc.
  • Samsung Semiconductor, Inc.
  • SIGNETICS
  • Tianshui Huatian Technology Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • TSMC Ltd.
  • UTAC Holdings Ltd.
  • Veeco Instruments Inc.

목차

I. 서론, 조사 방법, 조사 범위

II. 개요

제1장 시장 개요

  • 세계 경쟁사의 시장 점유율
  • 세계의 반도체 첨단 패키징 경쟁사 시장 점유율 시나리오(%) : 2019년 및 2025년
  • Covid-19의 영향과 다가오는 세계의 경기후퇴

제2장 주요 기업

제3장 시장 동향과 촉진요인

제4장 세계 시장의 전망

III. 시장 분석

  • 지역별 시장 분석
  • 미국
  • 캐나다
  • 일본
  • 중국
  • 유럽
  • 프랑스
  • 독일
  • 이탈리아
  • 영국
  • 기타 유럽
  • 아시아태평양
  • 기타 지역

IV. 경쟁

  • 기업 개요 : 46
KSA 20.07.21

Abstract:

Global Semiconductor Advanced Packaging Market to Reach US$50.6 Billion by the Year 2026

The semiconductor advanced packaging market growth is driven by the growing trend of miniaturization. Constant transitions and miniaturization of nodes were regular features that the industry faced, and now ULSI fabrication resulting in increased wafer sizes are further driving market growth. With many companies focusing more on R&D, there is rise in the number of manufacturers who offer innovative products. Factors such as growing numbers of consumers using electronic appliances, consumer preference for lighter, thinner, and smaller products driving the need for electronic products with advanced architecture, and the growing demand for connected devices such as tablets and smartphones are also driving growth of semiconductor advanced packaging market. Growing interest in device miniaturization in various sectors is driving market gains. Further, the growing use of 2.5D packaging in chips and 3D IC in smartphones and other mobile devices is anticipated to spur advanced packaging demand.

Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$32.6 Billion in the year 2020, is projected to reach a revised size of US$50.6 Billion by 2026, growing at a CAGR of 7.7% over the analysis period. Flip Chip Packaging, one of the segments analyzed in the report, is projected to grow at a 7.3% CAGR to reach US$40.2 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.2% CAGR for the next 7-year period. This segment currently accounts for a 9.6% share of the global Semiconductor Advanced Packaging market. An incremental step from traditional 2D IC packaging technology, 2.5D packages enable finer lines and spaces. 2.5D packages are commonly used in high-end ASICs, FPGAs, GPUs, and memory cubes. Demand for high-speed flip chip packages creates an opportunity for highly integrated, multi-chip modules (MCM`s) and 2.5D/3D silicon (Si) interposer packages.

The U.S. Market is Estimated at $3.2 Billion in 2021, While China is Forecast to Reach $14.3 Billion by 2026

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.2 Billion in the year 2021. The country currently accounts for a 9.48% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$14.3 Billion in the year 2026 trailing a CAGR of 9.8% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.4% CAGR while Rest of European market (as defined in the study) will reach US$1.5 Billion by the end of the analysis period. North America is an important market for advanced packaging technologies, where growth is supported by the existence of several semiconductor companies, and increasing initiatives by the government to encourage the semiconductor and electronics manufacturing sector. Increasing demand for wireless sensor/mobile, fingerprint sensors, and CIS is expected to fuel the growth of WLCSP and Copper pillar in the Asia Pacific region. Further, the rising IoT penetration in several areas, supportive government policies in various countries, and the growing focus on smart infrastructure and smart city are fueling market growth in the region.

FI WLP Segment to Reach $3.2 Billion by 2026

In the global FI WLP segment, USA, Canada, Japan, China and Europe will drive the 5.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.5 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$2 Billion by the year 2026.

Select Competitors (Total 87 Featured) -

  • Amkor Technology, Inc.
  • ASE Technology Holding, Co., Ltd.
  • China Wafer Level CSP Co., Ltd.
  • ChipMOS Technologies, Inc.
  • FlipChip International LLC
  • HANA Micron Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • King Yuan Electronics Corp. (KYEC)
  • Nepes Corporation
  • Powertech Technology, Inc.
  • Samsung Semiconductor, Inc.
  • SIGNETICS
  • Tianshui Huatian Technology Co., Ltd.
  • TongFu Microelectronics Co., Ltd.
  • TSMC Ltd.
  • UTAC Holdings Ltd.
  • Veeco Instruments Inc.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Impact of COVID-19 Pandemic and Looming Global Recession: 2020 Marked as a Year of Disruption & Transformation
    • As the Race between the Virus & Vaccines Intensifies, Where is the World Economy Headed in 2021?
    • EXHIBIT 1: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
    • Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
    • Among the Hammered Companies in the Supply Chain is the "Semiconductor Industry"
    • EXHIBIT 2: Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
    • EXHIBIT 3: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
    • Semiconductor Trends for Specific End-Use Categories
    • COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
    • Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
    • Industrial Activity Remain Subdued in 2020
    • EXHIBIT 4: Global PMI Index Points for the Years 2018, 2019 & 2020
    • An Introduction to Semiconductor Advanced Packaging
    • Global Market Prospects & Outlook
    • Key Trends to Drive Semiconductor Advanced Packaging Market
    • Regional Analysis
    • Competitive Scenario
    • Semiconductor Supply Chain Transitions at Various Levels
    • Financial Performances of Packaging Suppliers Reveals New Growth Players
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market
    • EXHIBIT 5: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
    • IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging
    • EXHIBIT 6: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
    • EXHIBIT 7: Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
    • EXHIBIT 8: Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022
    • EXHIBIT 9: World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing
    • Increasing Functionality & Application Scope
    • New Packaging Technologies Crucial to Semiconductor Innovation
    • 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
    • 3D InCites - Advanced Packaging for 5G
    • Advanced Packaging Influences Design Chain
    • Innovative Advanced Packaging Techniques to Flood the Market
    • Amkor Technology Leading Packaging Technology Innovation
    • Reducing the Cost of Advanced Packaging
    • Issues and Challenges
    • Solving Lithography Challenges
    • Warped Wafer Processing
    • UBM/RDL and PR Strip Challenges
    • UBM/RDL Etch
    • Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
    • Post Pandemic Recovery in CE Sector to Augment Prospects
    • EXHIBIT 10: Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
    • EXHIBIT 11: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
    • Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
    • Smartphones
    • EXHIBIT 12: Smartphone Penetration Rate as Share of Total Population: 2016-2021
    • Tablet PCs
    • FOWLP and Challenges to Packaging Materials Suppliers
    • Automobile Electronification Trends Widen the Addressable Market
    • EXHIBIT 13: Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
    • EXHIBIT 14: World Automobile Production in Million Units: 2008-2022
    • Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
    • EXHIBIT 15: Commercial Airline Revenue Growth (in %) for 2010-2020
    • EXHIBIT 16: Global Airlines Performance by Region: 2020 Vs 2019
    • Sustained High Growth in ICT Sector Augurs Well
    • EXHIBIT 17: World Internet Penetration Rate (in %) by Geographic Region: June 2021
    • EXHIBIT 18: Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022
    • EXHIBIT 19: Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 2: World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 3: World 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
    • TABLE 4: World Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 5: World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 6: World 15-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 7: World Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 8: World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 9: World 15-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 10: World Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 11: World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 12: World 15-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 13: World Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 14: World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 15: World 15-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 16: World Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 18: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 19: World Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 20: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 21: World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 22: World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 23: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 24: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 25: World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 26: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 27: World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
    • TABLE 28: World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 29: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 30: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • TABLE 31: USA Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 32: USA Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 33: USA 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 34: USA Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 35: USA Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 36: USA 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • CANADA
    • TABLE 37: Canada Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 38: Canada Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 39: Canada 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 40: Canada Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 41: Canada Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 42: Canada 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • JAPAN
    • TABLE 43: Japan Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 44: Japan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 45: Japan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 46: Japan Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 47: Japan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 48: Japan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • CHINA
    • TABLE 49: China Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 50: China Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 51: China 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 52: China Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 53: China Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 54: China 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • EUROPE
    • TABLE 55: Europe Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 56: Europe Historic Review for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 57: Europe 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2021 & 2027
    • TABLE 58: Europe Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 59: Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 60: Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 61: Europe Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 62: Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 63: Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • FRANCE
    • TABLE 64: France Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 65: France Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 66: France 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 67: France Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 68: France Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 69: France 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • GERMANY
    • TABLE 70: Germany Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 71: Germany Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 72: Germany 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 73: Germany Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 74: Germany Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 75: Germany 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • ITALY
    • TABLE 76: Italy Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 77: Italy Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 78: Italy 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 79: Italy Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 80: Italy Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 81: Italy 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • UNITED KINGDOM
    • TABLE 82: UK Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 83: UK Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 84: UK 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 85: UK Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 86: UK Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 87: UK 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • REST OF EUROPE
    • TABLE 88: Rest of Europe Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 89: Rest of Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 90: Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 91: Rest of Europe Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 92: Rest of Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 93: Rest of Europe 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • ASIA-PACIFIC
    • TABLE 94: Asia-Pacific Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
    • TABLE 95: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 96: Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2012, 2021 & 2027
    • TABLE 97: Asia-Pacific Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 98: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 99: Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 100: Asia-Pacific Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 101: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 102: Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • SOUTH KOREA
    • TABLE 103: South Korea Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 104: South Korea Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 105: South Korea 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 106: South Korea Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 107: South Korea Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 108: South Korea 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • TAIWAN
    • TABLE 109: Taiwan Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 110: Taiwan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 111: Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 112: Taiwan Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 113: Taiwan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 114: Taiwan 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • REST OF ASIA-PACIFIC
    • TABLE 115: Rest of Asia-Pacific Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 116: Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 117: Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 118: Rest of Asia-Pacific Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 119: Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 120: Rest of Asia-Pacific 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027
  • REST OF WORLD
    • TABLE 121: Rest of World Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 122: Rest of World Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 123: Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2012, 2021 & 2027
    • TABLE 124: Rest of World Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
    • TABLE 125: Rest of World Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
    • TABLE 126: Rest of World 15-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2012, 2021 & 2027

IV. COMPETITION

  • Total Companies Profiled: 87
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