시장보고서

상품코드

1530335

세계의 웨이퍼 레벨 패키징 시장 - 규모, 점유율, 동향 분석 보고서 : 기술별, 유형별, 최종 용도별, 지역별, 부문 예측(2024-2030년)

Wafer Level Packaging Market Size, Share & Trends Analysis Report By Technology (Fan-in Wafer Level Packaging (FI-WLP), Fan-out Wafer Level Packaging (FO-WLP)), By Type, By End-use, By Region, And Segment Forecasts, 2024 - 2030

발행일: 2024년 07월 | 리서치사:

Grand View Research | 페이지 정보: 영문 150 Pages | 배송안내 : 2-10일 (영업일 기준)

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웨이퍼 레벨 패키징 시장 규모·동향

세계의 웨이퍼 레벨 패키징 시장 규모는 2023년에 75억 6,000만 달러로 추정되며, 2024-2030년에 걸쳐 CAGR 10.2%를 나타낼 것으로 예측됩니다. 기술적으로 개선된 모바일 기기에 대한 수요 증가와 집적 회로 및 반도체 산업의 지속적인 발전은 예측 기간 동안 웨이퍼 레벨 패키징 시장의 성장을 가속화할 것으로 예상됩니다.

게다가 선진국과 신흥국에서 보다 작고 컴팩트한 전자기기에 대한 수요 증가가 웨이퍼 레이어 패키징 시장의 역학을 형성하고 있습니다. 소비자 일렉트로닉스, 자동차, 의료 산업이 보다 작고 컴팩트한 디바이스를 계속 요구하고 있는 가운데, 웨이퍼 레벨 패키징은 전자 부품의 소형화를 가능하게 하고, 성능과 기능의 강화로 이어지는 솔루션을 제공합니다. 예를 들어, 스마트 워치와 피트니스 트래커와 같은 웨어러블의 시작은 여러 기능을 단일 컴팩트한 칩에 통합할 수 있게 하기 때문에 웨이퍼 레벨 패키징에 대한 수요를 부추기고 있습니다.

또한 다양한 산업에서 사물인터넷(IoT) 디바이스 채택이 확대되고 있습니다. IoT 에코시스템은 다양한 센서, 마이크로컨트롤러 및 무선 통신 모듈을 컴팩트한 폼 팩터에 맞추기 위한 고급 패키징 솔루션을 필요로 합니다. 웨이퍼 레벨 패키징은 여러 컴포넌트를 하나의 칩에 통합할 수 있어 보다 작고 전력 효율적인 IoT 디바이스 개발을 가능하게 합니다. 예를 들어, 자동차 부문에서는 커넥티드 자동차 기술과 ADAS(첨단 운전 지원 시스템)의 보급으로 컴팩트한 공간에 센서와 프로세서를 원활하게 통합할 수 있는 웨이퍼 레벨 패키징에 대한 요구가 높아지고 있습니다.

또한 팬아웃 웨이퍼 레벨 패키징(FOWLP)과 실리콘 관통 비아(TSV)와 같은 첨단 패키징 기술 개척 등 반도체 기술의 지속적인 발전이 웨이퍼 레벨 패키징 시장의 성장을 뒷받침하고 있습니다. 이러한 기술 혁신은 기능성 향상, 성능 개선, 폼 팩터 축소를 가능하게 하고, 경쟁이 치열한 일렉트로닉스 시장에서 우위에 서려고 하는 제조업체에게 있어서, 웨이퍼 레벨 패키징은 매력적인 솔루션이 되고 있습니다.

세계의 웨이퍼 레벨 패키징 시장 보고서 세분화

이 보고서는 2018-2030년에 걸쳐 수익 성장을 세계 수준, 지역 수준, 국가별 수준에서 예측하고 각 하위 부문에 대한 최신 업계 동향 분석을 제공합니다. 이 연구를 위해 Grand View Research는 웨이퍼 레벨 패키징 시장 보고서를 유형, 기술, 최종 용도 및 지역에 따라 세분화합니다.

시장 계통의 전망
침투와 성장의 전망 매핑
업계 밸류체인 분석
- 원재료의 동향
- 제조업의 동향
- 판매 채널 분석
규제 프레임워크
- 표준 및 컴플라이언스
- 안전성
시장 역학
- 시장 성장 촉진요인 분석
- 시장 성장 억제요인 분석
- 시장 과제 분석
- 시장 기회 분석
비즈니스 환경 분석
- 업계 분석 - Porter's Five Forces 분석
- PESTEL 분석
웨이퍼 레벨 패키징 시장의 최신 동향과 기술

제4장 웨이퍼 레벨 패키징 시장 : 시장 공급자 정보

클라리치 매트릭스(포트폴리오 분석)
참여 모델
협상 전략
조달 모범 사례
벤더 선택 기준

제5장 웨이퍼 레벨 패키징 시장 : 유형, 추정·동향 분석

정의와 범위
유형 변동 분석과 시장 점유율, 2023년과 2030년
3D TSV WLP
2.5D TSV WLP
웨이퍼 레벨 칩 스케일 패키징(WLCSP)
나노 WLP
기타

제6장 웨이퍼 레벨 패키징 시장 : 기술, 추정·동향 분석

정의와 범위
기술변동 분석과 시장 점유율, 2023년과 2030년
팬인 웨이퍼 레벨 패키징(FI-WLP)
팬아웃 웨이퍼 레벨 패키징(FO-WLP)

제7장 웨이퍼 레벨 패키징 시장 : 최종 용도, 추정·동향 분석

정의와 범위
최종 용도 변동 분석과 시장 점유율, 2023년과 2030년
소비자용 전자 기기
IT 및 통신
자동차
의료
기타

제8장 웨이퍼 레벨 패키징 시장 : 지역별, 추정·동향 분석

주요 포인트
지역변동 분석과 시장 점유율, 2023년과 2030년
북미
- 시장 추정·예측, 2018-2030년
- 미국
- 캐나다
- 멕시코
유럽
- 시장 추정·예측, 2018-2030년
- 독일
- 영국
- 프랑스
- 이탈리아
- 스페인
아시아태평양
- 시장 추정·예측, 2018-2030년
- 중국
- 인도
- 일본
- 한국
- 호주
중남미
- 시장 추정·예측, 2018-2030년
- 브라질
- 아르헨티나
중동 및 아프리카
- 시장 추정·예측, 2018-2030년
- 사우디아라비아
- 아랍에미리트(UAE)
- 남아프리카

제9장 경쟁 구도

주요 진출기업과 최근의 동향, 그리고 업계에 대한 영향
주요 기업/경쟁의 분류
주요 원재료 판매자와 채널 파트너 일람
잠재고객 목록, 용도별
기업의 시장 점유율과 포지션 분석, 2023년
기업 히트맵 분석
경쟁 대시보드 분석
전략 매핑
- 확대
- 협업/파트너십/계약
- 신제품 발매
- 합병과 인수
- 연구개발
- 기타

제10장 기업 리스트/프로파일

Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
MKS Instruments
SMTA
MueTec
ULVAC
Micross
Nanotronics
JCET
ECI Technology
KLA Corporation
Bruker
CAPLINQ Corporation
Nordson Corporation
ASE

제11장 전략적 권장 사항사항/분석가의 관점

JHS 24.08.22

Wafer Level Packaging Market Size & Trends

The global wafer level packaging market size was estimated at USD 7.56 billion in 2023 and is expected to grow at a CAGR of 10.2% from 2024 to 2030. Increasing demand for the technologically improved mobile devices and ongoing advancements in integrated circuits and semiconductor industry is expected to accelerate the growth of wafer layer packaging market during the forecast period.

In addition, rising demand for smaller and more compact electronic devices in established and emerging economies is shaping the dynamics of the wafer layer packaging market. Hence, as consumer electronics, automotive, and healthcare industries continue to demand smaller and more compact devices, wafer level packaging offers a solution by enabling the miniaturization of electronic components, leading to enhanced performance and functionality. For example, the rise of wearables such as smartwatches and fitness trackers has fueled the demand for wafer level packaging as it allows for the integration of multiple functions into a single compact chip.

Furthermore, the escalating adoption of Internet of Things (IoT) devices across various industries. The IoT ecosystem requires advanced packaging solutions to accommodate the diverse range of sensors, microcontrollers, and wireless communication modules in a compact form factor. Wafer level packaging facilitates the integration of multiple components onto a single chip, enabling the development of smaller, more power-efficient IoT devices. For instance, in the automotive sector, the proliferation of connected car technologies and advanced driver assistance systems (ADAS) has led to an increased need for wafer level packaging to enable the seamless integration of sensors and processors in a compact space.

Moreover, the continuous advancements in semiconductor technology, including the development of advanced packaging techniques such as fan-out wafer level packaging (FOWLP) and through-silicon vias (TSV), are driving the growth of the wafer level packaging market. These innovations have enabled increased functionality, improved performance, and reduced form factors, making wafer level packaging an attractive solution for manufacturers seeking to stay ahead in the competitive electronics market.

Global Wafer Level Packaging Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2018 to 2030. For the purpose of this study, Grand View Research has segmented the wafer level packaging market report on the basis of type, technology, end-use, and region:

Type Outlook (Revenue, USD Million, 2018 - 2030)
3D TSV WLP
2.5D TSV WLP
Wafer Level Chip Scale Packaging (WLCSP)
Nano WLP
Others
Technology Outlook (Revenue, USD Million, 2018 - 2030)
Fan-in Wafer Level Packaging (FI-WLP)
Fan-out Wafer Level Packaging (FO-WLP)
End-use Outlook (Revenue, USD Million, 2018 - 2030)
Consumer Electronics
IT & Telecommunication
Automotive
Healthcare
Others
Regional Outlook (Revenue, USD Million, 2018 - 2030)
North America

U.S.

Canada

Mexico

Europe

Germany

France

Italy

Spain

Asia Pacific

China

India

Japan

South Korea

Australia

Central & South America

Brazil

Argentina

Middle East & Africa

Saudi Arabia

UAE

South Africa

Chapter 1. Methodology and Scope

1.1. Market Segmentation & Scope
1.2. Market Definition
1.3. Information Procurement
- 1.3.1. Purchased Database
- 1.3.2. GVR's Internal Database
- 1.3.3. Secondary Materials & Third-Party Perspectives
- 1.3.4. Primary Research
1.4. Information Analysis
- 1.4.1. Data Analysis Models
1.5. Market Formulation & Data Visualization
1.6. Data Validation & Publishing
1.7. List of Abbreviations

Chapter 2. Executive Summary

2.1. Market Outlook, 2023 (USD Million)
2.2. Segmental Outlook
2.3. Competitive Landscape Snapshot

Chapter 3. Wafer Level Packaging Market Variables, Trends, and Scope

3.1. Market Lineage Outlook
3.2. Penetration and Growth Prospect Mapping
3.3. Industry Value Chain Analysis
- 3.3.1. Raw Material Trends
- 3.3.2. Manufacturing Trends
- 3.3.3. Sales Channel Analysis
3.4. Regulatory Framework
- 3.4.1. Standard & Compliance
- 3.4.2. Safety
3.5. Market Dynamics
- 3.5.1. Market Driver Analysis
- 3.5.2. Market Restraint Analysis
- 3.5.3. Market Challenges Analysis
- 3.5.4. Market Opportunity Analysis
3.6. Business Environment Analysis
- 3.6.1. Industry Analysis - Porter's
- 3.6.2. PESTEL Analysis
3.7. Latest Trends & Technologies in Wafer Level Packaging Market

Chapter 4. Wafer Level Packaging Market: Market Supplier Intelligence

4.1. Kraljic Matrix (Portfolio Analysis)
- 4.1.1. Non-Critical Items
- 4.1.2. Leverage Items
- 4.1.3. Bottleneck Items
- 4.1.4. Strategic Items
4.2. Engagement Model
4.3. Negotiation Strategies
4.4. Sourcing Best Practices
4.5. Vendor Selection Criteria

Chapter 5. Wafer Level Packaging Market: Type Estimates & Trend Analysis

5.1. Definition & Scope
5.2. Type Movement Analysis & Market Share, 2023 & 2030
5.3. 3D TSV WLP
- 5.3.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
5.4. 2.5D TSV WLP
- 5.4.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
5.5. Wafer Level Chip Scale Packaging (WLCSP)
- 5.5.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
5.6. Nano WLP
- 5.6.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
5.7. Others
- 5.7.1. Market estimates and forecasts, 2018 - 2030 (USD Million)

Chapter 6. Wafer Level Packaging Market: Technology Estimates & Trend Analysis

6.1. Definition & Scope
6.2. Technology Movement Analysis & Market Share, 2023 & 2030
6.3. Fan-in Wafer Level Packaging (FI-WLP)
- 6.3.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
6.4. Fan-out Wafer Level Packaging (FO-WLP)
- 6.4.1. Market estimates and forecasts, 2018 - 2030 (USD Million)

Chapter 7. Wafer Level Packaging Market: End-use Estimates & Trend Analysis

7.1. Definition & Scope
7.2. End-use Movement Analysis & Market Share, 2023 & 2030
7.3. Consumer Electronics
- 7.3.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
7.4. IT & Telecommunication
- 7.4.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
7.5. Automotive
- 7.5.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
7.6. Healthcare
- 7.6.1. Market estimates and forecasts, 2018 - 2030 (USD Million)
7.7. Others
- 7.7.1. Market estimates and forecasts, 2018 - 2030 (USD Million)

Chapter 8. Wafer Level Packaging Market: Regional Estimates & Trend Analysis

8.1. Key Takeaways
8.2. Regional Movement Analysis & Market Share, 2023 & 2030
8.3. North America
- 8.3.1. market estimates and forecasts, 2018 - 2030 (USD Million)
- 8.3.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
- 8.3.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
- 8.3.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.3.5. U.S.
  - 8.3.5.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.3.5.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.3.5.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.3.5.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.3.6. Canada
  - 8.3.6.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.3.6.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.3.6.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.3.6.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.3.7. Mexico
  - 8.3.7.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.3.7.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.3.7.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.3.7.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
8.4. Europe
- 8.4.1. market estimates and forecasts, 2018 - 2030 (USD Million)
- 8.4.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
- 8.4.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
- 8.4.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.4.5. Germany
  - 8.4.5.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.4.5.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.4.5.3. market estimates and forecasts, by Technology, 2018 - 2030 (USD Million)
  - 8.4.5.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.4.6. UK
  - 8.4.6.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.4.6.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.4.6.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.4.6.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.4.7. France
  - 8.4.7.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.4.7.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.4.7.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.4.7.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.4.8. Italy
  - 8.4.8.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.4.8.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.4.8.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.4.8.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.4.9. Spain
  - 8.4.9.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.4.9.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.4.9.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.4.9.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
8.5. Asia Pacific
- 8.5.1. market estimates and forecasts, 2018 - 2030 (USD Million)
- 8.5.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
- 8.5.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
- 8.5.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.5.5. China
  - 8.5.5.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.5.5.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.5.5.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.5.5.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.5.6. India
  - 8.5.6.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.5.6.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.5.6.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.5.6.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.5.7. Japan
  - 8.5.7.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.5.7.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.5.7.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.5.7.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.5.8. South Korea
  - 8.5.8.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.5.8.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.5.8.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.5.8.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.5.9. Australia
  - 8.5.9.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.5.9.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.5.9.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.5.9.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
8.6. Central & South America
- 8.6.1. market estimates and forecasts, 2018 - 2030 (USD Million)
- 8.6.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
- 8.6.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
- 8.6.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.6.5. Brazil
  - 8.6.5.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.6.5.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.6.5.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.6.5.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.6.6. Argentina
  - 8.6.6.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.6.6.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.6.6.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.6.6.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
8.7. Middle East & Africa
- 8.7.1. market estimates and forecasts, 2018 - 2030 (USD Million)
- 8.7.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
- 8.7.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
- 8.7.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.7.5. Saudi Arabia
  - 8.7.5.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.7.5.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.7.5.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.7.5.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.7.6. UAE
  - 8.7.6.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.7.6.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.7.6.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.7.6.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)
- 8.7.7. South Africa
  - 8.7.7.1. market estimates and forecasts, 2018 - 2030 (USD Million)
  - 8.7.7.2. market estimates and forecasts, by type, 2018 - 2030 (USD Million)
  - 8.7.7.3. market estimates and forecasts, by technology, 2018 - 2030 (USD Million)
  - 8.7.7.4. market estimates and forecasts, by end-use, 2018 - 2030 (USD Million)

Chapter 9. Competitive Landscape

9.1. Key Players & Recent Developments & Their Impact on the Industry
9.2. Key Company/Competition Categorization
9.3. List of key Raw Material Distributors and Channel Partners
9.4. List of Potential Customers, by End-use
9.5. Company Market Share & Position Analysis, 2023
9.6. Company Heat Map Analysis
9.7. Competitive Dashboard Analysis
9.8. Strategy Mapping
- 9.8.1. Expansion
- 9.8.2. Collaboration/ Partnerships/ Agreements
- 9.8.3. New Product launches
- 9.8.4. Mergers & Acquisitions
- 9.8.5. Research & Development
- 9.8.6. Others

Chapter 10. Company Listing / Profiles

10.1. Amkor Technology
10.2. Taiwan Semiconductor Manufacturing Company Limited
10.3. MKS Instruments
10.4. SMTA
10.5. MueTec
10.6. ULVAC
10.7. Micross
10.8. Nanotronics
10.9. JCET
10.10. ECI Technology
10.11. KLA Corporation
10.12. Bruker
10.13. CAPLINQ Corporation
10.14. Nordson Corporation
10.15. ASE